Si(111) 衬底上3C-SiC的超低压低温外延生长

研究了发展一种Si衬底上低温外延生长3C－SiC的方法。采用LPCVD生长系统，以SiH4和C2H4为气源，在超低压（30Pa) ,低温（900℃）的条件下，在Si(111衬底上外延生长出高质量的3C－SiC薄膜材料。采用俄歇能谱（AES），X射线衍射（XRD）和原子力显微镜（AFM）等分析手段研究了SiC薄膜的外延层组分，晶体结构及其表面形貌。AES结果表明薄膜中的Si/C的原子比例符合SiC的理想化学计量比，XRD结果显示了3C－SiC外延薄膜的良好晶体结构，AFM揭示了3C－SiC薄膜的良好的表面形貌。     

3C-SiC/Si(111)的掠入射X射线衍射研究

在衬底温度为1000℃条件下, 利用固源分子束外延(SSMBE)技术在Si衬底上生长3C-SiC单晶薄膜. RHEED结果显示在Si(111)上所生长的SiC薄膜为3C-SiC, 并与衬底的取向基本一致. 采用同步辐射掠入射X射线衍射(GID)技术并结合常规X射线衍射(XRD)研究了SiC薄膜内的应变和晶体质量. 常规衍射的联动扫描曲线得到薄膜处于双轴张应变状态. 3C-SiC薄膜和Si衬底的晶格失配和热膨胀系数失配是导致双轴张应变的原因. 根据不同角度的掠入射衍射Phi扫描的摇摆曲线结果, 发现薄膜晶体质量在远离SiC/Si界面区变好. 这是由于SiC薄膜中的缺陷随着远离界面逐渐减少的原因. GID和XRD的摇摆曲线结果表明薄膜中镶嵌块的倾斜大于扭转, 表明SiC薄膜在面内的晶格排列要比垂直方向更加有序.     

蒸发速率对Si衬底上SSMBE外延SiC薄膜的影响

采用固源分子束外延（SSMBE）生长技术,用不同的蒸发速率,在Si（111）衬底上生长SiC薄膜。利用反射式高能电子衍射（RHEED）、X射线衍射（XRD）、原子力显微镜（AFM）等实验技术,对生长的样品的形貌和结构进行研究。结果表明,在优化的蒸发速率（1.0 nm·min^-1）下,所生长的薄膜质量最好。低的蒸发速率（0.25 nm·min^-1）难以抑制孔洞的形成,衬底的Si原子可通过这些孔洞扩散到样品表面,导致结晶质量变差。在高的蒸发速率（1.8 nm·min^-1）下,以岛状方式生长甚至以团簇聚集,表面的原子难以迁移到最佳取向的平衡位置,导致样品表面粗糙度变大,薄膜的结晶质量变差,甚至出现多晶。     

不同衬底温度下预沉积Ge对SiC薄膜生长的影响

分别在未沉积Ge和不同衬底温度(300、 500、700℃)沉积Ge条件下,利用固源分子束外延(SSMBE)技术在Si衬底上外延SiC薄膜.通过反射式高能电子衍射(RHEED)、X射线衍射(XRD)、原子力显微镜(AFM)和傅里叶变换红外光谱(FTIR)等仪器对样品进行测试.测试结果表明,预沉积Ge的样品质量明显好于未沉积Ge的样品,而且随着预沉积温度的升高,薄膜的质量在逐渐地变好.     

PLD方法生长ZnO/Si异质外延薄膜的研究

用脉冲激光沉积法在Si(111)衬底上制备了ZnO薄膜。RHEED和XRD测试表明,直接沉积在Si衬底上的ZnO薄膜为多晶薄膜,且薄膜的结晶质量随衬底温度的升高而下降。相比之下,生长在一低温同质缓冲层上的ZnO薄膜则展现出规则的斑点状RHEED图像,说明它们都是外延生长的高质量ZnO薄膜。XRD与室温PL谱分析表明,外延ZnO薄膜的质量随衬底温度的升高得到明显的改善。在650℃生长的样品具有最好的结构和发光特性,其(002)衍射峰的半高宽为0.185°,UV峰的半高宽仅为86meV。     

低温生长硅基碳化硅薄膜研究

在 8 5 0℃的低温下 ,在Si( 10 0 )衬底上生长了 3C SiC薄膜 ,气源为SiH4和C2 H4混合气体。用X射线衍射、X射线光电子能谱和傅立叶红外吸收谱分析了薄膜的晶体结构、组分以及键能随深度的变化。研究表明薄膜为富硅的 3C SiC结晶层 ,其中的Si/C比约为 1 2。     

新型声表面波器件中氧化锌薄膜的研制

本文采用直流磁控反应溅射法,在单晶Si(110),Al/Si,Diamond/Si三种衬底上分别生长出了高度c轴取向的ZnO薄膜.此薄膜具有高质量的纳米级结晶度(10nm～30nm),良好的表面平整度(低于10nm),高于107Ω·cm的电阻率及较高的应力承载性,很好的满足了薄膜声表面波(SAW)器件制备及降低损耗的需要.通过改变工作气压,氩氧比等工艺参数,较系统地探索了ZnO薄膜的制备条件.采用多种分析手段,如X射线衍射(XRD),扫描电镜(SEM),高能反射式电子衍射(RHEED),原子力显微镜(AFM)等对薄膜的微观结构及结晶品质进行了测试分析,并对薄膜的电学性能及机械性能进行了考察.     

衬底温度对Si(111)衬底上MBE异质外延3C-SiC薄膜的影响

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上异质外延生长3C-SiC单晶薄膜, 通过RHEED、XRD、AFM、XPS等实验方法研究了衬底温度对薄膜结构、形貌和化学组分的影响. 研究结果表明, 1000℃生长的样品具有好的结晶质量和单晶性. 在更高的衬底温度下生长, 会导致大的孔洞形成, 衬底和薄膜间大的热失配使降温过程中薄膜内形成更多位错, 从而使晶体质量变差. 在低衬底温度下生长, 由于偏离理想的化学配比也会导致薄膜的晶体质量降低.     

钙钛矿型氧化物SrTiO3/BaTiO3多层膜的激光分子束外延生长研究

用激光分子束外延技术在SrTiO3(001)衬底上外延生长SrTiO3/BaTiO3多层膜,通过反射式高能电子衍射(RHEED)原位实时监测并结合原子力显微镜(AFM),研究了不同基片温度下所生长薄膜的表面平整度,利用X射线衍射(XRD)对外延薄膜进行了结构分析,结果表明薄膜具有二维生长模式,在基片温度为380～470℃之间生长的薄膜具有原子级光滑,并且具有完全C轴取向.同时运用X射线光电子能谱(XPS)研究了薄膜界面的互扩散,结果表明降低制备薄膜时的基片温度有利于减少互扩散.     

不同基底对掺镧钛酸铅铁电薄膜结晶性能的影响

采用射频磁控溅射技术,使用相同的工艺条件在Si(100)基底和Pt/Ti/SiO2/Si(100)基底上生长了掺镧钛酸铅[(Pb0.9,La0.1)TiO3,PLT10]铁电薄膜。采用常规热处理工艺对两种基底上生长的PLT铁电薄膜在相同条件下进行了退火。用原子力显微镜(AFM)观察PLT薄膜的表面形貌。用X射线衍射技术(XRD)研究PLT薄膜结晶性能。XRD图谱表明硅基底上的PLT在晶化后,各主要晶面的衍射峰均出现,取向呈现多样化;而在铂上的PLT在晶化后,只出现了(111)晶面衍射峰和(222)晶面衍射峰,取向是单一的〈111〉方向。通过对XRD的数据计算可知,在相同条件下退火的PLT薄膜,在铂上的PLT的晶粒尺寸大于在硅基底上的PLT的晶粒尺寸。晶粒尺寸的差异反应出了由于基底的影响而造成薄膜晶化过程中成核方式的差异。     

Si(111)衬底上多层石墨烯薄膜的外延生长

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上沉积碳原子外延生长石墨烯薄膜, 通过反射式高能电子衍射(RHEED)、红外吸收谱(FTIR)、拉曼光谱(RAMAN)和X射线吸收精细结构谱(NEXAFS)等手段对不同衬底温度(400、600、700、800℃)生长的薄膜进行结构表征. RAMAN和NEXAFS结果表明: 在800℃下制备的薄膜具有石墨烯的特征, 而 400、600和700℃生长的样品为非晶或多晶碳薄膜. RHEED和FTIR结果表明, 沉积温度在600℃以下时C原子和衬底Si原子没有成键, 而衬底温度提升到700℃以上, 沉积的C原子会先和衬底Si原子反应形成SiC缓冲层, 且在800℃沉积时缓冲层质量较好. 因此在Si衬底上制备石墨烯薄膜需要较高的衬底温度和高质量的SiC缓冲层.     

Si(001)衬底上方形3 C-SiC岛的LPCVD生长

Si衬底上SiC的异质外延生长深受关注,为了了解Si衬底上的成核及长大过程,采用PLCVD方法在Si(001)衬底上生长出了方形3C-SiC岛,利用Nomarski光学显微镜和扫描电子显微镜（SEM）观察了SiC岛的形状,尺寸,密度和界面形貌,结果表明,3C－SiC岛生长所需的Si原子来自反应气源,衬底上的Si原子不发生迁移或外扩散,气相中C原子浓度决定了SiC岛的生长过程。     

GaN films grown by vapor-phase epitaxy in a hydride-chloride system on Si(111) substrates with AlN buffer sublayers

Oriented GaN layers with a thickness of about 10 μm have been grown by hydride-chloride vaporphase epitaxy (HVPE) on Si(111) substrates with AlN buffer layers. The best samples are characterized by a halfwidth (FWHM) of the X-ray rocking curve of ω_θ = 3–4 mrad. The level of residual mechanical stresses in AlN buffer layers decreases with increasing temperature of epitaxial growth. The growth at 1080°C is accompanied by virtually complete relaxation of stresses caused by the lattice mismatch between AlN and Si.     

Heteroepitaxy of zinc-blende SiC nano-dots on Si substrate by organometallic ion beam

The self-assembled SiC nano-dots were fabricated on Si(111) substrate at low-temperatures using the organometallic ion beam deposition technique. The single precursor of methylsilicenium ions (SiCH₃⁺) with the energy of 100 eV was deposited on Si(111) substrate at 500, 550 and 600 °C. The characteristics of the self-assembled SiC nano-dots were analyzed by reflection high-energy electron diffraction (RHEED), Raman spectroscopy and atomic force microscope (AFM). The RHEED patterns showed that the crystal structure of the SiC nano-dots formed on Si(111) substrate was zinc-blende SiC (3C-SiC) and it was heteroepitaxy. The self-assembled SiC nano-dots were like a dome in shape, and their sizes were the length of 200-300 nm and the height of 10-15 nm. Despite the low-temperature of 500 °C as SiC crystallization the heteroepitaxial SiC nano-dots were fabricated on Si(111) substrate using the organometallic ion beam.     

Investigation of the nucleation and growth of SiC nanostructures on Si

Using in situ reflection high energy electron diffraction (RHEED), ex situ atomic force microscopy (AFM) and transmission electron microscopy (TEM) the early stages of SiC growth on Si during the carbonisation were investigated in a solid source molecular beam epitaxy equipment. Different mechanisms of SiC precipitate growth by SSMBE were found. The SiC growth during carbonisation of Si(111) at 600°C is controlled by diffusion and at higher temperatures by a two-dimensional nucleation process, which is mononuclear at 660°C and polynuclear above 750°C. At temperatures greater than 750°C and 850°C three-dimensional nucleation occurs at (111) and (100) surfaces, respectively.     

The structural deformations in the Si/SiGe system induced by thermal annealing

The structural deformations in Si/SiGe system during thermal annealing were investigated by means of atomic force microscope (AFM) and high-resolution X-ray diffraction (HRXRD). The (004) rocking curve measurements showed that the obvious fringes of rocking curve obtained from pre-annealing sample were faded out gradually and disappeared completely with increasing the annealing temperature, which indicated that the abrupt Si/SiGe interface was destroyed gradually. The analyses of the peak broadening and relative position of the SiGe epilayer with respect to the Si substrate in high-resolution reciprocal space map (HRRSM) measurements described clearly the formation of mosaic structure in Si/SiGe system. The inner deformation induced the surface corrugate, known as crosshatch morphologies, which was analyzed by AFM measurements.     

The structure and photoluminescence properties of ZnO/SiC multilayer film on Si substrate

ZnO/SiC multilayer film has been fabricated on a Si (111) substrate with a silicon carbide (SiC) buffer layer using the RF (radio frequency)-magnetron technique with targets of a ceramic polycrystalline zinc oxide (ZnO) and a composite target of pure C plate with attached Si chips on the surface. The as-deposited films were annealed at a temperature range of 600–1000°C under nitrogen atmosphere. The structure and photoluminescence (PL) properties of the samples were measured using X-ray diffractometry (XRD), Fourier transform infrared (FTIR) spectroscopy and PL spectrophotometry. By increasing the annealing temperature to 800°C, it is found that all the ZnO peaks have the strongest intensities, and the crystallinity of ZnO is more consistent on the SiC buffer layer. Further increase of the annealing temperature allows the ZnO and SiC layers to penetrate one another, which makes the interface between ZnO and SiC layer become more and more complicated, thus reduces the crystallinities of ZnO and SiC. The PL properties of a ZnO/SiC multilayer are investigated in detail. It is discovered that the PL intensities of these bands reach their maximum after being annealed at 800°C. The PL peaks shift with an increase in the annealing temperature, which is due to the ZnO and SiC layers penetrating reciprocally. This makes the interface more impacted and complicated, which induces band structure deformation resulting from lattice deformation.