A 44 GHz HEMT amplifier

A 44-GHz amplifier using 0.25-μm gate length and double-heterojunction structure HEMT devices is described. Higher gain and power performance have been obtained from the amplifier using this device at millimeter-wave frequencies. A spot gain of 9.4 dB and a 1-dB gain compression point of +7.5 dBm has been achieved at 43.5 GHz.     

A low-noise GaAs MESFET made with graded-channel doping profiles

We have demonstrated that devices fabricated from epitaxially grown material with a graded-channel doping profile are capable of improved microwave performance. For operation at 12 GHz, graded-channel doping profile devices have an associated gain that is always 1 dB higher at the minimum noise-figure point compared to ion-implanted Gaussian-channel doping profile devices. A noise figure of 1.60 dB with 11-dB associated gain has been obtained at 12 GHz for 0.5-µm × 300-µm gate devices. A tranconductance of 200 mS/mm for this device has been achieved.     

A high aspect ratio design approach to millimeter-wave HEMT structures

In MESFET and HEMT structures as the gate length is reduced below 0.5 µm in an attempt to achieve amplification at highest possible frequencies, it is essential that the depletion depth under the gate be also reduced in order to preserve a high aspect ratio that ensures a high device voltage gain factor (gm/g0) and a reasonable value of stable power gain at high frequencies. Results based on this design approach indicate that an n-A1GaAs/GaAs HEMT structure with 0.25-µm gate length could provide stable power gain in excess of 6 dB at the unity current gain frequency of 92.4 GHz, and for an aspect ratio of ten it is difficult to reduce the gate length below 0.25 µm.     

Noise figure characteristics of 1/2-µm gate single-heterojunction high-electron-mobility FET's at 35 GHz

In this letter, we report room-temperature noise figure performance of Gallium Arsenide single-heterojunction high-electron-mobility transistors (HEMT's). We have measured a noise figure of 2 dB at 35 GHz with 5 dB of associated gain. The devices tested were 150 µm wide with 0.5-µm-long gates. The active layers were grown by molecular beam epitaxy (MBE). These values are the best reported results for either HEMT's or MESFET's at these frequencies, regardless of their geometry.     

A 77 GHz mHEMT MMIC Chip Set for Automotive Radar Systems

A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 µm gate‐length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4‐inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2 mm × 2 mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1 mm × 2 mm. The frequency doubler achieved an output power of –6 dBm at 76.5 GHz with a conversion gain of ?16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2 mm × 1.2 mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W‐band.     

Planar fully ion implanted InP power junction FET's

This letter reports on the fabrication and performance of planar all ion-implanted 1.0-µm gate length InP power junction field effect transistors (JFET's). The devices were fabricated utilizing n+ implantation, a AuZn/TiW/Au gate metallization, and an n+ drain ledge. At 4.5 GHz, the 300-µm gate width JFET's exhibited maximum insertion gains of up to 13 dB and scaled output powers as high as 1 W/mm with 3-dB gain.     

X波段宽带单片低噪声放大器

从获取放大器的等噪声系数圆最大半径的角度来进行电路设计,设计了工作于X波段9～14GHz的宽带低噪声单片放大器,采用法国OMMIC公司的0.2μmGaAsPHEMT工艺(fT=60GHz)研制了芯片。在片测试结果为在9～14GHz,噪声系数<2.5dB,最小噪声系数在10.4GHz为2.0dB,功率增益在所需频段9～14GHz大于21dB,输入回波损耗<-10dB,输出回波损耗<-6dB。在11.5GHz,输出1dB压缩点功率为19dBm。     

Power performance and scalability of AlGaN/GaN power MODFETs

The scalability of power performance of AlGaN/GaN MODFETs with large gate periphery, as necessary for microwave power devices, is addressed in this paper. High-frequency large-signal characteristics of AlGaN/GaN MODFETs measured at 8 GHz are reported for devices with gatewidths from 200 μm to 1 mm. 1-dB gain compression occurred at input power levels varying from -1 to +10 dBm as the gatewidth increased, while gain remained almost constant at -17 dB. Output power density was ~1 W/mm for all devices and maximum output power (29.9 dBm) occurred in devices with 1-mm gates, while power-added efficiency remained almost constant at ~30%. The large-signal characteristics were compared with those obtained by dc and small-signal S-parameters measurements. The results illustrate a notable scalability of AlGaN/GaN MODFET power characteristics and demonstrate their excellent potential for power applications     

14-GHz band 1 watt GaAs f.e.t. amplifier

A 14.0?14.5 GHz 1 W amplifier using 0.5 ?m gate length power GaAs f.e.t.s has been developed. The amplifier, consisting of a cascade of three single-ended stages, realises 13 dB small-signal gain, 1.1 W output-power saturation and 39 dBm third-order intermodulation intercept. The circuit design and the microwave performance of the amplifier are discussed.     

A low-distortion K-band GaAs power FET

A K-band low-distortion GaAs power MESFET was developed by incorporating a pulse-type channel doping profile using molecular-beam-epitaxial technology and a novel 0.3-μm T-shaped gate. The low-distortion FETs offer about 10 to 15 dBc improvement in second-harmonic distortion compared to devices fabricated on a uniformity doped active layer. Significantly larger power load-pull contours are obtained with the low-distortion devices, indicating the improved linearity of these devices. In an 8-20-GHz single-stage broad-band amplifier, up to 10 dBc improvement in harmonic performance was achieved using the low-distortion device. This low-distortion device exhibits very linear transconductance as a function of the gate bias. A typical 750-μm-gate-width device is capable of 26 dBm of output power with 6 dB of gain, and power-added efficiency in excess of 35% when measured at 18 GHz. At 25 GHz, the device is capable of 24 dBm of output power with 5 dB associated gain     

A study of high-speed normally off and normally on Al0.5Ga0.5As heterojunction gate GaAs FET's (HJFET)

The dc, small-signal microwave, and large-signal switching performance of normally off and normally on Al0.5Ga0.5As gate heterojunction GaAs field-effect transistors (HJFET) with submicrometer gate lengths are reported. The structure of both types of devices comprises an n-type 10¹⁷-cm^-3Sn-doped active layer on a Cr-doped GaAs substrate, a p-type 10¹⁸-cm^-3Ge-doped Al0.5Ga0.5As gate layer and a p⁺-type 5 × 10¹⁸-cm^-3Ge-doped GaAs "contact and cap" layer on the top of the gate. The gate structure is obtained by selectively etching the p⁺-type GaAs and Al0.5Ga0.5As. Undercutting of the Al0.5Ga0.5As layer results in submicrometer gate lengths, and the resulting p⁺-GaAs overhang is used to self-align the source and the drain with respect to the gate. Normally off GaAs FET's with 0.5- to 0.7-µm long heterojunction gates exhibit maximum available power gains (MAG) of about 9 dB at 2 GHz. Large-signal pulse measurements indicate an intrinsic propagation delay of 40 ps with an arbitrarily chosen 100-Ω drain load resistance in a 50-Ω microstrip circuit. Normally on FET's with submicrometer gate lengths (∼0.6 µm) having a total gate periphery of 300 µm and a corresponding dc transconductance of 20-30 mmhos exhibit a MAG of 9.5 dB at 8 GHz. The internal propagation delay time measured under the same conditions as above is about 20 ps.     

A sub-mW 2.9-dB noise figure Inductor-less low noise amplifier for wireless sensor network applications

In this paper, a low power differential inductor-less Common Gate Low Noise Amplifier (CG-LNA) is presented for Wireless Sensor Network (WSN) applications. New Shunt feedback is employed with noise cancellation and Dual Capacitive Cross Coupling (DCCC) techniques to improve the performance of common gate structures in terms of gain, Noise Figure (NF) and power consumption. The shunt feedback path boosts the input conductance of the LNA in current reuse scheme. Both shunt feedback and current reuse bring power dissipation down considerably. In addition, the positive feedback is utilized to cancel the thermal noise of the input transistor. The proposed LNA is designed and simulated in 0.18 µm TSMC CMOS technology. Post layout Simulation results indicate a voltage gain of 16.5 dB with −3 dB bandwidth of 100 MHz–3 GHz. Also third order Input Intercept Point (IIP3) is equal to + 1 dBm. The minimum NF is 2.8 dB and the value of NF at 2.4 GHz is 2.9 dB. S11 is better than −13 dB in whole frequency range. The core LNA consumes 985 µW from a 1.8 V DC voltage supply.     

Prediction of Wide-Band Power Performance of MESFET Distributed Amplifiers Using the Volterra Series Representation

The power performance of a four-section MESFET distributed amplifier is predicted over the frequency range 2-8 GHz. The nonlinear model of the MESFET used has three nonlinear elements: g/sub d/, and C/sub gs/, which are represented by power series up to the third order. The analysis employs the Volterra series representation up to the third order. Experimental verification is first made on a 0.5x400-µm medium-power MESFET device to confirm the validity of the nonlinear model used in the analysis. The agreement between predicted and measured output power at 1-dB gain compression is within +-0.5 dBm across the 2-16 GHz band. A four-section distributed amplifier was then built with four 0.5x400-µm MESFET's. The agreement between predicted and measured output power at 1-dB gain compression of this amplifier is within +-0.7 dBm across the 2-8-GHz band. The measured output power at 1-dB gain compression is (22+-1) dBm across the 2-8-GHz band.     

T形栅In0.52Al0.48As/In0.6Ga0.4As MHEMTs功率器件

利用电子束光刻技术制备了200nm栅长GaAs基T型栅InAlAs/lnGaAs MHEMT器件.该GaAs基MHEMT器件具有优越的直流、高频和功率性能,跨导、饱和漏电流密度、阈值电压、电流增益截止频率和最大振荡频率分别达到510mS/mm,605mA/mm,-1.8V,138GHz和78GHz.在8GHz下,输人功率为-0.88(2.11)dBm时,输出功率、增益、PAE、输出功率密度分别为14.05(13.79)dBm,14.9(11.68)dB,67.74(75.1)%,254(239)mW/mm,为进一步研究高性能GaAs基MHEMT功率器件奠定了基础.     

GaAs microwave power FET

A design consideration for an X-band GaAs power FET, features of the fabrication process, and electrical characteristics of the FET are described. Interdigitated 53 source and 52 drain electrodes and an overlaid gate electrode for connecting 104 Schottky gates in parallel have been introduced to achieve a 1.5-µm-long and 5200-µm-wide gate FET. A sheet grounding technique has been developed in order to minimize the common source lead inductance (L8= 50 pH). The resulting devices can produce 0.7-W and 1.6-W saturation output power at 10 GHz and 8 GHz, respectively. At 6 GHz, a linear gain of 7 dB, an output power of 0.85 W at 1-dB gain compression and 30-percent power added efficiency can be achieved. The intercept point for third-order intermodulation products is 37.5 dBm at 6.2 GHz.     

2.9 V operation GaAs power MESFET with 31.5-dBm output power and64% power-added efficiency

A state-of-the-art GaAs power MESFET operating at a drain bias of 2.9 V has been developed using the high-low doped channel structure grown by molecular beam epitaxy. The device has 0.6 μm gate length and 16 mm gate width. The power performance tested at a 2.9 V drain bias and 900 MHz operation frequency was output power of 31.5 dBm with 11.5 dB gain and 64% power-added efficiency     

A 68% PAE, GaAs power MESFET operating at 2.3 V drain bias for lowdistortion power applications

A high-efficient GaAs power metal semiconductor field effect transistor operating at a drain voltage of 2.3 V has been developed for low distortion power applications. The device has been fabricated on an epitaxial layer with a high-low doped structure grown by molecular beam epitaxy. The MESFET with a gate length of 0.8 μm and a total gate width of 21.16 mm showed a maximum drain current of 5.9 A at V_gs =0.5 V, a knee voltage of 1.0 V and a gate-to-drain breakdown voltage of 28 V. The MESFET tested at a 2.3 V drain bias and a 900 MHz operation frequency displayed the best power-added efficiency of 68% with an output power of 31.3 dBm. The associate power gain at 20 dBm input power and the linear gain were 11.3 dB and 16.0 dB, respectively. The power characteristics of the device operating under a bias of 2 V exhibit power-added efficiency of 67% and output power of 30.1 dBm at an input power of 20 dBm. Two tone test measured at 900.00 MHz and 900.03 MHz shows that 3rd-order intermodulation and power-added efficiency at an output power of 27 dBm were -30.6 dBc and 36%, respectively, which are good for CDMA digital applications. A third-order intercept point and a linearity figure-of-merit were measured to be 49.5 dBm and 53.8, respectively     

GaAs MESFET's by molecular beam epitaxy

The noise performance of "T" shaped Ti/W/Au gate GaAs Schottky-barrier field-effect transistors fabricated on channel layers grown by molecular-beam epitaxy (MBE) is reported. The nominal gate length was about 0.7 µm with a total gate width of 250 µm. Typical noise figure and the associated gain were 1.2 and 14 dB at 4 GHz, and 1.9 and 8.5 dB at 12 GHz. To out knowledge these are the best results reported to date on devices fabricated using MBE-grown GaAs. These preliminary results show the promise of MBE for high-quality GaAs FET's.     

X-band self-aligned gate enhancement-mode InP MISFET's

Self-aligned gate enhancement-mode InP/SiO2MISFET's with ∼0.8-µm channel length were successfully fabricated on an Fe-doped semi-insulating substrate. The fabricated MISFET's exhibited very high transconductance, as high as 200 mS/mm, and goodX-band operation, especially marked high-power-output characteristics. The minimum noise figure at 4 GHz was 1.87 dB with 10.0-dB associated gain. 1.17 W/mm and 1.0 W/mm power outputs were obtained at 6.5 and 11.5 GHz, respectively. 43.5-percent maximum power-added efficiency was attained at 6.5 GHz.     

Gigabit/s Optical Receiver Sensitivity and Zero-Dispersion Single-Mode Fiber Transmission at 1.55 µm

High-speed pulse response and receiver sensitivity at 1.55 µm were measured at data rates ranging from 400 Mbits/s to 2 Gbits/s, in order to elucidate characteristics of a reach-through p/sup +/nn/sup -/ Ge APD. The p/sup +/nn/sup -/ Ge APD receiver provided a 2 Gbit/s received optical power level of -32.0 dBm at 1.55 µm and a 10/sup -9/ error rate, which was 4 dB better than the receiving level with a p/sup +/n Ge APD. Detector performance at 1.3 µm was also studied for comparison with performance at 1.55 um. Single-mode fibers, which have 0.54 dB/km loss and zero dispersion at 1.55 µm, and an optical transmitter-receiver, whose repeater gain is 29.2 dB, have enabled 51.5 km fiber transmission at 2 Gbits/s. The transmission system used in this study has a data rate repeater-spacing product of 103 (Gbits/s) /spl dot/ km at 1.55 µm. Optical pulse broadening and fiber dispersion were also studied, using 1.55 and 1.3 µm dispersion free fibers. Future repeater spacing prospects for PCM-IM single-mode fiber transmission systems are discussed based on these experimental results.