外加偏压对未退火Co/n-poly-SiGe肖特基接触特性的影响

采用直流离子束溅射法,在n型单晶硅衬底上淀积Si1-xGex薄膜.俄歇电子谱(AES)测得Si1-xGex薄膜的Ge含量约为0.15.对薄膜进行高温磷扩散后,经XRD测试为多晶态,即得n-poly-Si0.85Ge0.15.在n-poly-Si0.85Ge0.15上溅射一层薄的Co膜,做成Co/n-poly-Si085Ge0.15肖特基结样品.在90～332 K范围对未退火样品做I-V-T测试.研究发现,随着外加偏压增大,表观理想因子缓慢上升,肖特基势垒高度(SBH)下降.基于SBH的不均匀分布建模,得到了二者近似为线性负相关的结论.     

结构为Pt/SiNWs/n-Si/Al肖特基二极管的电子特性(英文)

采用湿化学刻蚀法直接在n-Si衬底上制备了硅纳米线(Si NWs),用无电镀法在制备好的硅纳米线上修饰Pt纳米粒子作为上电极以形成结构为Pt/Si NWs/n-Si/Al的肖特基二极管。研究了无电镀参数(如氯铂酸钾K2PtCl6浓度,无电镀时间)对结构为Pt/Si NWs/n-Si/Al的肖特基二极管电流-电压的影响。从所得的电流-电压特性曲线中提取了肖特基二极管的三个特征参数(理想因子、势垒高度以及串联电阻),并分析了这三个特征参数与无电镀参数的关系,从而确定了一个制备结构为Pt/Si NWs/n-Si/Al肖特基二极管的理想条件。研究还发现所制备的肖特基二极管理想因子大于1,势垒高度～0.67eV,与金属铂(Pt)的功函数无关,这些特性可以用巴丁模型来解释。     

ZnO上肖特基接触的研究进展

由于ZnO存在本征施主缺陷(锌间隙和氧空位),使得表面存在较高浓度的施主能级,难以获得肖特基接触.本文回顾了近年来在n型ZnO上制备肖特基接触的研究进展,对n型ZnO上制备肖特基接触的Au、Pt、Pd、Ag等金属方案的性能与特点,以及影响接触性能等因素,如表面处理和退火等进行了分析与归纳.同时,对P型ZnO上难以获得肖特基接触的原因进行了讨论.另外,由于Au、Pt等金属普遍存在热稳定差的问题,会降低ZnO基大功率器件的寿命,寻找能与n型ZnO能形成高热稳定性、低泄露电流、高势垒高度的肖特基接触材料是未来ZnO上肖特基光电器件的发展方向.     

金属/半导体肖特基接触模型研究进展

在分析理想金属/半导体肖特基接触的基础上,概述了一般情形下肖特基接触的形成机理和影响因素。金属/半导体间的界面层使得肖特基势垒高度(SBH)对功函数的依赖减弱,也导致SBH与外加偏压有关。研究证实,多种因素,如界面晶向、原子结构、化学键和结构不完整性等,都会造成SBH的空间不均匀分布。该特性在肖特基接触中普遍存在,并对基于肖特基结的器件工作有显著影响。     

Pt/（Ba0．65Sr0．35）TiO3/Pt漏电流特性研究

利用射频(RF)溅射在Pt/Ti/SiO2/Si衬底上沉积(Ba0.65Sr0.35)TiO3(BST)薄膜,制成Pt/BST/Pt平板电容,研究在正反偏压下BST薄膜漏电流的J-V和J-T特性.反偏压时,上电极Pt和BST薄膜形成肖特基接触,漏电流遵循肖特基发射机制.正偏压时,BST薄膜和下电极Pt界面存在大量的界面态,使得漏电流遵循空间电荷限制电流(SCLC)机制,漏电流密度随偏压的增加而急剧增加,随测试温度的增加而减小产生了PTCR效应.利用深陷阱空间电荷限制电流模型,解释了BST薄膜的PTCR效应受εr(T)和V(Tc/T) 1的共同作用,其中εr(T)的作用占优.     

钛掺入对Cu/Si（100）及Cu/SiO2薄膜体系热稳定性的影响

利用简易合金靶材在Si（100）和SiO2基底上磁控溅射制备了Cu（1.42%Ti）薄膜。研究了少量钛对Cu/Si（100）和Cu/SiO2薄膜体系在573-773 K退火前后的微观组织结构以及界面反应的影响。X射线衍射分析表明,溅射态Cu（Ti）薄膜均呈现Cu（111）和Cu（200）衍射峰,而钛显著增强铜薄膜的（111）织构。对于退火态的Cu（Ti）/Si薄膜体系,由于少量钛在薄膜/基底界面处的存在,起到净化界面作用,促使Cu3Si的形成,从而降低了薄膜体系的热稳定性。但对于Cu（Ti）/SiO2薄膜体系,在773 K退火后,仍然呈现出良好的热稳定性。薄膜截面的结构形貌以及界面处俄歇谱的分析结果都充分证实了上述结果。     

ZnO上欧姆接触的研究进展

为制备高性能的ZnO基器件如UV光发射器，探测器、场效应晶体管，在ZnO上形成优良的金属电极是十分必要的。回顾了近年来ZnO上制备欧姆接触的新进展，对在n型ZnO上制备欧姆接触的Al，A1/Pt，A1/Au，Ti/Al，Ti，AU，Ti/A1/Pt/Au，Re/Ti/Au等金属化方案的性能与特点，以及影响欧姆接触电阻率和热稳定性的因素，如表面处理和退火等进行了分析与归纳。同时，对P型ZnO上难以获得低接触电阻的原因进行了讨论。文章还简要说明了ZnO上透明欧姆接触的研究现状，指出获得低阻、高导电、高透光和高热稳定性的接触是未来ZnO基光电器件的发展方向。     

磁控共溅射Ni3 Al合金薄膜的微观结构及电阻特性

研究了室温下采用直流磁控共溅射法在抛光玻璃和Si基底上沉积Ni3Al合金薄膜的制备工艺、微观结构和电阻特性.采用SEM、EDX、AFM、TEM等测试分析了不同基底、溅射功率、工作气压等因素对薄膜微观结构、成分比和电阻特性的影响.结果表明:采用大功率混合溅射可以得到多晶态Ni3Al纳米合金薄膜,且呈多层岛状生长.所得薄膜具有良好的导电性,与玻璃相比,在Si基底上的薄膜表面光滑平整,晶粒更小,电阻率略大.然而随着厚度的减小,薄膜的电阻率增加迅速,发生金属向绝缘体过渡的相变,而厚度较大时这种现象不明显,这表明Ni3Al薄膜相变与厚度及晶格中氧含量有关.     

室温下Cu／3C—SiC（111）界面形成的研究

用同步辐射光电子能谱(SRPES)和X射线光电子能谱(XPS)的方法研究了室温下Cu/3C-SiC (111) 界面的形成.在超高真空下,Cu慢慢沉积到2ML.Cu2p3/2用XPS测得,结合能从沉积0.08ML时的933.1eV移动到沉积2ML的932.8eV,Si2p用同步辐射光测得,峰位从未沉积时的43.55eV移动到沉积2ML的43.87eV,峰形状未发生变化,表明Cu与衬底之间没有发生化学反应,薄膜的生长开始为二维生长,超过0.1ML时变为三维生长,SiC的表面有表面态存在,当沉积少量的Cu时,表面态消失.随着Cu的沉积价带(VB)发生弯曲,肖特基势垒高度增加,在沉积2ML Cu时肖特基势垒变为1.2eV.     

金属诱导生长多晶锗硅薄膜的电学性能研究

采用超高真空化学气相沉积与金属诱导相结合的方法生长多晶SiGe薄膜。530℃下,金属Ni先与SiGe反应生成Ni硅化物,直至Ni被完全消耗完,接着多晶SiGe薄膜在Ni硅化物上异质生长;首次制作了Al/PolySiGe/Ni Silicide肖特基二极管,对器件的I-V特性测试表明,采用这种结构制备的肖特基结在±1 V时,整流比可达到8 000,而在-2 V时反向漏电流只有10-7A,显示出很好的器件性能。     

The effect of high temperature annealing on Schottky diode characteristics of Au/n-Si contacts

The current-voltage and capacitance-voltage characteristics of Au/n-Si/Al Schottky barrier diode were measured in the temperature range of 100-800 °C. Au/n-Si/Al Schottky barrier diode annealed at temperatures from 100 °C to 400 °C for 5 min and from 500 °C to 800 °C for 7 min in N₂ atmosphere. The electronic parameters such as barrier height and ideality factor (n) of the device were determined using Cheung's method. To determine whether or not a Schottky diode is ideal it can be used the ideality factor (n) found from its forward current-voltage (I-V) characteristics. It has been found that the value of Φ_b (0.82 or 0.83 eV) remains constant up to 500 °C and 0.80 and 0.79 eV in 600, 750 °C respectively in the forward I-V mode. An ideality factor value of 1.04 was obtained for as-deposited sample. The ideality factor n varied from 1.04 to 2.30. The experimental results have shown that the ideality factor (n) values increases with increasing annealing temperature up to 750 °C. This has been explained in terms of the presence of different metallic-like phases produced by chemical reactions between the Au and Si substrate because of the annealing process. The Φ_b (C-V) values obtained from the reverse-bias C⁻²-V curves of the as-deposited and annealed diode are in the range 0.99-1.12 eV. The difference between Φ_b (C-V) and the Φ_b (I-V) is in close agreement with values reported in literature. Besides Fermi energy level and carrier concentration determined by using thermionic emission (TE) mechanism show strong temperature dependence. It has been seen current-voltage characteristics of the diode show an ideal behavior.     

Fabrication and electrical properties of Al/phenolsulfonphthalein/n-Si/AuSb structure

The current-voltage (I-V), capacitance-voltage (C-V) and capacitance-frequency (C-f) characteristics of Al/phenolsulfonphthalein (PSP)/n-Si/AuSb structure were investigated at room temperature. A modified Norde's function combined with conventional forward I-V method was used to extract the parameters including barrier height and the series resistance. The barrier height and series resistance obtained from Norde's function were compared with those from Cheung functions, and it was seen that there was a good agreement between the barrier height values from both method. It was also seen that the values of capacitance were almost independent of frequency up to a certain value of frequency, whereas at high frequencies the capacitance decreased quickly. The higher values of capacitance at low frequencies were attributed to the excess capacitance resulting from the interface states in equilibrium with the n-Si that can follow the alternating current (a.c) signal.     

Efficient speech coding techniques by simplified orthogonal transformation

Abstract

The G _1c –G _15v bandgap of the Al _x Ga_1–x As compound semiconductor with x ranging from 0.06 to 0.87 was determined by fitting their Schottky barrier spectral response with a device model. Since the spectral response near the Al _x Ga₁_ _x As bandgap is proportional to its absorption coefficient, the bandgap could also be obtained by direct extrapolation of the square response versus photon energy curve to zero response. Both results are shown to be in good agreement. Using samples with x larger than 0.48, we could also observe additional responses originated from G _15v to X _1c and L _1c indirect transitions. By using least‐squared fit we obtained not only the X band but also the L band energies. The electrolyte electroreflectance method was also applied to measure the direct bandgap of those samples with x ranging from 0.06 to 0.59, and gave similar results.     

Schottky contacts of refractory metal nitrides on gallium nitride using reactive sputtering

Schottky contacts of refractory metal nitrides formed by reactive sputtering on n-type gallium nitride (GaN) were electrically evaluated, including film resistivity, Schottky characteristics and thermal stability. For the metal nitrides of TiN_x, MoN_x and ZrN_x, resistivities of 108.3, 159.0 and 270.0 μΩcm were obtained, respectively. Current-voltage (I-V) characteristics showed that the ideality factor varied from 1.03 to 1.16, while the Schottky barrier height (SBH) varied from 0.66 to 0.79 eV for the three kinds of Schottky contacts. Especially for the ZrN_x contact, the ideality factor and SBH were improved after annealing at 800 °C for 30 s. Schottky contact utilizing a refractory metal nitride on GaN shows its potential to develop thermally stable GaN devices.     

氧气等离子体处理对AlGaN肖特基接触的影响

研究了不同的干法刻蚀以及氧气等离子体处理条件对AlGaN表面特性的影响。在合适的条件下,氧气等离子体处理可以使AlGaN表面发生氧化,并使肖特基接触的反向漏电流降低两个数量级,反向击穿电压也有显著提高。该方法简单易行,可应用于制备高性能的AlGaN／GaN HEMT器件。     

The determination of interface state energy distribution of the H-terminated Zn/p-type Si Schottky diodes with high series resistance by the admittance spectroscopy

Analysis of Zn/p-Si Schottky diodes (SDs) with high resistivity has been given by admittance spectroscopy. The importance of the series resistance in the determination of energy distribution of interface states and especially their relaxation time in the SDs with high resistivity has been considered. The effect of the series resistance on capacitance-conductance/frequency characteristics has been given by comparing experimental data with theoretical data. The interface state density N_ss from the admittance spectroscopy ranges from 1.0×10¹² cm⁻² eV⁻¹ in 0.720-E_v eV to 2.03×10¹² cm⁻² eV⁻¹ in 0.420-E_v eV. Furthermore, the relaxation time ranges from 4.20×10⁻⁵ s in (0.420-E_v) eV to 3.20×10⁻⁴ s in (0.720-E_v) eV. It has been seen that the interface state density has a very small distribution range (1.0-2.03×10¹² cm⁻² eV⁻¹) that is ascribed to the predominant termination with hydrogen of the silicon surface after HF treatment.     

Au与p-CZT晶体的接触特性及其CZT表面处理状态的影响

对不同腐蚀、钝化表面处理的CZT晶片与Au接触的I-V特性进行了研究.用XPS分析了钝化前后CZT晶体表面成分,发现钝化后CZT晶片表面形成厚度为3.1nm的TeO2氧化层.用Agilent 4339B高阻仪进行未腐蚀、腐蚀与腐蚀钝化的CZT晶片I-V特性测试,结果表明腐蚀和腐蚀钝化均能不同程度提高Au/p-CZT接触的势垒高度,相应地减小了漏电流.     

Structural and electrical properties of InSe polycrystalline films and diode fabrication

Polycrystalline InSe diode structures, which have been known as a phase-change material, were studied for the first time where the current–voltage characteristics show high potential for data storage application. Highly oriented InSe films were prepared onto heated quartz substrates using the co-evaporation technique with 20% Se over pressure followed by 1 h annealing at the growth temperature. The films were characterized by X-ray diffraction, Raman spectroscopy and atomic force microscopy. InSe films were found to grow in 3-dimension with a roughness of around 400 nm. Diode structures were fabricated for the first time using these InSe films with both Mo bottom and Pt top electrodes that show large change in the electrical characteristics upon fabrication procedures. Thick InSe films (800 nm) showed Schottky characteristics, yielding a barrier height of approximately 1.0 eV.