Plastic modules for free-space optical interconnects

A combined optoelectronic and optomechanical packaging technique for the construction of snap-together free-space optical interconnect systems is described. The modules integrate relaying and routing functions by use of transparent optical molded plastic, which can achieve sufficient alignment precision that further adjustment is not required during system assembly. Methods to integrate the optoelectronic chips, such as vertical-cavity surface-emitting laser and receiver arrays with these plastic optical modules are described. Other chips can also be integrated to form optoelectronic multichip modules. These modules can also be designed to accommodate coupling to or from optical fiber arrays. A test-bed system to demonstrate the concept was assembled to a lower precision by use of conventional machining techniques.     

Microelectromechanical system pressure sensor integrated onto optical fiber by anodic bonding

Optical microelectromechanical system pressure sensors based on the principle of Fabry-Perot interferometry have been developed and fabricated using the technique of silicon-to-silicon anodic bonding. The pressure sensor is then integrated onto an optical fiber by a novel technique of anodic bonding without use of any adhesives. In this anodic bonding technique we use ultrathin silicon of thickness 10 microm to bond the optical fiber to the sensor head. The ultrathin silicon plays the role of a stress-reducing layer, which helps the bonding of an optical fiber to silicon having conventional wafer thickness. The pressure-sensing membrane is formed by 8 microm thick ultrathin silicon acting as a membrane, thus eliminating the need for bulk silicon etching. The pressure sensor integrated onto an optical fiber is tested for static response, and experimental results indicate degradation in the fringe visibility of the Fabry-Perot interferometer. This effect was mainly due to divergent light rays from the fiber degrading the fringe visibility. This effect is demonstrated in brief by an analytical model.     

Parallel optical coherence tomography system

We present the design and procedures for implementing a parallel optical coherence tomography (POCT) imaging system that can be adapted to an endoscopic format. The POCT system consists of a single mode fiber (SMF) array with multiple reduced diameter (15 microm) SMFs in the sample arm with 15 microm center spacing between fibers. The size of the array determines the size of the transverse imaging field. Electronic scanning eliminates the need for mechanically scanning in the lateral direction. Experimental image data obtained with this system show the capability for parallel axial scan acquisition with lateral resolution comparable to mechanically scanned optical coherence tomography systems.     

Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package

We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI's) can be integrated simply on electronic multichip modules (MCM's) for intra-MCM-board interconnects. Our system-level packaging architecture is based on a modified folded 4f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than -20 dB at low frequency have been measured. The system is compact at only 10 in.(3) (25.4 cm(3)) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.     

Low-loss passive alignment of single-mode fibers in low-temperature cofired ceramics using CO2 laser fabricated U-grooves

We report a step toward optoelectronic integration on low-temperature cofired ceramics substrates in the form of fiber alignment U-grooves. The precision of the CO2 laser machining of green state ceramic for this purpose is investigated. The groove-writing process with a speed of 1 mm/s was carried out in air at room temperature and ambient pressure. The process is to a large extent self-cleaning without any gas jet assist. By analysis of groove profiles after firing of a near-zero shrinkage green tape formulation, it is shown that the cutting accuracy is approximately 2 microm, which is at the fundamental limit set by the particle size (1-5 microm). We demonstrate low-loss butt coupling of <1 dB for single-mode fibers using the laser written U-grooves. The technique exhibits a potential for fabrication of low-cost fiber ribbon and fiber array connectors.     

Practical realization of massively parallel fiber-free-space optical interconnects

We propose a novel approach to realizing massively parallel optical interconnects based on commercially available multifiber ribbons with MT-type connectors and custom-designed planar-integrated free-space components. It combines the advantages of fiber optics, that is, a long range and convenient and flexible installation, with those of (planar-integrated) free-space optics, that is, a wide range of implementable functions and a high potential for integration and parallelization. For the interface between fibers and free-space optical systems a low-cost practical solution is presented. It consists of using a metal connector plate that was manufactured on a computer-controlled milling machine. Channel densities are of the order of 100/mm(2) between optoelectronic VLSI chips and the free-space optical systems and 1/mm(2) between the free-space optical systems and MT-type fiber connectors. Experiments in combination with specially designed planar-integrated test systems prove that multiple one-to-one and one-to-many interconnects can be established with not more than 10% uniformity error.     

Lensed fiber probes designed as an alternative to bulk probes in optical coherence tomography

We demonstrate a compact all-fiber sampling probe for an optical coherence tomography (OCT) system. By forming a focusing lens directly on the tip of an optical fiber, a compact sampling probe could be implemented. To simultaneously achieve a sufficiently long working distance and a good lateral resolution, we employed a large-mode area photonic crystal fiber (PCF) and a coreless silica fiber (CSF) of the same diameters. A working distance of up to 1270 microm, a 3 dB distance range of 2210 microm, and a transverse resolution of 14.2 microm were achieved with the implemented PCF lensed fiber; these values are comparable to those obtainable with a conventional objective lens having an NA of 0.25 (10 x). The performance of the OCT system equipped with the proposed PCF lensed fiber is presented by showing the OCT images of a rat finger as a biological sample and a pearl as an in-depth sample.     

Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks

We present a demonstration system under the three-dimensional (3D) optoelectronic stacked processor consortium. The processor combines the advantages of optics in global, high-density, high-speed parallel interconnections with the density and computational power of 3D chip stacks. In particular, a compact and scalable optoelectronic switching system with a high bandwidth is designed. The system consists of three silicon chip stacks, each integrated with a single vertical-cavity-surface-emitting-laser-metal-semiconductor-metal detector array and an optical interconnection module. Any input signal at one end stack can be switched through the central crossbar stack to any output channel on the opposite end stack. The crossbar bandwidth is designed to be 256 Gb/s. For the free-space optical interconnection, a novel folded hybrid micro-macro optical system with a concave reflection mirror has been designed. The optics module can provide a high resolution, a large field of view, a high link efficiency, and low optical cross talk. It is also symmetric and modular. Off-the-shelf macro-optical components are used. The concave reflection mirror can significantly improve the image quality and tolerate a large misalignment of the optical components, and it can also compensate for the lateral shift of the chip stacks. Scaling of the macrolens can be used to adjust the interconnection length between the chip stacks or make the system more compact. The components are easy to align, and only passive alignment is required. Optics and electronics are separated until the final assembly step, and the optomechanic module can be removed and replaced. By use of 3D chip stacks, commercially available optical components, and simple passive packaging techniques, it is possible to achieve a high-performance optoelectronic switching system.     

光纤定位激光钎焊键合过程中钎料与镀层的界面反应

光电子封装中,光导纤维的定位键合是一项关键技术,并且焊点界面处的显微组织对于焊点的可靠性有重要影响.本文选用80Au20Sn和52In48Sn钎料实现了激光钎焊条件下的光纤键合,采用扫描电子显微镜及能谱分析的方法对于两种钎料分别与硅片上的Au/Ti镀层和光纤上的Au/Ni镀层反应形成的界面微观组织形态及形成规律进行了分析.结果表明:对于80Au20Sn钎料,除了共晶组织ζ相+δ相,在AuSn/Au/Ti镀层界面形成了大量枝状的先共晶ζ相,在AuSn/Au/Ni镀层界面形成了针状的(Au,Ni)3Sn2;对于52In48Sn钎料,在InSn/Au/Ti镀层界面形成了连续层状的Au(In,Sn)2,随着输入能量的增加,其逐渐转变为不连续的块状化合物AuIn2,在熔融钎料流的作用下部分AuIn2脱离界面进入钎料中,在InSn/Au/Ni镀层界面形成了一层极薄的Au(In,Sn)2.     

Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits

Through five experiments, we demonstrate and characterize the basic functionality of imaging fiber bundles for optoelectronic chip-level interconnections. We demonstrate the transmission of spot arrays with spot sizes and a spot pitch roughly equal to 2 and 4 times the core pitch, respectively. We show that optoelectronic integrated circuits, including sources and detectors, can be butt coupled directly to fiber bundles without any additional optical elements. We demonstrate a 16-channel interconnect with -23 dB of cross talk, and we characterize the most significant optical loss mechanism. Finally, we show how imaging fiber bundles can be used to implement more complex interconnection structures by an example of a hybrid-bonded structure that implements a low-cost, high-connectivity solution for more advanced system architectures.     

High-resolution frequency-domain second-harmonic optical coherence tomography

We used continuum generated in an 8.5 cm long fiber by a femtosecond Yb fiber laser to improve threefold the axial resolution of frequency domain second-harmonic optical coherence tomography (SH-OCT) to 12 microm. The acquisition time was shortened by more than 2 orders of magnitude compared to the time-domain SH-OCT. The system was applied to image biological tissue of fish scales, pig leg tendon, and rabbit eye sclera. Highly organized collagen fibrils can be visualized in the recorded images. Polarization dependence on the SH has been used to obtain polarization resolved images.     

Multichip module with planar-integrated free-space optical vector-matrix-type interconnects

Even in the semiconductor industry, free-space optical technology is nowadays seen as a prime option for solving the continually aggravating problem with VLSI chips, namely, that the interconnect technology has failed to keep pace with the increase in communication volume. To make free-space optics compatible with established lithography-based design and fabrication techniques the concept of planar integration was proposed approximately a decade ago. Here its evolution into a photonic microsystems engineering concept is described. For demonstration, a multichip module with planar-integrated freespace optical vector-matrix-type interconnects was designed and built. It contains flip-chip-bonded vertical-cavity surface emitting laser arrays and a hybrid chip with an array of multiple-quantum-well p-i-n diodes on top of a standard complementary metal-oxide semiconductor circuit as key optoelectronic hardware components. The optical system is integrated into a handy fused-silica substrate and fabricated with surface-relief diffractive phase elements. It has been optimized for the given geometrical and technological constraints and provides a good interconnection performance, as was verified in computer simulations on the basis of ray tracing and in practical experiments.     

Effect of low dose rate irradiation on doped silica core optical fibers

The optical attenuation induced in multimode doped silica core optical fiber waveguides by a year's exposure to low dose rate (1 rad/day) ionizing radiation was studied, allowing a characterization of fibers deployed in these environments and a determination of the permanent induced loss in the waveguides. Variations in the induced attenuation at 0.85 microm have been observed with changes in the dose rate between 1 rad/day and 9000 rads/min. These dose rate dependences have been found to derive directly from the recovery that occurs during the exposure; the recovery data predict little or no dose rate dependence of the damage at 1.3 microm. The low dose rate exposure has been found to induce significant permanent attenuation in the 0.7-1.7-microm spectral region in all fibers containing P in the core, whether doped uniformly across the diameter or constrained to a narrow spike on the centerline. Whereas permanent loss was induced at 0.85 microm in a P-free binary Ge-doped silica core fiber by the year's exposure, virtually no damage was observed at 1.3 microm.     

Extensible, Low-Chromatic-Sensitivity, All-diffractive-Optics Relay for Interconnecting Optoelectronic Device Arrays

For free-space optical interconnections between optoelectronic chips to reach commercial realization, the technology must provide high-density optical channels in a simple, inexpensive, and easily aligned package. Although point-to-point connections with microlens pairs can provide densities of several thousand channels per square centimeter, the Gaussian nature of the beams limits the connection range to a few millimeters. We propose an arrangement of microlens pairs with an intermediate relay lens that significantly increases the connection distance. This basic setup can be tiled laterally across large chips to form extensible arrays. The optical design is constructed entirely with diffractive elements because of the low chromatic sensitivity over a range of approximately ?10% around the design wavelength. We derive the lateral positioning error at the image by using a simple ray trace, and we show the effect of Gaussian beams. We experimentally demonstrate the low chromatic sensitivity for a system with an interconnection distance of 64 mm. Finally, we demonstrate the interconnection of two linear arrays of multimode fibers with two adjacent channels operating at data rates of hundreds of megabits per second.     

Free-space parallel multichip interconnection system

A parallel data-communication scheme is described for interchip communication with free-space optics. We present a proof-of-concept and feasibility demonstration of a practical modular packaging approach in which free-space optical interconnect modules can be simply integrated on top of an electronic multichip module (MCM). Our packaging architecture is based on a modified folded 4-f imaging system that is implemented with off-the-shelf optics, conventional electronic packaging techniques, and passive assembly techniques to yield a potentially low-cost packaging solution. The prototype system, as built, supports 48 independent free-space channels with eight separate laser and detector chips, in which each chip consists of a one-dimensional array of 12 devices. All chips are assembled on a single ceramic carrier together with three silicon complementary metal-oxide semiconductor chips. Parallel optoelectronic (OE) free-space interconnections are demonstrated at a speed of 200 MHz. The system is compact at only 10 in.(3) (~164 cm(3)) and is scalable because it can easily accommodate additional chips as well as two-dimensional OE device arrays for increased interconnection density.     

Proposal for optical fiber designs with ultrahigh effective area and small bending loss applicable to long haul communications

A proposal for the multiclad MII optical fiber structure with ultralarge effective area and small bending loss is presented. For the proposed structure small dispersion and dispersion slope are obtained thanks to what we believe to be a novel design method. The suggested design method is based on a weighted fitness function, which is applied to the genetic algorithm optimization technique. In the meantime, the foregoing structure introduces a special fiber whose mode field diameter is small and approximately insensitive to the variation of the effective area. Compared to the work reported previously, our method can precisely set the zero dispersion wavelength. The designed dispersion-shifted single-mode fibers have effective area, mode field diameter, and quality factor respectively within [150-194.79] microm(2), [6.82-7.95] microm, and [3.04-3.85] at lambda(0)=1.55 microm. An analytical method is used for the calculation of the dispersion and its slope. These calculations give dispersion and dispersion slope of [(-2.57 x 10(-4))-(-0.085)] ps/km/nm and approximately 0.064 ps/km x nm(2), respectively.     

Three-dimensional optical high-resolution profiler with a large observation field: foot arch behavior under low static charge studies

Our aim is to describe a method for detecting small deformations from a three-dimensional (3D) shape of large lateral dimensions. For this purpose the measurement method is based on the simultaneous utilization of several 3D optical systems and the phase-shifting technique. In this way, the following problems appear: optical distortion due to the large field observed, nonlinear phase-to-height conversion, conversion of image coordinates into object coordinates for each 3D optical system, and coordinate unification of all optical systems. The resolution is 50 microm with a field of view of 320 mm x 150 mm. We used this system to study the 3D human foot arch deformation under low loads in vivo. First results indicate the hysteresis behavior of the human foot under a low load (50 to 450 N).     

Design and implementation of a modulator-based free-space optical backplane for multiprocessor applications

Design and implementation of a free-space optical backplane for multiprocessor applications is presented. The system is designed to interconnect four multiprocessor nodes that communicate by using multiplexed 32-bit packets. Each multiprocessor node is electrically connected to an optoelectronic VLSI chip which implements the hyperplane interconnection architecture. The chips each contain 256 optical transmitters (implemented as dual-rail multiple quantum-well modulators) and 256 optical receivers. A rigid free-space microoptical interconnection system that interconnects the transceiver chips in a 512-channel unidirectional ring is implemented. Full design, implementation, and operational details are provided.     

Gallium arsenide deep-level optical emitter for fibre optics

Fibre-optic components fabricated on the same substrate as integrated circuits are important for future high-speed communications. One industry response has been the costly push to develop indium phosphide (InP) electronics. However, for fabrication simplicity, reliability and cost, gallium arsenide (GaAs) remains the established technology for integrated optoelectronics. Unfortunately, the GaAs bandgap wavelength (0.85 microm) is far too short for fibre optics at 1.3-1.5 microm. This has led to work on materials that have a large lattice mismatch on GaAs. Here we demonstrate the first light-emitting diode (LED) that emits at 1.5 microm fibre-optic wavelengths in GaAs using optical transitions from arsenic antisite (As(Ga)) deep levels. This is an enabling technology for fibre-optic components that are lattice-matched to GaAs integrated circuits. We present experimental results showing significant internal optical power (24 mW) and speed (in terahertz) from GaAs optical emitters using deep-level transitions. Finally, we present theory showing the ultimate limit to the efficiency-bandwidth product of semiconductor deep-level optical emitters.     

Design and demonstration of a high-speed, multichannel, optical-sampling oscilloscope

Free-space digital optical systems have demonstrated the capability to provide thousands of optical connections between optoelectronic chips. This dense concentration of channels creates substantial challenges in monitoring individual connections for diagnostic purposes without compromising performance. Prom the concept of stroboscopic techniques, we have designed and constructed a multichannel optical diagnostic tool that operates analogously to an electronic-sampling oscilloscope. The tool is economically constructed by the use of commercially available video cameras and video-enhanced personal computers. An integrated software application operates the tool and displays multiple-channel waveforms. We demonstrate the oscilloscope-sampling optical waveforms of a two-dimensional optoelectronic modulator array operating at data rates from 0.5 to 4 Gbits/s.