宽带放大器可靠性问题浅析

叙述了国产高频宽带放大器的质量和可靠性现状，详细介绍了这类产品的质量一致性检验、可靠性摸底试验和现场使用过程中出现的可靠性问题，用统计的方法得出了可靠性特征量，通过对失效样品的失效分析，总结出宽带放大器主要的失效模式和失效机理，并提出了消除和减少失效、提高宽带放大器可靠性的措施和建议。     

失效分析结果在元器件可靠性设计中的应用

本文从阐述失效分析的主要任务和电子元器件可靠性设计的基本概念入手，探讨了失效分析与元器件可靠性设计之间的关系，介绍了如何根据不同的失效模式采取相应的可靠性设计技术的基本方法，并用实例说明了失效分析结果在促进电子元器件可靠性设计技术的深入研究和工程应用，以及提高产品可靠性方面所起的重要作用。     

电子元器件的失效分析技术

失效分析是电子元器件的质量和可靠性保证体系的重要组成部分。电子元器件的可靠性是评价可靠性能水平的重要手段,是可靠性研究的基本环节,分析了电子元器件的失效原因。     

MEMS微加速度计在振动环境下的可靠性研究

由于微加速度计的可靠性成为其产品商业化过程中的一个重要问题,而冲击断裂是导致其性能失效的主要原因。主要研究了压阻式微加速度计在振动环境下的可靠性问题。设计了微加速度计在振动环境下的可靠性试验并通过ANSYS进行仿真。经过分析得出微加速度计在振动环境下的主要失效模式,并进行了相应的失效机理分析。通过可靠性实验进行了验证,对微加速度计在振动环境下的可靠性进行评估,并描绘了其可靠度与失效概率曲线。     

集成电路制程可靠性介绍（一）

集成电路制程可靠性是通过特殊设计的电子器件结构来研究集成电路制程工艺相关的可靠性失效模式的物理模型、寿命评估方法,并针对主要失效机理提出对策措施、消除制程开发和生产阶段中的可靠性问题,从而保证集成电路在特定使用年限内的可靠性。表1从可靠性观点的角度,列出了和关键模块相关的失效模式。本文将对这些失效模式的物理图像、模型及重要现象作一简单介绍。     

电子元器件可靠性增长的分析技术

从元器件可靠性物理分析技术角度,系统地阐述了失效信息的收集与分析、失效分析、破坏性物理分析、密封器件内部气氛分析、失效模式及机理与工艺的相关性分析、失效模式与影响分析等元器件的质量与可靠性分析技术。将元器件质量与可靠性分析技术融入元器件产品设计、制造过程是实现元器件可靠性增长的必然趋势。     

塑封双极型功率晶体管的失效与案例分析

由于其自身的结构与封装形式,塑封双极型功率管存在很多可靠性问题.介绍了塑封双极型功率晶体管可靠性问题及失效机理,包括封装缺陷、粘结失效以及由于温度变化而引起的热应力失效和由于吸入潮气而导致的腐蚀失效.通过剖析一晶体管的失效机理,给出了对此类晶体管失效分析的方法和思路.讨论了晶体管存在异物、芯片粘结失效和热应力失效等失效模式.     

一种无失效数据可靠性分析的方法

系统集成中的产品可靠性分析不少具有无失效数据的特征。该文运用Bayes方法对无失效数据问题进行有效的可靠性分析,分析了无失效数据产生的原因,并提出了运用黄金分割系数求失效概率P赞Bi的方法。     

失效电子元器件分析方法

介绍了一种电子元器件失效分析方法,给出了失效器件失效的统计要素,并对失效要素进行分析、研究失效模式与失效机理,找出失效原因,找到生产过程中的薄弱环节,制定相应措施,及时有效预防器件的再次失效,提高电子元器件的使用可靠性,进而提高整机可靠性,以较小的质量成本获取较高的经济效益,避免产品出现重复性问题,最终达到控制质量成本的目的。     

产品可靠性测试失效的预分析

产品可靠性测试的失效分析是半导体失效分析的重要也是极具挑战性的部分。而物性失效分析前的预分析（包括电性失效分析）又是整个产品可靠性失效分析中的关键步骤。充分和合理的预分析是提高物性失效分析成功率的重要保障。本文主要根据不同的产品可靠性测试的失效类型和机理来介绍常用的预分析方法和手段,并通过具体的实例图片来阐述预分析的重要作用。将预分析融合于产品可靠性失效分析中,将取得事半功倍的效果。     

一种星载电子产品老练试验加速因子估计方法

提出一种基于可靠性预计数据的星载电子产品老练试验加速因子的估计方法。在该方法中,温度对产品失效过程的影响通过器件失效率预计模型中的温度应力参数予以刻画。通过比较产品在工作环境温度与老练试验温度下的预计失效率数据来估计老练试验加速因子。该方法简单、易行,含义明确,有望增强可靠性评估结果与可靠性预计结果的可比性。     

竞争硬故障与软故障失效模式产品的可靠性分析

根据系统可靠性理论,考虑到硬故障和软故障两种竞争失效模式对产品失效的影响,对传统的可靠性分析方法进行了扩展。研究了满足硬故障和软故障竞争失效规则的产品可靠性函数和失效率函数。并通过不同的失效模式之间的关系。得到产品在不同的硬、软故障模式下的失效分布函数。另外还给出一个简单的算例来说明该分析方法的应用。该分析方法可能更符合机电产品的失效规律。     

Development of a high-resolution quartz resonator force and weight sensor with increased reliability

Test-analyze-and-redesign method is employed to develop a quartz crystal resonator (QCR) force and weight sensor with increased reliability for batch production. The sensor, which mainly consists of a QCR and a metal diaphragm structure, has the advantages of high resolution, digital output, and low cost. The failure mechanism of the single-diaphragm QCR sensor has been uncovered by experiments aiming at providing insight into the failure factors. In order to eliminate the failure stress and improve reliability, the sensor has been redesigned based on failure analysis results by designing a double-diaphragm structure. Life testing experiments for validating the effect of the corrective action show that reliability has been improved five times, and after redesign, the reliability satisfies the requirement of practical use. Accelerated life testing is performed to find acceleration factors and development stresses for batch production.     

Reliability matrix solution to multiple mechanism prediction

We present a method for predicting the failure rate and thus the reliability of an electronic system by summing the failure rate of each known failure mechanism. We use a competing acceleration factor methodology by combining the physics of failure for each mechanism with its own effect as observed by High/Low temperature and High/Low voltage stresses. Our Multiple High Temperature Overstress Life-test (M-HTOL) method assumes that the lifetime of each failure mechanism follows constant rate distribution whereby each mechanism is independently accelerated by its own stress factors. Stresses include temperature, frequency, current, and other factors that can be entered into a reliability model. The overall failure rate thus, also follows an exponential distribution and is described as the standard FIT (Failure unIT or Failure in Time). This method combines mathematical models for known failure mechanism and solves them simultaneously for a multiplicity of accelerated life test results to find a consistent set of weighting factors for each mechanism. The result of solving the system of equations is a more accurate and a unique combination for each system model by proportional summation of each of the contributing failure mechanisms.     

基于加速性能退化试验的板级可靠性评估

传统的可靠性评估方法一般基于失效寿命数据,而目前对于高可靠长寿命的电子产品,很难通过加速试验获得其失效寿命时间。为解决这一矛盾,将性能退化理论引入到传统可靠性评估中,提出了基于失效数据及加速性能退化的可靠性评估的新方法。应用某型雷达24V/2A稳压电源板加速性能退化试验进行验证,结果表明该方法用于高可靠长寿命电子装备的可靠性评估是正确有效的。     

Impact of component placement in solder joint reliability

Component placement in an electronic product is usually derived using manufacturability or electromagnetic effects as the defining factors. The effect of placement on component reliability is rarely studied. High integration level of modern products provides advantages in high speed electronics but can severely degrade the reliability of components, unless certain design rules are met.In this paper the relation between placement and the solder joint reliability of a BGA components is studied with computational methods in 3-D and verified with experimental tests. Finite element method is utilized to calculate the accumulation of plastic work in solder joints. Based on the failure criteria obtained in the process, simple design rules are extracted and presented.     

空间通信中的网络可靠性分析

为研究空间通信网络的可靠性,首先介绍了空间通信环境特点及通信网络的可靠性理论基础,然后讨论了通信网络的可靠性评价指标,包括抗毁性、生存性、有效性及其计算方法。由于网络可靠性评估涉及的因素较多且相互影响,采用建立网络可靠性模型方法以研究网络部件失效及修复的情况,应用概率分析方法得到系统可靠性的数学模型,并给出了系统可靠性与节点和链路可靠性的关系,可供空间网设计参考。     

大型雷达装备使用可靠性评估

为查找制约大型雷达装备可靠性提高的薄弱环节,提高雷达战备完好性,建立了一种基于重要性的可靠性评估模型,并依据外场统计故障数据,利用该模型对某大型雷达发射系统的使用可靠性进行了评估。首先,针对大型雷达装备的特点,采用层次分析方法（AHP）,建立了具有3层评估指标的整机使用可靠性评估系统;其次,运用数理统计的方法,根据相同类型故障的寿命分布模型计算其可靠性指标;最后运用加权融合的方法获得部件系统及整机的平均故障间隔时间,用以评估雷达的使用可靠性,为大型雷达装备科学维修、设计改进以及新装备研制提供了参考。     

Evaluation of board-level reliability of electronic packages under consecutive drops

In general, the drop reliability of a board-level electronic package is characterized by the number of drops to failure according to a certain failure criterion. This implies that damage of solder joints evolves during each drop and eventually leads to failure. Development of a numerical method capable of obtaining accumulated stresses and strains under consecutive drop conditions is therefore in need because without these damage factors, accurate predictions for the board-level drop reliability of electronic packages are unattainable. We implement in this paper the support excitation scheme incorporated with the implicit time integration scheme to study transient structural responses of a board-level chip-scale package subjected to consecutive drops. Accumulated stresses, plastic strains, and plastic strain energy densities on the solder joints under repetitive drop impacts are investigated.