Miscibilization of low molecular weight functionalized polyethylenes in epoxy resins. I. Effects of composition and modifications chemistry

Toughening of epoxy resins is traditionally carried out by adding small proportions of a low T_g oligomer containing reactive end groups. These induce the precipitation of crosslinked rubbery particles during curing. In this study, an investigation was carried out to examine the possibility of using randomly functionalized low molecular weight polyethylene for the same purpose. In the first part of the work we examined the miscibility of binary and ternary blends of several low molecular weight polyethylenes, containing either hydroxyl or acid functional groups, with two types of epoxy resins and two anhydrides, respectively. Various chemical reactions were performed on some of the polyethylenes, as well as on a bisphenol epoxy resin, with the view to increase the miscibility between the components prior to the curing. From these experiments it was established that by modifying the polyethylene component with a monofunctional epoxy resin it is possible to substantially improve their miscibility with both types of difunctional epoxy resins, but to a lesser extent in the presence of anhydride hardeners. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1457–1470, 1999     

Change of viscoelastic properties of epoxy resin in the curing process

This paper is concerned with the relation between the time and temperature dependences of the flexural properties and the curing conditions for the bisphenol A-type epoxy resin with acid anhydride hardener. Relaxation moduli of epoxy resin, prepared at several curing temperatures and times, were measured in the temperature range from T_g ?70°C to T_g. The master curves of relaxation modulus for the epoxy resin could be constructed, using their thermorheological simple properties. The time–temperature shift factors of the epoxy resin could be approximately expressed by the Arrhenius equation with the activation energy 59.4 kcal/mole. independent of its curing conditions. The curing time and temperature were equivalent, that is, the short curing time at high temperature corresponded to the long curing time at low temperature. The curing time–temperature shift factor could be approximately expressed by the Arrhenius equation with the activation energy 21.3 kcal/mole, which was higher than the activation energy 14.2 kcal/mole obtained in the measurements of gel times. The increase in the values shows that the temperature dependences of reaction rates increase with progressing gelation.     

A Study of the Interphase Region in Carbon Fibre/Epoxy Composites using Dynamic Mechanical Thermal Analysis

We have examined the effect of fibre addition on the glass transition temperature (T _g ) of two epoxy resin systems (an amine cured and an anhydride cured epoxy system) using dynamic mechanical thermal analysis (DMTA) and differential scanning calorimetry (DSC). The presence of fibres changes the glass transition temperature (T _g ) of an anhydride cured epoxy resin but does not affect that of an amine cured epoxy. The data suggest that two counteracting mechanisms are responsible for these changes: firstly, the presence of fibres causes a restriction of the molecular motion in the resin system, and secondly, the presence of carboxyi and keto-enol groups on the fibre surface inhibit curing of the resin close to the fibre, i.e. in the interphase region. The former increases the T _g and is a long range effect whereas the latter decreases the T _g and is a localised phenomenon. Changes in the dynamic properties of the interphase region are only detected when the samples are loaded in the longitudinal direction and not in the transverse direction where bulk matrix properties dominate. Sizing the fibres before their incorporation into the epoxy resin eliminates the variation in interfacial properties arising from differences in fibre surface chemistry.     

Torsional braid analysis of the aromatic amine cure of epoxy resins

The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′-diaminodiphenyl methane (DDM), 4,4′-diaminodiphenyl sulfone (44DDS), and 3,3′-diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoichiometry of the resin mixtures was varied from a two to one excess of amino hydrogens per epoxy group to a two to one excess of epoxy groups per amino hydrogen. Isothermal cures of the resin mixtures were carried out from 70 to 210°C (range depending on epoxy—amine mixture), followed by a temperature scan to determine the glass transition temperature (T_g). The times to the isothermal liquid-to-rubber transition were shortest for the DDM mixtures and longest for the 44DDS mixtures. The liquid-to-rubber transition times were also shortest for the amine excess mixtures when stoichiometry was varied. A relatively rapid reaction to the liquid-to-rubber transition was observed for the epoxy excess mixtures, followed by an exceedingly slow reaction process at cure temperatures well above the T_g. This slow process was only observed for epoxy excess mixtures and eventually led to significant increases in T_g. Using time—temperature shifts of the glass transition temperature vs. logarithm of time, activation energies approximately 50% higher were derived for this process compared to those derived from the liquid-to-rubber transition. The rate of this reaction was virtually independent of curing agent and was attributed to etherification taking place in the epoxy excess mixtures. © 1994 John Wiley & Sons, Inc.     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Intercalation and exfoliation behavior of epoxy resin/curing agent/montmorillonite nanocomposite

The epoxy resin/curing agent/montmorillonite nanocomposite was prepared by a casting and curing process. The intercalation and exfoliation behaviors of epoxy resin in the presence of organophilic montmorillonite were investigated by X‐ray diffraction (XRD) and dynamic mechanical thermal analysis (DMTA). For the diethylenetriamine curing agent, the intercalated nanocomposite was obtained; and the exfoliated nanocomposite would be formed for tung oil anhydride curing agent. The curing condition does not affect the resulting kind of composite, both intercalation or exfoliation. For intercalated nanocomposite, the glass transition temperature T_g, measured by DMTA and affected by the curing temperature of matrix epoxy resin is corresponded to that of epoxy resin without a gallery. The α′ peak of the loss tangent will disappear if adding montmorillonite into the composite. It was also found that the T_g of the exfoliated nanocomposite decreases with increasing montmorillonite loading. © 2002 John Wiley & Sons, Inc. J Appl Polym Sci 84: 842–849, 2002; DOI 10.1002/app.10354     

Investigation of epoxy‐resin‐modified asphalt binder

Epoxy asphalt (EA) binder has been used extensively for paving long‐span bridges in many countries because it shows excellent heat resistance, is free from bleeding, has a low‐temperature cracking resistance, and has aggregate scattering resistance. EA binders were prepared by the mixture of asphalt, epoxy resin, and a new curing agent (CR) with functional groups. The properties of the EA binder were characterized by their viscosity, tensile strength, elongation at break, compatibility, morphology, glass transition temperature (T_g), contact angle, and surface free energy. The curing process was analyzed. The results indicate that the curing temperature and asphalt content had significant effects on the properties of the EA binder. We observed that most of the strength was generated after the first 3 h at 165 °C; this provided good workability for EA pavement construction. The CR with various functional groups improved the compatibility and morphology of the EA binder. The test results show that T_g of the EA binder decreased and the contact angles increased with increasing asphalt content. It is worth noting the contact angles between water and the EA binder were always greater than 90°; this implied that the EA binder was hydrophobic and, hence, water repellent. The surface free energy and dispersion force increases with decreasing asphalt content. However, the polarity forces decreased with decreasing asphalt content. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43401.     

Novel nanocomposite of epoxy resin by introduced reactive and nanoporous material

A reactive and nanoporous particle (OG) was introduced to UV-cured epoxy resin to form great low D _k material for electronic industrial. We expected the porous cage of OG to decrease the dielectric constant of UV-cured epoxy resin and multiple reactive functional groups (oxirane ring) of OG reacted with photoinitiator to increase the curing density of UV-cured epoxy resin. The glass transition temperatures (T _g) of epoxy increases with the increase of the OG content up to 10 phr due to the increase of crosslinking density. Excessive aggregation at highest OG content of 15 phr results in the reduced crosslinking density and T _g. The char yield of the composite increases with increase of OG content because stable Si and SiO₂ are formed after thermal decomposition. The presence of OG results in the higher porosity and thus the lower dielectric constant.     

Toughening of an epoxy anhydride resin system using an epoxidized hyperbranched polymer

This paper reports on the use of an epoxidized hyperbranched polymer (HBP) as an additive to an epoxy anhydride resin system. The hyperbranched polymer used was an aliphatic polyester with a molecular weight of around 10 500 g mol^?1. The epoxy resin mixture used was a combination of a difunctional diglycidyl ether of bisphenol A (DGEBA) epoxy and an epoxy novolac, and was cured with a catalysed anhydride curing agent. It has been shown that, at a concentration range of 0 to 20 wt% addition, the HBP is able to almost double the fracture toughness, with little evidence of any deleterious effects upon processing and the durability of the cured resin system. The flexural modulus and stress, however, were found to both decrease by about 30% as a result of HBP addition while the T_g was found to decrease by about 10%. The processability of the uncured resin systems has been investigated by using rheological and calorimetric techniques and it was found that the processability window, as determined by the gel time and viscosity changes, was relatively unaffected by HBP addition. The fracture surfaces were evaluated by using scanning electron microscopy which showed that the unique structure of the HBP facilitates an enhanced interaction with the polymer matrix to achieve excellent toughness enhancement of the polymer matrix. The durability of the epoxy network has been investigated via thermogravimetric analysis (TGA) and solvent uptake, and the HBP has been shown to have little systematic deleterious effect upon the degradation temperatures and the total amount of solvent absorbed. Copyright © 2003 Society of Chemical Industry     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Multifunctional formaldehyde resins as curing agent for epoxy resins

Formaldehyde resins (FR) at 1/1/2 molar ratios of monomers (Cl‐phenol/amino monomers/p‐formaldehyde) were synthesized under acid catalysis. The obtained resins were characterized using elemental analysis, FTIR and RMN spectroscopic methods, being used as crosslinking agents for epoxy resin formulations. The curing of epoxy resins with FR were investigated. The glass transition temperature (T_g) and decomposition behavior of crosslinked resins were studied by differential scanning calorimetry (DSC) and thermogravimetric (TGA) techniques. All DSC scans show two exothermic peaks, which implied the occurrence of cure reactions between epoxy ring and amine or carboxylic protons, in function of chemical structures of FR. The crosslinked products showed good thermal properties, high glass transitions, and low water absorption. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Studies on the conductivity properties of a family of cyanoethylated amine cured epoxy resin matrices

A group of epoxy matrices having a varied amount of crosslink densities have been prepared by curing diglycidyl ether of bisphenol A (DGEBA)–epoxy resin with the help of a family of cyanoethylated amine hardeners based on the adducts of 1 mole of triethylenetetramine and x moles of acrylonitrile, where x = 1, 2, and 3, to effect increasing level of cyanoethylation of triethylenetetramine. The electrical conductivities of such epoxy matrices having increasing crosslink densities were evaluated by a two‐probe a.c. technique in the frequency range of 100 Hz to 13 MHz using an impedance analyzer in the temperature range from 299 to 495 K. It was observed that the conductivity increased with an increased level of cyanoethyl (? CH₂CH₂CN) moiety in the matrix resin, while the activation energy (E_c) of conductivity in the elastomeric region above T_e generally showed a reversed trend with respect to E_v from 1.11 to 0.83 eV, where T_e is defined by T_e = (T_g + ΔT), the 〈ΔT 〉 for this family of matrix resin being 44.83°C. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 1627–1631, 2003     

New chemically reworkable epoxy coatings obtained by the addition of polyesters with star topologies to diglycidyl ether of bisphenol A resins

A new multiarm star with hyperbranched aromatic–aliphatic polyester core and poly(?-caprolactone) arms (HBPCL) was synthesized and characterized. Mixtures of diglycidyl ether of bisphenol A (DGEBA) resin and different proportions of this star type modifier were cured using a thermal cationic curing agent, Yb(OTf)₃. The HBPCL prepared has hydroxyl groups as chain ends, which are capable of chemically incorporating to the epoxy matrix by means of the monomer activated mechanism. This, together with the chemical structure of the modifier, allowed the preparation of new homogeneous thermosets for coating applications. The curing mixtures were investigated by differential scanning calorimetry (DSC) to study the curing process and evaluate the kinetic parameters of the formulations. These studies demonstrated that HBPCL decreased the curing rate and affected the gelation process. The thermosets obtained showed an improvement in impact strength with a discrete reduction of the T_g. The modified coatings showed an increased reworkability in alkaline solution with the maintenance of thermal stability.     

Development of high‐performance epoxy/clay nanocomposites by incorporating novel phosphonium modified montmorillonite

Novel organoclays were synthesized by several kinds of phosphonium cations to improve the dispersibility in matrix resin of composites and accelerate the curing of matrix resin. The possibility of the application for epoxy/clay nanocomposites and the thermal, mechanical, and adhesive properties were investigated. Furthermore, the structures and morphologies of the epoxy/clay nanocomposites were evaluated by transmission electron microscopy. Consequently, the corporation of organoclays with different types of phosphonium cations into the epoxy matrix led to different morphologies of the organoclay particles, and then the distribution changes of silicate layers in the epoxy resin influenced the physical properties of the nanocomposites. When high‐reactive phosphonium cations with epoxy groups were adopted, the clay particles were well exfoliated and dispersed. The epoxy/clay nanocomposite realized the high glass‐transition temperature (T_g) and low coefficient of thermal expansion (CTE) in comparison with those of neat epoxy resin. On the other hand, in the case of low‐reactive phoshonium cations, the dispersion states of clay particles were intercalated but not exfoliated. The intercalated clay did not influence the T_g and CTE of the nanocomposite. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Material systems for rapid manufacture of composite structures

A manufacturing process is described that builds complex composite parts using a layered building process in which each layer of pre‐preg composite is laid and cured as the build progresses. In order to employ on‐line curing without molds, resin technologies that provide fast curing at room temperature—ultraviolet curable and epoxy/polyamide—were investigated. UV‐curable resins were tested for their ability to “shadow” cure by exposing carbon fiber composites to ultraviolet light to determine if the cure propagated from areas directly exposed to areas under fibers. Though ultraviolet curing showed advantages in cure time and low volatile production, very minimal “shadow” curing was achieved. A low temperature curing epoxy/polyamide mixture was tested for the effects of cure temperature, cure time, and mix ratio on the final degree of cure (%DOC) and glass transition temperature (T_g). Layers were made using different resin mixtures, partially cured, and used to build layered parts to determine curing characteristics during the lay‐up process. In the epoxy/polyamide mixtures, mix ratio had little effect on the reaction rate but did affect the T_g. A kinetic model was established for the resin epoxy/polyamide system for optimizing processing conditions during fabrication. However, the model failed to correctly predict the fabrication. The reaction of the material was different during the fabrication process than during the isothermal cure due to the presence of oxygen. During the build process, the degree of cure in each layer increased significantly over the prestaged degree of cure in less time than theoretically predicted. However, the final resin properties, such as T_g, were still below the specifications for high performance parts.     

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourier‐transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The results showed that the FTIR absorption intensity of anhydride and epoxide decreased during the curing reaction, and the absorption peak of ester appeared. The dynamic curing energies were determined as 48.5 and 54.1 kJ/mol with Kissinger and Flynn–Wall–Ozawa methods, respectively. DSC measurements showed that as higher is the curing temperature, higher is the glass transition. The thermal degradation of the cured bisANER/MHHPA network was identified as two steps: the breaking or detaching of ? OH, ? CH₂? , ? CH₃, OC? O and C? O? C, etc., taking place between 300 and 450°C; and the carbonizing or oxidating of aromatic rings occurring above 450°C. The kinetics of the degradation reaction was studied with Coats–Redfern method showing a first‐order process. In addition, vinyl cyclohexene dioxide (VCD) was employed as a reactive diluent for bisANER (VCD/bisANER = 1 : 2 w/w) and cured with MHHPA, and the obtained network had a higher T_g and a slight lower degradation temperature than the undiluted system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2041–2048, 2007     

Bisphenol-A bimodal epoxy resins. Part I: The dynamic mechanical characterization of a 6300 (340/22,500) weight average molecular weight system

By using an advanced epoxy resin of 22,500 weight average molecular weight two bimodal systems of 6300 weight average molecular weights were prepared. By altering the curing procedure normally used to cure epoxy resins and high molecular weight resins we have succeeded in minimizing the difficulty associated with preparing bimodal epoxy resin systems. The ultimate T_g of these bimodal systems is associated with the phase morphology and controlled by the curing conditions employed. For the completely phase separated bimodal system a T_g of 473 K is reported and for the partially phase separated system a T_g of 466 K is reported. Equations were developed for predicting the equilibrium shear modulus of these bimodal systems. Theoretical predictions based on these equations were found to be consistent with experimental results.     

Preparation of epoxy-based insulator and optimization of its thermal property by Taguchi robust design method in double base propellant grain application

Taguchi method (orthogonal array, OA₉) was used to design an epoxy insulator by evaluating its glass transition temperature (T _g) for using in a double base (DB) propellant grain. In this design method, three epoxy resins based on diglycidylether bisphenol A (DGEBA), three polyamine curing agents and a DGEBA-based reactive diluent agent were used. The curing process of epoxy resins with polyamines was studied by Fourier transform infrared spectroscopy. The results showed that the curing process was completed at room temperature. The effects of four parameters including resin type, curing agent type, curing agent concentration and diluent quantity were investigated to design a resin formulation with a highest T _g after curing. The obtained results were quantitatively evaluated by the analysis of variance (ANOVA). The results of ANOVA showed that the highest T _g of 86.0 ± 9.0 °C was obtained for the optimum formulation of MANA POX-95 as epoxy resin, H-30 as curing agent and 52 phr H-30. The T _g measured by the experiment was 78.0 ± 0.9 °C. In addition, the single lap shear strength (adhesion strength) of the optimized insulator was measured at 13.66 ± 1.02 MPa. Pull-off test performed on the surface of DB propellant resulted a 1.935 ± 0.003 MPa adhesion strength.     

Time–temperature–transformation cure diagrams of phenol–formaldehyde and lignin–phenol–formaldehyde novolac resins

In this study, the time–temperature– transformation (TTT) cure diagrams of the curing processes of several novolac resins were determined. Each diagram corresponded to a mixture of commercial phenol–formaldehyde novolac, lignin–phenol–formaldehyde novolac, and methylolated lignin–phenol–formaldehyde novolac resins with hexamethylenetetramine as a curing agent. Thermomechanical analysis and differential scanning calorimetry techniques were applied to study the resin gelation and the kinetics of the curing process to obtain the isoconversional curves. The temperature at which the material gelled and vitrified [the glass‐transition temperature at the gel point (_gelT_g)], the glass‐transition temperature of the uncured material (without crosslinking; T_g0), and the glass‐transition temperature with full crosslinking were also obtained. On the basis of the measured of conversion degree at gelation, the approximate glass‐transition temperature/conversion relationship, and the thermokinetic results of the curing process of the resins, TTT cure diagrams of the novolac samples were constructed. The TTT diagrams showed that the lignin–novolac and methylolated lignin–novolac resins presented lower T_g0 and _gelT_g values than the commercial resin. The TTT diagram is a suitable tool for understanding novolac resin behavior during the isothermal curing process. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Preparation of a high-temperature-resistant lightening agent and its application in a cement slurry system

With an organic–inorganic polymer lightening material (EL) based on epoxy resin and an aromatic amine curing agent, through addition reaction, we synthesized an epoxy-cured resin coupled with an inorganic activation filler, microsilicon. First, epoxy resin bisphenol A 2-glycidyl ether (E-51) and the curing agent, m-phenylenediamine, were selected as the materials for the epoxy-curing system. The thermal stability of the epoxy-cured compound (EM) was studied by differential scanning calorimetry and thermogravimetric analysis. The glass-transition temperature (T _g) of EM reached 131 °C, and the results show that T _g and the thermal stability was raised when EM was kept at 150 °C for 12 h. Second, the inorganic active filler was modified with a titanate coupling agent and characterized by contact angle measurement and Fourier transform infrared spectroscopy, and the results show that the titanate coupling agent was successfully applied to the modification of the inorganic active filler. Finally, the performance of EL in a cement slurry system was also studied. The macroscopic data showed that the compressive strength of the cement stone increased from 8.6 MPa for the EM cement stone system to 13.2 MPa for the EL cement stone system. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 136, 47292.