消费类电子设备与技术

0221601家用电力线联网系统的研究与设计[刊]/吴娟//计算机工程.—2002.28(6).—144～145,242(E) 0221602新型风扇速度自动控制集成电路及其应用[刊]/陈汝全//电子质量.—2002.(3).—54～58(E)介绍两种新型风扇速度自动控制集成电路:使用简单远程二极管温度传感器的四速风扇控制集成电路LM88及双风扇速度控制集成电路 LTC1840的性能特点及其应用电路。参10221603剖析家电企业实施6sigma 管理[刊]/傅琼//电子质量.—2002,(4).—117～118,122(L)     

风扇速度控制器

TC650和TC651是带有温度传感器,用于无刷直流风扇速度控制的集成电路,主要应用于个人计算机过热保护,机顶盒、笔记本电脑、数据通信装置、电源系统的散热风扇控制系统。其主要特点是:根据检测的温度来控制风扇转速,达到合理的散热功能,既减小风扇噪音、延长风扇寿命,又节约电能。由于制造厂已在器件内设定温度控制的范围,并分成多级PWM控制,使用户无需外设电阻元件,电路简洁,使用方便。该器件使用工作温度为     

散热风扇控制器集成电路(上)

<正> 在电子仪器、设备中,用散热风扇对发热的功率器件或模块进行冷却、散热已沿用了几十年了,但采用集成电路或专用集成电路对风扇实现控制还是近年来的事。随着半导体工业技术及电子产品的发展,特别是计算机技术的突飞猛进,促使散热风扇控制器IC迅速发展,从简单的模拟集成电路发展到数字电路,从开关控制发展到根据器件的发热温度来控制风扇的转速,实现PWM控制,从开环控制发展到闭环控制,从控制单台风扇到实现多台风扇的控制,形成所谓“热管理”或“系统热管理”。它既使功率器件或模块安全、可靠地工作,又减小了噪声、降低了能耗、延长了风扇的寿命。这一点对笔记本电脑来说是十分重要的。     

风扇控制器TC650及TC651

TC650及TC651是带有温度传感器用于无刷直流风扇速度控制的集成电路。这两个器件主要特点:根据检测的温度来控制风扇转速,达到合理的散热功能,既减小风扇噪声、延长风扇寿命,又能节省电能;工厂已在器件内设定温度控制的范围,并分成多级PWM控制,使用户无需设定及外设电阻元件,电路简洁、使用方便;从25℃到+70℃,其典型精度可达±1℃;低功耗,静态电流典型值50μA;工作电压范围2.8～5.5V;内部有超温报警信号（Tover）输出（电平信号）;工作温度-40℃～+125℃。 这两种芯片主要应用于个人计算机过热保护、机顶盒、笔记本电脑、数据通信装置、电源系统里的散热风扇控制。     

Microchip Technology率先推出带热敏电阻器输入的风扇管理器

ＭｉｃｒｏｃｈｉｐＴｅｃｈｎｏｌｏｇｙ推出了业内首个单、双ＳＭＢｕｓ风扇速度控制器 ,扩大了其ＴＣ6ｘｘ风扇管理器产品系列。该风扇速度控制器能发现风扇问题及温度是否过热 ,十分适用于下一代风扇速度控制和风扇监控的应用。型号为ＴＣ6 5 4、ＴＣ6 5 5、ＴＣ6 6 4和ＴＣ6 6 5的风扇管理器可根据温度调整风扇速度 ,而不像以往风扇以最大速度不断运转。此功能还可减少噪声 ,延长风扇寿命。风扇速度可通过一个远程的热敏电阻器输出或通过基于ＳＭＢｕｓ通信的指令来编程控制。这种双重操作功能提高了设计灵活和系统冗余性。该器件系列…     

新型延时照明灯控制器

新型延时照明灯控制器朱建坤目前市售壁式延时照明灯控制开关组件使用时有局限性。本文介绍的新型延时照明灯控制器，采用专用集成电路控制，它有四档电子定时和不定时共五种状态可供选择。工作原理延时照明灯控制器的电原理如图所示，ＩＣＩ为程控风扇控制集成电路ＬＣ９...     

Microchip热管理产品又有扩展

Microchip发布新款风扇控制器件，其专利型风扇自动重启功能，可增强风扇速度控制和风扇故障探测功能。器件的这种重启功能使风扇在发生故障时可自动连续重启，而不需在出现故障后对风扇进行重新设定，简化了系统设计。TC64xB系列中的TC642B和TC647B器件使用户能设定最低风扇速度门限，     

GPS推出变速推动机控制器及集成电路

GEC Plessey Semirconductors(GPS)推出两种集成电路,主要用于控制大型家庭电器的变速电动机,例如洗衣机、冷气机的风扇推动器、水泵及一般用途工业用逆变器。     

多风扇控制方案

随着数据吞吐量和数据传输速度的提高,数据处理的速度也在提高,例如在服务器和工作站以及某些电信设备中需要多个处理器同时工作,这样一来就可能需要2个风扇,甚至4个或更多的风扇解决散热问题,那么如何控制这些风扇的速度?MAX6651为这些应用提供了理想的解决方案。MAX6651有4个转速计监控输入接口(TachO-Tach4),5条通用输入/输出接口(GPIO#0-GPIO#4),可以实现开环或闭环风扇速度控制,MAX6651通     

冷却风扇控制器MAX6670

<正> MAX6670是MAXIM公司推出的一种冷却风扇控制器集成电路。它用来控制冷却风扇,使耗散功率大的器件、模块冷却、散热,保证安全可靠地工作。它适用于各种计算机、网络设备、通信设备、电源系统及仪器设备等。器件主要特点为:内部集成了能驱动冷却风扇的功率MOSFET;由工厂在器件内部设     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.