Large-Format Voltage-Tunable Dual-Color Midwavelength Infrared Quantum-Well Infrared Photodetector Focal Plane Array

We report a large-format (640 times 512) voltage-tunable quantum-well infrared photodetector (QWIP) focal plane array (FPA) for dual-color imaging in the midwavelength infrared (3-5 mum) band. Voltage-tunable spectral response has been achieved through series connection of two eight-well stacks of AlGaAs-InGaAs epilayers grown by molecular beam epitaxy on GaAs substrate. The peak responsivity wavelength of the detectors is shifted from 4.1 mum (color 1) to 4.7 mum (color 2) as the bias is increased within the limit applicable by commercial read-out integrated circuits. The operability of the FPA is ~99.5% with noise equivalent temperature differences of ~60 and 30 mK (f/1.5) in color modes 1 and 2, respectively. To our knowledge, this is the first large-format voltage-tunable dual-color QWIP FPA reported for midwavelength thermal imaging.     

Comparison of Long-Wave Infrared Quantum-Dots-in-a-Well and Quantum-Well Focal Plane Arrays

This paper reports on a comparison between a commercially available quantum-well infrared focal plane array (FPA) and a custom quantum-dot (QD)-in-a-well (DWELL) infrared FPA in the long-wave infrared (LWIR). The DWELL detectors consist of an active region composed of InAs QDs embedded in $ hbox{In}_{.15}hbox{Ga}_{.85}hbox{As}$ quantum wells. DWELL samples were grown using molecular beam epitaxy and fabricated into 320 $times$ 256 pixels FPA with a flip-chip indium bump technique. Both the DWELL and QmagiQ commercial quantum-well detector were hybridized to an Indigo ISC9705 readout circuit and tested in the same camera system. Calibrated blackbody measurements at a device temperature of 60 K with LWIR optics yield a noise equivalent change in temperature of 17 mK and 91 mK for quantum-well and DWELL FPAs operating at 0.95- and 0.58-V biases, respectively. The comparison of the DWELL and quantum-well FPA when imaging a 35 $^{circ}hbox{C}$ black body showed that the DWELL had a signal-to-noise ratio of 124 while the quantum-well FPA showed 1961. As well, the quantum-well FPA showed a higher collection efficiency of 1.3 compared to the DWELL.      

Large-Format Voltage-Tunable Dual-Band Quantum-Well Infrared Photodetector Focal Plane Array for Third-Generation Thermal Imagers

We report a large-format (640 times 512) voltage- tunable quantum-well (QW) infrared photodetector focal plane array (FPA) for dual-band imaging in the mid- and long-wavelength infrared (MWIR and LWIR) bands. Voltage-tunable spectral response has been achieved through a series connection of eight-well MWIR AlGaAs-InGaAs and 16-well LWIR AlGaAs-GaAs QW stacks grown by molecular beam epitaxy on GaAs substrate. The peak responsivity wavelength of the detectors is shifted from 4.8 to 8.4 mum as the bias is increased within the limit applicable by commercial read-out integrated circuits. The FPA with MWIR and LWIR cutoff wavelengths of 5.1 and 8.9 mum provides noise equivalent temperature differences of 20 and 32 mK (f/1.5) in these bands, respectively. The results are very encouraging for the development of low-cost large-format dual-band MWIR/LWIR FPA technology.     

Large Format AlInAs–InGaAs Quantum-Well Infrared Photodetector Focal Plane Array For Midwavelength Infrared Thermal Imaging

We report the first large format (640times512) AlInAs-InGaAs quantum-well infrared photodetector (QWIP) focal plane array (FPA), and investigate the characteristics of AlInAs-InGaAs QWIPs both at pixel and FPA level. The measurements on the detectors fabricated with molecular beam epitaxy grown epilayer structure including 30 InGaAs quantum wells (26 Aring thick, N_D=2times10¹⁸ cm^-3) yielded very promising characteristics. The detectors with lambda_p=4.2 mum and Deltalambda/lambda_p=25% displayed a background-limited performance temperature as high as 105 K with f/2 aperture. The noise equivalent temperature difference of the FPA is as low as 23 mK (f/1.5) at 105-K sensor temperature with 99.6% operability. These results are comparable to the best results reported for AlGaAs-InGaAs midwavelength infrared QWIPs showing the promise of this material system for completely lattice-matched multiband QWIP FPAs.     

InGaAs红外焦平面

本文概括了国内外InGaAs红外焦平面的研究现状、发展趋势和基本性质。介绍了几种InGaAs红外焦平面的结构和工作原理,及其在军用、民用和空间遥感领域的应用前景。对InGaAs焦平面的研究和开发将具有非常重要的意义。     

测辐射热计红外焦平面列阵

非制冷测辐射热计红外焦平面列阵设计为桥式结构,器件制作采用微机械加工技术。工作被段为８￣１２μｍ,热阻达１０＾７Ｋ／Ｗ量级,噪声等效温差为０．１Ｋ。     

碲镉汞多色红外焦平面探测芯片

文章从芯片结构、晶格匹配和PN结性能三个方面对碲镉汞多色焦平面探测芯片技术进行了探讨,结果显示在三种主要的双色探测芯片结构中,单电极和环孔工艺的双色芯片技术相对比较成熟,高难度的刻蚀技术以及所引起的表面反型是制约双电极或多电极多色探测芯片技术发展的主要因素,而环孔技术在发展多色探测芯片方面则有其独到之处,随着探测波段的增加,其工艺难度并没有质的变化。多色探测芯片不同外延层之间的晶格失配以及和Si基衬底之间热失配也是必须加以考虑和解决的一个问题,在现阶段, Si基直接外延、大面积碲锌镉材料和ZnCdTe /Si复合衬底技术并举仍将是明智的选择。在PN结方面,二代焦平面的成结技术在多色器件的宽带结上尚未能够实现,刻蚀反型和深台面侧面钝化的困难依然存在,这些均制约着器件性能的提高,另外,多色芯片的结构和表面加工工艺也影响着探测芯片的光通量利用率和量子效率。     

非致冷测辐射热计红外焦平面阵列

非致冷测辐射热计以其高性能和低价格 ,成为红外热成像技术新的研究热点。焦平面设计为桥式结构 ,器件制作采用微机械加工技术。文章介绍了该器件的设计、制作、性能和应用。     

Demonstration and Performance Assessment of Large Format InP–InGaAsP Quantum-Well Infrared Photodetector Focal Plane Array

There have been various studies showing that InP-InGaAs quantum-well infrared photodetectors (QWIPs) are potential alternatives to AlGaAs-GaAs QWIPs in the long wavelength infrared (LWIR) band, especially for applications requiring high responsivity. Being on InP substrate, this material system also offers lattice matched mid-wavelength infrared (MWIR)/LWIR dual band QWIP stack when it is used with the AlInAs-InGaAs system. It is desirable to extend the cut-off wavelength of InP based LWIR QWIPs to , which can be accomplished by replacing the QW material with InGaAsP. In this paper, we report the first InP-InGaAsP QWIP focal plane array (FPA). The 640 512 FPA displayed remarkably low noise equivalent temperature difference (NETD) with very short integration times (46 mK at 66 K with and f/1.5 optics). The results show that these QWIPs can be operated with high responsivity (1 A/W) while offering bias adjustable gain in a wide range where the detectivity is almost constant at a reasonably high level.     

非致冷红外焦平面阵列用探测材料

非致冷红外焦平面阵列以其高密度、高性能和低成本,成为当前红外热成像技术的研究重点;而探测材料是非致冷红外焦平面阵列的基础。本文重点介绍了目前比较成功的三类非致冷红外焦平面阵列——热电堆型、热敏电阻型和热释电型,在开发过程中所采用的各种探测材料。     

红外焦平面阵列盲元检测技术研究

盲元的数量及其分布对红外焦平面阵列器件成像质量的影响较大.在给出盲元定义的基础上,对盲元的各种产生机理进行了分析,并给出了具体的盲元检测方法,为盲元补偿技术的研究提供了理论基础.     

Quantum Dot Based Infrared Focal Plane Arrays

In the past decade, there has been active research on infrared detectors based on intersubband transitions in self-assembled quantum dots (QDs). In the past two years, at least four research groups have independently demonstrated focal plane arrays based on this technology. In this paper, the progress from the first raster scanned image obtained with a QD detector to the demonstration of a 640 512 imager based on self-assembled QDs is reviewed. In particular, emphasis will be placed on a novel quantum dots-in-a-well (DWELL) design, which represents a hybrid between a conventional quantum-well infrared photodetector (QWIP) and a quantum-dot infrared photodetector (QDIP). In the DWELL detectors, the active region consists of InAs quantum dots embedded in an InGaAs quantum well. Like QDIPs, the DWELL detectors have 3-D confinement and display normal incidence operation while demonstrating reproducible ldquodial-in recipesrdquo for control over the operating wavelength, like QWIPs. Moreover, the DWELL detectors also have demonstrated bias-tunability and multicolor operation in the midwave infrared (MWIR, 3-5 ), long-wave infrared (LWIR, 8-12 ), and very long wave infrared (VLWIR, ) regimes. Recently midformat 320 256 and 640 512 focal plane arrays (FPAs) with an NETD of 40 mK at have been reported. The paper will conclude with a perspective on the future directions on the research on QDIP FPA including enhanced functionality and higher operating temperatures.     

双波段毫米波／红外焦平面列阵

美国中佛罗里达大学CREOL红外系统实验室的研究人员最近研制成功一种基于隙缝天线耦合金属氧化物金属二级管的双波段毫米波与红外焦平面列阵。本文介绍毫米波和红外天线耦合探测器像元的接收特性。     

国外长波红外焦平面列阵现状

文中介绍了长波工外焦平面列阵的国外进展，这些列阵包括碲镉汞光电二极管、肖特基势垒器件、砷化镓／砷铝镓多量子阱光导体、高温超导体以及室温工作的焦平面列阵，其中非制冷的混合式热释电陶瓷和单片式的微型测辐射热计焦平面列阵已进入批理生产阶段。     

HgCdTe微台面红外焦平面技术研究

文章报导了采用液相外延(LPE)生长P型材料、B离子注入成结、全干法深台面刻蚀、深台面侧向钝化及电极引出技术制备出中波320 ×256HgCdTe微台面阵列结构,其相元中心距为30μm,截止波长为5. 0μm。     

红外焦平面阵列非均匀性仿真技术研究

红外焦平面阵列非均匀性的建模和仿真,是红外成像系统仿真中很关键的一部分.根据红外焦平面阵列非均匀性产生的原因和特点,建立了基于空间相关性的探测器响应模型,较基于各探测元间是独立不相关假设下的响应模型更为科学客观.     

红外焦平面阵列器件非均匀性分析

红外焦平面阵列固有的非均匀性严重地制约着其成像系统的成像质量,必须对其进行补偿校正。在深入地研究了非均匀性的各种来源及其表现形式的基础上,论述了校正原理,并提出了一种普遍适用的测量方法。     

9μm截止波长128×128 AlGaAs/GaAs量子阱红外焦平面探测器阵列

报道了128×128 AlGaAs/GaAs量子阱红外焦平面探测器阵列的设计和制作.采用金属有机化学气相淀积外延技术生长外延材料,并在GaAs集成电路工艺线上完成工艺制作.为得到器件参数,设计制作了台面尺寸为300μm×300μm的大面积测试器件;77K下2V偏压时暗电流密度为1.5×10-3A/cm2;80K工作温度下,器件峰值响应波长为8.4μm,截止波长为9μm,黑体探测率DB 为3.95×108(cm·Hz1/2)/W.将128×128元 AlGaAs/GaAs量子阱红外焦平面探测器阵列芯片与相关CMOS读出电路芯片倒装焊互连,在80K工作温度下实现了室温环境目标的红外热成像,盲元率小于1%.     

9μm截止波长128×128 AlGaAs/GaAs量子阱红外焦平面探测器阵列

报道了128×128 AlGaAs/GaAs量子阱红外焦平面探测器阵列的设计和制作.采用金属有机化学气相淀积外延技术生长外延材料,并在GaAs集成电路工艺线上完成工艺制作.为得到器件参数,设计制作了台面尺寸为300μm×300μm的大面积测试器件;77K下2V偏压时暗电流密度为1.5×10-3A/cm2;80K工作温度下,器件峰值响应波长为8.4μm,截止波长为9μm,黑体探测率DB 为3.95×108(cm·Hz1/2)/W.将128×128元 AlGaAs/GaAs量子阱红外焦平面探测器阵列芯片与相关CMOS读出电路芯片倒装焊互连,在80K工作温度下实现了室温环境目标的红外热成像,盲元率小于1%.     

Monolithic Integration of Diffractive Microlens Arrays and Infrared Focal Plane Arrays

Monolithic integration method has been demonstrated to increase the fill factor of the infrared focal plane arrays (IRFPA). Which is consists of 256×256 Pt-Si schottky barrier charge coupled devices(CCD) operation in 3-5μm IR region. The relative silicon 256×256 element diffractive microlens arrays have been fabricated on the back side of the substrate of the IRFPA using binary optics technology. The aligning process between IRFPA and microlens arrays on each side of the substrate has been completed by IR mask aligner. The testing results show that the imaging quality is very good and the average optical response of the IR FPA is increased by a factor of 3.0, which is improved by about 25% compared with the hybrid integration method in the previous work.