聚醚醚酮增韧改性环氧树脂

采用共混法用聚醚醚酮(PEEK)改性环氧树脂(EP),借助差示扫描量热分析(DSC)确定了环氧树脂的固化工艺,测试了共混体系的工艺性能,研究了聚醚醚酮含量对环氧树脂力学性能的影响。借助扫描电子显微镜(SEM)对材料断裂面的形态结构进行了分析,探讨了体系的形态结构与冲击性能之间的关系。结果表明,在改性材料的韧性有所提高的同时,压缩强度、马丁耐热都没有降低。从断裂面的形态来看,是属于韧性断裂。当PEEK的加入量为6%时,韧性最好,达到19．1kJ/m~2,比纯的环氧树脂增加了107．6%。     

反应型液晶化合物改性环氧树脂的性能

利用自行合成的端基含有活性基团的热致性液晶化合物(LCEU)改性环氧树脂CYD-128／4，4’-二氨基二苯砜(DDS)固化体系，用DMA测试了共混物的动态力学性能并研究其结构与性能的关系，对改性体系的冲击强度、拉伸强度、弯曲强度、弹性模量、断裂伸长率、热失重温度(TG)与LCEU含量的关系进行了探讨，用扫描电镜(SEM)对材料断面的形态结构进行了研究。结果表明，经LCEU改性的共混物的α、β转变温度提高，橡胶态模量提高，材料的力学性能和热稳定性提高，改性后材料断裂面的形态逐渐呈现韧性断裂特征。     

纺织结构碳纤维增强聚醚醚酮基复合材料的制备及界面改性

采用热压成型法制备纺织结构碳纤维增强聚醚醚酮(CFF/PEEK)航空热塑性复合材料。通过对碳纤维(CF)进行去浆、活化,及采用磺化聚醚醚酮(SPEEK)进行表面涂层,显著提高了CFF/PEEK复合材料的层间剪切强度。讨论了热压温度、压力等工艺参数对材料综合力学性能的影响规律,确定优化工艺条件,制备的复合材料拉伸强度和弯曲强度分别达到714.29 MPa和955.84 MPa。借助扫描、金相显微镜等观察手段,发现经过界面改性处理后,复合材料断裂发生在基体内部而非界面处,基体与增强体浸润性和结合性良好。     

PEK—C／PEEK共混物的研究

用挤出方法制备了新型聚芳醚酮(PEK-C)和聚醚醚酮(PEEK)共混物。对共混体系的相容性、转变、结晶结构及力学性能等进行了研究。初步结果显示了PEK-C和PEEK具有很好的互补和协同作用,表明该共混物是一种很有前途的工程材料。     

聚醚醚酮改性研究进展

聚醚醚酮(PEEK)作为一种新型高性能热塑性工程塑料,在许多工程领域有着广泛的应用.采用不同手段增强PEEK,改善其加工性能和力学性能、热性能、摩擦学性能,有利于降低材料成本和进一步拓展应用范围.本文从纤维增强PEEK、颗粒填充PEEK、PEEK表面改性、与聚合物共混等方面综述了PEEK改性研究的进展情况.     

聚醚醚酮与酚酞型聚芳醚砜共混物的相容性特征

本文借助示差扫描量热(DSC),扭辩分析(TBA)和傅里叶变换红外光谱(FTIR)等技术研究了聚醚醚酮(PEEK)/酚酞型聚芳醚砜(PES-C)共混物的相容性特征。结果表明共混物是部分相容的,共混物的相容程度与共混物的热历史有关。在共混物相容程度较高时,共混物的两个 T_g 随共混物组分的改变彼此向对方移动;共混使对应于 PES-CT_g 的玻璃化转变变宽。PEEK/PES-C 共混物的部分相容性从两者有一定程度的分子链水平的相互作用得到证实。     

互穿网络型乙烯基酯树脂/环氧树脂的增韧与热性能

使用双酚A型环氧乙烯基酯树脂(VER)与双酚F型环氧树脂(EP)同步固化的方法对环氧树脂进行增韧改性.研究了共混体系的固化反应过程、力学和热性能以及形态结构.结果表明,当环氧树脂与乙烯基酯树脂的质量比为90∶10时,所得到的树脂体系在韧性提高的同时,耐热性能(Tg)也有明显的提高,获得了一种兼具韧性和耐热性能的树脂基体.     

乙烯基侧链环氧树脂对E-51/NBR体系的影响

采用新型乙烯基侧链环氧树脂(VE)与E-51环氧树脂/液体丁腈橡胶体系共混,用万能材料试验机、动态力学分析仪和扫描电镜表征了VE的含量对树脂/橡胶体系力学性能、玻璃化转变温度(Tg)、微观相态结构的影响.结果表明,利用VE与E-51、丁腈橡胶良好的相容性可以显著改善树脂/橡胶体系的相容性;添加了VE后,用液体丁腈橡胶改性过的环氧树脂韧性提高,并保持了较好的力学强度;当VE/E-51=4/6,NBR含量为20%(wt)时,其拉伸强度比纯E-51/NBR体系提高11.9%,弯曲强度提高31.3%,断裂伸长率提高14.8%;体系的Tg、微观相态结构都随VE的含量呈现出有规律的变化.     

聚乳酸/改性聚醚酯嵌段共聚物共混体系的结构与性能

采用熔融挤出共混的方法制备了聚乳酸(PLA)/改性聚醚酯嵌段共聚物(CH4132)共混物。利用差示扫描量热分析、动态力学热分析及场发射扫描电子显微镜等研究了共混物的结晶熔融行为、动态力学性能、相形态及力学性能。结果表明,CH4132的添加抑制了PLA的冷结晶能力,而对熔融及熔态结晶行为没有影响;PLA与CH4132具有部分的相容性且相容程度受CH4132含量影响;共混物呈现出以PLA为海、CH4132为岛的典型海岛结构;共混物的拉伸强度、弯曲强度和模量等刚性量随CH4132添加而降低,但体系的断裂伸长率和冲击强度等韧性性质得到了明显改善,在CH4132质量分数为10%时断裂伸长率最大,质量分数为30%时冲击强度为纯PLA的4.5倍。     

环氧树脂/超支化聚酯/纳米SiO2复合材料的制备及性能

采用超支化聚酯与聚硅酸溶胶共混改性环氧树脂,制备了环氧树脂/超支化聚酯/纳米SiO2三元共混体系纳米复合材料。研究了超支化聚酯/聚硅酸溶胶增韧改性环氧树脂固化体系的力学性能及热性能,通过X射线衍射(WAXD)、差示扫描量热(DSC)、热重分析(TGA)及扫描电镜(SEM)等测试手段对材料的微观相态结构与性能进行了表征。结果表明,超支化聚酯/聚硅酸的加入使纳米复合材料的力学性能和热性能得到明显提高。当纳米SiO2的含量为1%(质量分数,下同)时冲击强度比纯环氧树脂提高了10.48kJ/m2,材料的起始热分解温度也提高了27℃。     

可溶性聚醚醚酮对复合环氧/DDM的改性

热熔法制备了可溶性聚醚醚酮（s-PEEK）/E-51/多官能度环氧树脂复合体系,测试了体系的冲击强度、高温拉伸剪切强度和玻璃化温度,用扫描电镜（SEM）观察体系的微观结构,并与聚醚醚酮（PEEK）改性进行对比。结果表明,复合环氧体系加入两种聚醚醚酮后冲击强度下降,但含量为5g时出现较大值;体系的玻璃化温度随着s-PEE...     

Studies of modified bismaleimide resins Part I The influence of resin composition on thermal and impact properties

The influence of the components of a modified bismaleimide (BMI) resin on the thermal properties and impact properties of these resins are investigated in this paper. Toughened BMI resin castings incorporating 0%, 5%, 10%, 15%, 20%, 30%, and 40% (by weight) thermoplastic-modified polyetherketone (PEK-C) were prepared. The modified resins were characterized and analysed using dynamic mechanical thermal analysis (DMTA), thermogravimetric (TG) analysis, free beam impact tests, and scanning electron microscope (SEM) techniques. The results indicate that a typical 4,4'-bismaleimidodiphenyl methane (MBMI)/0,0'-diallybisphenol A (DABPA) two-component system modified with 4,4'-bismaleimide diphenyl ether of biphenyl A (MEBMI), Allyl phenol epoxy (AE), and PEK-C has a high glass transition temperature (Tg), excellent thermal stability, and outstanding impact strength. This novel toughened BMI resin is expected to find use in advanced composites.     

Poly(ether ether ketone) with pendent methyl groups as a toughening agent for amine cured DGEBA epoxy resin

A diglycidyl ether of bisphenol-A (DGEBA) epoxy resin was modified with poly(ether ether ketone) with pendent methyl groups (PEEKM). PEEKM was synthesised from methyl hydroquinone and 4,4′-difluorobenzophenone and characterised. Blends of epoxy resin and PEEKM were prepared by melt blending. The blends were transparent in the uncured state and gave single composition dependent T _g. The T _g-composition behaviour of the uncured blends has been studied using Gordon–Taylor, Kelley–Bueche and Fox equations. The scanning electron micrographs of extracted fracture surfaces revealed that reaction induced phase separation occurred in the blends. Cocontinuous morphology was obtained in blends containing 15 phr PEEKM. Two glass transition peaks corresponding to epoxy rich and thermoplastic rich phases were observed in the dynamic mechanical spectrum of the blends. The crosslink density of the blends calculated from dynamic mechanical analysis was less than that of unmodified epoxy resin. The tensile strength, flexural strength and modulus were comparable to that of the unmodified epoxy resin. It was found from fracture toughness measurements that PEEKM is an effective toughener for DDS cured epoxy resin. Fifteen phr PEEKM having cocontinuous morphology exhibited maximum increase in fracture toughness. The increase in fracture toughness was due to crack path deflection, crack pinning, crack bridging by dispersed PEEKM and local plastic deformation of the matrix. The exceptional increase in fracture toughness of 15 phr blend was attributed to the cocontinuous morphology of the blend. Finally it was observed that the thermal stability of epoxy resin was not affected by the addition of PEEKM.     

碳纤维-AlN/聚醚醚酮复合材料的制备与性能

以聚醚醚酮(PEEK)为基体树脂、碳纤维(CF)和氮化铝(AlN)为填料,通过模压成型的方法制备了抗静电耐热型CF-AlN/PEEK复合材料。采用高阻计、导热系数测定仪、热失重、差示扫描量热仪和SEM研究了CF-AlN/PEEK复合材料的抗静电性能、热性能、力学性能以及降温速率对复合材料性能的影响,并探讨了后期热处理对力学性能的影响。结果表明:当CF和AlN的质量分数均为10%时,CF-AlN/PEEK复合材料的性能较优,其表面电阻率达到108 Ω,比PEEK的表面电阻率提高了6个数量级;导热系数为0.418 W·(m·K)-1,初始分解温度高达573℃;拉伸强度提高了40.4%;降温速率越低,复合材料的熔点越高;后期热处理会影响CF-AlN/PEEK复合材料的力学性能,在270℃下热处理2 h,其拉伸强度可达146 MPa,表明在生产过程中,加工温度是影响复合材料性能的因素之一。      

Toughening mechanism for a rubber-toughened epoxy resin with rubber/matrix interfacial modification

For a rubber-toughened piperidine-DGEBA epoxy resin, the interface between the rubber particle and the epoxy resin matrix was modified by an epoxide end-capped carboxyl terminated butadiene and acrylonitrile random copolymer (CTBN). The end-capping epoxides used were a rigid diglycidyl ether of bisphenol-A (Epon 828), a short-chain flexible diglycidyl ether of propylene glycol (DER 736), and a long-chain flexible diglycidyl ether of propylene glycol (DER 732). The microstructures and the fracture behaviour of these rubber-modified epoxy resins were studied by transmission electron microscopy and scanning electron microscopy. Their thermal and mechanical properties were also investigated. In the rubber-modified epoxy resins, if the added CTBNs were end-capped by a flexible diglycidyl ether of propylene glycol (DER 732 or DER 736) before curing, the interfacial zone of the undeformed rubber particle, the degree of cavitation of the cavitated rubber particle on the fracture surface and the fracture energy of the toughened epoxy resin were all significantly increased. The toughening mechanism based on cavitation and localized shear yielding was considered and a mechanism for the interaction between cavitation and localized shear yielding that accounts for all the observed characteristics is proposed.     

聚醚酰亚胺对氰酸酯树脂/环氧树脂共混物的增韧作用

采用聚醚酰亚胺以提高双酚Ａ二氰酸酯／酚醛环氧树脂共混物的断裂韧性．实验结果表明，聚醚酰亚胺是氰酸酯／酚醛环氧树脂共混物的有效增韧剂，加入１５％的聚醚酰亚胺可使断裂韧性（ＫＩＣ）提高到１４５ＭＰａ·ｍ０．５，弯曲强度也有所提高．用扫描电子显微镜和动态粘弹谱研究了改性共混物的微观结构，具有双连续结构的共混物的耐溶剂性能大大下降，共混物的韧性和耐溶剂性主要与相行为有关， 固化工艺对含１０％聚醚酰亚胺的共混物的断裂韧性和形态没有明显的作用．     

Design and preparation of graphene/poly(ether ether ketone) composites with excellent electrical conductivity

Graphene/poly(ether ether ketone) (m-TRG/PEEK) composites with excellent electrical conductivity were fabricated by hot pressing technique with thermally reduced graphene nanosheets (m-TRG) which were modified by poly(ether sulfone). Moreover, the conductive, thermal, and mechanical properties of PEEK/m-TRG composites were investigated by the precision impedance analyzer, thermal gravimetric analyzer, differential scanning calorimetry, and universal tester, respectively. The electrical conductivity of m-TRG/PEEK composites was greatly improved by incorporating graphene, resulting in a sharp transition from electrical insulator to semiconductor with a low percolation threshold of 0.76 vol.%. A high electrical conductivity of 0.18 S m^?1 was achieved with 3.84 vol.% of m-TRG. The data were compared with those of composites reduced chemically, and the results showed that thermal reduction was an effective method to acquire higher electrical conductive composites. The excellent electrical property should be attributed to the large specific surface area of m-TRG, well dispersion of m-TRG in PEEK matrix, and good compatibility of m-TRG with PEEK matrix, as proven by scanning electron microscope. Besides, m-TRG/PEEK composites also exhibited relatively good thermal and mechanical properties.     

聚酰胺-胺树形分子对环氧树脂力学性能的影响

采用聚酰胺-胺(PAM AM)树形分子改性环氧树脂。用超声波分散工艺、浇铸工艺和试样加工手段,制备了聚酰胺-胺树形分子改性环氧树脂浇铸体。利用Instron试验机测试其性能,用电子扫描显微镜(SEM)分析了改性体系的断口形貌。结果表明,聚酰胺-胺树形分子能同时提高环氧树脂的力学性能。拉伸强度和冲击强度提高幅度分别为18%(改性2.5G)和96%(树形2.5G),聚酰胺-胺树形分子(2.5G)优于液体丁腈橡胶(CBTN)改性环氧树脂;改性后的材料的冲击断口为塑性断裂。     

海因环氧树脂/DDS体系的制备与性能

合成了海因环氧树脂,采用红外光谱和核磁共振进行了表征,制备了海因环氧树脂/二氨基二苯砜(DDS)体系,研究了海因环氧树脂/DDS体系的固化反应特性及固化物的性能。结果表明,树脂体系在100℃~296℃有一放热峰,峰值温度为197℃,140℃的凝胶时间长于42 min,在180℃下仅8 min;树脂浇铸体的氧指数为26.6,弯曲强度为111MPa,弯曲模量为4.14 GPa,冲击强度为14.8 kJ/m2。