A Possible Relationship between Schottky Barrier Heights and Adhesion Energies of Metal／Semiconductor or

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Ion Beam Enhanced Adhesion of Metal/Ceramic Systems

Based on the electronic theory recently proposed by the author for metal-ceramic interactions, the physicalorigin of the ion beam enhanced adhesion of non-reactive metal / ceramic systems was outlined for the firsttime. It has been shown that the ion beam enhanced adhesion is attributed to the enhancement of the chemicalbonding between metal and ceramic. The copper / sapphire system was chosen as a typical example for demon-strations.     

Electrical properties of Al/conducting polymer (P2ClAn)/p-Si/Al contacts

Al/P2ClAn/p-Si/Al structure was obtained by the evaporation of the polymer P2ClAn on the front surface of p-type silicon substrate. The P2ClAn emeraldine salt was chemically synthesized by using propionic (C₂H₅COOH) acid. The current–voltage (I–V) characteristic of the structure was measured at room temperature. The capacitance–voltage–frequency (C–V–f) in terms of interface states over the frequency range of 10 kHz to 3 MHz has been investigated. The capacitance has decreased with increasing frequency, due to the interface states distribution. From the forward bias I–V plot for the sample, the ideality factor (n) and zero-bias barrier height (Φ_bp,0) were obtained as 4.84 and 0.787 eV, respectively. Under forward bias, the high value of the ideality factor and the dispersion in capacitance could be due to the interface state distribution, the interfacial insulator layer, the conducting polymer on the interface and inhomogeneity of the barrier height. The energy distributions and the relaxation times of the interface states were determined in the energy range of (0.387 − E_v) to (0.787 − E_v) eV.     

Microscopic Approach of Adhesion and Wetting of Liquid Metal on Solid Ionocovalent Oxide Surface

The adhesion and wetting of non-reactive liquid metals with solid ionocovalent oxides are studied on thebasis of the experimental work of adhesion W data obtained with the sessile drop method.An analysis of theexperimental W values of different liquid metals on various solid oxides is first performed to evidence the de-pendence of the work of adhesion of a metal/oxide system on the electron density of the metal and on thethermodynamic stability of the oxide.An electronic model is then proposed to describe the microscopic mech-anism of metal-oxide interactions.Based on the model,the contact angle and the work of adhesion of differentliquid metals on various solid oxides can be interpreted and estimated,and their correlations to the variousphysical quantities of the oxides can be easily deduced.The basic consideration of the model is that the adhe-sion between a metal and an oxide is assured by the electron transfer from the metal into the oxide valenceband which is not completely filled of electrons at high temperatures,and is enhanced when this electron trans-fer at the metal/oxide interface is intensified.The influence of interface defects on the wetting and adhesion issuggested and discussed.     

Ir/SiC界面结合力、稳定性和电子结构的第一性原理研究

基于密度泛函理论（DFT）第一性原理研究了Ir(111)/SiC(111)界面。在考虑不同堆垛位置和表面封端的基础上,共研究了6种不同的界面构型。结果表明：具有9层原子层的Ir(111)表面构型表现体相材料的特征,而12层原子层的SiC(111)表面构型能体现体相SiC的性能。粘附功和界面能结果表明,C封端顶位堆垛（C-TS）和Si封端中心位堆垛（Si-CS）界面构型具有最大的粘附功,分别为6.35和6.23 J/m²,是最稳定的构型;弛豫后的界面能分别为0.07和0.10 J/m²。电子结构分析表明：C-TS界面处具有离子特性,而Si-CS界面处具有共价键特性。C-TS和Si-CS界面的结合强度和稳定性归因于Ir-d与C-p,Si-p轨道之间的杂化。与C-TS界面相比,Si-CS界面第2层原子与界面Ir原子的相互作用更大。     

用于柔性电子器件的有机/无机薄膜封装技术研究进展

有机/无机薄膜封装技术被广泛用于有机发光二极管(OLED)、量子点显示及有机光伏等领域,是一种新型的柔性封装技术。综述近年来有机/无机薄膜封装技术的发展趋势,首先概述了传统硬质盖板封装方式与薄膜封装方式的发展及其优缺点。其次,系统地总结了有机/无机薄膜的制备方法,如原子层沉积、等离子体化学气相沉积等,详细阐述了不同制备方法的原理及其应用。再次,讨论了薄膜的微观缺陷、内应力,以及材料界面工程对有机/无机薄膜封装性能的影响,分析总结了有机/无机封装薄膜制备的技术要点,如采用基底表面预处理、引入中性层、调节层间应力等方式获得优质的封装薄膜。最后,探究了有机/无机封装薄膜的内在阻隔机理,提出气体在有机/无机薄膜中的传输方式以努森扩散为主,并总结了提高薄膜封装的策略,即延长气体扩散路径、“主动”引入阻隔基团及薄膜表面改性。提出了未来薄膜封装技术面临的问题,拟为柔性电子器件封装技术的发展提供一定参考。     

Effects of Ti/TiN multilayer on corrosion resistance of nickel-titanium orthodontic brackets in artificial saliva

The effects of multilayered Ti/TiN or single-layered TiN films deposited by pulse-biased arc ion plating (PBAIP) on the corrosion behavior of NiTi orthodontic brackets in artificial saliva are investigated. The multilayered Ti/TiN coating is found to exhibit a greater free corrosion potential, much lower passive current density, and no breakdown up to 1.5 V. Moreover, electrochemical impedance spectroscopy (EIS) results indicate that the multilayered Ti/TiN coating has a larger impedance and lower porosity which is believed to be responsible for the exceedingly low metal ion release rate during 720 h exposure in the test solution. Visual inspection of the surfaces reveals different corrosion processes for the TiN and multilayered Ti/TiN coatings.