无短环不规则QC_LDPC码的快速编码及联合译码

基于不规则部分并行结构设计了一种高吞吐量,低复杂度,码长码率可变且去除四环的低密度奇偶校验LDPC码及其译码结构实现方案,该编码结构可针对不同码长的不规则部分并行结构LDPC码进行扩展,译码器采用缩放最小和定点(Sum-Min)算法实现译码,中间信息节点存储器地址采用格雷码编码,降低动态功耗;采用Xilinx公司的Virtex-5XC5Vt X150T-ff1156FPGA芯片设计了一款码长1 270,码率1 2的不规则部分并行LDPC码的编码器和译码器。综合结果表明:该编码器信息吞吐量为2.52 Gb/s,译码器在10次迭代的情况下信息吞吐率达到44 Mb/s。     

LDPC译码器的Impulse C编程设计

提出了一种对LDPC码(低密度奇偶校验码)译码器进行FPGA(现场可编程门阵列)设计的新方案.不同于采用传统硬件描述语言方法,该方案基于最新一代从Impulse C编程到硬件编译的便捷技术,在Xilinx Virtex2芯片XC2V2000上实现了1/2码率、码长2500的(3,6)LDPC码译码器.最大迭代次数为10次,主频50 MHz时,数据吞吐量可达10Mbit/s,能够满足第三代移动通信系统对译码速率的要求.     

多码率QC-LDPC译码器设计与实现

低密度奇偶校验码（LDPC）是目前最有效的差错控制手段之一,而其中准循环LDPC码（QC-LDPC）应用最为广泛。提出了一种通用的多码率QC-LDPC译码器设计方法,并在FPGA上完成了实现和测试。测试结果表明,该多码率译码器在资源占用不超过2种码率译码器资源之和的前提下能够有效支持至少3种码率;且工作时钟在110 MHZ时,固定迭代次数为16次,该译码器的吞吐率能保持在110 Mb/s以上。     

CCSDS标准LDPC部分并行译码器实现

针对CCSDS标准中近地通信的LDPC码,为了提高准循环低密度奇偶校验（QC-LDPC）译码器的吞吐率和资源利用率,设计实现了一种低复杂度高速并行译码器。译码器整体采用流水线结构,通过改进校验节点与变量节点的更新方式,在不增加运算复杂度的情况下使信息处理所消耗的时间更短,压缩单次迭代所需时间,提高了译码器的吞吐量。以现场可编程门阵列（FPGA）作为实现平台,仿真并实现了基于归一化最小和算法的（8176,7154） LDPC译码器。结果表明,当译码器工作频率为200 MHz、迭代次数为10次的情况下,译码吞吐量可达到160 Mbit/s,满足大多数场景的应用需求。     

LDPC码译码器的设计与实现

由于传统的LLR BP译码算法不易于FPGA实现,为了降低实现复杂度,采用一种改进的LLR BP译码实现方法,设计了一种码长为40、码率为0.5的规则LDPC码译码器,并完成了FPGA仿真实现.仿真和综合的结果表明,所设计的译码器吞吐量达到15.68 Mbit/s,且译码器的资源消耗适中.     

IEEE802.16e标准LDPC译码器设计与实现

LDPC码自在上个世纪90年代被重新发现以来,以其接近香农极限的差错控制性能,以及译码复杂度低、吞吐率高的优点引起了人们的关注,成为继Turbo码之后信道编码界的又一研究热点。利用FPGA设计并实现了一种基于IEEE802.16e标准的LDPC码译码器。该译码器采用偏移最小和（Offset Min-Sum）算法,其偏移因子β取值为0.125,具有接近置信传播（Belief Propagation）算法浮点的性能。译码器在结构上采用了部分并行结构,可以灵活支持标准中定义的所有码率和码长的LDPC码的译码。此外,该译码器还支持对连续输入的数据块进行处理,并具有动态停止迭代功能。硬件综合结果表明,该译码器工作频率为150MHz时,固定15次迭代,最低可达到95Mb/s的译码吞吐率,完全满足802.16e标准的要求。     

DTMB中LDPC码编译码器的FPGA实现

针对数字地面多媒体广播标准中的低密度奇偶校验(LDPC)码,设计实现了基于现场可编程逻辑门阵列(FPGA)的LDPC码编译码器。设计所采用的编译码器方案均采用部分并行结构,在吞吐量与硬件复杂度之间达到了较好的折中。进一步,实现了用于LDPC码性能测试的误码测试硬件系统。基于FPGA的硬件实现结果表明,针对码率为0.4的LDPC码,设计的编译码器可工作在160MHz的时钟频率下,以译码前的数据量计算,吞吐量达到214Mbps。当误比特率为10-6时,实现的6比特量化译码器与浮点译码器的性能差距仅为0.05d B。     

采用C语言FPGA技术实现LDPC码译码算法

针对LDPC码(Low Density Parity Check Codes)译码算法的特点和最新一代Impulse C语言的并行编程技术,提出一种对LDPC码译码器进行FPGA(Field Programmable Gate Array)设计与实现的便捷新方案,以获得译码速率和硬件资源消耗的平衡.在XC2V2000芯片上实现了一种码率1/2,码长2500的(3,6)LDPC码译码器.实验表明当最大迭代次数为10次,主频50MHz时,译码速率可达10Mbps.     

LDPC码全并行译码器的设计与实现

本论文用可编程逻辑器件(FPGA)实现了一种低密度奇偶校验码(LDPC)的编译码算法.采用基于Q矩阵LDPC码构造方法,设计了具有线性复杂度的编码器. 基于软判决译码规则,采用全并行译码结构实现了码率为1/2、码长为40比特的准规则LDPC码译码器,并且通过了仿真测试.该译码器复杂度与码长成线性关系,与Turbo码相比更易于硬件实现,并能达到更高的传输速率.     

基于FPGA的不可分层LDPC码译码器

针对不可分层LDPC码无法采用分层译码算法的问题,设计了一种新型的LDPC码分层译码器。与传统分层译码器的结构不同,新结构在各层间进行并行更新,各层内进行串行更新。通过保证在不同分层的同一变量节点不同时进行更新,达到分层译码算法分层递进更新的目标。选用Altera公司的CycloneⅢ系列EP3C120器件,实现码率3/4,码长8 192的(3,12)规则不可分层QC-LDPC码译码器的布局布线,在最大迭代次数为5次时,最高时钟频率可以达到45.44 MHz,吞吐量可以达到47.6 Mbps。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks