共查询到19条相似文献,搜索用时 140 毫秒
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采用双曲正切函数的经验描述方法和器件物理分析方法,建立了适用于亚微米、深亚微米的LDD MOSFET输出I-V特性解析模型,模型中重点考虑了衬底电流的作用.模拟结果与实验有很好的一致性.该解析模型计算简便,对小尺寸器件中的热载流子效应等能够提供较清晰的理论描述,因此适用于器件的优化设计及可靠性分析. 相似文献
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提出了一个新的解析的适用于SOI MOSFET's的高频噪声模型.该模型通过耦合能量平衡方程克服了以往噪声模型所具有的缺点,并对短沟SOI器件的噪声给出精确地描述.同时,利用该模型可以容易地计算出相对于最小噪声值处的优化的栅源电压,为低噪声的电路设计提供优化的设计方向.由于该噪声模型的简单性,可以很方便地将模型植入电路模拟器如SPICE中完成电路设计. 相似文献
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SiGe基区异质结晶体管电流和频率特性的解析模型 总被引:1,自引:0,他引:1
给出了一个适用于分析SiGe基区异质结晶体管电流和频率特性的解析模型,并利用该模型分析了基区掺杂和组分均级变的SiGe异质结晶体管的电流增益、截止频率、最高振荡频率。模型中考虑了由于基区重掺杂和Ge的掺入引起的禁带窄变效应、载流子速度饱和效应。解析模型的计算结果与实验的对比证实了本模型可适用于器件的优化设计和电路的模拟。 相似文献
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对溶亚微米器件,由于工作电压下降,要求重新确定LDD和常规MOSFET在VLSI中的作用。本文从基本器件数理方程发出,对深亚微米常规及LDD MOSFET的器件特性、热载流子效应及短沟道效应进行了二维稳态数值模拟,指出了常规和LDD MOSFET各自的局限性,明确了在深亚微米VLSI中,LDD仍然起主要作用。 相似文献
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Wang H.H.-C. Diaz C.H. Boon-Khim Liew Sun J.Y.-C. Tahui Wang 《Electron Device Letters, IEEE》2000,21(12):598-600
This letter presents a deep submicron CMOS process that takes advantage of phosphorus transient enhanced diffusion (TED) to improve the hot carrier reliability of 3.3 V input/output transistors. Arsenic/phosphorus LDD nMOSFETs with and without TED are fabricated. The TED effects on a LDD junction profile, device substrate current and transconductance degradation are evaluated. Substantial substrate current reduction and hot carrier lifetime improvement for the input/output devices are attained due to a more graded n/sup -/ LDD doping profile by taking advantage of phosphorus TED. 相似文献
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In this paper, we have demonstrated successfully a new approach for evaluating the hot-carrier reliability in submicron LDD MOSFET with various drain engineering. It was developed based on an efficient charge pumping measurement technique along with a new criterion. This new criterion is based on an understanding of the interface state (Nit ) distribution, instead of substrate current or impact ionization rate, for evaluating the hot-carrier reliability of drain-engineered devices. The position of the peak Nit distribution as well as the electric field distribution is critical to the device hot-carrier reliability. From the characterized Nit spatial distribution, we found that the shape of the interface state distribution is similar to that of the electric field. Also, to suppress the spacer-induced degradation, we should keep the peak values of interface state away from the spacer region. In our studied example, for conventional LDD device, sidewall spacer is the dominant damaged region since the interface state in this region causes an additional series resistance which leads to drain current degradation. LATID device can effectively reduce hot-carrier effect since most of the interface states are generated away from the gate edge toward the channel region such that the spacer-induced resistance effect is weaker than that of LDD devices 相似文献
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The numerical simulation of two dimensional device is conducted to describe the mechanism of the special substrate current and degradation of submicron LDD structure observed in experiments, and finally, the optimum processes for submicron LDD CMOS are proposed. 相似文献
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The numerical simulation of two dimensional device is conducted to describe the mechanism of the special substrate current
and degradation of submicron LDD structure observed in experiments, and finally, the optimum processes for submicron LDD CMOS
are proposed. 相似文献
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Woo-Hyeong Lee Young-June Park Jong Duk Lee 《Electron Device Letters, IEEE》1993,14(12):578-580
To improve the performance and reliability of deep submicron MOS devices, a gate-recessed MOSFET (GR-MOSFET), which has a selectively halo-doped recessed channel and a deep graded source/drain formed without counterdoping, is proposed. The GR-MOS structure, which adopts a new doping concept, eliminates the tradeoff between drain-induced barrier lowering (DIBL) and hot-carrier effect, which are important to deep submicron device design. It also reduces the VT lowering effect and the lateral electric field at the drain. A 0.25-μm GR-MOSFET with a 10-nm gate oxide has exhibited 15% higher transconductance and 10% increased saturation current at VD=V G=3.3 V, 1 V higher BVDSS, and six times less substrate current compared with an LDD-MOSFET of the same device dimensions 相似文献