SnAgCu-xBi/Cu焊点界面反应及微观组织演化

本工作在Sn-3.0Ag-0.5Cu焊料中添加不同含量的Bi(0.1%,0.5%,1.0%(质量分数)),以此来研究Bi含量对Sn-3.0Ag-0.5Cu/Cu焊点的界面反应及金属间化合物微观组织演化的影响。结果发现:回流反应之后,焊点界面形成扇贝状的Cu_6Sn_5,对焊点进行时效处理后发现,在Cu_6Sn_5层与Cu基板之间又出现了一层Cu_3Sn,并且Cu_6Sn_5层的上表面及焊料中出现了颗粒状的Ag_3Sn,Ag_3Sn颗粒的数量随着时效时间的延长而增多;5d的时效处理之后,在Cu基板的上表面和Cu_3Sn层中发现了柯肯达尔孔洞,同时在大多数焊点界面的Cu_6Sn_5层的上表面和Cu_6Sn_5层中出现了裂纹,推测裂纹是由于热膨胀系数差导致的残余应力而形成的。时效过程中,焊点界面金属间化合物(IMC)层的厚度不断增加,并且IMC的平均厚度与时效时间的平方根呈线性关系。对比未添加Bi元素的Sn-3.0Ag-0.5Cu/Cu焊点发现,添加微量的Bi元素对IMC层生长有抑制作用,当Bi含量为1.0%时,抑制作用最为明显,而Bi含量为0.5%时,抑制作用最弱。Cu_6Sn_5晶粒的平均直径随着时效时间的延长而增加,且Cu_6Sn_5晶粒的平均直径与时效时间的立方根呈线性关系。     

Sn8Zn3Bi-xCu/Cu焊接接头界面反应及力学性能研究

以Sn8Zn3Bi为研究对象,采用微合金化方法研究了不同含量的Cu元素对其显微组织、钎料合金与Cu基板钎焊后的界面金属间化合物(IMC)层尺寸及焊接接头剪切强度的影响。结果表明,Sn8Zn3Bi-xCu/Cu(x=0.3,0.5,0.8,1.0,1.5)焊接界面IMC主要为层状Cu5Zn8相。随着Cu含量的增加,界面IMC层的厚度逐渐减小,接头的剪切强度逐渐提高,Sn8Zn3Bi-1.5Cu/Cu接头剪切强度较Sn8Zn3Bi/Cu显著提高。经120℃时效处理后,Sn8Zn3BixCu/Cu(x=0,0.3,0.5,0.8,1.0,1.5)焊接接头剪切强度都明显下降,接头断裂方式由韧性断裂转为局部脆性断裂,但添加了Cu元素的钎料界面IMC生长速度较Sn8Zn3Bi钎料慢,因此Cu元素的添加抑制了界面IMC层的生长。     

等温时效对SnAgCu/Cu焊接接头显微组织及强度的影响

研究了SnAgCu焊料与铜基的接头在150℃等温时效后,接头界面金属间化合物的形成与转变.用扫描电镜观察在时效过程中焊接接头的显微组织演变.用X射线能谱仪测定了化合物的成分.结果表明,回流焊接时,在焊料和铜基板之间形成了Cu6Sn5化合物层,随着时效时间的增加,Cu6Sn5的晶粒大小逐渐增加,并且形态逐渐从扇贝状依次转变为针状和杆状,最后转变为颗粒状.与此同时,在焊料及Cu6Sn5金属间化合物层之间形成了杆状的Ag3Sn.焊接接头的抗拉强度的测量表明,抗拉强度随着时效时间的增加开始略有增加而后逐渐下降.断口观察发现,随着时效时间的增加,断裂源从焊料内部向Cu6Sn5界面移动.在化合物层界面发生的断裂是由于化合物晶粒粗化和Cu6Sn5化合物层厚度的增加造成的.     

复合电镀层中SiC粒子与Ni之间的高温界面反应

本文研究了高温下Ni/SiC复合镀层中SiC粒子与Ni之间的界面反应.结果表明,温度高于600℃,保温1小时,Ni/SiC界面反应明显发生.对应于600℃、800℃和1000℃的反应产物分别是Ni₃Si、Ni₅Si₂和Ni₂Si.指出了该镀层耐磨性与反应产物存在的间接关系.     

电场激活燃烧合成( TiB2)PNi/Ni3Al/ Ni功能梯度材料

采用电场激活压力辅助合成技术(FAPAS)制备了(TiB₂)_PNi/(TiB₂)_PNi₃Al/Ni₃Al/Ni梯度材料,主要研究电场激活燃烧合成过程中电场对材料合成及层界面扩散连接的作用。分析了梯度材料各层的界面微观组织及相组成和材料的硬度分布。结果表明,采用FAPAS 技术结合机械合金化工艺制备的(TiB₂)_PNi/(TiB₂)_PNi₃Al/Ni₃Al/Ni 功能梯度材料具有快速、简便和组织均匀密实的特点。梯度材料的陶瓷复合层、Ni₃Al层和Ni板的界面区产生成分的互扩散,形成了良好的冶金结合。从Ni板到陶瓷复合层的硬度呈梯度分布。     

Cu/Sn37Pb/Cu钎焊接头界面微观结构及其剪切性能

本工作借助扫描电镜(SEM)等手段,针对Cu/Sn37Pb/Cu钎焊接头进行剪切断裂实验,考察并分析钎焊及等温时效处理后焊点接头金属间化合物(IMC)的生长情况以及搭接焊点的剪切强度和断裂模式,旨在深入研究高体积分数界面IMC层对钎焊接头剪切性能及断裂形貌的影响。实验结果表明:在时效处理过程中,界面Cu3Sn层逐渐增厚且逐渐变得平坦。此外,在Cu3Sn/Cu界面观察到柯肯达尔空洞现象,随着时效时间的延长,空洞数量增多且尺寸变大。随着界面IMC层厚度增加,接头的剪切强度先增加后下降,这可能是由于脆性IMC厚度过大或粗化的富Pb相和富Sn相增多引起的。当时效时间与钎焊时间较短时,焊点具有较高体积分数的本体焊料,焊点断裂模式为韧性断裂,随着时效时间或钎焊时间的延长,焊点内IMC体积分数逐渐升高,焊点断裂模式开始转变为韧脆混合断裂,最后转变为脆性断裂。     

激光钎焊Sn-0.7Cu/Cu界面IMC生长行为EI北大核心

金属间化合物IMC厚度及形貌对焊点力学性能起到关键作用。本工作以激光为加热热源,Cu为基底,研究钎焊时激光功率以及激光扫描速度对Sn-0.7Cu无铅焊料界面金属间化合物生长规律的影响。结果表明:不同激光参数下,得到的界面金属间化合物形貌及厚度存在差异。随着激光功率增大,界面处形成的Cu6Sn5IMC层变厚;而随着扫描速度增大,IMC厚度减小;界面IMC厚度变化与功率及扫描速度有如下函数关系:d=D0+Kp/v。     

回流次数对无铅焊点组织演变及可靠性的影响

目的研究不同回流次数对焊点形貌以及组织演变的影响,并通过力学性能来表征不同回流次数下焊点的可靠性。方法利用置球法将Sn3Ag0.5Cu小球置于Cu基板表面,随后在回流焊机中形成焊点,并进行不同次数回流焊接得到所需焊点,横截镶样打磨腐蚀后,利用光学显微镜、扫描电子显微镜进行显微组织观察,并用推拉试验机进行剪切测试。结果在焊点反应过程中,由于熔融焊料中析出的过饱和Cu和Sn会在焊料部分形成中空的Cu6Sn5管状物和片状的Sn基体,但随着反应的持续,这些物质逐渐消失。在IMC层的形成过程中,伴随着大量Cu6Sn5颗粒的产生,随着反应的持续,颗粒数量逐渐减少,IMC层厚度逐渐增加,但增加速度减缓。结论在IMC层的生长过程中,大块IMC会吞噬Cu6Sn5小颗粒来增加自身体积,从而抑制小颗粒的产生,最终减缓自身的生长。此外随着回流次数的增加,焊点由韧性断裂逐渐转变为韧脆性混合断裂,对焊点可靠性的降低具有一定影响。     

稀土Ce对SnAgCu合金显微组织及剪切强度的影响

研究了稀土Ce对Sn-3.0Ag-0.5Cu合金显微组织及焊点剪切强度的影响规律.利用扫描电镜对铸态合金及焊点显微组织和断口形貌进行了观察和分析,利用能谱仪对铸态合金组分进行测试,采用力学试验机测试焊点的剪切强度.研究表明:当Ce添加量为0.25%时,铸态合金显微组织中β-Sn相与Ag3Sn相明显细化,出现了少量的Sn-Ce相及Ce的偏聚区;采用气雾化粉末所配制的焊膏进行回流焊,添加Ce后,焊点基体组织比未添加时明显优化;经过气雾化制粉,Ce向粉末表面富集并极易氧化,导致焊粉氧含量升高,使得回流焊接后焊料/Cu界面IMC层附近孔洞增加,焊点剪切强度降低.     

纳米Ni 颗粒对焊锡膏的界面IMC 影响

目的研究纳米Ni对SnAg0.3Cu0.7无铅焊锡膏的焊点界面IMC影响。方法采用在助焊剂中添加纳米Ni颗粒,制备出纳米Ni颗粒增强的SnAg0.3Cu0.7焊锡膏,分析纳米Ni在150℃时效中对IMC的影响。结果在150℃时效中界面IMC的厚度随着时效时间延长而增大,形貌变成平缓层状;添加Ni质量分数为0.025%时,对界面IMC几乎无影响,当添加质量分数为0.05%和0.1%的纳米Ni能促进IMC的生长,但抑制Cu3Sn层的生长。结论通过添加纳米Ni颗粒,在150℃时效中可促进IMC的生长,抑制Cu3Sn层的生长。     

电子焊料的无铅化及可靠性问题

随着环境保护意识的增强,人们更清楚意识到铅的剧毒性给人类健康、生活环境带来的严重危害,全球范围已相继立法规定了使用含铅电子焊料的最后期限,无铅封装,无铅焊料成为了近年来的研究热点问题。本文主要叙述了研究无铅焊料的驱动力,以及无铅焊料须满足的基本要求、常用无铅焊料的优缺点和改进方法,同时介绍了无铅化焊接由于焊料的差异和工艺参数的调整,给焊点可靠性带来的相关问题。     

电子组装用无铅钎料的研究进展

随着电子组装技术的发展和人们对环境日益关注,研制和开发无毒高性能的无铅钎料替代传统的Sn Pb钎料成为热点。本文综述了无铅钎料使用的必然性和近年来国内外对无铅钎料研究的新进展,并介绍了今后可能的发展趋势。     

Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy

It is important, for electronic application, to decrease the melting point of Sn-5Sb solder alloy because it is relatively high as compared with the most popular eutectic Pb-Sn solder alloy. Adding Au or Ag can decrease the onset melting temperature （233℃） of this alloy to 203,5℃ and 216℃, respectively. The results indicate that the Sn-5Sb-i.5Au alloy has very good ultimate tensile strength （UTS）, ductility, and fusion heat, which are better than both those of the Sn-5Sb-3.SAg and Sn-5Sb alloys. The formation of intermetallic compounds （IMCs） AuSn4 and Ag3Sn enhanced the SbSn precipitates in the solidification microstructure microstructure stability, while retained the formation of thus significantly improved the strength and ductility For all alloys, both UTS and yield stress （σy） increase with increasing strain rate and decrease with increasing temperature in tensile tests, but changes of ductility are generally small with inconsistent trends.     

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Abstract

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.     

光纤定位激光钎焊键合过程中钎料与镀层的界面反应

光电子封装中,光导纤维的定位键合是一项关键技术,并且焊点界面处的显微组织对于焊点的可靠性有重要影响.本文选用80Au20Sn和52In48Sn钎料实现了激光钎焊条件下的光纤键合,采用扫描电子显微镜及能谱分析的方法对于两种钎料分别与硅片上的Au/Ti镀层和光纤上的Au/Ni镀层反应形成的界面微观组织形态及形成规律进行了分析.结果表明:对于80Au20Sn钎料,除了共晶组织ζ相+δ相,在AuSn/Au/Ti镀层界面形成了大量枝状的先共晶ζ相,在AuSn/Au/Ni镀层界面形成了针状的(Au,Ni)3Sn2;对于52In48Sn钎料,在InSn/Au/Ti镀层界面形成了连续层状的Au(In,Sn)2,随着输入能量的增加,其逐渐转变为不连续的块状化合物AuIn2,在熔融钎料流的作用下部分AuIn2脱离界面进入钎料中,在InSn/Au/Ni镀层界面形成了一层极薄的Au(In,Sn)2.     

Intermetallic compounds in 3D integrated circuits technology: a brief review

Abstract

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.     

纳米Ag颗粒/In-3Ag复合焊料的微观组织演变

通过外向法制备纳米Ag颗粒/In-3Ag复合焊料, 研究在多次回流过程中, 添加不同含量的纳米Ag颗粒对In-3Ag焊料焊点基体组织和界面IMC层(intermetallic compound)的影响规律, 采用SEM、HRTEM、能量色散仪(EDS)和电子探针(EPMA)分别对焊点基体及IMC层的微观结构及成分进行观察和分析。研究结果表明: 纳米Ag颗粒能诱发晶粒成核, 多次回流后, 复合焊料基体中颗粒状二次相AgIn₂没有明显长大现象; 通过塞积扩散通道和表面吸附效应, 纳米Ag颗粒能显著抑制焊料界面IMC层在多次回流过程的生长; 纳米Ag颗粒的合适添加量为0.5%(质量分数,下同), 当添加1%时, 颗粒团聚, 导致界面处出现球形AgIn₂, 降低焊料的力学性能。     

Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates

Shear tests were conducted to evaluate the mechanical behavior of miniature single solder ball joints. The tests were carried out at room temperature under displacement control mode and various displacement rates (2.16-0.019 mm/s) using a miniaturized testing machine with an attached piezo-electric actuator. The mean shear stress was estimated on the basis of the mean cross-section area rather than the minimum cross-section area. The shear fracture strength of the present solder ball joints generally increased as the shear strain rate increased due to the sensitivity of the bulk solder strength to the strain rate. The relationship between strain rate and stress of the current shear tests is consistent with findings from other experimental techniques on the same solder alloy. The unloading shear fracture toughness was found to increase as the shear strain rate increased. The unloading shear fracture toughness is generally consistent with the amount of bulk solder on the fractured surface.     

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400 ℃. However, the surface of the Sn-10Sb-5...