低银BAg10CuZnSnInNd钎料组织与性能

研究了复合添加微量In和Nd元素对低银BAg10CuZnSn钎料熔化特性、润湿性能、显微组织及钎焊接头力学性能的影响.结果表明,In元素的添加可以显著降低钎料的固、液相线温度,而Nd元素对钎料的固、液相线温度没有明显的影响.适量In元素和Nd元素的添加可以显著提高钎料在304不锈钢和紫铜上的铺展面积,同时钎料的显微组织得到了明显细化,过量添加In元素和Nd元素后钎料组织中出现了富铟相和稀土相.当In和Nd元素的添加量分别为2%和0.1%时,304不锈钢/304不锈钢接头的抗剪强度达到最大值430 MPa,而304不锈钢/紫铜的钎焊接头发生断裂,且均断于紫铜处,说明钎焊接头的强度大于紫铜.     

合金元素Ga对Sn-9Zn无铅钎料性能的影响

研究了合金元素Ga的添加量对Sn-9Zn无铅钎料熔化特性、润湿性能及其焊点力学性能的影响.结果表明,添加合金元素Ga以后,合金的熔点显著降低,熔化温度区间有所增大,润湿性能得到明显改善;合金元素Ga的添加量(质量分数)在0.5%时,钎料的晶粒组织最为细小均匀,钎料焊点的力学性能最佳;当合金元素Ga的添加量大于1%时,钎料的润湿性能趋于稳定,钎料组织中晶界处出现黑色富Ga相,钎料焊点的力学性能大幅度降低.因此,Sn-9Zn无铅钎料中合金元素Ga的最佳添加量为0.5%.     

Ag元素含量对SnAgCuX无铅钎料性能的影响

分析了SnAgCuX系无铅钎料中Ag异元素含量的变化对熔化温度、润湿性能的影响,同时研究了时效前和高温时效后钎焊接头的抗剪强度和显微组织,其中X包含Ni,P和Ce三种元素.结果表明,添加微量X元素能够在一定程度上弥补snAgCu钎料中Ag元素含量的降低引起的性能下降.X元素的添加对SnAgCu钎料的熔化温度影响不大,但能改善钎料合金的润湿性能,提高钎焊接头的抗剪强度,并抑制时效引起的接头强度下降.这与微量X元素的添加改善了钎料的显微组织和金属间化合物的形貌有很大的关系.     

微量元素镓对AgCuZn钎料性能的影响

研究了微量添加元素对AgCuZn钎料的熔化温度和显微组织的影响.结果表明:在银钎料中添加镓等元素,可以显著地降低银钎料的熔化温度(固相线和液相线),特别是同时添加适量的Ga、In、Sn等元素,Ag-Cu-Zn钎料的熔化温度降低非常显著.研究发现,镓元素的添加对AgCuZn钎料的显微组织有显著的影响.不过,添加适量Ga、In、Sn等元素的同时,为使钎焊接头具有一定的强度和塑性,应尽可能地增多钎料中的共晶组织,同时减少脆性金属间化合物组织舍量.     

添加元素Sn,Cu对Zn-Al钎料组织性能的影响

向Zn-10Al基体中添加元素Cu,采用真空炉VF-1600M、金相显微镜、岛津AG-125KN精密万能材料试验机等,研究了Cu元素对Zn-Al钎料合金的熔化特性、润湿性能、金相组织以及力学性能的影响。结果表明,随着Cu元素的增加,钎料的熔点呈先下降后上升的趋势,在铜添加量为4%(质量分数)时,熔点最低;在铜添加量为5%时,润湿性能优良,钎料晶粒最细小,抗拉强度最好;当铜添加量继续增大时,其润湿性能下降,钎料晶粒变大,抗拉强度降低。其次研究了Sn元素的添加量对Zn-10Al-5Cu钎料性能的影响。结果表明,当Sn添加量达到3%时,其抗拉强度良好,钎料的熔化温度降低,在Cu上的润湿性能良好。当锡添加量进一步增加时,钎料合金的的润湿性能降低,基本不铺展。试验得到的Zn-10Al-5Cu-3Sn为性能较为优良的铝/铜钎焊用钎料。     

稀土元素Nd对Sn-Zn-Ga无铅钎料组织及性能的影响

研究了添加合金元素Ga及稀土元素Nd对Sn-Zn钎料润湿性能、显微组织和焊点力学性能的影响.结果表明,在钎料中适当添加Nd元素,可以提高钎料的润湿性能,当Nd元素的质量分数为0.1％时,钎料的润湿力最大,润湿时间最短,润湿性能达到最佳.同时适当升高温度时润湿性能得到改善.随着Nd元素的加入,钎料中大块的黑色针状富锌相逐渐变少,钎料基体组织得到细化,在Nd元素的添加量达到0.1％时,钎料的组织最为均匀、细小.同时Nd元素的加入可以改善焊点的力学性能,在Nd元素含量为0.1％时抗剪强度增至最大.因此Nd元素在Sn-9Zn-0.5 Ga钎料中的最佳添加量为0.1％左右.     

无镉银基钎料合金化的研究进展

从单独添加一种合金元素和复合添加多种合金元素2种合金化方式,介绍了无镉银基钎料合金化的研究进展.概述了单独添加Sn,Ni,In,Ga的无镉银钎料性能和特点.从熔化温度、铺展性能、力学性能、组织影响等方面重点分析了复合添加Sn,Ga,In、稀土Ce的无镉银钎料的综合性能.指出了通过优化成分配比,复合添加Sn,Ga,In、...     

微量In对AgCuZn钎料组织和性能的影响

研究了不同In含量银钎料的熔化温度、铺展性能、钎料显微组织以及钎缝力学性能的变化规律.以紫铜、黄铜为母材,采用火焰钎焊方法,用对接和搭接接头形式进行钎焊试验.结果表明,在银钎料中添加微量In元素,能够降低钎料的熔化温度,改善钎料的铺展性能,并显著改变钎料显微组织.对于黄铜对接来说,钎焊接头的抗拉强度,随银钎料中In含量的增加而呈抛物线方式增加;除黄铜对接接头外,其它形式的接头断裂位置均在母材上,说明含In银钎料的力学性能优良.     

Sn-9Zn-xAl无铅钎料润湿性能

采用润湿平衡法测试了不同温度下Sn-9Zn-xAl无铅钎料在空气和氮气两种气氛下的润湿性能,研究探索了合金元素Al的添加量、气氛和温度对Sn-9Zn-xAl无铅钎料润湿性能的影响规律.结果表明,添加Al元素以后,Sn-Zn-xAl无铅钎料的润湿性得到明显改善,在使用ZnCl2-NH4Cl助焊剂时,Al的最佳添加量为0.02%(质量分数),在使用免清洗助焊剂时,Al的最佳添加量为0.005%(质量分数);采用氮气保护时,Cu基板表面张力提高,钎料的氧化减少、表面张力降低,明显改善了钎料在Cu基板上的润湿性能;在215～245℃时,温度升高使钎料的表面张力减小,提高了钎料的润湿性能.     

Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响

在Sn-Sb-Cu三元钎料合金中添加微量元素Ag和Ni,通过合金化形成Sn-Sb-Cu-Ag和Sn-Sb-Cu-Ni两种新型四元无铅钎料合金,以改善基体钎料性能.结果表明,在Sn-Sb-Cu钎料合金中添加微量元素Ag,合金熔化温度较基体钎料下降,铺展面积增大,这与钎料过热度增大,形成弥散低熔点相SnAg和液态钎料表面张力减小有关;添加微量元素Ni,合金熔化温度较基体钎料下降,铺展性能稍稍变差,这是因为添加微量元素Ni后,Sn-Sb-Cu-Ni液态钎料粘度提高,表面张力增大.且在钎料与铜基板处形成了多面体形状(Cu,Ni)6Sn5,且该相覆盖在Cu6Sn5表面,不利于液态钎料的润湿铺展.     

Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys

Through the use of a wetting balance technique, the wetting characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys with respect to the In content and soldering temperature were investigated to validate the applicability of compositions with a low Ag content as solder material. It was found that a small addition (0.4–0.6 wt.%) of In significantly improved the wetting properties of the Sn-1.2Ag-0.5Cu-xIn composition at soldering temperatures ranging from 230 °C to 240 °C due to the excellent wetting property of In. In an observation of the interfacial reaction, it was found that the added In element did not participate in the interfacial reaction with a Cu or Ni pad, unlike in the Sn-Ag-Cu-In case, which has a high In content. The package or boardside IMC layers in Sn-1.2Ag-0.5Cu-0.4In joints were thinner than those of Sn-3.0Ag-0.5Cu, especially after aging.     

Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy（SEM） and energy dispersive X-ray（EDX）. The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.SCu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1%.     

Sn-6Bi-2Ag(Cu, Sb)无铅钎料合金微观组织分析

利用差示扫描量热计 (DSC)测定了Sn 6Bi 2Ag ,Sn 6Bi 2Ag 0 .5Cu ,Sn 6Bi 2Ag 2 .5Sb三种新无铅钎料合金的熔化温度。结果表明 ,少量Cu的加入能降低Sn Bi Ag系无铅钎料合金的熔化温度 ,而Sb的加入使合金的熔化温度升高。利用光学显微镜 (OM )、扫描电子显微镜 (SEM )、能谱分析 (EDX)对合金的微观组织进行了分析与比较 ,钎料合金的微观组织与冷却条件和合金元素的含量有关 ,Sb的加入使析出相的尺寸细化。硬度测定表明Sn Bi Ag(Cu ,Sb)无铅钎料合金的硬度远大于纯Sn的硬度 ,加入少量的Cu(0 .5 % ) ,Sb(2 .5 % )对Sn Bi Ag系钎料合金的硬度影响较小     

Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响

通过在钎料中添加Fe粉颗粒,研究其对Sn-3Ag-0.5Cu复合无铅钎料的黏度、熔点、钎焊接头界面微观组织、与Cu基板之间的润湿性及焊点力学性能的影响。结果表明:微米级Fe粉的添加增加了复合钎料焊膏单位体积内焊粉的接触面积,使得焊膏内摩擦力增大,导致复合钎料焊膏的黏度增加;微米级Fe粉的添加对Sn-3Ag-0.5Cu钎料的熔化特性没有显著影响;钎焊时,由于重力偏聚及界面吸附作用,Fe粉颗粒集中沉积于Sn-3Ag-0.5Cu-Fe/Cu钎焊接头界面处靠近钎料一侧,由于增大液态钎料黏度而导致钎料与Cu板间的润湿性降低;与Sn-3Ag-0.5Cu/Cu相比,Sn-3Ag-0.5Cu-Fe/Cu界面处钎料一侧粗大的β-Sn枝晶区消失,取而代之的是细小的等轴晶。Sn-3Ag-0.5Cu-1%Fe/Cu的剪切强度为46 MPa,比Sn-3Ag-0.5Cu/Cu剪切强度提高39%;靠近界面金属间化合物处钎料基体的显微硬度提高约25%。     

Ag元素含量对Sn-Ag-Cu钎料焊接性的影响

以Sn-xAg-0.5Cu为基体制备了低银无铅钎料,其中Ag元素的质量分数分别为0.3%,0.5%,0.7%,0.9%.借助钎料合金的DSC熔化曲线,分析了Ag元素含量对合金熔点的影响规律.通过比较各组钎料合金在Cu基板上的铺展面积和铺展率,分析了Ag元素含量的变化对各组钎料润湿性的影响规律.结果表明,随着Ag元素含量...     

Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In

Nowadays, a major concern of Sn-Cu based solder alloys is focused on continuously improving the comprehensive properties of solder joints formed between the solders and substrates. In this study, the influence of Ag and/or In doping on the microstructures and tensile properties of eutectic Sn-0.7Cu lead free solder alloy have been investigated. Also, the effects of temperature and strain rate on the mechanical performance of Sn-0.7Cu, Sn-0.7Cu-2Ag, Sn-0.7Cu-2In and Sn-0.7Cu-2Ag-2In solders were investigated. The tensile tests showed that while the ultimate tensile strength (UTS) and yield stress (YS) increased with increasing strain rate, they decreased with increasing temperature, showing strong strain rate and temperature dependence. The results also revealed that with the addition of Ag and In into Sn-0.7Cu, significant improvement in YS (∼255%) and UTS (∼215%) is realized when compared with the other commercially available Sn-0.7 wt. % Cu solder alloys. Furthermore, the Sn-0.7Cu-2Ag-2In solder material developed here also exhibits higher ductility and well-behaved mechanical performance than that of eutectic Sn-0.7Cu commercial solder. Microstructural analysis revealed that the origin of change in mechanical properties is attributed to smaller β-Sn dendrite grain dimensions and formation of new inter-metallic compounds (IMCs) in the ternary and quaternary alloys.     

Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions

The ADAMIS database was used for calculation of the surface tension of the quaternary Sn−Ag−Cu−Bi liquid alloys by Butler's model. The resultant data were compared with those from the maximum bubble pressure measurements from Part I. The same thermodynamic database was next applied for the calculation of various phase equilibria. It was established that the Bi addition to the ternary Sn−Ag−Cu alloys (Sn-2.6Ag-0.46Cu and Sn-3.13Ag-0.74Cu in at.%; Sn-2.56Ag-0.26 Cu and Sn-2.86Ag-O.40Cu in mass%) causes lowering of the melting temperature and the surface tension to make the tested alloys closer to, traditional Sn−Pb solders. The simulation of the solidification by Scheil's model showed that the alloys with the higher Bi concentration are characterized by the lifting-off failure due to the segregation of Bi at the solder/substrate boundary. Thus, in modeling of new Pb-free solders, a compromise among various properties should be taken into consideration.     

Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响

研究了添加适量的Bi元素对低银型Sn-0．3Ag-0．7Cu无铅钎料合金性能的影响,应用差示扫描量热仪和SAT-5100型润湿平衡仪对Sn-0．3Ag-0．7Cu·xBi（x=0.1,3,4．5）钎料的熔点、润湿性能作了对比试验分析。结果表明,一定量Bi元素的加入可以降低Sn-0．3Ag-0．7Cu钎料合金的熔点,并改善其润湿性能。但过多的Bi元素会导致钎料的液固相线温度差增大,塑性下降,造成焊点剥离缺陷。综合考虑得到Sn-0．3Ag-0．7Cu-3．0Bi无铅钎料具有最佳的综合性能。     

无铅焊料在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为

研究了Sn-3.5Ag-0.75Cu和Sn-0.75Cu焊料合金在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为,并与Sn-37Pb焊料合金的腐蚀浸出行为对比分析。研究表明,这3种焊料合金中Sn的浸出量随时间的延长趋于平缓,且Sn-0.75Cu焊料合金中Sn的浸出量最高,添加Ag元素后明显抑制了Sn-3·5Ag-0·75Cu焊料合金中Sn的浸出;Ag,Cu,Pb的浸出量随时间的延长呈线性增加,且Ag,Cu的浸出量较少。3种焊料合金浸出后表面产物层较厚,主要由Sn_4(OH)_6Cl_2和SnO组成,其中Sn-0.75Cu焊料合金的表面产物层有裂纹和孔洞,Sn-3.5Ag-0.75Cu焊料合金的表面产物相对致密,而Sn-37Pb焊料合金的表面产物局部出现剥落现象。这3种焊料合金浸出动力学行为存在差异,主要与表面产物的相组成和形貌有关。     

Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能

研究了稀土元素Nd的添加量对超低银无铅钎料Sn-0.3Ag-0.7Cu的润湿性能、显微组织和力学性能的影响.结果表明,微量Nd元素的加入可以显著改善Sn-0.3Ag-0.7Cu超低银无铅钎料的润湿性能和焊点的力学性能,并且能够起到细化基体组织的作用.当钎料中Nd元素的质量分数达到0.1%时,钎料的综合性能最佳,基体组织最为均匀细化.虽然Ag元素含量的降低使钎料的性能有所下降,但是加入适量Nd元素后钎料的润湿性能已接近传统Sn-3.8Ag-0.7Cu钎料.