微量稀土添加剂对Cu—Ag合金原位纤维复合材料结构与性能的影响

制备了Cu-10Ag和Cu-10Ag-RE（RE=Ce，Y，Gd）合金原位纤维复合材料，研究了它们的显微结构与性能。结果表明，微量RE添加剂对合金铸态组织具有变质和细化作用，增大了（Cu＋Ag）共晶比例和减少了Ag沉淀比例，并能提高合金的再结晶温度和不连续Ag沉淀温度。随真实应变叩增大，复合材料中Ag纤维平均直径d呈η的负指数函数减小：d=d0·exp（-0．228η），而复合材料的应变强度呈η的指数函数增大：σCu/Ag=σ0（Cu）＋[kCu/Agd0^-1/2]exp（η／3）。Cu-10Ag和Cu-10Ag-RE复合材料显示两阶段强化机制：低应变阶段为加工硬化机制，高应变阶段为超细Ag纤维及界面强化机制。微量RE添加剂明显减小凶值，因而明显增高原位纤维复合材料的应变强化速率。     

不同凝固条件制备的Cu-Ag合金原位纤维复合材料的结构与性质

以冷却速率10^1～10^3K/s的不同凝固务件制备了Cu-10Ag合金及其原位纤维复合材料。研究了铸态和形变态合金的结构与性能。铸态合金的结构由Cu相、Ag沉淀相和(Cu Ag)共晶组成。通过大变形发展为Cu—Ag合金原位纳米纤维复合材料，其中由Ag沉淀相所形成的Ag纤维尺寸(d)与真实应变(η)呈指数函数关系：d=C.exp(-0．228η)，(Cu Ag)共晶中Ag层转变为更细的纳米Ag纤维。Cu—Ag合金原位纳米纤维复合材料显示了两阶段应变强化效应：在低真实应变阶段主要表现为加工硬化或位错强化，在高真实应变阶段主要表现为超细Ag纤维强化或界面强化。快速凝固的Cu—Ag合金原位纳米纤维复合材料比慢速凝固材料具有更高的包括极限拉伸强度和电导率在内的综合性能。在形变过程中复合材料的强度与电导率的演变出于相同的结构原因。     

大变形Cu-10Ag原位纳米纤维复合材料

以不同的凝固速率制备了Cu-10Ag亚共晶合金。铸态结构由初生Ag沉淀,(Cu+Ag)共晶和Cu相组成。采用大变形制备了Cu-10Ag合金原位纤维复合材料。其中由初生Ag沉淀相所形成的Ag纤维具有较大直径(d)并可用幂指数关系d=C·exp(-0.228η)拟合,式中η是真实应变,C是与合金原始晶体尺寸有关的系数,而由(Cu+Ag)共晶中的Ag层所形成的Ag纤维具有更细直径(几纳米)。低温中间热处理可进一步细化Ag纤维尺寸和改进性能。经热机械处理的Cu-10Ag合金原位纳米纤维复合材料具有高强度(σb＞1.5 GPa)和高电导率(＞60％IACS)。大变形Cu-10Ag合金原位纳米纤维复合材料显示了两阶段强化效应。讨论了影响Ag纤维尺寸的因素和复合材料的强化与形变机制。     

某些因素对Cu-Ag合金原位复合材料的结构和性能的影响

制备了具有不同Ag含量的Cu-Ag合金及其原位纤维复合材料,增加Ag含量可以细化铸态组织和Ag纤维尺寸,增大合金的极限拉伸强度和电阻率.但当Ag含量＞20%,这种对组织细化和性能影响的趋势减小.研究了凝固条件、微量稀土添加和中间热处理等冶金学因素对低Ag含量的Cu-Ag合金及其原位纤维复合材料的结构和性能的影响,获得了具有拉伸强度σb＞1.5GPa和导电率γ＞60%IACS的Cu-Ag合金原位纤维复合材料.讨论了大变形Cu-Ag合金原位纳米纤维复合材料所显示的两阶段应变强化效应及其机制.     

Cu-Ag合金原位纤维复合材料的沉淀强化效应

研究了形变态Cu-10Ag和Cu-10Ag-RE合金原位纤维复合材料时效强化效应。在300℃以下温度时效显示连续沉淀并导致合金强化，在300℃以上温度时效显示不连续沉淀，析出片层状Ag沉淀并与Cu基体保持共格位向关系。在真应变η=6时效，合金具有高的时效强化效应，其极限拉伸强度增幅可达约12％；而在真应变η=9．8时效，时效强化效应减弱，极限拉伸强度增幅约4％-5％。微量Ce或Y添加剂提高Cu-10Ag合金的时效强化效应及不连续沉淀温度。     

大变形Cu-Ag合金原位纤维复合材料的稳定性

制备了Cu-10Ag和Cu-10Ag-0.05Ce合金,其铸态结构由Ag沉淀、(Cu Ag)共晶和Cu基体组成.采用大变形法制备了两合金的原位纳米纤维复合材料.研究了大变形(真应变ε≥9)合金和时效态合金的结构与性能,观察了Ag沉淀过程.结果表明微量Ce添加剂细化Ag纤维尺寸,提高再结晶温度和不连续沉淀的温度,明显提高形变态、时效态和完全退火态Cu-10Ag合金的拉伸强度,而保持与Cu-10Ag合金相近或相当的导电率.真实应变ε=9.9的大变形Cu-10Ag和Cu-10Ag-0.05Ce合金的抗拉强度分别为1 190和1 430 MPa,导电率分别为68.7%和67.6%IACS,这些性能在低于300℃是稳定的.     

凝固速率对Cu-Ag原位纤维复合材料性能的影响

研究了不同凝固速率对Cu-Ag原位纤维复合材料的显微组织、强度及电阻率的影响，探讨了强化机制。Cu-Ag原位纤维复合材料的强化分为两阶段，即以3位错强化为主和以纤维强化为主；第一阶段到第二阶段的转折点与Ag含量及显微结构尺寸有关。     

Cu-Ag合金原位纤维复合材料的形变特征

制备了Cu-10Ag合金及其原位纤维复合材料,观察与研究了铸态和形变态合金及复合材料的显微结构.铸态合金由Ag沉淀、(Cu Ag)共晶和Cu基体组成,其Ag相通过变形逐步形成纳米尺度Ag纤维,其平均直径可用真实应变η的幂指数d=d0·exp(-0.228η)拟合.复合材料的形变过程包含了滑移、孪生、位错增生与迁移以及Ag纤维与Cu基体间形成的共格位相关系和立方-立方协同形变机制.     

大变形Ag-10Cu原位纤维复合材料的应变强化效应

利用热挤压加冷拉拔制备Ag-10Cu原位纤维复合材料。Ag-10Cu合金铸态及挤压态结构由Ag基体、(Ag+Cu)共晶体和Cu沉淀组成。经大变形后变成Ag基体加Cu纤维的两相组织,合金中的Cu相转变成Cu纤维,其尺寸d随拉拔应变η呈幂指数关系变化,且可拟合为d=d0exp(-0.144η),其中d0是与Cu沉淀初始尺寸有关的系数。讨论了材料强度的两个阶段变化及其强化机制。所制备的材料可以达到抗拉强度接近1GPa及电导率大于60%IACS的较优性能组合。还讨论了中间热处理的影响。     

晶粒尺寸对Fe-20Mn-3Cu-1.3C合金钢加工硬化行为的影响

Fe-20Mn-3Cu-1.3C钢经热轧,冷轧后分别在950、970和1050℃下保温10 min进行再结晶处理,得到平均晶粒尺寸为18.12、24.56和47.00 μm的试样.硬度测试表明,随着晶粒尺寸的增大,合金拉伸变形前的显微维氏硬度而逐渐减小,而合金拉伸变形前后的硬度变化量逐渐增大.拉伸测试表明,在低应变阶段,TWIP钢应变硬化速率随真应变的增加而明显增加,而其增幅未随晶粒尺寸的增大发生明显变化;随着应变的增加,其应变硬化指数增加的幅度随晶粒尺寸的增大而增大.在低应变阶段,位错强化起主要作用;而高应变阶段,孪晶硬化起主要作用.     

合金元素对Cu-Ag合金组织、力学性能和电学性能的影响

采用冷变形及中间热处理方法制备了具有双相纤维复合组织的Cu-Ag合金，研究了成分与组织，性能的关系，随着变形程度的增加，合金强度上升而电导率下降，合金中Ag含量由6％增加至24％时，铸态组织中第二相数量明显增多，变形后能够形成更多的Ag纤维复合相，因而合金强度明显上升，在Cu-6%Ag中添加1％Cr元素可以使合金基体得到进一步强化并在一定程度上细化了Ag纤维相，也可使合金度得到显著改善，在Cu－6%Ag-1%Cr合金中添加微量稀土元素可使Ag纤维分布更为弥散，因而使合金在不降低导电性的同时增加强度，尤其在高强度范围内这种作用更为显著。     

Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In

Nowadays, a major concern of Sn-Cu based solder alloys is focused on continuously improving the comprehensive properties of solder joints formed between the solders and substrates. In this study, the influence of Ag and/or In doping on the microstructures and tensile properties of eutectic Sn-0.7Cu lead free solder alloy have been investigated. Also, the effects of temperature and strain rate on the mechanical performance of Sn-0.7Cu, Sn-0.7Cu-2Ag, Sn-0.7Cu-2In and Sn-0.7Cu-2Ag-2In solders were investigated. The tensile tests showed that while the ultimate tensile strength (UTS) and yield stress (YS) increased with increasing strain rate, they decreased with increasing temperature, showing strong strain rate and temperature dependence. The results also revealed that with the addition of Ag and In into Sn-0.7Cu, significant improvement in YS (∼255%) and UTS (∼215%) is realized when compared with the other commercially available Sn-0.7 wt. % Cu solder alloys. Furthermore, the Sn-0.7Cu-2Ag-2In solder material developed here also exhibits higher ductility and well-behaved mechanical performance than that of eutectic Sn-0.7Cu commercial solder. Microstructural analysis revealed that the origin of change in mechanical properties is attributed to smaller β-Sn dendrite grain dimensions and formation of new inter-metallic compounds (IMCs) in the ternary and quaternary alloys.     

Influences of different prior heat treatments on the microstructural and mechanical properties of Cu-Fe filamentary composites

Cu-6 wt.% Fe and Cu-12 wt.% Fe filamentary composites were prepared by casting and cold drawing. And a different heat treatment of quenching and aging or homogenizing was introduced before cold drawing process, respectively. The microstructure was observed and the tensile strength measured for the composites at different drawing strains. The quenching and aging or homogenizing prior to drawing deformation refine the as-cast microstructure and result in the increase in interface density in the drawn microstructure. The drawn alloys with the homogenizing treatment show smaller filament spacing than those with the quenching and aging treatment because homogenizing results in smaller and more dispersive primary Fe dendrites before drawing deformation. The heat treatments can improve the strength of the composites by increasing precipitation strengthening and interface strengthening levels. With the reduction in filament spacing during drawing deformation, the strength of the alloys with smaller initial size of Fe dendrites increases more obviously.     

Influence of Fe addition on microstructure and properties of Cu-Ag composite

We investigated the effects of Fe content on microstructure and properties in as-cast and as-drawn Cu-(5.1-x) vol%Ag-x vol%Fe alloys. In microscale, increasing Fe content first refined and then coarsened Cu dendrites. In nanoscale, the size and length of Ag precipitates in Fe-doped alloys were smaller than the size and length of Ag precipitates in Fe-free alloy, and the γ-Fe precipitates in Cu-2.9 vol%Ag-2.4 vol%Fe alloy were finer than the γ-Fe precipitates in Cu-5.1 vol%Fe alloy. The maximum hardness in as-cast Cu-Ag-Fe alloys was found in the Cu-2.9 vol%Ag-2.4 vol%Fe alloy. With increasing drawing strain, both ultimate tensile strength and hardness of Cu-Ag-Fe composites were increased. Simulation data among the relative volume fractions of Fe, hardness and electrical conductivity showed that, as the relative value approached 40%, the Cu-Ag-Fe composite displayed greater hardness than other samples. As a small amount of Ag was replaced by Fe, the electrical conductivity decreased significantly with a descending slope of approximately 3%IACS (International Annealed Copper Standard) per vol% Fe. As 47 vol%Ag was replaced by Fe, however, the electrical conductivity decreased by 51% and remained almost invariable with further increasing Fe content. After annealing at 450 °C for 4 h, the electrical conductivity of the Cu-2.9 vol%Ag-2.4 vol%Fe composite was elevated up to 68.3%IACS from 38.5%IACS.     

Electrical conductivity of Cu-Ag in situ filamentary composites

The electrical conductivity of Cu-10Ag in situ filamentary composite was studied during the deformation and annealing processes. The dependence of electrical resistivity of the deformed composites on the true strain presents a two-stage change with increase of the true strain. The intermediate heat treatment and the stabilized annealing treatment to the deformed composite promote the separation of Ag precipitate, and increase the electrical conductivity. The maximum conductivity of the composite experienced the stabilizing heat treatment can reach about 97% IACS with σb≥400 MPa at 550 ℃ annealing, and reach about 70% IACS with σb≥ 1 250 MPa at 300 ℃ annealing. The corresponded strength of the composite was reported. The microstructure reason for the changes of the conductivity was discussed.     

Microstructure and Properties of a Deformation-Processed Cu-Cr-Ag In Situ Composite by Directional Solidification

Cu-7Cr-0.07Ag alloys were prepared by casting and directional solidification, from which deformation-processed in situ composites were prepared by thermo-mechanical processing. The microstructure, mechanical properties, and electrical properties were investigated using optical microscopy, scanning electronic microscopy, tensile testing, and a micro-ohmmeter. The second-phase Cr grains of the directional solidification Cu-7Cr-0.07Ag in situ composite were parallel to the drawing direction and were finer, which led to a higher tensile strength and a better combination of properties.     

低密度NbTiAlVZr合金的微观组织和力学性能

通过熔炼和压力加工研制了一种多元低密度NbTiAlVZr合金,合金密度为5.9g/cm3,是目前难熔合金中密度最低的一种。采用光学显微镜,透射电镜,拉伸试验机对合金微观组织和力学性能进行表征,结果表明:该合金室温平均抗拉强度为990MPa,延伸率为16%,1100℃抗拉强度达到80MPa,延伸率为44%。该合金是一种综合了固溶强化和第二相TiC纳米粒子弥散强化的新型铌合金,同时也是一种塑性好,可进行压力加工成型的低密度铌合金。