TiO2薄膜制备及其氧敏特性

采用直流磁控溅射法制备TiO2薄膜,在不同温度下对薄膜进行退火,研究了薄膜晶体结构随退火温度的转化情况.对TiO2薄膜氧敏器件特性进行了测试,结果表明,在400℃下灵敏度随氧分压增加最快,并且在400℃具有最高的灵敏度.得到的激活能为0.41eV,并对TiO2薄膜氧敏器件的氧敏可逆性进行了讨论.     

一般性问题

TN032005050001TiO2薄膜制备及其氧敏特性/戴振清,孙以材,潘国峰,孟凡斌,李国玉(河北工业大学微电子研究所)//半导体学报.―2005,26(2).―324～328.采用直流磁控溅射法制备TiO2薄膜,在不同温度下对薄膜进行退火,研究了薄膜晶体结构随退火温度的转化情况.对TiO2薄膜氧敏器件特性进行了测试,结果表明,在400℃下灵敏度随氧分压增加最快,并且在400℃具有最高的灵敏度.得到的激活能为0.41eV,并对TiO2薄膜氧敏器件的氧敏可逆性进行了讨论.图5表1参15一般性问题…     

TiO_2薄膜氧敏特性研究

金属氧化物（如ZrO2，TiO2等）随氧分压不同而改变其电导率这一性质被广泛地用来制作氧敏传感器．传统的传感器大多采用体材料或厚膜材料，工作时需加高温．本文描述了TiO2薄膜材料与Pt薄膜形成的肖特基势垒高度随氧分区不同而改变的氧敏现象，测定了该肖特基二极管的氧敏特性，讨论了其敏感机理．     

不同金属掺杂对TiO2薄膜氧敏性能影响

该文讨论了TiO2对氧气的吸附过程及敏感机理、重点分析了掺铁和掺钨对氧敏特性的影响,并比较了两者的异同.制作了掺铁和掺钨的TiO2薄膜,并在400℃下对薄膜氧敏特性进行了测试.结果表明.TiO2具有低电阻的特点,在高温下能够有效感应氧气浓度的变化.     

直流反应磁控溅射法制备锐钛矿TiO2薄膜

采用直流反应磁控溅射的方法，溅射高纯钛靶在玻璃衬底上制备了TiO2薄膜。用XRD测试了TiO2薄膜的结构，研究了工艺因素中衬底温度、溅射气压、氧氩气体流量比和退火温度对薄膜结构的影响。实验结果表明：衬底温度高于200℃、溅射气压不高于0．7Pa、氧氩流量比为1／4、退火温度为650℃时，锐钛矿TiO2薄膜更容易结晶。     

掺TiO2的ZnO薄膜气敏特性研究

用直流磁控溅射法分别在Si(111)基片及陶瓷基片上制备掺有TiO2的ZnO薄膜,并进行500℃、700℃退火处理,对掺杂前后ZnO薄膜进行XRD分析,测试各掺杂样品气敏特性.500℃退火后,各掺杂样品对有机气体有较高的灵敏度,随着掺杂时间延长,气敏特性提高.700℃退火后,2 min掺杂的样品对乙醇有很高的灵敏度和很好的选择性,最佳工作温度为220℃左右.而其他掺杂量的样品对乙醇气体灵敏度低,随着掺杂时间延长,气敏特性降低.     

退火温度对WO_3薄膜结构及气敏性能的影响

采用直流磁控溅射法制备了WO3薄膜,并在350~550℃时对薄膜进行退火处理,研究了退火温度对薄膜结构及气敏性能的影响。结果表明:退火前及350℃退火后的薄膜为非晶态,450℃和550℃退火后的薄膜为WO3–x型晶态;随退火温度的提高,薄膜厚度增加,晶粒度增大。550℃退火后薄膜的厚度,较450℃退火后薄膜厚30nm,晶粒度相差8nm;450℃和550℃退火后的薄膜,在150℃时对体积分数为0.05%的NO2的灵敏度接近于22。     

磁控溅射法制备SnO2-CuO薄膜及其气敏特性研究

用直流磁控溅射法分别在Si及陶瓷管上制备掺有CuO的SnO2纳米薄膜,并用马弗炉进行500 ℃和700 ℃的退火处理.利用气敏测试系统对各样品进行气敏特性测试,500 ℃退火的样品对几种被测气体基本都有较高的灵敏度,且随着工作温度的提升,气敏特性下降.700 ℃退火的样品对乙醇具有很好的选择性,表现较好的灵敏度,当最佳工作电压为6.5 V时,在乙醇气体小注入条件下,对样品的测试体现了样品良好的气敏特性.     

退火温度对SiC薄膜结构和光学特性的影响

采用磁控溅射技术在p-Si基片上制备出SiC薄膜。将样品放在管式退火炉中通N2保护,分别在400℃,600℃,800℃和1 000℃进行退火处理,研究了退火温度对薄膜结构以及光致发光特性(PL)的影响。发现随着退火温度的升高,薄膜的结晶程度变好,SiC在800℃开始有晶相出现,Si—C峰也在向高波数的方向移动,这主要是由于膜中的Si1-xCx的化学计量发生变化。PL谱中的三个峰:322 nm起源于薄膜中的中性氧空缺,370 nm起源于SiC发光,412 nm起源于薄膜中的C簇。     

铟锡氧化程度对ITO薄膜光电特性的影响

采用直流磁控溅射法在普通载玻片上制备了氧化铟锡透明导电薄膜(ITO)。制备出的薄膜在大气环境下退火,退火温度分别为100℃、200℃和300℃,保温时间为1h。对薄膜中铟锡原子的氧化程度及其光电特性进行了测试与分析。结果表明:退火温度的升高,有助于提高ITO薄膜中Sn原子氧化程度,从而提高了薄膜在可见光范围内的透射率;退火温度为200℃时,In原子氧化程度较高,薄膜中氧空位数量最多,电阻率最低为6.2×10-3Ω.cm。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.