共查询到19条相似文献,搜索用时 46 毫秒
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在SIMOX SOI超薄硅衬底上外延生长了高质量SiGe合金薄膜来制备SGOI(SiGe on insulator)样品,并研究了其在1050℃氧化气氛中的高温退火行为.用Raman,DCXRD,RBS和光学显微镜等分析手段对SGOI样品在退火前后的性能进行了表征.分析结果表明:SGOI样品表面的穿透位错密度约为5e5cm-2;高温退火处理可以促进SGOI样品中异质外延生长SiGe合金薄膜的弛豫化和超薄Si夹层向SiGe合金薄膜的转化,进一步提高SiGe薄膜的晶体质量,并且有助于获得高Ge组分的SGOI材料. 相似文献
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绝缘体上张应变锗材料是通过能带工程提高锗材料光电性能得到的一种新型半导体材料,在微电子和光电子领域具有重要的应用前景.采用微电子技术中的图形加工方法以及利用锗浓缩的技术原理,在绝缘体上硅(SOI)材料上制备了绝缘体上张应变锗材料.喇曼与室温光致发光(PL)测试结果表明,不同圆形半径的绝缘体上锗材料张应变均为0.54%.对于绝缘体上张应变锗材料,应变使其发光红移的效果强于量子阱使其发生蓝移的效果,总体将使绝缘体上张应变锗材料的直接带发光峰位红移.同时0.54%张应变锗材料的直接带发光强度随着圆形半径的增大而减弱,这主要是因为圆形半径大的样品其晶体质量较差.该材料可进一步用于制备锗微电子和光电子器件. 相似文献
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在特定温控下对掺杂气体分子的状态和活性进行控制 ,建立了一套具有自主知识产权的气源分子束外延工艺生长 Si Ge/Si材料的原位掺杂控制技术。采用该技术生长的 Si Ge/Si HBT外延材料 ,可将硼杂质较好地限制在 Si Ge合金基区内 ,并能有效地提高磷烷对 N型掺杂的浓度和外延硅层的生长速率 ,获得了理想 N、P型杂质分布的 Si Ge/Si HBT外延材料 相似文献
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硅是最重要的半导体材料,在信息产业中起着不可替代的作用。但是硅材料也有一些物理局限性,比如它是间接带隙半导体材料,它的载流子迁移率低,所以硅材料的发光效率很低,器件速度比较慢。在硅衬底上外延生长其它半导体材料,可以充分发挥各自的优点,弥补硅材料的不足。本文介绍了硅衬底上的锗材料外延生长技术进展,讨论了该材料在微电子和光电子等方面的可能应用,重点介绍了它在硅基高速长波长光电探测器研制方面的应用。 相似文献
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本文分析了Si1 -x- yGexCy 半导体材料外延生长的困难所在 ,总结了用于生长Si1 -x- yGexCy材料的各种生长方法 ,并分析比较了各自的特点。 相似文献
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随着超大规模集成电路设计线宽向纳米尺寸过渡,对半导体硅材料的性能和参数提出了更加严格的要求。本文阐述了绝缘体上硅(SOI)和锗硅(SiGe)等主要硅基半导体材料的研究进展,讨论了这些材料应用于纳米集成电路和微电子、光电子器件的经济技术前景。 相似文献
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B. Keen R. Makin P. A. Stampe R. J. Kennedy S. Sallis L. J. Piper B. McCombe S. M. Durbin 《Journal of Electronic Materials》2014,43(4):914-920
The alloying of bismuth with III–V semiconductors, in particular GaAs and InAs thin films grown by molecular beam epitaxy (MBE), has attracted considerable interest due to the accompanying changes in band structure and lattice constant. Specifically, bismuth incorporation in these compounds results in both a reduction in band gap (through shifting of the valence band) and an increase in the lattice constant of the alloy. To fully understand the composition of these alloys, a better understanding of the binary endpoints is needed. At present, a limited amount of literature exists on the III-Bi family of materials, most of which is theoretical work based on density functional theory calculations. The only III-Bi material known to exist (in bulk crystal form) is InBi, but its electrical properties have not been sufficiently studied and, to date, the material has not been fabricated as a thin film. We have successfully deposited crystalline InBi on (100) GaAs substrates using MBE. Wetting of the substrate is poor, and regions of varying composition exist across the substrate. To obtain InBi, the growth temperature had to be below 100 °C. It was found that film crystallinity improved with reduced Bi flux, into an In-rich regime. Additionally, attempts were made to grow AlBi and GaBi. 相似文献
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采用固态磷源分子束外延技术,在不同的生长条件下生长了InP外延材料,并用原子力显微镜对样品表面形貌进行了系统研究.实验结果表明,样品表面形貌的显著变化与生长模式发生变化有关;二维(2D)生长模式和三维(3D)生长模式之间存在转换的临界工艺条件.通过对实验数据的分析,绘制了InP外延生长模式对应工艺条件的区域分布图;在2D生长区域获得了高质量的InP/InP外延材料. 相似文献
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利用气源分子束外延(GSMBE)技术,在InP(100)衬底上生长InAs量子点激光器.有源区包含5层InAs量子点,每层量子点的平均尺寸是2.9 nm和76 nm,面密度在1010 cm-2左右,势垒层为InGaAsP.室温下量子点的光致发光中心波长在1.55 μm,发光峰半高宽为108 imeV.通过化学湿法腐蚀制备双沟道8μm宽脊条激光器,在20℃连续波工作模式下,腔长为0.7 mm的激光器的阈值电流为143 mA(2.5 kA/cm2),器件的激射中心波长在1.55 μm.由于量子点尺寸的非均匀性,在大电流注入,激光器的激射谱展宽.器件单端面最大输出功率为27 mW,功率斜率效率为130 mW/A. 相似文献
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Ida Sadeghi Kevin Ye Michael Xu Yifei Li James M. LeBeau Rafael Jaramillo 《Advanced functional materials》2021,31(45):2105563
The making of BaZrS3 thin films by molecular beam epitaxy (MBE) is demonstrated. BaZrS3 forms in the orthorhombic distorted-perovskite structure with corner-sharing ZrS6 octahedra. The single-step MBE process results in films smooth on the atomic scale, with near-perfect BaZrS3 stoichiometry and an atomically sharp interface with the LaAlO3 substrate. The films grow epitaxially via two competing growth modes: buffered epitaxy, with a self-assembled interface layer that relieves the epitaxial strain, and direct epitaxy, with rotated-cube-on-cube growth that accommodates the large lattice constant mismatch between the oxide and the sulfide perovskites. This work sets the stage for developing chalcogenide perovskites as a family of semiconductor alloys with properties that can be tuned with strain and composition in high-quality epitaxial thin films, as has been long-established for other systems including Si-Ge, III-Vs, and II-VIs. The methods demonstrated here also represent a revival of gas-source chalcogenide MBE. 相似文献
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F. Erdem Arkun Dennis D. Edwall Jon Ellsworth Sheri Douglas Majid Zandian Michael Carmody 《Journal of Electronic Materials》2017,46(9):5374-5378
Recent advances in growth of Hg1?x Cd x Te films on large-area (7 cm × 7.5 cm) CdZnTe (CZT) substrates is presented. Growth of Hg1?x Cd x Te with good uniformity on large-area wafers is achieved using a Riber 412 molecular beam epitaxy (MBE) tool designed for growth of Hg1?x Cd x Te compounds. The reactor is equipped with conventional CdTe, Te, and Hg sources for achieving uniform exposure of the wafer during growth. The composition of the Hg1?x Cd x Te compound is controlled in situ by employing a closed-loop spectral ellipsometry technique to achieve a cutoff wavelength (λ co) of 14 μm at 78 K. We present data on the thickness and composition uniformity of films grown for large-format focal-plane array applications. The composition and thickness nonuniformity are determined to be <1% over the area of a 7 cm × 7.5 cm wafer. The films are further characterized by Fourier-transform infrared spectroscopy, optical microscopy, and Hall measurements. Additionally, defect maps show the spatial distribution of defects generated during the epitaxial growth of the Hg1?x Cd x Te films. Microdefect densities are in the low 103 cm?2 range, and void defects are below 500 cm?2. Dislocation densities less than 5 × 105 cm?2 are routinely achieved for Hg1?x Cd x Te films grown on CZT substrates. HgCdTe 4k × 4k focal-plane arrays with 15 μm pitch for astronomical wide-area infrared imagers have been produced using the recently developed MBE growth process at Teledyne Imaging Sensors. 相似文献