In situ gas phase measurements during metal alkylamide atomic layer deposition

Metal alkylamide compounds, such as tetrakis(ethylmethylamido) hafnium (TEMAH), represent a technologically important class of metalorganic precursors for the deposition of metal oxides and metal nitrides via atomic layer deposition (ALD) or chemical vapor deposition. The development of in situ diagnostics for processes involving these compounds could be beneficial in, e.g., developing deposition recipes and validating equipment-scale simulations. This report describes the performance of the combination of two techniques for the simultaneous, rapid measurement of the three major gas phase species during hafnium oxide thermal ALD using TEMAH and water: TEMAH, water, and methylethyl amine (MEA), the only major reaction by-product. For measurement of TEMAH and MEA, direct absorption methods based on a broadband infrared source with different mid-IR bandpass filters and utilizing amplitude modulation and synchronous detection were developed. For the measurement of water, wavelength modulation spectroscopy utilizing a near-IR distributed feedback diode laser was used. Despite the relatively simple reactor geometry employed here (a flow tube), differences were easily observed in the time-dependent species distributions in 300 mL/min of a helium carrier gas and in 1000 mL/min of a nitrogen carrier gas. The degree of TEMAH entrainment was lower in 300 mL/min of helium compared to that in 1000 mL/min of nitrogen. The capability to obtain detailed time-dependent species concentrations during ALD could potentially allow for the selection of carrier gas composition and flow rates that would minimize parasitic wall reactions. However, when nitrogen was employed at the higher flow rates, various flow effects were observed that, if detrimental to a deposition process, would effectively limit the upper range of useful flow rates.     

Atomic layer deposition of hafnium oxide dielectrics on silicon and germanium substrates

Hafnium oxide films have been deposited at 250 °C on silicon and germanium substrates by atomic layer deposition (ALD), using tetrakis-ethylmethylamino hafnium (TEMAH) and water vapour as precursors in a modified Oxford Instruments PECVD system. Self-limiting monolayer growth has been verified, characterised by a growth rate of 0.082 nm/cycle. Layer uniformity is approximately within ±1% of the mean value. MOS capacitors have been fabricated by evaporating aluminium electrodes. CV analysis has been used to determine the bulk and interface properties of the HfO₂, and their dependence on pre-clean schedule, deposition conditions and post-deposition annealing. The dielectric constant of the HfO₂ is typically 18. On silicon, best results are obtained when the HfO₂ is deposited on a chemically oxidised hydrophilic surface. On germanium, best results are obtained when the substrate is nitrided before HfO₂ deposition, using an in-situ nitrogen plasma treatment.     

A Single‐Chamber System of Initiated Chemical Vapor Deposition and Atomic Layer Deposition for Fabrication of Organic/Inorganic Multilayer Films

A single‐chamber system capable of depositing both organic and inorganic layers by initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD) is demonstrated to facilitate the fabrication of organic/inorganic hybrid thin film encapsulation (TFE). The chamber geometry and the process conditions of iCVD and ALD are similar to each other, which enabled the design of the single‐chamber system. Both organic and inorganic films deposited via the single‐chamber system produces films with their properties equivalent to those deposited in separate iCVD and ALD reactors. Alternating the deposition mode between iCVD and ALD produces organic/inorganic multilayers with outstanding barrier properties as well as optical transparency mechanical flexibility.     

Dosimetry aspects of hafnium oxide metal-oxide-semiconductor (MOS) capacitor

This paper reports the investigation of hafnium oxide based metal-oxide-semiconductor capacitor for the detection of gamma radiation. The fabrication of the device involved deposition of hafnium oxide thin film on n-type Si wafer by electron beam evaporation technique followed by deposition of aluminum metal layer by thermal evaporation process. The device was irradiated incrementally to the cumulative dose of 480 Gy by gamma rays of 1.25 MeV (Co-60). The change in accumulation capacitance, effective oxide charge and interface trap density with cumulative gamma dose was examined at room temperature. As the creation of oxide charge and change in oxide capacitance are well correlated with radiation dose, the device can be useful for radiation dosimetry.     

Atomic layer deposition on polymer based flexible packaging materials: Growth characteristics and diffusion barrier properties

One of the most promising areas for the industrial application of atomic layer deposition (ALD) is for gas barrier layers on polymers. In this work, a packaging material system with improved diffusion barrier properties has been developed and studied by applying ALD on flexible polymer based packaging materials. Nanometer scale metal oxide films have been applied to polymer-coated papers and their diffusion barrier properties have been studied by means of water vapor and oxygen transmission rates. The materials for the study were constructed in two stages: the paper was firstly extrusion coated with polymer film, which was then followed by the ALD deposition of oxide layer. The polymers used as extrusion coatings were polypropylene, low and high density polyethylene, polylactide and polyethylene terephthalate. Water vapor transmission rates (WVTRs) were measured according to method SCAN-P 22:68 and oxygen transmission rates (O₂TRs) according to a standard ASTM D 3985. According to the results a 10 nm oxide layer already decreased the oxygen transmission by a factor of 10 compared to uncoated material. WVTR with 40 nm ALD layer was better than the level currently required for most common dry flexible packaging applications. When the oxide layer thickness was increased to 100 nm and above, the measured WVTRs were limited by the measurement set up. Using an ALD layer allowed the polymer thickness on flexible packaging materials to be reduced. Once the ALD layer was 40 nm thick, WVTRs and O₂TRs were no longer dependent on polymer layer thickness. Thus, nanometer scale ALD oxide layers have shown their feasibility as high quality diffusion barriers on flexible packaging materials.     

Making inert polypropylene fibers chemically responsive by combining atomic layer deposition and vapor phase chemical grafting

Uniformly grafting organic reactive molecular species, e.g. -NH?, onto substrates that have three-dimensional complex structures and are chemically inert is challenging. The vapor phase chemical grafting of organic molecules enabled by low temperature metal oxide atomic layer deposition (ALD) is presented as a general and promising solution to functionalize inert matrices with complex morphology, such as nonwoven polypropylene mats, through the controllable self-limited molecular assembly mechanism in a combined ALD and vapor phase chemical grafting process.     

Comparison of some coating techniques to fabricate barrier layers on packaging materials

Atomic layer deposition (ALD), electron beam evaporation, magnetron sputtering and a sol-gel method were used to deposit thin aluminum oxide coatings onto two different fiber-based packaging materials of commercial board grades coated with synthetic and biodegradable polymers. Significant decreases in both the water vapor and oxygen permeation rates were observed. With each technique the barrier performance was improved. However, among the techniques tested ALD was found to be most suitable. Our results moreover revealed that biodegradable polylactic acid-coated paperboard with a 25-nm thick layer of aluminum oxide grown by ALD on top of it showed promising barrier characteristics against water vapor and oxygen.     

Interface roughness effect between gate oxide and metal gate on dielectric property

We report a simple theoretical model based on experimental data about the interface roughness effect between gate oxide and metal gate on dielectric. From the analytic approach, we confirm that the increase in interface roughness generates the decrease in the dielectric constant as well as the increase in the leakage current. We checked the interface roughness effect between high-κ HfO₂ gate oxides and Ru gates by atomic layer deposition (ALD) and physical vapor deposition (PVD). The ALD Ru gate showed better dielectric properties (high dielectric constant and low leakage current) and lower interface roughness than the PVD Ru metal gate.     

Trapping properties of sputtered hafnium oxide films: Bulk traps vs. interface traps

The purpose of this work is to investigate the influence of the spatial distribution of traps on the electrical characteristics of hafnium oxide films deposited by physical vapor deposition. Samples were Al gated metal-oxide-semiconductor capacitors with hafnium oxide films deposited on SiO₂ layer thermally grown on Si. During capacitance-voltage measurements large hysteresis, up to 10 V, are observed in all samples. It is shown that depending on the hafnium oxide deposition conditions, the spatial distribution of the traps responsible for the hysteresis can be either two dimensional (interface/border traps) or three dimensional (bulk traps).     

Functional metal oxide coatings by molecule-based thermal and plasma chemical vapor deposition techniques

Deposition of thin films through vaccum processes plays an important role in industrial processing of decorative and functional coatings. Many metal oxides have been prepared as thin films using different techniques, however obtaining compositionally uniform phases with a control over grain size and distribution remains an enduring challenge. The difficulties are largely related to complex compositions of functional oxide materials, which makes a control over kinetics of nucleation and growth processes rather difficult to control thus resulting in non-uniform material and inhomogeneous grain size distribution. Application of tailor-made molecular precursors in low pressure or plasma-enhanced chemical vapor deposition (CVD) techniques offers a viable solution for overcoming thermodynamic impediments involved in thin film growth. In this paper molecule-based CVD of functional coatings is demonstrated for iron oxide (Fe2O3, Fe3O4), vanadium oxide (V2O5, VO2) and hafnium oxide (HfO2) phases followed by the characterization of their microstructural, compositional and functional properties which support the advantages of chemical design in simplifying deposition processes and optimizing functional behavior.     

Electrical resistivity of Ti-Zn mixed oxide thin films deposited by atomic layer deposition

Ti-Zn mixed oxide thin films, with thickness less than 50 nm, were grown with atomic layer deposition (ALD) technique at low temperature (90 °C) varying the composition. ALD is a powerful chemical technique to deposit thin films with thickness of few atomic layers. ALD oxide material growth is achieved by dosing sequentially the metal precursor and the oxidizing agent. Thanks to ALD nature of layer by layer growth it was possible to realize mixed metal, Ti and Zn, oxide thin films with controlled composition, simply by changing the number of cycles of each metal oxide layer. Structural and electrical properties of the prepared thin films were studied as a function of their composition. Synchrotron radiation X-ray diffraction technique was used to follow thin film crystallization during sample annealing, performed in situ. It was observed that the onset temperature of crystallization raises with Ti content, and sample structure was Zn₂TiO4 phase. Electrical resistivity measurements were performed on crystalline samples, annealed at 600 °C, revealing an increase in resistivity with Ti content.     

In-situ synchrotron X-ray scattering study of thin film growth by atomic layer deposition

We report an atomic layer deposition chamber for in-situ synchrotron X-ray scattering study of thin film growth. The chamber was designed for combined synchrotron X-ray reflectivity and two-dimensional grazing-incidence X-ray diffraction measurement to do a in-situ monitoring of ALD growth. We demonstrate ruthenium thermal ALD growth for the performance of the chamber. 10, 20, 30, 50, 70, 100, 150 and 250-cycled states are measured by X-ray scattering methods during ALD growth process. Growth rate is calculated from thickness values and the surface roughness of each state is estimated by X-ray reflectivity analysis. The crystal structure of initial growth state is observed by Grazing-incidence X-ray diffraction. These results indicate that in-situ X-ray scattering method is a promising analysis technique to investigate the initial physical morphology of ALD films.     

Thin film atomic layer deposition equipment for semiconductor processing

Atomic layer deposition (ALD) of ultrathin high-K dielectric films has recently penetrated research and development lines of several major memory and logic manufacturers due to the promise of unprecedented control of thickness, uniformity, quality and material properties. LYNX-ALD technology from Genus, currently at beta phase, was designed around the anticipation that future ultrathin materials are likely to be binary, ternary or quaternary alloys or nanolaminate composites. A unique chemical delivery system enables synergy between traditional, production-proven low pressure chemical vapor deposition (LPCVD) technology and atomic layer deposition (ALD) controlled by sequential surface reactions. Source chemicals from gas, liquid or solid precursors are delivered to impinge on reactive surfaces where self-limiting surface reactions yield film growth with layer-by-layer control. Surfaces are made reactive by the self-limiting reactions, by surface species manipulation, or both. The substrate is exposed to one reactant at a time to suppress possible chemical vapor deposition (CVD) contribution to the film. Precisely controlled composite materials with multiple-component dielectric and metal–nitride films can be deposited by ALD techniques. The research community has demonstrated these capabilities during the past decade. Accordingly, ALD equipment for semiconductor processing is unanimously in high demand. However, mainstream device manufacturers still criticize ALD to be non-viable for Semiconductor device processing. This article presents a broad set of data proving feasibility of ALD technology for semiconductor device processing.     

Metalcones: hybrid organic-inorganic films fabricated using atomic and molecular layer deposition techniques

Hybrid organic-inorganic films can be deposited using atomic layer deposition (ALD) and molecular layer deposition (MLD) techniques. A special set of hybrid organic-inorganic films based on metal precursors and various organic alcohols yields metal alkoxide films that can be described as "metalcones." Many metalcone films are possible such as the "alucones" and "zincones" based on the reaction of trimethylaluminum and diethylzinc, respectively, with various organic alcohols such as ethylene glycol (EG). This paper reviews the previous work on metalcone MLD and discusses a variety of new metalcone systems. "Titanicones" are grown using TiCl4 and glycerol or EG and "zircones" are grown using zirconium tetra-tert-butoxide and EG. In addition, the organic alcohol can also be varied to change the properties within one metalcone family. For example, the glycerol triol precursor allows for more cross-linking and higher toughness in alucones than the EG diol precursor. Alloys can also be formed by combining metalcone MLD and metal oxide ALD. By varying the relative number of cycles of MLD and ALD, the composition and properties of the hybrid organic-inorganic films can be tuned from pure metalcone MLD to pure metal oxide ALD.     

Understanding 'clean-up' of III-V native oxides during atomic layer deposition using bulk first principles models

The use of III-V materials as the channel in future transistor devices is dependent on removing the deleterious native oxides from their surface before deposition of a gate dielectric. Trimethylaluminium has been found to achieve in situ 'clean-up' of the oxides of GaAs and InGaAs before atomic layer deposition (ALD) of alumina. Here we propose six reaction mechanisms for 'clean-up,' featuring exchange of ligands between surface atoms, reduction of arsenic oxide by methyl groups and desorption of various products. We use first principles Density Functional Theory (DFT) to determine which mechanistic path is thermodynamically favoured based on models of the bulk oxides and gas-phase products. We therefore predict that 'clean-up' of arsenic oxides mostly produces As4 gas. Most C is predicted to form C2H6 but with some C2H4, CH4 and H2O. An alternative pathway is non-redox ligand exchange, which allows non-reducible oxides to be cleaned-up.     

Effect of atomic layer deposited ultra thin HfO2 and Al2O3 interfacial layers on the performance of dye sensitized solar cells

The objective of this work was to investigate the improvement in performance of dye sensitized solar cells (DSSCs) by depositing ultra thin metal oxides (hafnium oxide (HfO₂) and aluminum oxide (Al₂O₃)) on mesoporous TiO₂ photoelectrode using atomic layer deposition (ALD) method. Different thicknesses of HfO₂ and Al₂O₃ layers (5, 10 and 20 ALD cycles) were deposited on the mesoporous TiO₂ surface prior to dye loading process used for fabrication of DSSCs. It was observed that the ALD deposition of ultrathin oxides significantly improved the performance of DSSCs and that the improvement in the DSSC performance depends on the thickness of the deposited HfO₂ and Al₂O₃ films. Compared to a reference DSSC the incorporation of a HfO₂ layer resulted in 69% improvement (from 4.2 to 7.1%) in the efficiency of the cell and incorporation of Al₂O₃ (20 cycles) resulted in 19% improvement (from 4.2 to 5.0%) in the efficiency of the cell. These results suggest that ultrathin metal oxide layers affect the density and the distribution of interface states at the TiO₂/organic dye and TiO₂/liquid electrolyte interfaces and hence can be utilized to treat these interfaces in DSSCs.     

Atomic layer deposition of transition metals

Atomic layer deposition (ALD) is a process for depositing highly uniform and conformal thin films by alternating exposures of a surface to vapours of two chemical reactants. ALD processes have been successfully demonstrated for many metal compounds, but for only very few pure metals. Here we demonstrate processes for the ALD of transition metals including copper, cobalt, iron and nickel. Homoleptic N,N'-dialkylacetamidinato metal compounds and molecular hydrogen gas were used as the reactants. Their surface reactions were found to be complementary and self-limiting, thus providing highly uniform thicknesses and conformal coating of long, narrow holes. We propose that these ALD layers grow by a hydrogenation mechanism that should also operate during the ALD of many other metals. The use of water vapour in place of hydrogen gas gives highly uniform, conformal films of metal oxides, including lanthanum oxide. These processes should permit the improved production of many devices for which the ALD process has previously not been applicable.     

Growth of Nanoscale Carbon Structures and Their Corresponding Hydrogen Uptake Properties

Carbon nanostructures have been synthesized using the chemical vapor deposition technique (CVD) on different catalysts, using ethylene, acetylene, or methane as the hydrocarbons. Morphological characterizations obtained using a scanning electron microscope (SEM) showed that the reaction products are carbon nanofibers (CNF) with an outer diameter that depends on the reaction conditions and nature of the reactants. Hydrogen uptake measurements, performed volumetrically in a Sievert-type installation, showed the quantity of desorbed hydrogen (for pressure intervals ranging from 1 to 100 bars) depends on the synthesis conditions and the treatment preceding the hydrogen absorption process. For carbon nanotubes that were preparedaccording to literature guidelines and obtained from ethylene on a Ni:Cu catalyst, the amounts of absorbed hydrogen were less than 1% by weight. carbon nanostructures chemical vapor deposition hydrogen absorption SEM     

Atomic layer deposited aluminum oxide barrier coatings for packaging materials

Thin aluminum oxide coatings have been deposited at a low temperature of 80 °C on various uncoated papers, polymer-coated papers and boards and plain polymer films using the atomic layer deposition (ALD) technique. The work demonstrates that such ALD-grown Al₂O₃ coatings efficiently enhance the gas-diffusion barrier performance of the studied porous and non-porous materials towards oxygen, water vapor and aromas.     

Growth of Nanoscale Carbon Structures and Their Corresponding Hydrogen Uptake Properties

Carbon nanostructures have been synthesized using the chemical vapor deposition technique (CVD) on different catalysts, using ethylene, acetylene, or methane as the hydrocarbons. Morphological characterizations obtained using a scanning electron microscope (SEM) showed that the reaction products are carbon nanofibers (CNF) with an outer diameter that depends on the reaction conditions and nature of the reactants. Hydrogen uptake measurements, performed volumetrically in a Sievert-type installation, showed the quantity of desorbed hydrogen (for pressure intervals ranging from 1 to 100 bars) depends on the synthesis conditions and the treatment preceding the hydrogen absorption process. For carbon nanotubes that were preparedaccording to literature guidelines and obtained from ethylene on a Ni:Cu catalyst, the amounts of absorbed hydrogen were less than 1% by weight.

carbon nanostructures chemical vapor deposition hydrogen absorption SEM