共查询到17条相似文献,搜索用时 144 毫秒
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随着电子工业的发展,大量需要各种印刷线路板、线路板上的导电铜箔是用电解沉积法生产的.本文介绍铜箔的电解沉积原理、工艺过程和主要的生产设备;研究了增强铜箔与基底材料抗剥离强度的方法.文中论述到的一些问题,对使用同一原理获得金属电镀层会有所启发和帮助.一铜箔的电解沉积原理及工艺技术利用一个不锈钢或纯钛制成的圆筒,放在硫酸铜电解液中作为阴极,通过直流电后便可以在圆筒上沉积出铜层.旋转圆筒,剥离铜层,连续旋转、 相似文献
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印制电路板用铜箔的表面处理 总被引:3,自引:0,他引:3
介绍了铜箔的用途和分类,以及电解铜箔和压延铜箔的生产方法,简述了印制电路板用铜箔的表面处理工艺流程,对比了国内外印制电路用铜箔的制备方法和表面处理技术。国内已能生产出厚度为9μm的电解铜箔,但压延铜箔的生产技术有待于研究。 相似文献
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采用无添加剂的铜盐–硫酸体系对电解铜箔进行多步粗化,一方面能保证铜箔具有较高的抗剥强度,另一方面能防止表面铜颗粒脱落。研究了电流密度、电解液铜含量、硫酸含量、温度等因素对粗化效果的影响。结果表明,电流密度是粗化的主要影响因素,通过调节电流密度可同时达到粗化和固化效果。最佳粗化工艺条件为:Cu2+30 g/L,H2SO4 110~150 g/L,温度35°C,前3步粗化电流密度270 A/dm2,后8步粗化电流密度40 A/dm2,总时间17~30 s。采用该工艺处理电解铜箔,所得粗化层表面无铜粉脱落,粗糙度大于8.40μm,抗剥强度大于2.10 N/mm,满足厂家要求。 相似文献
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Copper recovery from ethylenediaminetetraacetic acid (EDTA)‐chelating‐Cu wastewater was conducted by means of electrochemical process using a Cu cathode and a PbO2 anode. In this study, the effects of operating parameters including current density, initial pH, and electrolytic‐cell mode on the quality of copper deposit and current efficiency were studied. It was found that the key factors influencing deposit quality and current efficiency are current density and electrolytic cell mode as well as interactions between them. A better quality of copper deposit with high current efficiency can be obtained at lower current density (2.5 mA/cm2) in this fluidized packed‐bed electrolytic cell. 相似文献
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The effect of uniform magnetic fields on the electrolytic deposition of copper in electric fields consisting of a d.c. bias voltage and a superimposed rectified sine-pulse train of 1 mHz-0.1 Hz frequency was investigated in an experimental cell. At appropriate combinations of magnetic flux density and potential frequency, good quality deposits can be obtained at elevated cathode current densities. Current oscillations observed under certain conditions are directly related to strong surface deterioration. 相似文献
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In this paper, electrolysis method was used to produce copper powder particulates. The effects of parametric values, such as current density, concentration of copper ions, electrolyte temperature and rotation speed of cathode, on the morphologies and on the apparent densities of copper powders were examined. These parameters were evaluated by the current efficiency of hydrogen evolution. In addition, scanning electron microscopy (SEM) was used for analyzing the morphology of the copper powders. It was found that the increasing of the current density or the electrolyte temperature decreased the size of the powder particles promoting their morphology into dendritic structure. In contrast, the increase of copper ion concentration or rotation speed of cathode also increased the size of the particles resulting in a cauliflower-like morphology. All powder particles obtained were consisted of agglomerated copper grains. The most important difference was the size and the shape of the copper grains which were notably influenced by the electrolysis parameters. The apparent density values of copper powders were found to be suitable for many powder metallurgical applications. Attempts were also made in the later part of the paper to determine optimum process parameters for the production of electrolytic copper powders. 相似文献
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电解法生产铜箔必须使用钛阴极辊筒,由于其工作电流高达35kA-40kA,为了提高钛阴极辊筒的导电性能,要求在其导电环内壁与之接触的轴表面电镀一层金属银,由于钛阴极辊筒体积庞大,无法在电镀槽内进行电镀,采用电刷镀方法镀银最合适,本文介绍电刷镀银的工艺过程及影响因素。 相似文献
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The electrolytic reduction of vanillin to vanillyl alcohol was investigated as a function of temperature, pH and current density at a stationary amalgamated copper cathode. The results were compared with those for amalgamated lead and zinc electrodes. 相似文献