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1.
在大规模集成电路生产中,对掩膜版与硅片刻线宽度的在线检测是保证质量的重要手段。本文介绍了一种高精度,自动化的线宽测量仪。阐述了其原理,构成及设计中有关问题。经实验表明:该仪器的重复测量精度≤±0.005μm;测量精度为±0.02μm.  相似文献   

2.
一、常用位移传感器 (一)感应同步器 1.直线分离式单块尺标准长度250mm,GZD-1型有0级±1.5μm(国外±1μm)和1级±2.5μm,2级±5μm三种,前两种成品率达95%以上。标准长度400~1100mm有:00级±1.5μm,0级±3μm,按有的企业标准GZD-2型窄尺精度与GZD-1型基本相同。GZH-1(标准式)、GZH-2型(窄式)滑尺精度也分为0级(±0.8μm)、1级(±1.5μm)和2级(±2.5μm)三种,与相应精度等级的定尺配套使用。 2.组装式尺将定尺、滑尺组装在一个封闭的金属壳内并准确地调整好其相对位置和间隙,密封型结构,安装方便。国内组装尺型号较多,精度一般为±0.005  相似文献   

3.
德国Kem Micro-und Feinwerk公司在汉诺威EMO2001展出了新开发的KERN MMP型加工中心(见图)。该机为高精密的铣削、钻削机床。机床定位精度为+1μm,重复精度为±1μm。精加工表面粗糙度可达Ra  相似文献   

4.
感应同步器自50年代初问世以来,许多国家的公司已引进和生产。当今,美国法兰德(FARRAND)公司——数显技术的先驱和发明者,无论在品种或精度上仍居首位,如直线型感应同步器的精度为1μm,分辨率为0.03μm,重复定位精度为0.05μm。商品精度有±1μm和±2.5μm两种。国外感应同步器的品种齐全,有各种直径,不同规格的圆感应同步器,多层绕组圆感应同步器;直线型感应同步器除标准型外,还发展了窄式、三重式、带式等。国外还生产标准定型的感应同步器组装尺,如意大利奥利维蒂公司的TM—170、TM—420、TP—07和TP—17等型号组装尺。  相似文献   

5.
光电内窥参数检测装置   总被引:4,自引:1,他引:3  
报导一种新的光电内窥参数测量装置。将一半导体激光器发出的光束经柱面镜汇聚成一细线,通过特殊设计的折反棱镜将其沿轴线方向投影到管孔内壁,得到管孔内壁的光截轮廓,该轮廓经物镜成像到CCD光敏面,通过图像卡采集到计算机。在计算机图像测量及辅助提示下,完成参数测量。此外,该装置还可在测量显微镜横向移动导轨及读数手轮的配合下测量内孔中径。实验结果表明轴向测量的重复精度为±17μm;中径测量的重复精度为±12μm.它在工业制造领域内具有广阔的应用前景。  相似文献   

6.
目前世界机床在不断提高精度、效率、自动化,以提高加工生产率和劳动生产率。日本大隈公司最近开发出了对模具既可实现粗加工又能进行精加工、定位精度达±1μm,重复精度±0.2μm的MD-650立式加工中心。与过去开发的MD-550V立式加工中心形成系列。为高精度、高速、高功率机床。工作台尺寸为1300mm×600mm,最大工件重可达1500kg,X,Y,Z行程为1100mm,660mm,610mm,主轴锥孔BT50~#,主轴转速  相似文献   

7.
我们应用数显装置对关键工序中的C512A型立车进行了精化改造,半年多的生产实践表明,提高了生产率和加工质量,有较好的稳定性和可靠性。我们采用的数显装置是感应同步器作为传感元件的鉴幅型闭环测量系统,数显表的可测量范围是±9999.99mm,在此范围内可以任意置零或预置任意数值,精度为1μm,重复精度为2.5μm,数字量分辨率为10μm。直线式感应同步器选用JB3587-84标准中的I级定滑尺。定滑尺组件的综合误差分别为8~15μm。根据加工要求,主刀架横坐标选用三块GZD-1型定  相似文献   

8.
以步进电机驱动的开环系统存在着一些问题。比如伺服精度低,步进电机失步误差无法补偿等。为此,本文提出一种新型的位置准闭环控制系统。它具有闭环的伺服精度和开环的稳定性。在经济型数控车床上的实验表明:该系统的定位精度和重复定位精度均控制在±10μm以内,获得预期效果。  相似文献   

9.
像差在临界角方法探焦技术中的影响   总被引:4,自引:2,他引:2  
侯澍 《光学精密工程》1998,6(1):122-126
分析了在临界角方法探焦技术中像差对测量灵敏度的影响。并给出了对两个显微物镜测量的结果。焦点探测试验精度为±1×10-2μm.  相似文献   

10.
<正> 万能工具显微镜是各生产厂家计量室主要精密检测仪器之一。五、六十年代韵万能工具显微镜,光学座标已不清晰,导轨磨损,精度严重丧失;新购置的光学座标万能工具显微镜,精度也只能达±3μm。成都工具研究所研制的光栅微机系统给用户带来福音。老的万能工具显微镜装上光栅微机系统,精度可达±1.5μm,检测效率可提高3~10倍,并能大大减轻检测人员的劳动强度,用户已获明显的效益。  相似文献   

11.
工程表面粗糙度两用测量系统   总被引:5,自引:0,他引:5  
介绍了一种新型工程表面粗糙度两用测量系统的设计原理、仪器结构及测试结果。该系统可采用接触法和非接触法两种测量方式,接触法测量范围达±100μm,最小分辨率为0.005μm;非接触法测量范围达±250μm,最小分辨率为0.01μm。  相似文献   

12.
以激光CD 光学头为基础,提出新颖的自聚焦伺服测微工作原理,并以此原理试制测微仪。利用半导体激光器作光源,CD 光学头作高精度位移检测传感器,并利用高分辨率、高动态响应的压电晶体作微位移驱动源,建立实时闭环反馈的自聚焦伺服系统,由单片机进行控制,实现自动跟踪测量。系统首先在±500μm 范围内进行寻焦搜索,实现光学头聚焦于被测表面,随后立即进入闭环聚焦伺服状态,对微位移进行检测。可获得±0.1μm 以上的测量精度,测量范围±10μm ,测量形式为非接触测量。同时,该测微仪还有成本低、体积小、使用方便等优点,是一种值得推广的新方法。  相似文献   

13.
This paper presents a long-stroke contact scanning probe with high precision and low stiffness for micro/nano coordinate measuring machines (micro/nano CMMs). The displacements of the probe tip in 3D are detected by two plane mirrors supported by an elastic mechanism, which is comprised of a tungsten stylus, a floating plate and two orthogonal Z-shaped leaf springs fixed to the outer case. A Michelson interferometer is used to detect the vertical displacement of the mirror mounted on the center of the floating plate. An autocollimator based two dimensional angle sensor is used to detect the tilt of the other plane mirror located at the end of the arm of the floating plate. The stiffness and the dynamic properties are investigated by simulation. The optimal structural parameters of the probe are obtained based on the force-motion model and the constrained conditions of stiffness, measurement range and horizontal size. The results of the performance tests show that the probe has a contact force gradient within 0.5 mN/μm, a measuring range of (±20 μm), (±20 μm), and 20 μm, respectively, in X, Y and Z directions, and a measurement standard deviation of 30 nm. The feasibility of the probe has preliminarily been verified by testing the curved surface of a convex lens.  相似文献   

14.
In ISO 14405-1, the global sizes, such as least-squares diameter, minimum circumscribed diameter and maximum inscribed diameter are defined. The diameters above can be measured by using cylindrical coordinate measuring method like the circular section measuring method of cylindricity error. The determination method of the least-squares diameter was firstly given based on the cylindrical measuring system, and the optimization models of the minimum circumscribed diameter and the maximum inscribed diameter were built, respectively. The corresponding objective functions were unified as “minimax” expressions. For the four axis parameters of the cylinder with the minimum circumscribed diameter or the maximum inscribed diameter, the searching ranges of cylinder’s axis parameters for their optimal solutions were defined numerically. Thereafter, the genetic, steepest decent and BFGS-0.618 algorithms were introduced, and the optimization evaluation algorithms of two kinds of diameters mentioned above were given. Based on many cylinders’ profiles obtained by the circular section measuring method on a measuring instrument of cylinder’s global sizes which was developed by Zhongyuan University of Technology, Zhengzhou, China. The accuracy, efficiency and suitability of three optimization algorithms were investigated through the evaluation of a lot of the minimum circumscribed diameters and the maximum inscribed diameters. The measurement uncertainty of the global sizes for the cylindrical specimen was analyzed, and the measurement uncertainties of the sizes in the radial and z directions are ±0.95 μm and ±0.5 μm, respectively. The total measurement uncertainties of the global sizes of the cylindrical specimens with the specifications of ϕ10 × 120 mm and ϕ100 × 300 mm are ±3.8 μm and ±5.7 μm, respectively. The investigation results showed that for the evaluation of the globe sizes, any one of three algorithms above is not absolutely prior to the other two algorithms while considering both evaluation accuracy and efficiency, and the difference of their evaluation results do not exceed 0.5 μm. On the other hand, many points between the maximum value and the least value do not affect the evaluation results in optimization process. For improving the evaluation efficiency, by de-selecting those points while considering the characteristic parameter was also studied based on the statistic method and experiment. Coefficient t should be less than 0.3 to ensure the evaluation accuracy. This research may be useful for developing the next generation measurement instrument for the global sizes and the way forward for the digital manufacturing.  相似文献   

15.
以双盘式渐开线测量装置为研究对象,研究了对此装置的微机误差补偿方法。从众多的误差源中选出最大的三种误差进行补偿,使装置不确定度由原来的≤±0.7μm下降到≤±0.5μm.  相似文献   

16.
干涉测距系统中的光程定位   总被引:1,自引:1,他引:0  
提出一个由定位干涉仪和测量干涉仪两部分组成的光纤干涉距离测量系统,并采用标准长度光纤实现量程倍增以增大测量范围。文中重点讨论了用准单色光源脉冲电流调制干涉实现光程定位的方法及其精度,通过理论分析和仿真实验可知,定位重复性误差优于±1μm.  相似文献   

17.
本装置是一多功能光谱测试装置,适用于对红外探测器作宽范围光谱灵敏度的测量,以及红外光源光谱能量分布测量。整个装置由光学系统、电信号处理系统和数据自动记录系统组成。光谱响应的波长范围为1~50μm,在1~10μm波长范围内已校正的波长准确度为±0.1μm,其相对光谱灵敏度分布的重复性为2%。由于采用参比探测器方法组成双光路分光系统,以及锁相放大技术,消除了辐射源光谱分布的选择性和反射及吸收形成的能量损失对测量带来的影响。同时有效地抑制了噪声,提高了系统测试的信噪比,使装置的噪声等效功率达到NEP<7×10~(-11)W/HZ1/2。  相似文献   

18.
Measurements of penetration on silicon and austenitic stainless steel have been continued using the same criteria as previously reported (Thomas, 1968) up to 2.5 MeV using the 3 MeV Toulouse electron microscope. The results show that penetration increases to about 14 μm at 2.5 MeV for silicon although the curve starts to flatten out above 1.5 MeV, but no significant gain was found for stainless steel ?2μm at 2.5 MeV). Primary knock-on damage occurs readily in both materials. The critical voltages for 440 silicon and 422 tantalum were measured, and both found to be 1.4 MeV (± 10 kV). Attempts to measure the variation of radiation damage with beam voltage in crystalline amino acids as indicated by the fading of diffraction patterns indicated that the damage rates apparently decrease as the voltage is raised to 2.5 MeV. However, it was not possible to determine this variation quantitatively because of difficulties in measuring the absolute values of the critical exposures.  相似文献   

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