Zinc oxide thin film transistors using MgO-Bi1.5Zn1.0Nb1.5O7 composite gate insulator on glass substrate

We report on high mobility ZnO thin film transistors (TFTs) (< 5 V), utilizing a room temperature grown MgO-Bi_1.5Zn_1.0Nb_1.5O₇ (BZN) composite gate insulator on a glass substrate. 30 mol% MgO added BZN composite gate insulators exhibited greatly enhanced leakage current characteristics (~< 2 × 10^− 8 A/cm² at 0.3 MV/cm) due to the high breakdown strength of MgO, while retaining an appropriate high-k dielectric constant of 32. The ZnO-TFTs with MgO-BZN composite gate insulators showed a high field-effect mobility of 37.2 cm²/Vs, a reasonable on-off ratio of 1.54 × 10⁵, a subthreshold swing of 460 mV/dec, and a low threshold voltage of 1.7 V.     

High-performance ZnO thin film transistors with sputtering SiO2/Ta2O5/SiO2 multilayer gate dielectric

A high-performance ZnO thin film transistor （ZnO-TFT） with SiO₂/Ta₂O₅/SiO₂ (STS) multilayer gate insulator is fabricated by sputtering at room temperature. Compared to ZnO-TFTs with sputtering SiO₂ gate insulator, its electrical characteristics are significantly improved, such as the field effect mobility enhanced from 11.2 to 52.4 cm²/V s, threshold voltage decreased from 4.2 to 2 V, and sub-threshold swing improved from 0.61 to 0.28 V/dec. The improvements are attributed to the high gate capacitance (from 50 to 150 nF/cm²) as well as nice surface morphology by using dielectric with high～k Ta₂O₅ sandwiched by SiO₂ layers. The capacitance-voltage characteristic of a metal-insulator-semiconductor capacitor with the structure of Indium Tin Oxide/STS/ZnO/Al was investigated and the trap charges at the interface or bulk is evaluated to be 2.24 × 10¹² cm⁻². From the slope of C⁻² versus gate voltage, the doping density N_D of ZnO is estimated to be 1.49 × 10¹⁶ cm⁻³.     

Improvement in the negative bias temperature stability of ZnO based thin film transistors by Hf and Sn doping

We assessed the performance of ZnO TFTs using Si₃N₄ gate dielectrics after various treatments. A remarkable improvement in the transfer characteristics was obtained for the O₂ plasma treated ZnO TFT and SiO₂ interlayer deposited ZnO TFT. Also, we developed amorphous hafnium-zinc-tin oxide (HZTO) thin film transistors (TFTs) and investigated the influence of hafnium (Hf) doping on the electrical characteristics of the hafnium-zinc oxide (HZO) thin film transistors. Doping with Hf can decrease the carrier concentration, which may result from a decrease of the field effect mobility, and reduce oxygen vacancy related defects in the interfacial layer. Adding tin (Sn) can suppress the growth of a crystalline phase in the HZTO films. The HZTO TFTs exhibited good electrical properties with a field effect mobility of 14.33 cm²/Vs, a subthreshold swing of 0.97 V/decade, and a high I_ON/OFF ratio of over 10⁹.     

Evaluation of Y2O3 gate insulators for a-IGZO thin film transistors

In this work, Y₂O₃ was evaluated as a gate insulator for thin film transistors fabricated using an amorphous InGaZnO₄ (a-IGZO) active layer. The properties of Y₂O₃ were examined as a function of various processing parameters including plasma power, chamber gas conditions, and working pressure. The leakage current density for the Y₂O₃ film prepared under the optimum conditions was observed to be ~ 3.5 × 10^− 9 A/cm² at an electric field of 1 MV/cm. The RMS roughness of the Y₂O₃ film was improved from 1.6 nm to 0.8 nm by employing an ALD (Atomic Layer Deposition) HfO₂ underlayer. Using the optimized Y₂O₃ deposition conditions, thin film transistors (TFTs) were fabricated on a glass substrate. The important TFT device parameters of the on/off current ratio, sub-threshold swing, threshold voltage, and electric field mobility were measured to be 7.0 × 10⁷, 0.18 V/dec, 1.1 V, and 3.3 cm²/Vs, respectively. The stacked insulator consisting of Y₂O₃/HfO₂ was highly effective in enhancing the device properties.     

Charge trapping characteristics of Al2O3/Al-rich Al2O3/SiO2 stacked films fabricated by radio-frequency magnetron co-sputtering

A thin-film structure comprising Al₂O₃/Al-rich Al₂O₃/SiO₂ was fabricated on Si substrate. We used radio-frequency magnetron co-sputtering with Al metal plates set on an Al₂O₃ target to fabricate the Al-rich Al₂O₃ thin film, which is used as a charge storage layer for nonvolatile Al₂O₃ memory. We investigated the charge trapping characteristics of the film. When the applied voltage between the gate and the substrate is increased, the hysteresis window of capacitance-voltage (C-V) characteristics becomes larger, which is caused by the charge trapping in the film. For a fabricated Al-O capacitor structure, we clarified experimentally that the maximum capacitance in the C-V hysteresis agrees well with the series capacitance of insulators and that the minimum capacitance agrees well with the series capacitance of the semiconductor depletion layer and stacked insulator. When the Al content in the Al-rich Al₂O₃ is increased, a large charge trap density is obtained. When the Al content in the Al-O is changed from 40 to 58%, the charge trap density increases from 0 to 18 × 10¹⁸ cm^− 3, which is 2.6 times larger than that of the trap memory using SiN as the charge storage layer. The device structure would be promising for low-cost nonvolatile memory.     

Optical and electrical properties of 2 wt.% Al2O3-doped ZnO films and characteristics of Al-doped ZnO thin-film transistors with ultra-thin gate insulators

Al-doped ZnO (AZO) thin films have been prepared on the c-Si oriented direction of (100) and glass substrates, by radio frequency magnetron sputtering from ZnO-2 wt.% Al₂O₃ ceramic targets. The effects of the working pressure on the optical and electrical properties of the films have been studied. The optical properties, measured by the ultraviolet-visible system, show that the transmittance and optical bandgap energy are influenced by the working pressure. The Hall resistivity, mobility, and carrier concentration were obtained by a Hall measurement system and these parameters were also influenced by the working pressure. The AZO thin-film transistors (TFTs) were fabricated on highly doped c-Si substrates. The TFT structures were made up AZO as the active layer and SiO_xN_y/SiN_x/SiO_x as the gate layer with 20 nm and 35 nm thickness, respectively. The ultra-thin TFTs had an on/off current ratio of 10⁴ and a field-effect mobility of 0.17 cm²/V·s. These results show that it is possible to fabricate an AZO TFT that can be operated with an ultra-thin gate dielectric.     

The influence of fabrication process on top-gate thin-film transistors

Amorphous indium zinc oxide (a-IZO) thin-film transistors (TFTs) with bottom- and top-gate structures were fabricated at room temperature by direct current (DC) magnetron sputter in this research. High dielectric constant (κ) hafnium oxide (HfO₂) films and a-IZO were deposited for the gate insulator and the semiconducting channel under a mixture of ambient argon and oxygen gas, respectively. The bottom-gate TFTs showed good TFT characteristics, but the top-gate TFTs did not display the same characteristics as the bottom-gate TFTs despite undergoing the same process of sputtering with identical conditions. The electrical characteristics of the top-gate a-IZO TFTs exhibited strong relationships with sputtering power as gate dielectric layer deposition in this study. The ion bombardment and incorporation of sputtering ions damaged the interface between the active layer and the gate insulator in top-gate TFTs. Hence, the sputtering power was reduced to decrease damage while depositing HfO₂ films. When using 50 W DC magnetron sputtering, the top-gate a-IZO TFTs showed the following results: a saturation mobility of 5.62 cm²/V-s; an on/off current ratio of 1 × 10⁵; a sub-threshold swing (SS) of 0.64 V/decade; and a threshold voltage (V_th) of 2.86 V.     

Effect of Ag doping on the performance of ZnO thin film transistor

Ag-doped zinc oxide (SZO) thin film transistors (TFTs) have been fabricated using a back-gate structure on thermally oxidized and heavily doped p-Si (100) substrate. The SZO thin films were deposited via pulsed laser deposition (PLD) from a 1, 3, and 5 wt.% Ag-doped ZnO (1SZO, 3SZO, and 5SZO, respectively) target using a KrF excimer laser (λ, 248 nm) at oxygen pressure of 350 mTorr. The deposition carried out at both room-temperature (RT) and 200 °C. The SZO thin films had polycrystalline phase with preferred growth direction of (002) as well as a wurtzite hexagonal structure. Compare with ZnO thin films, the SZO thin films were characterized by confirming the shift of (002) peak to investigate the substitution of Ag dopants for Zn sites. The as-grown SZO TFTs deposited at RT and 200 °C showed insulator characteristics. However the SZO TFTs annealed at 500 °C showed good n-type TFT performance because Ag was diffused from Zn lattice site and bound themselves at the high temperature, and it caused generation of electron carriers. The post-annealed 5SZO TFT deposited at 500 °C exhibited a threshold voltage (V_th) of 11.5 V, a subthreshold swing (SS) of 2.59 V/decade, an acceptable mobility (μ_SAT) of 0.874 cm²/V s, and on-to-off current ratios (I_on/off) of 1.44 × 10⁸.     

Copper phthalocyanine thin-film field-effect transistor with SiO2/Ta2O5/SiO2 multilayer insulator

Top-contact Copper phthalocyanine (CuPc) thin-film field-effect transistor (TFT) with SiO₂/Ta₂O₅/SiO₂ (STS) multilayer as the dielectric was fabricated and investigated. With the multi-layer dielectric, drive voltage was remarkably reduced. A relatively large on-current of 1.1 × 10⁻⁷ A at a V_GS of −15 V was obtained due to the strong coupling capability provided by the STS multilayer gate insulator. The device shows a moderate performance: saturation mobility of μ_sat = 6.12 × 10⁻⁴ cm²/V s, on-current to off-current ratio of I_on/I_off = 1.1 × 10³, threshold voltage of V_TH = −3.2 V and sub-threshold swing SS = 1.6 V/dec. Atomic force microscope images show that the STS multilayer has a relative smooth surface. Experiment results indicate that STS multilayer is a promising insulator for the low drive voltage CuPc-based TFTs.     

Improvement in the bias stability of zinc oxide thin-film transistors using Si3N4 insulator with SiO2 interlayer

The performance of ZnO thin film transistors (TFT) subjected to SiO₂ interlayer treatments on Si₃N₄ insulators was investigated. In the case of a SiO₂ interlayer of 10 nm on Si₃N₄ insulator, a drastic improvement in device performance was obtained. ZnO TFT with this interlayer showed reduced trap density between the Si₃N₄ and ZnO channel, bringing remarkable improvement in bias stability characteristics. These devices show good performance and exhibit a high field-effect mobility of 6.41 cm²/Vs, an on/off current ratio of 10⁸, and a subthreshold swing of 1.46 V/decade. Also, the turn-on voltage shifted from − 2 V to − 6 V with negligible changes in the subthreshold swing and field effect mobility after total stress time.     

Properties of LiNbO3 based heterostructures grown by pulsed-laser deposition for optical waveguiding application

Epitaxial LiNbO₃ (LN) thin films have been grown onto (00.1) Al₂O₃ substrates and onto sapphire covered with a conductive ZnO buffer layer. For the two systems, the LN thin films are well crystallised and highly (00.1) oriented. Epitaxial relationships between the different layers are evidenced both on the LN/sapphire film and the LN/ZnO/sapphire heterostructure. The optical waveguiding propagation losses of the LN/sapphire films are very low (1 ± 0.5 dB/cm) while the LN/ZnO/sapphire heterostructure does not exhibit satisfying waveguiding properties mainly due to the high conductivity (600 S m^− 1) of the ZnO buffer layer.     

V-doping effects on ferroelectric properties of K0.5Bi4.5Ti4O15 thin films

V-doped K_0.5Bi_4.5Ti₄O₁₅ (K_0.5Bi_{4.5 − x/3}Ti_4 − xV_xO₁₅, KBTiV-x, x = 0.00, 0.01, 0.03, and 0.05) thin films were prepared on a Pt(111)/Ti/SiO₂/Si(100) substrate by a chemical solution deposition method. The thin films were annealed by using a rapid thermal annealing process at 750 °C for 3 min in an oxygen atmosphere. Among them, KBTiV-0.03 thin film exhibited the most outstanding electrical properties. The value of remnant polarization (2P_r) was 75 μC/cm² at an applied electric field of 366 kV/cm. The leakage current density of the thin film capacitor was 5.01 × 10⁻⁸ at 100 kV/cm, which is approximately one order of magnitude lower than that of pure K_0.5Bi_4.5Ti₄O₁₅ thin film capacitor. We found that V doping is an effective method for improving the ferroelectric properties of K_0.5Bi_4.5Ti₄O₁₅ thin film.     

Single-source chemical vapor deposition of clean oriented Al2O3 thin films

Clean oriented Al₂O₃ thin film with a dominant Al₂O₃ <1 1 3> plane was deposited on Si <1 0 0> substrate at 550 °C, by single-source chemical vapor deposition (CVD) using aluminium(III) diisopropylcarbamate, Al₂(O₂CNⁱPr₂)₆. This process represents a substantial reduction in typical CVD film growth temperatures which are typically > 1000 °C. Through the studies of thermal stability of this precursor, we propose a specific β-elimination decomposition pathway to account for the low temperature of the precursor decomposition at the substrate, and for the lack of carbon impurity byproducts in the resulting alumina films that are characterized using X-ray photoelectron spectroscopy and depth profiling.     

Electrical and chemical analysis of zinc oxide interfaces with high dielectric constant barium tantalate and aluminum oxide in metal-insulator-semiconductor structures fabricated at Low temperatures

Zinc oxide (ZnO) was incorporated into metal-insulator-semiconductor (MIS) structures featuring high dielectric constant (high-κ) barium tantalate (BaTa₂O₆)or alumina (Al₂O₃)as the insulator, and the structures were electrically evaluated for potential applications in transparent thin film transistors. The ZnO films were deposited by radio-frequency magnetron sputtering at 100 °C whereas the dielectric films were deposited by the same method at room temperature. The leakage currents of both the BaTa₂O₆ and Al₂O₃ structures were on the order of 10⁻⁷A/cm². The trap density and trapped charge concentration at the BaTa₂O₆/ZnO interface were determined to be 6.18 × 10¹¹ eV⁻¹ cm⁻²and 5.82 × 10¹¹ cm⁻² from conductance-voltage and capacitance-voltage measurements. At the Al₂O₃/ZnO interface the trap density and trapped charge were more than an order of magnitude smaller at 1.09 × 10¹⁰ eV⁻¹ cm⁻²and 1.04 × 10¹⁰ cm⁻² respectively. The BaTa₂O₆ structures had significantly larger frequency dispersions due to the larger number of interface traps. Chemical analysis using X-ray photoelectron spectroscopy with depth profiling indicates that acceptor type defects associated with a deficiency of oxygen are related to the observed electron trapping in the BaTa₂O₆MIS structure. Overall, the results indicate that Al₂O₃ would be better suited for transparent thin film transistors deposited at low temperature or without substrate heating.     

Annealing effect on dielectric and leakage current characteristics of Mn-doped Ba0.6Sr0.4TiO3 thin films as gate insulators for low voltage ZnO thin film transistor

We report on the dielectric properties and leakage current characteristics of 3 mol% Mn-doped Ba_0.6Sr_0.4TiO₃ (BST) thin films post-annealed up to 600 °C following room temperature deposition. The suitability of 3 mol% Mn-doped BST films as gate insulators for low voltage ZnO thin film transistors (TFTs) is investigated. The dielectric constant of 3 mol% Mn-doped BST films increased from 24 at in-situ deposition up to 260 at an annealing temperature of 600 °C due to increased crystallinity and the formation of perovskite phase. The measured leakage current density of 3 mol% Mn-doped BST films remained on the order of 5 × 10^− 9 to 10^− 8 A/cm² without further reduction as the annealing temperature increased, thereby demonstrating significant improvement in the leakage current characteristics of in-situ grown Mn-doped BST films as compared to that (5 × 10^− 4 A/cm² at 5 V) of pure BST films. All room temperature processed ZnO-TFTs using a 3 mol% Mn-doped BST gate insulator exhibited a field effect mobility of 1.0 cm²/Vs and low voltage device performance of less than 7 V.     

Electrical characteristics of Ti-O/Ta2O5 thin film sputtered on Ta/Ti/Al2O3 substrate

The electrical characteristics of Ti-O/Ta₂O₅ films sputtered on Ta/Ti/Al₂O₃ substrate were investigated. Ta (tantalum) was used for the bottom and upper electrodes for the purpose of simplifying the fabrication process and Al₂O₃ substrates were used, which are needed in integral passive devices. Ta/Ti-O/Ta₂O₅/Ta/Ti/Al₂O₃ capacitors were annealed at 700 °C for 60 s in vacuum. The X-ray diffraction pattern (XRD) results showed that as-deposited Ta had a highly preferred orientation, but Ta₂O₅ film had amorphous structure, which was transformed to crystallization structure by rapid thermal heat treatment. We examined the log J-E and C-V characteristics of the dielectric thin films deposited on the Ta bottom electrode. From these results, we concluded that the leakage current could be reduced by introducing a Ti-O buffer layer. The conduction mechanisms of Ta/Ti-O/Ta₂O₅/Ta/Ti/Al₂O₃ capacitors could be interpreted appropriately by hopping conduction in lower field (E<1×10⁵ V/cm) and space-charge-limited current in higher fields (1×10⁵ V/cm<E).     

RF diode reactive sputtering of n- and p-type zinc oxide thin films

We present the relationship between parameters of reactive RF diode sputtering from a zinc oxide (ZnO) target and the crystalline, electrical and optical properties of n-/p-type ZnO thin films. The properties of the ZnO thin films depended on RF power, substrate temperature and, particularly, on working gas mixtures of Ar/O₂ and of Ar/N₂. Sputtering in Ar+O₂ working gas (up to 75% of O₂) improved the structure of an n-type ZnO thin film, from fibrous ZnO grains to columnar crystallites, both preferentially oriented along the c-axis normally to the substrate (〈0 0 2〉 direction). These films had good piezoelectric properties but also high resistivity (ρ≈10³ Ω cm). ZnO:N p-type films exhibited nanograin structure with preferential 〈0 0 2〉 orientation at 25% N₂ and 〈1 0 0〉 orientation for higher N₂ content. The presence of nitrogen N_O at O-sites forming N_O-O acceptor complexes in ZnO was proven by SIMS and Raman spectroscopy. A minimum value of resistivity of 790 Ω cm, a p-type carrier concentration of 3.6×10¹⁴ cm⁻³ and a Hall mobility of 22 cm² V⁻¹ s⁻¹ were obtained at 75% N₂.     

Enhancement on effective piezoelectric coefficient of Bi3.25Eu0.75Ti3O12 ferroelectric thin films under moderate annealing temperature

Bi_3.25Eu_0.75Ti₃O₁₂ (BET) thin films were deposited on Pt/Ti/SiO₂/Si(111) substrates by a metal-organic decomposition method. The effects of annealing temperatures 600-800 °C on microstructure, ferroelectric, dielectric and piezoelectric properties of BET thin films were studied in detail. The spontaneous polarization (87.4 × 10^− 6 C/cm² under 300 kV/cm), remnant polarization (65.7 × 10^− 6 C/cm² under 300 kV/cm), the dielectric constant (992.9 at 100 kHz) and the effective piezoelectric coefficient d₃₃ (67.3 pm/V under 260 kV/cm) of BET thin film annealed at 700 °C are better than those of the others. The mechanisms concerning the dependence of the enhancement d₃₃ are discussed according to the phenomenological equation, and the improved piezoelectric performance could make the BET thin film a promising candidate for piezoelectric thin film devices.     

The preparation of Zn-ferrite epitaxial thin film from epitaxial Fe3O4:ZnO multilayers by ion beam sputtering deposition

A new method to grow a well-ordered epitaxial ZnFe₂O₄ thin film on Al₂O₃(0001) substrate is described in this work. The samples were made by annealing the ZnO/Fe₃O₄ multilayer which was grown with low energy ion beam sputtering deposition. Both the Fe₃O₄ and ZnO layers were found grown epitaxially at low temperature and an epitaxial ZnFe₂O₄ thin film was formed after annealing at 1000 °C. X-ray diffraction shows the ZnFe₂O₄ film is grown with an orientation of ZnFe₂O₄(111)//Al₂O₃(0001) and ZnFe₂O₄(1-10)//Al₂O₃(11-20). X-ray absorption spectroscopy studies show that Zn²⁺ atoms replace the tetrahedral Fe²⁺ atoms in Fe₃O₄ during the annealing. The magnetic properties measured by vibrating sample magnetometer show that the saturation magnetization of ZnFe₂O₄ grown from ZnO/Fe₃O₄ multilayer reaches the bulk value after the annealing process.     

Color emission and dielectric properties of Eu-doped Gd2O3 gate oxide thin films

High-k Gd₂O₃ used for thin film transistor (TFT) gate insulators has been synthesized via a simple solution process. Phase analysis and capacitive performance reveal that a high dielectric constant of ~ 20 and a low leakage current level of < 10⁻⁸ A/cm² at 1 MV/cm with a good transparency under the visible wavelength region are readily produced by the sol-gel method. Eu³⁺ doping leads to an increased dielectric constant induced by the additional electric dipole transition, which is evidently visualized by the photoluminescence behavior and/or by the defect-controlled thin film microstructures. Thus, the solution-processed (Gd,Eu)₂O₃ film is a viable gate insulator to be considered for the proposed “color emissive” switching devices as well as for the low power-driven TFT devices.