A 2-bit miniature X-band MEMS phase shifter

The design and performance of a compact low-loss X-band true-time-delay (TTD) MEMS phase shifter fabricated on 8-mil GaAs substrate is described. A semi-lumped approach using microstrip transmission lines and metal-insulator-metal (MIM) capacitors is employed for the delay lines in order to both reduce circuit size as well as avoid the high insertion loss found in typical miniaturized designs. The 2-bit phase shifter achieved an average insertion loss of -0.70 dB at 9.45 GHz, and an associated phase accuracy of /spl plusmn/1.3/spl deg/. It occupies an area of only 5 mm/sup 2/, which is 44% the area of the smallest known X-band MEMS phase shifter . The phase shifter operates over 6-14 GHz with a return loss of better than -14 dB.     

W-band CPW RF MEMS circuits on quartz substrates

This paper presents W-band coplanar waveguide RF microelectromechanical system (MEMS) capacitive shunt switches with very low insertion loss (-0.2 to -0.5 dB) and high-isolation (/spl les/ -30 dB) over the entire W-band frequency range. It is shown that full-wave electromagnetic modeling using Sonnet can predict the performance of RF MEMS switches up to 120 GHz. Also presented are W-band 0/spl deg//90/spl deg/ and 0/spl deg//180/spl deg/ switched-line phase shifters with very good insertion loss (1.75 dB/bit at 90 GHz) and a wide bandwidth of operation (75-100 GHz). These circuits are the first demonstration of RF MEMS digital-type phase shifters at W-band frequencies and they outperform their solid-state counterparts by a large margin.     

Distributed MEMS analog phase shifter with enhanced tuning

The design, fabrication, and measurement of a tunable microwave phase shifter is described. The phase shifter combines two techniques: a distributed capacitance transmission line phase shifter, and a large tuning range radio frequency (RF) microelectromechanical system (MEMS) capacitor. The resulting device is a large bandwidth, continuously tunable, low-loss phase shifter, with state-of-the-art performance. Measurements indicate analog tuning of 170/spl deg/ phase shift per dB loss is possible at 40 GHz, with a 538/spl deg/ phase shift per centimeter. The structure is realized with high-Q MEMS varactors, capable of tuning C/sub max//C/sub min/= 3.4. To our knowledge, this presents the lowest loss analog millimeter wave phase shifter performance to date.     

Design and modeling of 4-bit slow-wave MEMS phase shifters

A true-time-delay multibit microelectromechanical systems (MEMS) phase-shifter topology based on impedance-matched slow-wave coplanar-waveguide sections on a 500-/spl mu/m-thick quartz substrate is presented. A semilumped model for the unit cell is derived and its equivalent-circuit parameters are extracted from measurement and electromagnetic simulation data. This unit cell model can be cascaded to accurately predict N-section phase-shifter performance. Experimental data for a 4.6-mm-long 4-bit device shows a maximum phase error of 5.5/spl deg/ and S/sub 11/ less than -21 dB from 1 to 50 GHz with worst case S/sub 21/ less than -1.2 dB. In a second design, the slow-wave phase shifter was additionally loaded with MEMS capacitors to result in a phase shift of 257/spl deg//dB at 50 GHz, while keeping S/sub 11/ below -19 dB (with S/sub 21/<-1.9 dB). The beams are actuated using high-resistance SiCr bias lines with typical actuation voltage around 30-45 V.     

Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems

We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package, we have designed and implemented a 2-bit true-time delay X-band phase shifter using commercially available microelectromechanical switches. The packaged phase shifter has a measured insertion loss of 2.45 plusmn 0.12 dB/bit at 10 GHz. The worst case phase variation of the phase shifter at 10 GHz is measured to less than 5deg. We have also conducted temperature cycling (-65degC to 150degC) and 85/85 to qualify the packaging structures.     

2.4 GHz continuously variable ferroelectric phase shifters using all-pass networks

Continuously variable ferroelectric (BST on sapphire) phase shifters based on all-pass networks are presented. An all-pass network phase shifter consists of only lumped LC elements, and thus the total size of the phase shifter is kept to less than 2.2 mm /spl times/ 2.6 mm at 2.4 GHz. The tunability (C/sub max//C/sub min/) of a BST interdigital capacitor is over 2.9 with a bias voltage of 140 V. The phase shifter provides more than 121/spl deg/ phase shift with the maximum insertion loss of 1.8 dB and the worst case return loss of 12.5 dB from 2.4 GHz to 2.5 GHz. By cascading two identical phase shifters, more than 255/spl deg/ phase shift is obtained with the maximum insertion loss of 3.75 dB. The loss figure-of-merit of both the single- and double-section phase shifters is over 65/spl deg//dB from 2.4 GHz to 2.5 GHz.     

单偏置电压多位分布式MEMS传输线移相器

针对传统多位分布式MEMS传输线(DMTL)移相器需要多个偏置电压控制的问题,提出了一种单电压控制多位DMTL移相器的设计方案。这种移相器的每一位具有不同的弹性系数,因此它们的下拉电压各不相同。给出了这种移相器的相关理论、设计实例及仿真结果。通过仿真结果可知,单偏置电压3位DMTL移相器低位到高位的下拉电压分别为19.73,40.49和74.89 V,低位发生下拉时高位相移偏移小于0.062%(10 GHz,2.925×10-4 rad)。单偏置电压4位DMTL移相器低位到高位的下拉电压分别为19.73,32.55,48.41和74.89 V,低位发生下拉时高位相移偏移小于0.094%(10 GHz,4.425×10-4 rad)。     

一个DC-32GHz两位微机械移相器

采用分布式微机械传输线结构实现了两位移相器,并且为了减小传输线负载电容和驱动电压首次提出了用共面波导传输线来驱动微机械桥的结构(共面波导驱动结构).结果显示驱动电压小于20V,20GHz时两位移相器的相移为0°/20.1°/41.9°/68.2°,插入损耗为-1.2dB.在DC到32GHz的范围内相移具有良好的线性,插入损耗小于-1.8dB,反射损耗好于-11dB.实验结果表明了该结构在高介电常数衬底上制造低插损、宽带数字微机械射频移相器的潜力.     

A compact V-band 2-bit reflection-type MEMS phase shifter

Air-gap overlay CPW couplers and low-loss series metal-to-metal contact microelectromechanical system (MEMS) switches have been employed to reduce the loss of reflection-type MEMS phase shifters at V-band. Phase shift is obtained by changing the lengths of the open-ended stubs using series MEMS switches. A 2-bit [135] reflection-type MEMS phase shifter showed an average insertion loss of 4 dB with return loss better than 11.7 dB from 50 to 70 GHz. The chip is very compact with a chip size as small as 1.5 mm /spl times/ 2.1 mm.     

A 2-bit RF MEMS phase shifter in a thick-film BGA ceramic package

The development of a thick-film hermetic BGA package for a radio-frequency (RF) microelectromechanical systems (MEMS) 2-bit phase shifter is presented. The measured packaged MEMS phase shifter average in-band insertion loss was 1.14 dB with an average return loss of 15.9 dB. The package transition insertion loss was less than 0.1 dB per transition with excellent agreement between simulated and measured results. It was also demonstrated that the RF MEMS phase shift performance could be improved to obtain a phase error of less than 3.3 degrees. The first reported measurements of the average rise and fall times associated with a MEMS circuit (in this case a 2-bit phase shifter) were 26 and 70 /spl mu/s, respectively. The advent of packaged RF MEMS phase shifters will reduce the cost (both design and building) of future phase arrays.     

RF MEMS phase shifters based on PCB MEMS technology

An X-band main-line type loaded line RF MEMS phase shifter fabricated using printed circuit based MEMS technology is reported. The phase shifter provides a phase shift of 31.6/spl deg/ with a minimum insertion loss of 0.56 dB at 9 GHz for an applied DC bias voltage of 40 V. These phase shifters are suitable for monolithic integration with low-cost phased arrays on Teflon or Polyimide such as low dielectric constant substrates.     

A Monolithic Phased Array Using 3-bit Distributed RF MEMS Phase Shifters

This paper presents a novel electronically scanning phased-array antenna with 128 switches monolithically implemented using RF microelectromechanical systems (MEMS) technology. The structure, which is designed at 15 GHz, consists of four linearly placed microstrip patch antennas, 3-bit distributed RF MEMS low-loss phase shifters, and a corporate feed network. MEMS switches and high-Q metal-air-metal capacitors are employed as loading elements in the phase shifter. The system is fabricated monolithically using an in-house surface micromachining process on a glass substrate and occupies an area of 6 cm times 5 cm. The measurement results show that the phase shifter can provide nearly 20deg/50deg/95deg phase shifts and their combinations at the expense of 1.5-dB average insertion loss at 15 GHz for eight combinations. It is also shown by measurements that the main beam can be steered to required directions by suitable settings of the RF MEMS phase shifters.     

A DC to 10-GHz 6-b RF MEMS time delay circuit

A 6-b radio frequency (RF) microelectromechanical system (MEMS) time-delay circuit operating from dc to 10 GHz with 393.75-ps total time delay is presented. The circuit is fabricated on 250-/spl mu/m-thick alumina and uses metal contacting RF MEMS switches to realize series-shunt SP4T switching networks. The circuit demonstrates 1.8+/-0.6 dB of loss at 10 GHz and has linear phase response across the entire band with accuracy of better than a least significant bit for most states.     

五位RF MEMS开关延迟线移相器

设计并研制了一种6～11GHz、超宽带5位RF MEMS开关延迟线移相器,器件实现了5位延迟:λ、2λ、4λ、8λ、16λ。该器件采用微带混合介质多层板技术,分4层制作,尺寸为45mm×20 mm。整个器件包括20个RFMEMS悬臂梁开关,用60～75V的静电压驱动。6～11GHz频带内,对32个相移态的测试结果表明:一般回波损耗S11<-10dB,各状态平均插入损耗为-8～-10dB;中心频率处,器件可实现的最大延迟位时延为1680ps,总时延为3255ps。     

A fully integrated SOI RF MEMS technology for system-on-a-chip applications

In this paper, a silicon-on-insulator (SOI) radio-frequency (RF) microelectromechanical systems (MEMS) technology compatible with CMOS and high-voltage devices for system-on-a-chip applications is experimentally demonstrated for the first time. This technology allows the integration of RF MEMS switches with driver and processing circuits for single-chip communication applications. The SOI high-voltage device (0.7-/spl mu/m channel length, 2-/spl mu/m drift length, and over 35-V breakdown voltage), CMOS devices (0.7-/spl mu/m channel length and 1.3/-1.2 V threshold voltage), and RF MEMS capacitive switch (insertion loss 0.14 dB at 5 GHz and isolation 9.5 dB at 5 GHz) are designed and fabricated to show the feasibility of building fully integrated RF systems. The performance of the fabricated RF MEMS capacitive switches on low-resistivity and high-resistivity SOI substrates will also be compared.     

Broadband 180/spl deg/ bit phase shifter using a /spl lambda//2 coupled line and parallel /spl lambda//8 stubs

In this paper, a broadband 180/spl deg/ bit phase shifter using a new switched-network was presented. The new network is composed of a /spl lambda//2 coupled line and parallel /spl lambda//8 open and short stubs, which are shunted at the edge points of a coupled line, respectively. According to a desired phase shift, it provides a controllable phase dispersive characteristic by the proper determination of Z/sub m/,Z/sub s/, and R values. The 180/spl deg/ bit phase shifter operated at 3 GHz was fabricated and experimented using design graphs which provide the required Z/sub m/,Z/sub s/ values, and I/O match and phase bandwidths. The experimental performances showed broadband characteristics.     

On the feasibility of CMOS multiband phase shifters for multiple-antenna transmitters

We present the design of an integrated multiband phase shifter in RF CMOS technology for phased array transmitters. The phase shifter has an embedded classical distributed amplifier for loss compensation. The phase shifter achieves a more than 180/spl deg/ phase tuning range in a 2.4-GHz band and a measured more than 360/spl deg/ phase tuning range in both 3.5-GHz and 5.8-GHz bands. The return loss is less than -10dB at all conditions. The feasibility for transmitter applications is verified through measurements. The output power at a 1-dB compression point (P/sub 1 dB/) is as high as 0.4dBmat 2.4GHz. The relative phase deviation around P/sub 1 dB/ is less than 3/spl deg/. The design is implemented in 0.18-/spl mu/mRF CMOS technology, and the chip size is 1200/spl mu/m /spl times/ 2300 /spl mu/m including pads.     

A Fast Low-Loss Microstrip p-i-n Phase Shifter

A 4-bit p-i-n phase shifter with low RF attentuation, fast switching time, and low switching power requirements is described. The circuit, made in microstripline, consists of four cells giving phase shifts of 180, 90, 45, and 22.5/sup deg/, respectively. Each cell consists of a 3-dB coupler loaded by two p-i-n diodes. The transmission loss is 1.6 dB /spl plusmn/ 0.2 dB over the operating bandwidth of 11.7-12.2 GHz for a biasing current of only 5 mA/cell. Switching time between phase states is 1 ns.     

K-band HBT and HEMT monolithic active phase shifters using vector sum method

Two monolithic 3-bit active phase shifters using the vector sum method to K-band frequencies are reported in this paper. They are separately implemented using commercial 6-in GaAs HBT and high electron-mobility transistor (HEMT) monolithic-microwave integrated-circuit (MMIC) foundry processes. The MMIC HBT active phase shifter demonstrates an average gain of 8.87 dB and a maximum phase error of 11/spl deg/ at 18 GHz, while the HEMT phase shifter has 3.85-dB average measured gain with 11/spl deg/ maximum phase error at 20 GHz. The 20-GHz operation frequency of this HEMT MMIC is the highest among all the reported active phase shifters. The analysis for gain deviation and phase error of the active phase shifter using the vector sum method due to the individual variable gain amplifiers is also presented. The theoretical analysis can predict the measured minimum root-mean-square phase error 4.7/spl deg/ within 1/spl deg/ accuracy.     

New miniature 15-20-GHz continuous-phase/amplitude control MMICs using 0.18-/spl mu/m CMOS technology

The design and performance of two new miniature 360/spl deg/ continuous-phase-control monolithic microwave integrated circuits (MMICs) using the vector sum method are presented. Both are implemented using commercial 0.18-/spl mu/m CMOS process. The first phase shifter demonstrates all continuous phase and an insertion loss of 8 dB with a 37-dB dynamic range from 15 to 20 GHz. The chip size is 0.95 mm /spl times/ 0.76 mm. The second phase shifter can achieve all continuous phase and an insertion loss of 16.2 dB with a 38.8-dB dynamic range at the same frequency range. The chip size is 0.71 mm /spl times/ 0.82 mm. To the best of the authors' knowledge, these circuits are the first demonstration of microwave CMOS phase shifters using the vector sum method with the smallest chip size for all MMIC phase shifters with 360/spl deg/ phase-control range above 5 GHz reported to date.