超分子聚合物研究进展

介绍了超分子聚合物领域的研究进展及其应用,阐述了其主要类别（如氢键超分子聚合物、配合物型超分子聚合物、π-π堆积超分子聚合物及离子效应超分子聚合物）,最后讨论了超分子化合物研究过程中的表征方法。超分子聚合物的研究前景将朝着更大产率、更简便制备步骤及更新颖结构的方向发展。     

浅谈聚合物/纳米复合材料研究进展

简述了聚合物纳米复合材料的四种复合方法(粒子直接分散复合、插层复合、原位复合、分子复合)，及聚合物纳米复合材料的研究进展、应用、展望。     

分子模拟在纳米材料改性聚合物中的应用

介绍了近年来国内外分子模拟研究纳米改性聚合物材料的部分工作,主要包括纳米材料的结构模拟,力学性能的模拟,改性剂相互作用的模拟以及聚合物基纳米复合材料界面作用的模拟。     

超分子聚合物纳米复合材料的研究进展

超分子聚合物纳米复合材料作为一种有别于传统聚合物基纳米复合材料的新型纳米复合材料而深受人们的重视。本文综述了纳米碳材料类超分子纳米复合材料的研究进展,并着重评述了无机-聚合物和金属-聚合物类超分子纳米复合材料的研究进展,并对其它的超分子纳米复合材料的研究现状作了介绍。     

三聚氰胺分子印迹聚合物的理论研究

三聚氰胺为模板,甲基丙烯酸为功能单体,采用量子化学理论研究了三聚氰胺分子印迹聚合物的形成机理,使用计算机模拟软件计算了三聚氰胺、甲基丙烯酸及三聚氰胺分子印迹聚合物的分子结构、能量及键长键角,并讨论计算结果。结果表明三聚氰胺和甲基丙烯酸之间形成了很强的氢键     

利用动态光散射法研究聚合物分子尺寸

在聚合物驱油藏,聚合物溶液能否顺利注入油层,分子尺寸是关键因素之一,因此,对其进行准确表征是正确选择分子尺寸的前提。本文建立了利用水动力学半径表征聚合物分子尺寸的新方法,可更准确、全面地描述聚合物分子尺寸。利用动态光散射技术,研究了分子量、浓度、矿化度对流体力学半径的影响规律及影响程度,并分析了其原因。     

基于氢键作用的超分子聚合物的研究进展

氢键的温度敏感性和可逆性对聚合物热力学性质、微观自组装、结晶及液晶行为有重要影响,因而在超分子聚合物的设计与结构控制方面受到广泛关注。详细介绍了氢键型超分子聚合物的研究现状及其进展。     

基于固态成型工艺聚合物基复合材料自增强技术研究进展

针对当前聚合物实际强度远低于理论强度的问题,介绍了固态挤出、固态拉伸等自增强技术的制备流程及其工艺特点。此外,通过分析固态形变过程中试样内部的微观形貌与分子构型,进一步研究聚合物基复合材料固态加工过程中的自增强机理。最后,通过归纳总结影响试样增强效果的因素,进一步探索聚合物基复合材料的性能上限,拓宽其在不同领域的高性能化应用。     

人血红蛋白分子印迹聚合物的制备及分子识别性能

以丙烯酰胺和甲基丙烯酸为功能单体制备得到了具有选择性识别能力的人血红蛋白分子印迹聚合物. 该印迹聚合物的分子识别特性来自聚合物的结合基团与印迹分子的功能基团之间的氢键和静电作用,以及印迹孔穴的空间几何选择性. 研究表明,聚合单体中甲基丙烯酸的含量会影响聚合物对血红蛋白的特异结合能力及分子印迹聚合物的吸附容量和洗脱性能.     

超分子聚合物研究与应用进展

超分子聚合物与传统的聚合物在制备方法、结构和性能上都有很大不同。近年来,超分子科学的研究应用工作飞速发展。本文通过对超分子液晶、金属-超分子聚合物、自组装超分子膜的介绍,介绍了超分子聚合物的研究应用进展。     

Polymer-polymer composites fabricated by the in situ release and coalescence of polymer chains from their inclusion compounds with urea into a carrier polymer phase

Inclusion compounds (ICs) can be formed between small-molecule hosts and guest polymers, where the crystalline host lattice confines the guest polymers to occupy narrow cylindrical channels. The included polymers are highly extended by the narrow channel diameters and are separated from neighboring polymer chains by the walls of the small-molecule host lattice. It is possible to coalesce the polymer chains from their ICs by exposure to a solvent for the small-molecule host which is not a solvent for the included polymer chains. When crystallizable polymers are coalesced from their ICs by solvent treatment, they are observed to crystallize in an extended-chain morphology accompanied by much less chain-folding than occurs when crystallization of the same polymers take place from their disordered melt or solution environments. In this report we outline our initial efforts to create polymer-polymer molecular composites based on the coalescence of polymer chains from their IC crystals with urea, which were previously embedded in a carrier polymer phase. Both film and fiber composites made with chemically identical or distinct IC-included and carrier polymers are described. Water vapor permeation, differential scanning calorimetry (DSC) and microscopic observations are used to probe these composites; and several applications are suggested. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 281–287, 1997     

石墨烯导电高分子复合材料研究进展

本文综述了有关填充型导电高分子复合材料的研究进展及其应用,重点介绍并比较了石墨烯／聚合物导电高分子复合材料的制备方法,讨论了石墨烯的功能化改性处理。     

Effect of the polymer matrices on the immobilisation of microbial cells by radiation polymerisation

Streptomyces phaeochromogenes cells were immobilised by radiation polymerisation, at low temperature, using various acrylate and diacrylate monomers. The form and enzymatic activity of the immobilised cell composites were affected by the molecular structure of the monomers. The activities of the composites from acylate and diacrylate monomers increased with increased numbers of methylene or ethylene glycol units in the monomers. The water content of the immobilised cell composites was also affected by the molecular structure of the monomers. The pH and heat stabilities of the immobilised cell composites were increased when the polymer matrix had a porous sponge structure.     

凹凸棒土/聚合物复合材料研究进展

综述了凹凸棒土在聚合物中的应用研究进展。研究表明，大多数情况下，常规的聚合物加工技术不足以将凹凸棒土解离为纳米短纤维，因此只能形成凹凸棒土／聚合物微米复合材料，但将凹凸棒土进行有机改性，可以明显提高其增强效果。采用原位聚合的方法可以制备出性能优异的凹凸棒土／聚合物纳米复合材料，或在高黏度和高极性的聚合物熔体中，凹凸棒土在剪切力下可以解离为纳米单晶，从而形成纳米复合材料。利用凹凸棒土／乳液共混共凝方式也可制备出凹凸棒土／橡胶纳米复合材料。     

聚合物材料的微波制备技术

介绍了微波对聚合物材料的作用原理和影响因素,综述了微波技术在聚合物微球、热固性聚合物、功能性聚合物和聚合物泡沫材料制备方面的应用。指出微波技术具有选择性加热的特性,将在功能性高分子复合材料的制备方面具有独特的优势。     

核壳型导电高分子复合粒子的制备研究进展

介绍了导电高分子、复合粒子、核壳型导电高分子复合粒子的概念、分类及其特点,重点对高分子包覆无机导电粒子、结构型导电高分子包覆无机粒子或高分子、金属粒子包覆高分子三类核壳型导电高分子复合粒子的制备方法进行了较全面的介绍,并对核壳型导电高分子复合粒子的应用及发展趋势作了简介。     

Bridged double percolation in conductive polymer composites: an electrical conductivity, morphology and mechanical property study

Conductive polymer composites are ubiquitous in technological applications and constitute an ongoing topic of tremendous commercial interest. Strategies developed to improve the level of electrical conductivity achieved at a given filler concentration have relied on double-percolated networks induced by immiscible polymer blends, as well as mixtures of fillers in a single polymer matrix, to enhance interparticle connectivity. In this work, we combine these two strategies by examining quaternary composites consisting of high-density polyethylene (HDPE), ultrahigh molecular weight polyethylene (UHMWPE), graphite (G) and carbon fiber (CF). On the basis of our previous findings, we examine the electrical conductivity, morphology, thermal signature and mechanical properties of HDPE/UHMWPE/G systems that show evidence of double percolation. Upon addition of CF, tremendous increases in conductivity are realized. The mechanism by which this increase occurs is termed bridged double percolation to reflect the role of CF in spanning non-conductive regions and enhancing the continuity of conductive pathways. At CF concentrations above the percolation threshold concentration, addition of G promotes increases in conductivity and dynamic storage modulus in which the conductivity increases exponentially with increasing modulus.     

Curing behavior,mechanical properties,intermolecular interaction,and morphology of silicone/polypyrrole/polymer electrolyte composites

The curing behavior, mechanical properties, intermolecular interaction, and morphology of silicone, polypyrrole, and polymer electrolyte composites were studied. A rigid‐body pendulum rheometer was used to determine the curing behavior of silicone/PEL blends. The polymer structure was evaluated using FTIR and Differential Scanning Calorimetery. The mechanical properties, including stress, strain, and hardness, were measured using a material testing system. The morphology of the composites was measured using scanning electron micrographs. The intermolecular interaction of the composites was measurement using dynamic mechanical analysis. The results show that the curing reaction rate is fast upon addition of 10 wt % of polymer electrolyte for silicone. The linear molecular structure of the polymer electrolyte was wound around the silicone polymer network structure forming a semi‐interpenetrating network. The intermolecular interaction was influenced by the composites, and the Ppy film effect on the surface of SP10 blends is more uniform than that of silicone. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 2754–2764, 2006     

Mixing of a self-assembled supramolecular polymer and a covalent polymer in organic solutions

We report on a neutron scattering study of the molecular structure of a self-assembled supramolecular polymer composed of a bicopper complex within a solution of a covalent polymer (atactic polystyrene/trans-decalin). The study is achieved by putting two binary phases in contact and allowing for diffusion of both components in either phase. It is shown that the one-dimensional bicopper filaments are compatible to a high extent with the atactic polymer. These results are discussed in the light of a recently devised encapsulation process of the bicopper filaments within the fibrils of a physical network of isotactic polystyrene.     

Thermally conductive polymer composites for electronic packaging

Polyurethane composites filled with alumina or carbon fibers were prepared to study the thermal conductivities and dielectric properties of polymer composites under humid environments. The thermal conductivities of these polymer composites in relation to filler concentrations and filler sizes were investigated and it was found that the thermal conductivities can increase up to 50 times that of pure polyurethane. The results were analyzed using Agari's model to explain the intrinsic reasons to affect the thermal conductivities of composites. The dielectric loss of these polymer composites were also measured to estimate the influence of moisture under various humid environments. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65: 2733–2738, 1997