铜铝异步轧制复合压下率对其组织性能的影响

采用异步轧制工艺进行了铜铝薄带的复合,并进行了退火处理,利用金相显微镜、扫描电镜和拉伸试验机进行了复合带组织和性能的研究。结果表明:随着压下率的增大,复合带的剥离强度会明显增加;复合带的延伸率和抗拉强度会随压下率的增加先升高后降低,在65%时复合带延伸率达到最大值;压下率增加会促进界面元素的扩散,铜、铝元素的扩散路径增加;总压下率增加,使得复合带铜侧和铝侧压下率差值减小,变形趋于同步。     

冷拉拔铜包铝细丝的退火工艺与组织性能研究

研究了冷拉拔铜包铝细丝合理的退火工艺及其对材料力学性能、铜包覆层组织及界面扩散层厚度的影响规律.结果表明:铜包铝细丝的最佳退火工艺为300℃×60min.低于200℃退火时,铜包铝细丝铜包覆层处于回复阶段,细丝强度从冷拉态的361MPa急剧下降到236MPa,延伸率略有降低;300℃退火后,铜包覆层的再结晶完成,细丝的抗拉强度下降至约152MPa,延伸率升到最高,达到16.3%;400℃退火后,铜包覆层晶粒显著长大,界面处生成脆性金属间化合物,延伸率急剧下降.界面扩散层的厚度随退火温度和保温时间的增加而增大,当退火温度低于300℃时,扩散层厚度随退火时间增加缓慢;当退火温度高于350℃后,扩散层厚度快速增大.延伸率随扩散层厚度的增加先升高后降低,当界面扩散层厚度为2μm时,铜包铝细丝的延伸率最高.     

磁屏Cu-Fe-Cu叠层材料的轧制复合

选用电工纯铁与无氧铜两种组元材料, 采用轧制复合工艺制备了Cu-Fe-Cu磁屏叠层材料, 对轧合件进行力学性能分析, 并运用金相显微镜、 扫描电镜、 能谱仪等手段分析复合件界面形貌及复合机制。结果表明: 采用50%热轧压下率可使铜、 铁板有效复合, 轧合件内各叠层厚度尺寸稳定、 叠层间平行度良好, 经简单退火后其叠层间无明显扩散发生, 叠层间抗剪切强度达167 MPa, 此时热轧的主要复合机制为机械啮合。     

高温下Al/Cu/Al复合材料界面扩散规律及对导电性能的影响

针对热电池内部导线易腐蚀问题,采用冷轧的方法制备了Al/Cu/Al复合带作为新型导线,应用SEM,XRD,EDX等技术研究了热处理工艺对复合带金属间化合物增长速度以及电导率的影响。结果表明,铜铝复合带抗蚀性和导电性均优于现在广泛使用的纯镍带;高温下复合带有显著的互扩散,扩散层厚度的平方(h²)与保温时间为线性关系,界面的迁移过程受原子的扩散控制;复合带中扩散层相分别是Cu-Cu₉Al₄-Cu₃Al₂-CuAl-CuAl₂-Al,这些低电导率金属间化合物的存在使复合带电导率降低;复合带电导率随扩散层厚度增加而降低表现为3个阶段：(1)快速下降区(<25μm)、(2)减速下降区(25～35μm)、(3)加速下降区(>35μm),导致现象的原因为复合带界面化合物相总含量和其中CuAl₂与Cu₉Al₄含量的相对变化。     

铜铝复合母线槽的技术经济分析

介绍了铜铝复合母线槽的组成结构,对配电干线采用纯铜质母线槽、铜铝复合母线槽及采用铜电缆进行了技术经济分析,结果表明:同等条件下,采用铜铝复合母线槽可以节约投资40%以上.     

热处理工艺对铜铝复合母线排界面性能的影响

使用五机架连轧工艺制备了铜铝复合母线排,通过不同热处理工艺对轧态产品进行处理,使用光学显微镜观察了铜铝界面层的形貌,使用显微硬度计测试了界面层的硬度分布,使用能谱对界面处的成分变化进行了分析。结果表明:温度对界面合金化层的影响作用较大;冷却方式对复合母排的力学性能影响较小,复合母排的表面布氏硬度低于铜层的硬度。     

轧制工艺对热轧钨板材组织和性能的影响

比较了一火一道,一火两道和一火三道的热轧工艺制度对钨板材质量的影响,结果表明:采用传统的一火一道工艺轧制的板材无开裂,工艺可靠,但板材纤维组织粗大,有部分再结晶组织出现,切削和磨削过程中出现掉渣现象;采用一火两道工艺轧制时,通过减少两道次轧制之间的时间,可以充分保证板材轧制温度和塑性,轧制的板材中纤维组织细小均匀,保留部分亚晶粒组织.通过适当延长板材最终退火时间可提高后续加工性能;采用一火三道次轧制时,板材加工温度明显降低,加工后出现明显的边裂,加工性能明显降低.因此,可以采用一火两道次工艺轧制磨光钨板材,从而实现加工工艺的优化.     

轧制工艺对深冲钼带组织和性能的影响

通过轧制温度、轧制方式实验,以及织构和力学性能分析,研究了轧制工艺对液晶显示背光源用的深冲钼带的组织和性能的影响.结果表明:采用低温开坯,然后低温两次交叉轧制,再进行一次交叉轧制的工艺,使钼带在1 000℃退火后具有很强的{001}〈011〉板织构和弱的〈111〉丝织构;钼带纵、横向组织几乎完全一致,都为细小均匀、相互搭接的纤维状组织;钼带经过消除应力退火后,纵、横向不仅都具有较高并相近的延伸率,而且强度也相近,杯突值较高.由于强度和硬度适中,各项性能形成了很好的匹配,使钼带各向异性大大减弱,深冲性能良好.     

包铝镁板轧制复合机理的研究

镁合金由于具有比强度高、比刚度高、电磁屏蔽性能强等特点,而成为当今研究的热点金属材料之一。但是加工变形能力差和不耐腐蚀的缺点限制了镁合金的发展。本文采用轧制复合的方法制备包铝镁板,提高镁合金的加工变形能力和耐腐蚀能力,并研究镁．铝复合机理、工艺制度对镁一铝结合的影响。研究结果表明：镁埠;轧制复合的机制主要是裂口机制,当轧制变形率超过临界值时,才能实现镁-铝良好的结合;轧后退火对镁-铝的结合强度影响很大,退火中镁—铝原子的互扩散有助于提高镁—铝的结合强度,但是中间相的出现大大降低结合强度。     

铸态AZ31镁合金板材等温轧制工艺及组织性能研究

为研究铸态AZ31镁合金轧制工艺及轧制后组织性能,通过试验得到不同道次和变形量对铸态AZ31镁合金板材显微组织和力学性能的影响规律,并采用扫描电子显微镜研究了轧制后板材组织.结果表明,铸态AZ31镁合金板材经等温4道次、等变形量轧制后,板材厚度由20mm变化到4.8 mm,抗拉强度和屈服强度分别达到275 MPa和18...     

High‐performance Cu/Al laminated composites fabricated by horizontal twin‐roll casting

Horizontal twin‐roll casting technology was successfully introduced to produce high‐performance copper/aluminum (Cu/Al) laminated composites. The interface morphology, electrical properties and peeling strength after different annealing and cold rolling processes were investigated and contrasted with Cu/Al clad plates fabricated by conventional methods. The results show that sound metallurgical bonding between the copper and aluminum matrix can be attained after the horizontal twin‐roll casting processes and Al₂Cu is the only intermetallics at the interfacial region, the thickness of interfacial interlayer is about 0.7 μm. The peeling strength is 31.4 N/mm and can be further increased to 37.1 N/mm after annealing at 250 °C. However, higher temperature like 400 °C will cause the excessive growth of intermetallics so that peeling strength sharply decreases to 9.2 N/mm. Electrical conductivity of the clad plate is 51 MS/m. At the same electrical current intensity, the temperature‐rise of the composite plate is between the pure copper plate and the aluminum plate, and closer to the copper plate. All of the properties are outstanding than that of Cu/Al clad plate fabricated by conventional methods.     

层状镁/铝复合板轧制工艺研究进展

镁/铝复合板具有密度小、比强度高和耐腐蚀性好等优点,广泛应用于航空航天、汽车制造等领域.轧制法是目前生产镁/铝复合板最为广泛的一种方法,该法设备简单、操作容易、成本低廉.介绍了普通轧制法、异步轧制法、爆炸+轧制法、累积叠轧法、固-液铸轧法、波-平轧制法6种轧制工艺,以及这些工艺在制备镁/铝复合板时的优缺点.波-平轧制工艺可以提高复合板的平直度,有利于板材后续加工成形.也研究了轧制温度、轧制压下率、轧制速度、轧后退火处理对镁/铝复合板力学性能的影响,镁/铝界面金属间化合物的形成因素,以及化合物层厚度对镁/铝复合板力学性能的影响.     

基于BP神经网络算法的316L不锈钢极薄带热处理力学性能预测

目的 为了预测不锈钢极薄带热处理后的力学性能、优化热处理工艺以及实现热处理工艺的智能控制,构建基于BP算法的神经网络模型。方法 以316L不锈钢极薄带为研究对象,进行热处理试验和拉伸试验,通过以热处理的退火温度、保温时间和取样方向作为输入层参数,以屈服强度、抗拉强度、断后伸长率作为输出层参数,采用BP算法构建了316L不锈钢极薄带力学性能预测的思维进化算法优化BP神经网络模型,并进行模型的预测和应用验证,考虑不同隐含层节点数及不同BP神经网络模型对性能的影响。结果 思维进化算法优化的BP神经网络模型测试集的屈服强度、抗拉强度和断后伸长率的平均相对误差分别为8.92%、5.21%和9.28%,训练集相关系数为0.980 94。思维进化算法优化BP网络单、双隐含层误差总和最低分别为0.578 6和0.546 9,BP网络与思维进化算法优化的BP网络误差总和最低分别为0.579 9和0.546 9。结论 思维进化算法优化BP神经网络模型具有较好的预测能力和泛化能力,以及较高的预测精度。与企业现用生产工艺相比,采用模型优化后热处理工艺的综合力学性能有显著提高。     

工艺参数对连续挤压铜/铝复合接触线成形的数值模拟研究

针对铜铝无法复合成形和铜铝结合面不紧密等问题,采用Deform-3D有限元软件,模拟了铜铝复合接触线连续挤压包覆成形过程,研究了成形过程不同模芯端部导流角、复合变形区长度、坯料与模具表面状态和挤压轮转速对铜铝复合接触线包覆质量的影响.研究结果表明:模芯端部导流角度取45°~30°,复合变形区长度L取5 mm,铜铝结合紧密度高,包覆效果好;提高铜线与铝线之间的摩擦,降低模具与铜线之间的摩擦,有利于实现铜铝流动的同步性;适当提高挤压轮转速有利于铜铝结合面紧密度的提高.在TLJ340连续挤压机上进行了铜铝复合试验,试验结果与数值模拟结果相吻合,成功生产出质量合格的铜铝复合接触线产品.     

铝/钛/铝三层复合板热轧工艺及微观组织研究

钛/铝层状复合材料具有两种材料优异的特性,能够满足一些特殊工程需要。开发了热轧复合技术,成功制备了铝(1100)/钛(TA2)/铝(1100)三层复合板。研究了复合板轧制过程中的关键轧制技术参数(临界压下率和轧制复合工艺条件)。利用光学显微镜和SEM观察了钛/铝复合板及结合界面形貌,分析了不同退火温度对复合板力学性能的影响。基于实验结果,描述了影响复合板质量和有助于提高复合板结合强度的关键工艺过程。     

Magnetic properties of grain oriented ultra-thin silicon steel sheets processed by conventional rolling and cross shear rolling

A new procedure consisting of the cross shear rolling (CSR) and the subsequent tertiary recrystallization annealing under dry hydrogen atmosphere was developed to produce the grain oriented ultra-thin silicon sheets less than 0.1 mm with high magnetic property performance. For comparison, the conventional rolling (CR) was also used to process the grain oriented ultra-thin silicon steel sheets. The effect of processing parameters on magnetic properties of the grain oriented ultra-thin silicon steel sheets was investigated. With the increase of annealing temperature and holding time, magnetic properties of the sheets processed by both rolling methods reach saturation as the result of the proceeding of the tertiary recrystallization. The thin sheets rolled by CSR did achieve better magnetic properties than those rolled by CR.     

Investigation on the bond strength of Al-1100/St-12 roll bonded sheets,optimization and characterization

Al-1100/St-12 aluminum clad steel sheets were produced using roll bonding process at different reductions in thickness and with various supplemental annealing treatments. Experiments were conducted by applying the Taguchi method to obtain optimum condition for maximizing the joint strength. The joint strengths of the bi-layer sheets were evaluated by peel test. The Al/Fe intermetallic phases at the joint interface and the peeled surfaces were examined using scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) and Vickers microhardness test were performed to characterize the intermetallic compounds. The results indicate that at the optimum condition of 0.50 reduction in thickness, 450 °C annealing temperature and 90 min annealing time, the bond strength reaches to the base aluminum sheet strength. In comparison to the reduction in thickness and annealing time, the annealing temperature has the most influence on the joint strength changes. In general, raising the annealing temperature up to 450 °C, increases the joint strength. However, annealing treatment at 500 °C reduces the strength due to the formation of brittle Al/Fe intermetallic layer at the bond interface. Additionally, increasing the reduction in thickness improves the joint strength.     

退火工艺参数及母材性能对取向硅钢超薄带磁性能的影响EI北大核心CSCD

采用EBSD技术对不同退火工艺处理后的冷轧取向硅钢超薄带样品进行研究,分析退火样品的显微组织、织构与磁性能的关系,讨论母材性能对超薄带性能的影响。结果表明:冷轧超薄带的退火组织均匀、Goss取向度高以及母材磁性能优良均可有效提升磁性能;退火升温速率主要影响晶粒尺寸、Goss取向度及磁性能;再结晶的平均晶粒尺寸改变,会影响最终超薄带的磁感应强度及铁损;在900℃退火5 min以上会明显发生再结晶,10~30 min内退火的超薄带磁性能变化较小,退火15 min获得最佳磁性能。此外,在1000℃及1100℃下退火的时间均不宜超过10 min,否则会恶化磁性能。     

退火温度对3．55mm轧制Cu／Fe／Cu复合板组织和力学性能的影响

研究了退火温度对3．55mm轧制Cu／Fe／Cu复合板组织和力学性能的影响。结果表明,采用720℃-730℃的退火温度时,其组织和力学性能较佳。     

SPIF of Cu/Steel Clad Sheet: Annealing Effect on Bond Force and Formability

Clad sheet metals offer a better combination of different properties than a monolithic sheet does. In the present study, the formability of a cold bonded Cu/Steel clad sheet was investigated in single point incremental forming (SPIF). In order to relieve deformation stresses, the sheet was annealed over a range of temperature and time. It was found that the sheet ductility increases as the annealing temperature increases, and as a result the formability increases. On the other hand, the bond force at the interface of constituent sheets was observed to decrease with the increasing of temperature. Moreover, the annealing time was found to have no significant effect both on the formability and bond force. Therefore, performing annealing for low times can satisfactorily serve the purpose. The most appropriate annealing temperature for maximizing the formability was 700°C, because higher temperature was noticed to cause severe delamination of Cu layer, thus deteriorating the clad sheet. As a promising aspect of the study, there was no delamination of laminates during forming till the maximum achievable angle. The correlations presented herein study can act as guideline for the users. This study is the first report of its nature.