Fault characterization, testing considerations, and design fortestability of BiCMOS logic circuits

The results of a simulation-based fault characterization study of BiCMOS logic circuits are given. Based on the fault characterization results, the authors have studied different techniques for testing BiCMOS logic circuits. The effectiveness of stuck-at fault testing, stuck-open fault testing, delay fault testing, and current testing in achieving a high level of defect coverage is studied. A novel BiCMOS circuit structure that improves the testability of BiCMOS digital circuits is presented     

Testability analysis and fault modeling of BiCMOS circuits

Defect models have been used for testability analysis of BiCMOS circuits and the results have been compared with an analysis of CMOS circuits. Using a nominal point approach, faults generated are classified as logical or performance degradation faults. It is found that logical fault testing can only cover a small percentage of the total fault set, 54% for BiCMOS, versus 69% for equivalent CMOS gates. Delay faults and current faults are analyzed as applied to BiCMOS and CMOS gates. It is shown that logical fault testing in conjunction with either delay fault testing or current fault testing promises the highest fault coverage for BiCMOS logic gates, around 95%.This research was partially supported by the Department of National Defence of Canada, Academic Research Program, grant # 3705-921.     

Highly testable design of BiCMOS logic circuits

Most of the work reported in the literature to date on the testability of BiCMOS circuits has concentrated on fault characterization and the need for a suitable testing method that can address the peculiarities of BiCMOS circuits. The problem of adequately testing large BiCMOS logic networks remains open and complex. In this paper, we introduce a new design for testability technique for BiCMOS logic gates that results in highly testable BiCMOS logic circuits. The proposed design incorporates two features: a test charge/discharge path and built-in current sensing (BICS). The test charge/discharge path is activated only during testing and facilitates the testing of stuck-open faults using single test vectors. BICS facilitates testing of faults that cause excessive IDDQ. HSPICE simulation results show that the proposed design can detect stuck-open faults at a test speed of 10 MHz. Faults causing excessive IDDQ are detected by BICS with a detection time of 1 ns and a settling time of 2 ns. Impact of the proposed design on normal operation is minimal. The increase in propagation delay in normal operation is less than 3%. This compares very favorably with CMOS BICS reported in the literature, where the propagation delay increase was 20%, 14.4% respectively. The increase in the area is less than 15%     

Analysis of resistive bridging fault detection in BiCMOS digitalICs

This paper presents a study of the effects on the electrical behavior of BiCMOS digital circuits induced by bridging faults, whose resistance value is shown to have a strong impact on the static and dynamic behavior of faulty gates and of their fan-out gates. The problem of fault detection is addressed considering different testing techniques (current monitoring, functional, and delay testing). Electrical simulation has been used to investigate the main differences between BiCMOS and CMOS circuits. It is shown that, because of the large driving capability of BJTs, the detection of bridging faults in BiCMOS circuits is more difficult than in the CMOS case when functional or delay testing is used whereas it becomes more effective when adopting current monitoring     

False-Path Removal Using Delay Fault Simulation

Some false paths are caused by redundant stuck-at faults. Removal of those stuck-at faults automatically eliminates such false paths from the circuit. However, there are other false paths that are not associated with any redundant stuck-at fault. All segments of such a false path are shared with other testable paths. We focus on the elimination of this type of false paths. We use a non-enumerative path delay fault simulator based on the path status graph (PSG) data-structure, which duplicates selected gates to separate the detected and undetected path delay faults. The expanded circuit may contain new redundant stuck-at faults, corresponding to those undetected paths that are false. This happens because the expanded circuit has some new interconnects with only false paths passing through them. Such links become the sites for redundant stuck-at faults. Removal of these redundant faults eliminates false paths. The reported results show that the quality of the result may depend on the coverage of testable paths by the vectors that are simulated. When non-enumerative path delay simulation and implication-based redundancy removal techniques are used, the present procedure of false-path elimination can be applied to very large circuits.     

Design and optimization of buffer chains and logic circuits in aBiCMOS environment

The design and optimization of BiCMOS buffer chains and multi level logic circuits are reported. BiCMOS speedup contours are introduced and analytical expressions for the delay are obtained. The speedup contours and the delay expressions were used in the design and optimization of BiCMOS buffer chains. Also, general design guidelines, which can be easily automated, for circuit design in a BiCMOS environment are given. Designing multistage mixed CMOS/BiCMOS buffers, BiCMOS complex logic gates, and multi level CML (current mode logic) gates is also studied     

The effects of transistor source-to-gate bridging faults in complexCMOS gates

A study of the effect of gate-to-source bridging faults in the pull-up section of a complex CMOS gate is presented. The manifestation of these faults depends on the resistance value of the connection causing the bridging. It is shown that such faults manifest themselves either as stuck-at or stuck-open faults and can be detected by tests for stuck-at and stuck-open faults generated for the equivalent logic current. It is observed that for transistor channel lengths larger than 1 μm there exists a range of values of the bridging resistance for which the fault behaves as a pseudo-stuck-open fault     

片上集成电路系统测试的新电路设计

It is very important to detect transition-delay faults and stuck-at faults in system on chip （SoC） under 90 nm processing technology, and the transition-delay faults can only be detected by using an at-speed testing method. In this paper, an on-chip clock （OCC） controller with a bypass function based on an internal phase-locked loop is designed to test faults in SoC. Furthermore, a clock chain logic which can eliminate the metastable state is realized to generate an enable signal for the OCC controller, and then, the test pattern is generated by automatic test pattern generation （ATPG） tools. Next, the scan test pattern is simulated by using the Synopsys tool and the correctness of the design is verified. The result shows that the design of an at-speed scan test in this paper is highly efficient for detecting timing-related defects. Finally, the 89.29% transition-delay fault coverage and the 94.50% stuck-at fault coverage are achieved, and it is successfully applied to an integrated circuit design.     

Delay fault propagation in synchronous sequential circuits

Compared with the propagation of logic errors produced by stuck-at faults, the propagation of gate delay fault effects in sequential circuits poses some particular problems. The authors first describe the propagation conditions of such faults then define the propagation rules of these faults which are used in a new delay fault simulation process for synchronous sequential circuits     

Faulty behavior of storage elements and its effects on sequentialcircuits

It is often assumed that the faults in storage elements (SEs) can be modeled as output/input stuck-at faults of the element. They are implicitly considered equivalent to the stuck-at faults in the combinational logic surrounding the SE cells. Transistor-level faults in common SEs are examined here. A more accurate higher level fault model for elementary SEs that better represents the physical failures is presented. It is shown that a minimal (stuck-at) model may be adequate if only modest fault coverage is desired. The enhanced model includes some common fault behaviors of SEs that are not covered by the minimal fault model. These include data-feedthrough and clock-feedthrough behaviors, as well as problems with logic level retention. Fault models for complex SE cells can be obtained without a significant loss of information about the structure of the circuit. The detectability of feedthrough faults is considered     

An Exact approach for Complete Test Set Generation of Toffoli-Fredkin-Peres based Reversible Circuits

Reversible logic has gained interest of researchers worldwide for its ultra-low power and high speed computing abilities in the future quantum information processing. Testing of these circuits is important for ensuring high reliability of their operation. In this work, we propose an ATPG algorithm for reversible circuits using an exact approach to generate CTS (Complete Test Set) which can detect single stuck-at faults, multiple stuck-at faults, repeated gate fault, partial and complete missing gate faults which are very useful logical fault models for reversible logic to model any physical defect. Proposed algorithm can be used to test a reversible circuit designed with k-CNOT, Peres and Fredkin gates. Through extensive experiments, we have validated our proposed algorithm for several benchmark circuits and other circuits with family of reversible gates. This algorithm produces a minimal and complete test set while reducing test generation time as compared to existing state-of-the-art algorithms. A testing tool is developed satisfying the purpose of generating all possible CTS’s indicating the simulation time, number of levels and gates in the circuit. This paper also contributes to the detection and removal of redundant faults for optimal test set generation.     

Oscillation Ring Delay Test for High Performance Microprocessors

This paper proposes a new test scheme, oscillation ring test, and its associated test circuit organization for delay fault testing for high performance microprocessors. For this test scheme, the outputs of the circuit under test are connected to its inputs to form oscillation rings and test vectors which sensitize circuit paths are sought to make the rings oscillate. High speed transition counters or oscillation detectors can then be used to detect whether the circuit is working normally or not. The sensitizable paths of oscillation rings cover all circuit lines, detecting all gate delay faults, a large part of hazard free robust path delay faults and all the stuck-at faults. It has the advantage of testing the circuit at the working speed of the circuit. Also, with some modification, the scheme can also be used to measure the maximum speed of the circuit. The scheme needs minimal simple added hardware, thus ideal for testing, embedded circuits and microprocessors.     

Resynthesis of combinational logic circuits for improved path delayfault testability using comparison units

We propose a resynthesis method that modifies a given circuit to reduce the number of paths in the circuit and thus improve its path delay fault testability. The resynthesis procedure is based on replacing subcircuits of the given circuit by structures called comparison units. A subcircuit can be replaced by a comparison unit if it implements a function belonging to the class of comparison functions defined here. Comparison units are fully testable for stuck-at faults and for path delay faults. In addition, they have small numbers of paths and gates. These properties make them effective building blocks for resynthesis to improve the path delay fault testability of a circuit. Experimental results demonstrate considerable reductions in the number of paths and increased path delay fault testability. These are achieved without increasing the number of gates, or the number of gates along the longest path in the circuit. The random pattern testability for stuck-at faults remains unchanged     

IEEE Standard 1500 Compatible Oscillation Ring Test Methodology for Interconnect Delay and Crosstalk Detection

A novel oscillation ring (OR) test scheme and architecture for testing interconnects in SOC is proposed and demonstrated. In addition to stuck-at and open faults, this scheme can also detect delay faults and crosstalk glitches, which are otherwise very difficult to be tested under the traditional test schemes. IEEE Std. 1500 wrapper cells are modified to accommodate the test scheme. An efficient algorithm is proposed to construct ORs for SOC based on a graph model. Experimental results on MCNC benchmark circuits have been included to show the effectiveness of the algorithm. In all experiments, the scheme achieves 100% fault coverage with a small number of tests.     

Multiple Stuck-at Fault Testability Analysis of ROBDD Based Combinational Circuit Design

Automatic test pattern generation (ATPG) is the next step after synthesis in the process of chip manufacturing. The ATPG may not be successful in generating tests for all multiple stuck-at faults since the number of fault combinations is large. Hence a need arises for highly testable designs which have 100% fault efficiency under the multiple stuck-at fault(MSAF) model. In this paper we investigate the testability of ROBDD based 2×1 mux implemented combinational circuit design. We show that the ROBDD based 2×1 mux implemented circuit is fully testable under multiple stuck-at fault model. Principles of pseudoexhaustive testing and multiple stuck-at fault testing of two level AND-OR gates are applied to one sub-circuit(2×1 mux). We show that the composite test vector set derived for all 2×1 muxes is capable of detecting multiple stuck-at faults of the circuit as a whole. Algorithms to derive test set for multiple stuck-at faults are demonstrated. The multiple stuck-at fault test set is larger than the single stuck-at fault test set. We show that the multiple stuck-at fault test set can be derived from the Disjoint Sum of Product expression which allows test pattern generation at design time, eliminating the need of an ATPG after the synthesis stage.     

Generation and evaluation of current and logic tests for switch-level sequential circuits

This article presents an approach to developing high quality tests for switch-level circuits using both current and logic test generation algorithms. Faults that are aborted or undetectable by logic tests may be detected by current tests, or vice versa. An efficient switch level test generation algorithm for generating current and logic tests is introduced. Clear definitions for analyzing the effectiveness of the joint test generation approach are derived. Experimental results are presented for demonstrating high coverage of stuck-at, stuck-on, and stuck-open faults for switch level circuits when both current and logic tests are used.This is expanded version of the work originally presented at the 1991 International Test Conference.     

Application-Dependent Testing of FPGAs

Testing techniques for interconnect and logic resources of an arbitrary design implemented into a field-programmable gate array (FPGA) are presented. The target fault list includes all stuck-at, open, and pair-wise bridging faults in the mapped design. For interconnect testing, only the configuration of the used logic blocks is changed, and the structure of the design remains unchanged. For logic block testing, the configuration of used logic resources remains unchanged, while the interconnect configuration and unused logic resources are modified. Logic testing is performed in only one test configuration whereas interconnect testing is done in a logarithmic number of test configurations. This approach is able to achieve 100% fault coverage     

Testing of multiple-output domino logic (MODL) CMOS circuits

Techniques for testing MODL circuits are presented. It is shown that, due to the greater observability of MODL circuits, their test sets can be considerably small than those derived for the conventional domino CMOS circuits. Tests for faults are derived from a comprehensive fault model which includes stuck-at, stuck-open, and stuck-on faults. Test sets for MODL circuits are inherently robust in the presence of circuit delays and timing skews at the inputs. They are also well-protected against the charge distribution problem. It is thus concluded that MODL is an attractive CMOS logic technique     

Defect-oriented testability for asynchronous ICs

For a CMOS manufacturing process, asynchronous ICs are similar to synchronous ICs. The defect density distributions are similar, and hence, so are the fault models and fault-detection methods. So, what makes us think that asynchronous circuits are much harder to test than synchronous circuits? Because the effectiveness of best known test methods for synchronous circuits drops when applied to asynchronous circuits? They may very well be a temporal hurdle. Many test methods have already been reevaluated and successfully adapted from the synchronous to the asynchronous test domain. The paper addresses one of the final hurdles: I_DDQ testing. This type of test method, based on measuring the quiescent power supply current, is very effective for detecting (resistive) bridging faults in CMOS circuits. Detection of bridging faults is crucial, because they model the majority of today's manufacturing defects. I_DDQ fault effects are sensitized in a particular state or set of states and can only be detected if we stop the circuit operation right there. This is a problem for asynchronous circuits, because their operation is self-timed. In the paper, we quantify the impact of self timing on the effectiveness of I_DDQ -based test methods for bridging faults, and propose a Design-for-Test (DfT) approach to develop a low-cost DfT solution. For comparison, we do the same for logic voltage testing and stuck-at faults. The approach is illustrated on circuits from Tangram, the asynchronous design-style employed at Philips Research, but it is applicable to asynchronous circuits in general     

Functional fault models for non-scan sequential circuits

The paper presents two functional fault models that are applied for functional delay test generation for non-scan synchronous sequential circuits: the pin pair state (PPS) fault model and the pin pair full state (PPFS) fault model. The PPS fault model deals with the pairs of stuck-at faults on the primary inputs and the primary outputs, as well as, with the pairs of stuck-at faults on the previous state bits and the primary outputs. The PPFS fault model encompasses the PPS model, and additionally deals with the pairs of stuck-at faults on the primary inputs and the next state bits, as well as, with the pairs of stuck-at faults on the previous state bits and the next state bits. The main factor in assessing the quality of obtained test sequences was the transition fault coverage at the gate level of the selected according to the appropriate fault model test sequences from the generated randomly ones. The experimental results demonstrate that the implementation using presented functional fault models allow selecting the test sequences from the initial test set without the loss of transition fault coverage in many cases, and the number of the selected test sequences is much lesser than that of the initial test set. This result demonstrates that the functional delay test can be generated using the presented functional delay fault models before structural synthesis of the circuit.