微电子封装用主流键合铜丝半导体封装技术

微电子工业对于产品可靠性和材料成本的需求促使键合铜丝取代金丝成为半导体封装时应用的主流材料,在设备和技术工艺优化发展的前提下,键合铜丝技术由DIP等低端产品推广至QFN、小间距焊盘等高端产品领域,这也提升了半导体封装企业对铜丝性能和键合工艺的要求。本文对键合铜丝的性能优势与主要应用问题进行了论述,结合应用现状从使用微量元素、涂抹绝缘材料、优化超声工艺、改进火花放电工艺等几个方面提出了改善主流键合铜丝半导体封装技术应用效果的具体措施,以为相关生产单位提供参考指引。     

FT1500处理器中仿真驱动的DDR3封装设计

针对高性能微处理器封装中DDR3的信号完整性和电源完整性问题,提出了仿真驱动的封装设计方法：在设计之初通过前仿真制定准确的设计规则和目标,在设计过程中通过仿真指导设计优化,在设计完成后用后仿真验证设计结果。应用该方法设计了FT1500芯片封装,实测结果表明,该芯片的DDR3接口可以稳定工作在1400Mbps。     

SiP系统级封装设计仿真技术

SiP(System in Package)系统级封装技术正成为当前电子技术发展的热点,国际国内许多研究院所和公司已经将SiP技术作为最新的重要发展方向。首先阐述了SiP系统级封装的设计仿真技术及应用,然后结合实际工程项目,详细介绍了SiP最新的设计和仿真方法,并提出SiP设计仿真中应注意的问题。     

光读出红外成像芯片真空封装研究

为解决光读出红外成像焦平面阵列器件的真空封装,提出了一种新颖的真空封装方法。该封装结构由可见光窗口、硅垫片和红外窗口三部分构成。硅垫片和可见光窗口（玻璃）通过阳极键合形成封装腔体,用于放置芯片;红外窗口不仅选择性增透8～14μm波段的红外辐射,且作为封装盖板;封装腔体和红外窗口在真空室内通过焊料键合完成真空封装。该封装结构通过了气密检测,并测试得到了200℃电烙铁热像图。     

MEMS器件气密性封装的低温共晶键合工艺研究

介绍了一种采用Pb-Sn共晶合金作为中间层的键合封装技术,通过电镀的方法在芯片与基片上形成Cr/N i/Cu/Pb-Sn多金属层,在温度为190℃、压强为150 Pa的真空中进行键合,键合过程不需使用助焊剂,避免了助焊剂对微器件的污染。试验表明:这种键合工艺具有较好的气密性,键合区合金分布均匀、无缝隙、气泡等脱焊区,键合强度较高,能够满足电子元器件和微机电系统(MEMS)可动部件低温气密性封装的要求。     

阳极键合在MEMS封装中的研究进展

在微电子机械系统(Micro Electro Mechanical Systems,MEMS)领域,阳极键合是应用最为广泛的一项技术,有着广阔的发展前景。表面预处理和键合工艺是阳极键合中最为重要的两个因素。介绍了近年来在表面预处理和键合工艺方面的研究进展,分析总结了该技术的研制情况,指明了现阶段表面预处理和阳极键合存在的问题以及未来的研究方向。     

MEMS陀螺芯片的晶圆级真空封装

微机电系统(MEMS)陀螺需要真空封装以确保其检测精度,晶圆级真空封装可以使MEMS微结构避免芯片切割过程中的粘连以及颗粒污染,提高芯片的成品率.为实现MEMS陀螺芯片的晶圆级真空封装,提出了一种全硅MEMS陀螺芯片的晶圆级真空封装结构方案,并突破了Si-SiO2直接键合、吸气剂制备、金—硅(Au-Si)键合等关键技术...     

一种封装管壳快速建模方法

随着芯片工作频率越来越高,越来越多的封装被应用于高速电子系统。IC 封装的电性能在整个系统性能上 起着越来越重要的作用。工程师经常会遇到基板层数减少或者电源地管脚数量有限,但以Wirebond 形式封装的IC 仍要工作 在超高的频率。在封装电性能未知的情况下要确认整个芯片是否能正常工作将非常困难,这将会影响产品推向市场的时间。 为了提高设计效率及成功率,有必要从Chip-Package-Board 的系统仿真中找出设计的盈余。基于此原因,需要评估出封装管 壳的寄生参数并用于系统的仿真。本文介绍了一种管壳建模的快速方法。     

MEMS耐高温压力传感器封装工艺研究

为解决特种压力传感器结构的封装难题,提出了三种能够适用于200°C高温条件下的先进封装技术.通过有限元模拟,确定了采用低温玻璃键合技术对多种压力传感器进行封装,分析得出了适合的中间键合层厚度.选定了高强度低膨胀基底合金材料,制定了低温玻璃键合的工艺流程,采用先进的丝网印刷工艺确保中间键合层厚度.实验表明经过该工艺封装的压力传感器在高温下具有可靠的性能,能满足现代工业测量需求.     

A neural network model for the wire bonding process

A crucial step in manufacturing microcircuits is the wire bonding process in which a very thin gold wire must be formed to connect two surfaces in the microcircuit. The quality of the wire bond can be measured by visual inspection and a pull test—both of which are high-reliability, high-cost approaches to statistical process control. Westinghouse wanted to develop a high-reliability, low-cost quality assurance system. In this paper, we report on a year-long study to construct a neural network model that is capable of predicting the quality of wire bonds. The results of our modeling efforts reveal that neural networks are useful tools for statistical process control problems.     

Development and optimization of the laser-assisted bonding process for a flip chip package

In a fine pitch flip chip package, a laser-assisted bonding (LAB) technology has recently been developed to overcome several reliability and throughput issues in the conventional mass reflow (MR) and thermal compression bonding technology. This study investigated the LAB process for a flip chip package with a copper (Cu) pillar bump using numerical heat transfer and thermo-mechanical analysis. During the LAB process, the temperature of the silicon die was uniform across the entire surface and increased to 280 °C within a few seconds; this was high enough to melt the solder. The heat in the die was quickly conducted to the substrate through the Cu pillar bumps. Meanwhile, the substrate temperature was low and remained constant. Therefore, a stable solder interconnection was quickly achieved with minimal stress and thermal damage to the package. The substrate thickness, the number of Cu bumps, and the bonding stage temperature were found to be important factors affecting the heat transfer behavior of the package. The temperature of the die decreased when a thinner substrate, a higher number of Cu bumps, and a lower bonding stage temperature were used. If the temperature of the die was not sufficiently high, insufficient heat was transferred to the solder to melt it, resulting in incomplete solder joint formation. Thermo-mechanical analysis also showed that the LAB process produced lower warpage and thermo-mechanical strain than the conventional MR process. These results indicated that a LAB process using a selective local heating method would be beneficial in reducing thermo-mechanical stress and increasing throughput for the fine pitch flip chip packages.

     

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

In the process of piezo-resistive pressure sensor packaging, a simple thermo-compression bonding setup has been fabricated to achieve the wire bonding interconnection of a silicon chip with printed circuit board. An annealed gold wire is joined onto a pad surface with a needle-like chisel under a force of 0.5–1.5 N/point. The temperature of the substrate was maintained in the range of 150–200°C and the temperature of the chisel was fixed at around 150°C during wire bonding operation. The tensile strength of the wire bonding was measured with a bonding tester by the destructive-pulling experiment and was found to be at the average of 132 mN/mm². The microstructure of the bonding point was examined by scanning electron microscopy. The interface of the thermo-compression boning was shown to possess an acceptable level of reliability for a micro-electromechanical system (MEMS)-based device. The results showed that this setup can be easily operated for fabrication and is suitable for fabricating not only low-cost pressure sensors, but also other MEMS devices.

     

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

In the process of piezo-resistive pressure sensor packaging, a simple thermo-compression bonding setup has been fabricated to achieve the wire bonding interconnection of a silicon chip with printed circuit board. An annealed gold wire is joined onto a pad surface with a needle-like chisel under a force of 0.5?C1.5?N/point. The temperature of the substrate was maintained in the range of 150?C200°C and the temperature of the chisel was fixed at around 150°C during wire bonding operation. The tensile strength of the wire bonding was measured with a bonding tester by the destructive-pulling experiment and was found to be at the average of 132?mN/mm². The microstructure of the bonding point was examined by scanning electron microscopy. The interface of the thermo-compression boning was shown to possess an acceptable level of reliability for a micro-electromechanical system (MEMS)-based device. The results showed that this setup can be easily operated for fabrication and is suitable for fabricating not only low-cost pressure sensors, but also other MEMS devices.     

Reliability based design optimization of wire bonding in power microelectronic devices

This paper presents a numerical investigation of the probabilistic approach in estimating the reliability of wire bonding, and develops a reliability-based design optimization Methodology (RBDO) for microelectronic device structures. The objective of the RBDO method is to design structures which should be both economical and reliable where the solution reduces the structural weight in uncritical regions. It does not only provide an improved design, but also a higher level of confidence in the design. The Finite element simulation model intends to analyze the sequence of the failure events in power microelectronic devices. This numerical model is used to estimate the probability of failure of power module regarding the wire bonding connection. However, due to time-consuming of the multiphysics finite element simulation, a response surface method is used to approximate the response output of the limit state, in this way the reliability analysis is performed directly to the response surface by using the First and the Second Order Reliability Methods FORM/SORM. Subsequently the reliability analysis is integrated in the optimization process to improve the performance and reliability of structural design of wire bonding. The sequential RBDO algorithm is used to solve this problem and to find the best structural designs which realize the best compromise between cost and safety.     

Automated insertion of package dies onto wire and into a textile yarn sheath

Microsystem Technologies - Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to...     

Tuning the performance of a computational persistent homology package

In recent years, persistent homology has become an attractive method for data analysis. It captures topological features, such as connected components, holes, and voids, from point cloud data and summarizes the way in which these features appear and disappear in a filtration sequence. In this project, we focus on improving the performance of Eirene, a computational package for persistent homology. Eirene is a 5000-line open-source software library implemented in the dynamic programming language Julia. We use the Julia profiling tools to identify performance bottlenecks and develop novel methods to manage them, including the parallelization of some time-consuming functions on multicore/manycore hardware. Empirical results show that performance can be greatly improved.     

小波去噪在智能引线键合机图像处理中的应用

针对小波去噪中硬阈值法和软阈值法存在的缺陷,提出了一种新的多尺度自适应阈值选择算法,该方法根据小波变换的特点和噪声信号的3σ,准则,对于不同的小波系数乘以一个与自身小波系数相关的降噪因子.在现有的图像去噪评估算法的基础上,提出了基于图像平滑度和匹配度的去噪效果评估算法.实验结果表明:多尺度自适应阈值选择算法能有效去除图...     

Effects of package on the performance of MEMS piezoresistive accelerometers

Package is one of the key technologies for MEMS accelerometers. This paper investigated the influence of package on performances of custom-designed MEMS piezoresistive accelerometer. Based on the designed package process, the effect of die adhesive and potting materials on the sensor sensitivity and residual stress were studied by theory analysis and experimental test. The results showed that: with more quantity of die adhesive when the thickness was fixed, the sensitivity of MEMS piezoresistive accelerometer was much smaller; in addition, with thicker die adhesive, the accelerometer had much bigger sensitivity and much smaller residual stress increment after the die attach process. Meanwhile, the sensitivity was proportional to the density of potting material, and it varied with the elastic modulus.