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以硅-二氧化硅复合靶作为溅射靶,改变靶上硅与总靶面积比为0%,7%,10%,20%和30%,用射频磁控溅射方法在p型硅衬底上淀积了五种富硅量不同的二氧化硅薄膜.所有样品都在300℃氮气氛中退火30分钟.通过X射线光电子能谱、光吸收和光致发光测量确定出:随着硅在溅射靶中面积比的增加,所制备的氧化硅薄膜中纯硅(纳米硅)的量在增加,纳米硅粒的平均光学带隙在减小;但不同富硅量的二氧化硅膜的光致发光谱峰都接近于1.9eV,随硅在溅射靶中面积比增加,发光峰有很小的红移,其红移量远小于纳米硅粒的平均光学带隙的减少量. 相似文献
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用离子束溅射的方法在红外石英玻璃基底上制备了Ta2O5/SiO2(1.064μm波长下高透,2.128μm波长下高反)波长分离膜,利用飞秒激光系统(输出波长为2μm,脉宽为80 fs)测试了它的激光损伤情况,同时用光学显微镜和扫描电镜观察了样品的损伤形貌,根据不同能量作用下破斑面积与能量密度的关系拟合得到样品的损伤阈值。实验结果表明,2μm飞秒激光作用在波长分离膜的损伤形貌为层状分布,破斑边缘比较清晰,没有热扩散和热传导现象,属于本征损伤。利用基于导带电子数密度的理论模型,并结合电场分布与带隙理论讨论了2μm飞秒激光作用于光学薄膜的损伤机制,确定了损伤起源于高低折射率界面处的窄带隙材料。 相似文献
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室温下,采用直流磁控溅射法,在玻璃衬底上制备出Nb掺杂ZnO(NZO,ZnO:Nb)透明导电薄膜。研究了靶与衬底之间的距离对NZO薄膜结构、形貌、光学及电学性能的影响。实验结果表明,不同靶基距下制备的NZO薄膜均为c轴择优取向生长,(002)衍射峰的强度随着靶基距的减小而增大。靶基距增大时,薄膜表面逐步趋向平整光滑、均匀致密,薄膜的厚度逐渐减小。在靶基距为60mm时,制备的薄膜厚为355.4nm,电阻率具有最小值(6.04×10-4Ω.cm),在可见光区的平均透过率达到92.5%,其光学带隙为3.39eV。 相似文献
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生长温度对类金刚石膜结构和发光性质的影响 总被引:1,自引:0,他引:1
使用脉冲激光沉积技术制备了系列无氢类金刚石薄膜,测量了样品的Raman光谱、光吸收光谱和光致发光光谱,研究了薄膜结构和光致发光性质与制备条件的依赖关系。结果表明,这种薄膜是由少量sp2键和大量sp3键组成的非晶碳膜。薄膜的光学带隙在1.68~2.46eV,发光在可见光区呈宽带结构。生长温度能够对类金刚石薄膜的结构和发光性质产生较大影响。当生长温度从室温升高至400℃时,sp2团簇的变大使C原子的有序度增强,从而导致薄膜的光学带隙变窄,发光峰红移且半高宽变小。 相似文献
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制备参数和退火对a—C:H膜光学性质的影响 总被引:1,自引:0,他引:1
本文主要研究了制备参数和退火对a-C:H膜的光学性质的影响。得到了样品的吸收系数、光学带隙和带尾宽度等反映a-C:H膜电子能带结构的物理参数。 相似文献
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脉冲激光沉积法制备氧化锌薄膜 总被引:7,自引:0,他引:7
ZnO是一种新型的Ⅱ-Ⅵ族半导体材料,具有优良的晶格、光学和电学性能,其显著的特点是在紫外波段存在受激发射。利用脉冲激光沉积法(PLD)在氧气氛中烧蚀锌靶制备了纳米晶氧化锌薄膜,衬底为石英玻璃,晶粒尺寸约为28-35 nm。X射线衍射(XRD)结果和光致发光(PL)光谱的测量表明,当衬底温度在100-250℃范围内时,所获得的ZnO薄膜具有c轴的择优取向,所有样品的强紫外发射中心均在378-385 nm范围内,深能级发射中心约518-558 nm,衬底温度为200℃时,得到了单一的紫外光发射(没有深能级发光)。这归因于其较高的结晶质量。 相似文献
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飞秒脉冲激光沉积Si基a轴择优取向的钛酸铋铁电薄膜 总被引:3,自引:3,他引:3
在钛酸铋(Bi4Ti3O12)薄膜的制备过程中容易获得晶粒c轴垂直于基片表面的薄膜,而压电和铁电存储器主要利用a轴的自发极化分量,因而制备a轴择优取向的Bi4Ti3O12铁电薄膜具有特别的意义。采用飞秒脉冲激光作用在钛酸铋陶瓷靶上,采用Si(111)作为衬底,制备了a轴择优取向的钛酸铋薄膜。采用X射线衍射(XRD)的薄膜附件和场发射扫描电镜(FSEM)研究了薄膜的结构和形貌;采用傅里叶红外光谱仪测量了室温(20℃)下在石英基片上沉积的样品的光学特性;室温下沉积的钛酸铋薄膜呈c轴择优取向,晶粒的平均大小为20 nm,其光学禁带宽度约为1.0 eV。在500℃沉积的钛酸铋薄膜呈a轴择优取向,晶粒大小在30~300 nm之间,薄膜的剩余极化强度Pr为15μC/cm2,矫顽力Er为48 kV/cm。 相似文献
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采用磁控溅射法制备了C掺杂TiO2薄膜,并研究了氮气引入溅射过程对薄膜光学性能的影响。利用X射线衍射仪、拉曼光谱仪、X射线光电子能谱仪、分光光度计和原子力显微镜分析了不同氮气流量下薄膜的微结构、元素价态、透光性能和表面形貌。结果表明,沉积的薄膜主要是非晶结构,拉曼光谱中存在少量锐钛矿相,且随着氮气流量增大,锐钛矿特征峰强度减弱,意味着晶粒出现细化。当氮气流量增大为4cm3/min时,C掺杂TiO2薄膜内氮元素含量为3.54%,其光学带隙从3.29eV变化至3.55eV,可见光区的光学透过率明显提高。可见改变氮气流量可实现对C掺杂TiO2薄膜光学带隙和光吸收率的有效调控。 相似文献
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Bo Zhang 《Materials Science in Semiconductor Processing》2010,13(5-6):411-416
Indium tin oxide (ITO) and indium tin tantalum oxide (ITTO) films were deposited on glass substrates by magnetron sputtering technology with one or two targets. Properties of ITO and ITTO films deposited at different oxygen flow rates were contrastively studied. Ta-doping strengthens along the orientation of (400) plane and leads to better crystalline structure as well as to a decrease in surface roughness. The increase in oxygen flow rate increases sheet resistance and reduces carrier concentration, and ITTO films show higher carrier concentration. Certain oxygen flow rates can improve the visible light transmittance of films, but excessive oxygen can worsen the optical properties. The carrier concentration has an important influence on near-IR reflection, near-UV absorption and optical band gap. The optical band gap decreases with the increasing of oxygen flow rate, and ITTO films show wider optical band gap than ITO films. ITTO films prepared by co-sputtering reveal better optical–electrical properties and chemical and thermal stability than ITO films. 相似文献
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反应淀积氮化铝薄膜及其性质的研究 总被引:9,自引:0,他引:9
实验使用脉冲激光熔蚀金属铝靶,使溅射的物质粒子和真空室中的氮气反应以淀积氮化铝(AlN)薄膜,淀积时引入氮气直流放电以促使Al和N发生完全反应制备高质量符合化学计量比的AlN薄膜。讨论了脉冲能量密度、基底温度、气体放电对所沉积薄膜组织结构的影响。实验结果表明,当DE=1.0J·cm-2,PN2=13.333kPa,Tsub=200℃,V=650V,f=5Hz,dS-T=4cm时,高质量的AlN薄膜被成功地沉积于Si(100)基片上。分析表明薄膜是具有高取向性的AlN(100)多晶膜,薄膜的能带间隙约为6.2eV,其电阻率和击穿电场分别为2×1013Ω·cm和3×106V·cm-1。 相似文献
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A. P. Dostanko O. A. Ageev D. A. Golosov S. M. Zavadski E. G. Zamburg D. E. Vakulov Z. E. Vakulov 《Semiconductors》2014,48(9):1242-1247
The influence of the parameters of the deposition process on the stoichiometric composition and electrical and optical properties of ZnO films deposited by the ion-beam sputtering of a ZnO target is studied. It is established that, upon sputtering of a ZnO target with stoichiometric composition, there is a deficit of oxygen in the films deposited. Even for the case of target sputtering in a pure O2 atmosphere, the stoichiometry index of the films is no higher than 0.98. A decrease in the oxygen content in the films is accompanied by a sharp decrease in the resistivity to 35–40 Ω m, narrowing of the optical band gap, and a shift of the optical transmittance edge from 389 to 404 nm. All of the variations in the optical and electrical properties of the ZnO films can be attributed to variations in the concentration and mobility of free charge carriers in the films. 相似文献
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Yunfeng Lai Baowei Qiao Jie Feng Yun Ling Lianzhang Lai Yinyin Lin Ting’ao Tang Bingchu Cai Bomy Chen 《Journal of Electronic Materials》2005,34(2):176-181
Nitrogen-doped Ge2Sb2Te5 (GST) films for nonvolatile memories were prepared by reactive sputtering with a GST alloy target. Doped nitrogen content
was determined by using x-ray photoelectron spectroscopy (XPS). The crystallization behavior of the films was investigated
by analyzing x-ray diffraction (XRD) and differential scanning calorimetry (DSC). Results show that nitrogen doping increases
crystallization temperature, crystallization-activation energy, and phase transformation temperature from fcc to hexagonal
(hex) structure. Doped nitrogen probably exists in the grain vacancies or grain boundaries and suppresses grain growth. The
electrical properties of the films were studied by analyzing the optical band gap and the dependence of the resistivity on
the annealing temperature. The optical band gap of the nitrogen-doped GST film is slightly larger than that of the pure GST
film. Energy band theory is used to analyze the effect of doped nitrogen on electrical properties of GST films. Studies reveal
that nitrogen doping increases resistivity and produces three relatively stable resistivity states in the plot of resistivity
versus annealing temperature, which makes GST-based multilevel storage possible. Current-voltage (I-V) characteristics of
the devices show that nitrogen doping increases the memory’s dynamic resistance, which reduces writing current from milliampere
to microampere. 相似文献