热释电型热成像系统的调制斩波器技术

热释电成像系统以电子束扫描或半导体扫描替传统一代热成像系统的光机扫描，加之不需制冷的特点，使其成为廉价、轻巧、高可靠性、低功耗、室温使用的热成像系统。近年来非制冷焦平面探测器技术得到飞速发展，作为热释电型焦平面探测器的配套技术，调制斩波器成为非制冷焦平面热成像系统的关键技术之一。介绍了应用于热释电探测系统的调制斩波器技术，重点分析了热释电型非制冷焦平面热成像系统采用的新型阿基米德螺旋线斩波器技术，并介绍了具有发展前景的新型液晶斩波器技术。     

微型斩波器

光学微型斩波器是一种新型器件，主要用于热释电红外敏感器。本文介绍它的结构、工作原理和制造工艺。     

一种新的小规格热释电摄像管系统

比较了25mm标准热释电摄像管和新的18mm热释电摄像管的特性。新的热释电摄像管的靶面较小(12mm)导致滞后较小、本底电流较低、带宽较窄,因而使得用新的摄像管制成的摄像系统能获得与标准摄像管系统相当的性能。18mm的PEV以摄全景模式操作时,显示出2.5毫微安/℃的灵敏度,对于空间频率每毫米2.5线对的斩波器模式而言,测定的最小可分辨温度为0.4℃。     

热释电材料及其应用

对热释电材料进行了分类 ,对热释电材料、热释电传感器、热释电探测器的性能作了介绍 ,提出了一些改进热释电材料性能的方法 ,对热释电材料的研究现状和应用前景作了探讨。     

320×240热释电IRFPA联调成像系统

对于研制中的混合式红外焦平面阵列(IRFPA)器件,有必要通过联调实验对其进行初步的成像性能评价.基于虚拟仪器技术构建的热释电IRFPA联调成像系统,由红外镜头、斩波器、读出电路驱动信号源、数据采集卡及其接线盒和在LabVIEW平台下开发的成像系统软件等组成.系统充分利用虚拟仪器以软件为核心、模块化开发的特点,对成像信号的采集、图像处理等程序进行了更新和改进.在新研制的320x240热释电IRFPA联调实验中,获得了清楚、稳定的红外热像,为器件进一步的研制和改进奠定了良好基础.     

微桥结构PZT厚膜红外探测器研究

利用KOH溶液腐蚀结合SF6气体干法刻蚀工艺制备了锆钛酸铅(PbZr0.3Ti0.7O3,PZT)厚膜热释电红外探测器,得到了器件Si基背面完全悬空的微桥绝热结构.使用由斩波器调制的黑体辐射,测试了探测器在低频段的电压响应率、噪声等效功率和探测率等参数.结果表明,探测器在调制频率为5.3 Hz时的电压响应率约为4.5×...     

铁电材料红外热释电系数测试研究

基于动态变温方法及间接热释电电流法的原理,设计并研制了一套已获专利授权的动态热释电系数测试系统。介绍了该系统的测量原理、设计方法及组成,用已知热释电系数值的锆钛酸铅（PZT）陶瓷及钽酸锂（LT）单晶作为参考样品对系统进行了调试,并对PZT、聚二氟乙烯（PVDF）及钛酸锶钡（BST）等几种常见的铁电薄膜材料的热释电系数进行了测试。结果表明,热释电系数测试值与参考值吻合很好,而且该系统具有控温精度高（±0.002 ℃）、噪声低（≤14 nV）、测试动态范围大（1×10-11~1×10-4 C·cm-2·K-1）等优点,它不仅能满足传统热释电模式工作的PZT系列材料热释电系数的测试需要,还可用于测量热释电-介电模式工作的BST系列材料的热释电系数。文中所开发的动态法热释电系数测试系统完全可满足未来铁电材料在红外探测应用领域的研究要求。     

非制冷红外探测器用热释电材料的研究进展

分析了热释电非制冷红外探测技术的优势,介绍了当前应用较广泛的各种非制冷红外探测器用热释电材料,即单晶材料、高分子有机聚合物及复合材料和金属氧化物陶瓷及薄膜材料,并预计了热释电材料的发展趋势.指出了铁电性热释电陶瓷材料的优越性,其应用分为正常热释电体、介电测辐射热型热释电体和弥散相变热释电体,并分别列出了具有代表性材料的研究结果.最后,指出了研究高性能、大尺寸、易加工的热释电薄膜材料的制备技术,是未来红外探测器用热释电材料的发展的关键;并在此基础上结合半导体集成3-艺,制备高性能、大规模的热释电红外焦平面阵列.     

热释电探测器在线开关的研究及实现

本文论述了热释电探测器的工作原则，导出探测器电流响应度、电压响应度的解析表达式，介绍了热释电探测器的目前应用，提出并详细讨论了热释电探测器的在线开关应用及其实现方法。     

基于Pspice的热释电红外探测器设计探讨

介绍了热释电红外探测器的结构及工作原理,由热释电效应推导出了热释电电流及电压响应表达式,利用仿真软件Pspice分析了热释电探测器等效电路模型,并在红外专用芯片BISS0001不可重复触发工作方式下给出了探测器的实用电路。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.