三维封装叠层技术

三维封装技术是一种符合电子系统轻重量,小体积,高性能,低功耗的发展趋势的先进的封装技术,本文对三维封装技术进行了简要介绍,重点介绍了三维封装的叠层工艺和互连技术,阐述了三维封装技术的优点,。简要分析了三维封装技术所面临的问题。     

Printing 3D microfluidic chips with a 3D sugar printer

This study demonstrated how to quickly and effectively print two-dimensional (2D) and three-dimensional (3D) microfluidic chips with a low-cost 3D sugar printer. The sugar printer was modified from a desktop 3D printer by redesigning the extruder, so the melting sugar could be extruded with pneumatic driving. Sacrificial sugar lines were first printed on a base layer followed by casting polydimethylsiloxane (PDMS) onto the layer and repeating. Microchannels were then printed in the PDMS solvent, microfluidic chips dropped into hot water to dissolve the sugar lines after the PDMS was solidified, and the microfluidic chips did not need further sealing. Different types of sugar utilized for printing material were studied with results indicating that maltitol exhibited a stable flow property compared with other sugars such as caramel or sucrose. Low cost is a significant advantage of this type of sugar printer as the machine may be purchased for only approximately $800. Additionally, as demonstrated in this study, the printed 3D microfluidic chip is a useful tool utilized for cell culture, thus proving the 3D printer is a powerful tool for medical/biological research.     

用于微流控制备的3D打印机设计

针对微流控芯片传统加工工艺成本较高,工时较长等问题提出了一种低成本、适用于微流控芯片制备的3D打印机设计方案,该设计方案由3D打印机本体和上位机控制软件组成,其中上位机控制软件负责将事先建好的三维模型进行分析、切片,并生成G-code格式文件;3D打印控制系统负责接收、解析G-code文件及转化为打印机可识别的控制指令以完成物体的快速成型。详细阐述了3D打印机各功能模块的具体实现,给出了测试打印结果,证明该打印机具有成本低、精度高的优点。     

压气机叶片扭曲规律的多目标三维气动优化

为了提高轴流压气机的等熵效率和总压比,采用基于人工神经网络及遗传算法的叶轮机械叶片三维优化设计方法,开发了一种高性能的动叶片。优化目标是在流量不减小的情况下,尽可能的提高转子叶片的总压比和等熵效率。优化仿真结果显示,优化后所获得的扭曲叶片可以有效地改善叶根处的流动分离,流动分离区明显后移,损失显著降低,在整个工作范围,等熵效率提高了1.27%-7.08%,流量和总压比也都得到了大幅度的提高。结果表明,对亚音叶片进行扭曲规律优化效果很明显,优化方法是获得高性能转子叶片的有效途径。     

Embedded passive components in advanced 3D chips and micro/nano electronic systems

Microsystem Technologies - Electronic devices are shrinking day by day, while the speed and reliability is increasing. At the same time, IC designs and micro/nano electronic systems are becoming...     

Manufacture of microfluidic chips using a gap-control method based on traditional 3D printing technique

The solution to the commercialization of polymer microfluidic chips lies in the development of a low-cost and concise method. We present in this paper a gap-control method for obtaining low cost microfluidic chips on PMMA (polymethyl methacrylate) sheets based on traditional 3D printing technique—fused deposition modeling. The influence of 3D printing parameters such as printing temperature, printing speed, wire flow rate and initial layer thickness on printing quality is studied by experiments. The effect of O₂ plasma parameters such as chamber power and treatment time on the adhesion strength between printed PLA (polylactic acid) structures and PMMA substrate is investigated. The dye filling tests demonstrate that there is no blocking or leakage over the entire microchannels. With this newly developed technology, low-cost and large scale microfluidic chips can be fabricated, which allows commercial manufacturing of microchannels over large areas.

     

Microfluidic chips for cells capture using 3-D hydrodynamic structure array

Microfluidic chips were designed and fabricated to capture cells in a relative small volume to generate the desired concentration needed for analysis. The microfluidic chips comprise three-dimensional (3-D) cell capture structures array fabricated in PDMS. The capture structure includes two layers. The first layer consists of spacers to create small gap between the upper layer and glass. The second layer is a sharp corner U-shaped compartment with sharp corners at the fore-end. And another type capture structure with Y-shaped fluidic guide has been designed. It was demonstrated that the structures can capture cells in theory, using Darcy–Weisbach equation and COMSOL Multiphysics. Then yeast cell was chosen to test the performance of the chips. The chip without fluid guides captured ~1.44 × 10⁵ cells and the capture efficiency was up to 71 %. And the chip with fluid guides captured ~5.0 × 10⁴ cells and the capture efficiency was ~25 %. The chip without fluid guides can capture more cells because the yeast cells in the chip without fluid guides are subject to larger hydrodynamic drag force.     

SMD LED chips defect detection using a YOLOv3-dense model

This research develops a defect detector on the basis of the you only look once version 3, YOLOv3, and applies a process to inspect the chips of surface-mounted device light-emitting diodes (SMD LED). In addition to an inspection process that identifies defect-free products, the model also identifies missing components, incorrect placement, inverse polarity, missing wires and defective surface. To improve the performance of the defect detector, the research substitutes densely connected convolutional networks (DenseNet) for the Darknet-53 backbone, producing a model that is called YOLOv3-dense. The research introduces the Taguchi method to evaluate the sensitivity of YOLOv3-dense’s hyper-parameters in a fewer number of experiments. The result shows that the testing mean average precision (mAP) measured by YOLOv3-dense is 33.69% higher than the class activation mapping (CAM) localization of convolutional neural network (CNN). The testing mAP is also 14.98% higher than traditional YOLOv3.     

3D and 2D/3D holograms model

The estimating problem of 3D holograms orientation selectivity on angular, orthogonal, and azimuthal sensitivity parameters is formulated and solved. Tenfold increase of density 3D, 2D/3D holograms in comparison with 2D holograms at given selectivity for ones is shown in theory and experimentally.     

Datenschutz in 3D

Es wird ein Modell vorgestellt, das allen Beteiligten einen Gesamtüberblick darüber verschafft, was aus Datenschutzsicht zu planen, zu erheben, festzulegen oder zu prüfen ist.     

Java3D技术在三维服装设计中的应用

随着服装工业的发展,三维服装CAD技术得到广泛的应用,通过三维人体测量建立人体三维数据模型,在虚拟的三维人体上进行交互式立体设计,最后完成二维平面服装衣片。大大提高了服装工业产品设计的水平和生产的效率。本文叙述了利用强大的Java3D技术进行三维显示和设计的基本原理和方法。