均匀光强分布的5kW半导体激光硬化光源研制

随着半导体激光自身输出功率和转换效率的提升,半导体激光已经广泛的应用于激光加工领域。本文针对目前激光加工领域对半导体激光硬化光源的需求,研制了波长为976nm的连续输出半导体激光硬化光源。该光源采用空间/偏振合束工艺达到了较高的合束效率,采用柱面微透镜阵列分割与聚焦镜复合较好地匀化了巴条激光器慢轴方向固有的光强起伏,使聚焦光斑的光强呈平顶分布。最后对该光源进行了实验装调和测试。结果表明,在工作电流为93A时,光源的最大输出功率为5 120W,电光转换效率达47%,光斑尺寸为2mm×16mm,光斑分布为平顶分布,平整度大于90%,满足工业中对大面积、高效率激光硬化的要求。     

光纤陀螺用SLD光源全数字控制系统

超辐射发光二极管(SLD)是干涉式光纤陀螺的理想光源,介绍了全数字SLD光源控制系统的硬件构成、控制软件流程及PID算法。测试结果表明,在-20～50℃温度范围内,光功率波动小于0.3%,平均波长的温度漂移为3×10-6/K,此数控方法在光纤陀螺高精度、工程化研究中有良好的应用前景,对其他半导体激光光源的高精度控制具有通用性。     

10kW连续输出半导体激光熔覆光源

针对于目前国内半导体激光加工熔覆光源主要依赖于国外进口的局面,研制了连续输出功率达10kW的半导体激光熔覆光源。利用ZEMAX光学设计软件模拟半导体激光光路,包括光束整形、准直及聚焦透镜的设计等。实验中采用2只波长为915nm和2只波长为976nm的半导体激光叠阵,通过偏振合束和波长合束技术实现它的合束。由自行设计的聚焦系统进行了聚焦实验,结果显示,当模块工作电流为122A时,光源最大输出功率为10 120 W,电-光转换效率为46%,在工作面的聚焦光斑为2.5mm×18mm,可满足工业中大面积高速激光熔覆和表面热处理的要求。     

双法—珀光纤干涉仪及条纹定位法读数

双法—珀干涉型光纤位移传感器对光源的相干性要求很低,发光二极管LED即可作为光源。这种光源的优点是可以克服半导体激光光源的初始条件模糊及反馈引起的噪声等。用干涉条纹定位法测量传感腔长的变化,定位重复精度为4nm。     

SLD1型半导体激光光源

论述了我所研制的SLD1型半导体激光光源的基本构造、电源、冷却装置及安装方法。针对半导体激光发射功率随温度变化的特性，论述了怎样利用温控装置使其温度被控制在一定范围内，然后利用光功率自动控制电路，使其发光功率保特稳定。     

高功率半导体激光器直接调制特性的实验研究

本文介绍了一种具有自动功率控制(APC),自动温度控制(ATC)及 调制输入接口的半导体激光光源,并对其低频调制特性进行了深入的实验研 究。给出了用高速光电探测器探测到的调制信号波形,并进一步分析了调制 频率与闭值电流之间的关系,以及调制频率与平均输出功率之间的关系。     

双光—珀光纤干涉仪及条纹定位法读数

双法－珀干涉型光纤位移传感器对光源的相干性要求很低，发光二极管ＬＥＤ即可作为光源。这种光源的优点是可以克服半导体激光光源的初始条件模糊及反馈引起的噪声等。用于涉条纹定位法测量传感腔长的变化，定位重复精度为４ｎｍ。     

SLD1型半导体激光光源

论述了我所研制的ＳＬＤ１型半导体激光光源的基本构造，电源，冷却装置及安装方法，针对半导体激光发射功率随温度变化的特性，论述了息样利用温控装置使其温度被控制在一定范围内，然后利用光功率自动控制电路，使其发光功率保持稳定。     

半导体激光器电流调制实现短相干光源

传统的干涉仪采用激光光源,由于激光的高相干性,在平行平板、棱镜等特殊光学元件测量时存在严重的串扰;LED、钨灯等光源因准直性较差、光强稳定性差和相干长度较短等特征,同样不适合作为特殊光学元件检测干涉仪的光源。短相干激光光源具有方向性好、亮度高和相干长度适中等优点,是特殊元件检测干涉仪的理想光源。针对短相干干涉仪对光源的需求,对通过电流调制半导体激光器光源的相干性进行了理论研究。研究结果表明,调制频率越高、调制强度越大,光源的相干长度越短;偏置电流越大,输出功率越高,相干性也会变好,不利于产生短相干光源。在此基础上,搭建并研制了一款短相干激光光源,该光源相干长度为80μm,光源的旁瓣抑制比下降为0.31,输出光功率可达30 mW,能够满足短相干测量对光源的要求。     

YLS-2000W高功率光纤激光器

YLS-2000W高功率光纤激光是基于有源光纤和半导体二极管设计而成,它融合了两项极具创新力的、极先进的激光技术。光纤激光器采用单芯结半导体二极管作为光源来泵浦有源光纤。     

光纤陀螺用SLD的光功率自动控制的实验研究

光纤陀螺(FOG)所用光源的特性对光纤陀螺的性能有很大的影响,着重介绍半导体光源超辐射二极管(SLD)的特性,以及SLD的稳定性对光纤陀螺的影响。针对环境温度和驱动电流对SLD光功率稳定性的影响,设计光功率控制方案及相应的驱动控制电路。     

基于SoC单片机的小型化SLD光源数字控制系统设计

为提高光纤陀螺用超辐射发光二极管(SLD)光源的稳定性,实现光源性能检测和评价的灵活性,在光源工程化生产中常采用数字化控制系统对光源进行控制。以SoC单片机C8051F060为控制检测平台,结合高性能TEC控制器ADN8831和数字PID控制算法,设计了新型小型化光源数字控制系统。实验表明,该光源数字化控制系统体积小,精度高,操作灵活,可扩展性强,具有良好的实用价值。     

基于LabVIEW的SLD光源数字化测评系统研究

光纤传感器常常采用超发光二极管光源(SLD),SLD光源的稳定性对系统整体性能有着关键的影响。所以在SLD应用前,对光源的测试评价的工作是非常有必要的。通常光源的全面测试是一项操作纷繁复杂、数据量巨大、后期数据处理繁琐的工作,因此针对不同的测试系统,以虚拟仪器的设计思想,基于LabVIEW平台,结合Matlab设计了一系列测评程序,以实现对光源测试的自动化,能大大提高光源测试效率和测试系统的可靠性。     

光纤陀螺用SLD光源的光功率稳定性研究

SLD光源的稳定性对光纤陀螺的性能有及其重要的影响。为提高光纤陀螺的精度 ,设计了 SLD光源的数字化控制系统 ,采用“恒流 +温控”的方案 ,并引入了数字 PID控制算法 ,大大提高了光源出纤光功率的稳定性。用实验证明了数字方法的控制效果远远好于目前广泛应用的模拟控制方法     

基于模糊自适应PID的SLD光源温控方法研究

通过对超辐射发光二极管（SLD）光源进行分析,建立了二阶惯性环节加纯滞后的温度控制模型,提出了一种采用模糊自适应PID对光源进行温度控制的数字控制方法,并对所建立的模型进行了MATLAB仿真。结果表明,模糊自适应PID控制在调节时间、响应速度、调节精度和稳定性方面均优于常规的增量式PID控制,这对下一步光源的数字化实现具有重要指导意义。     

基于四阶矩法车削颤振可靠性研究*

再生颤振是影响加工质量、加速刀具磨损、刀具破坏的主要原因。以车削加工为研究对象,针对具有不确定参数的车削加工颤振预测问题,研究车削加工系统结构动态特性参数具有随机特性的情况下颤振可靠性建模及求解问题。定义车削加工过程不出现颤振的概率为颤振可靠度,建立车削加工系统可靠性模型,研究四阶矩法求解可靠度的问题,提出利用颤振可靠性叶瓣图方法进行颤振预测。通过模态试验对一车床进行频响函数测试,采用四阶矩法计算获得了颤振可靠度,并与蒙特卡洛法获得的可靠度相比较。结果表明四阶矩法计算获得的可靠度与蒙特卡洛仿真结果一致性很好,但是四阶矩法计算精度高而且计算耗时远小于蒙特卡洛法。进行颤振可靠性切削试验,通过观察振纹和分析噪声功率谱识别颤振,对典型参数进行验证,试验结果与分析结果一致。     

SLD光源驱动电路的设计与实验研究

分析了超辐射发光二极管(super lum inescent d iode,SLD)光源的驱动原理,给出了一种利用控制驱动电流和温度来稳定光源输出功率的驱动电路,并通过采集反馈电压来监控功率的输出。通过对SLD光源的驱动实验,得到电流与输出功率具有良好的线性关系,输出光功率的稳定度优于0.002dB。     

Dual-beam stealth laser dicing based on electrically tunable lens

In this paper, we present the development of a high-speed dual-beam stealth laser dicing (D-SLD) method for processing semiconductor wafers based on electrically tunable lenses (ETLs). An SLD system utilizes a laser beam to dice a wafer by inducing interior defects without modifying the surface characteristics of a wafer, thereby presenting significant advantages over conventional dicing methods, e.g., blade dicing or laser ablation. Currently, the throughput of SLD is limited by the serial scanning process; in addition, wafer misalignment and the warpage effects together deteriorate the dicing quality and yield and demand high-cost multi-axis precision stages. To address the issue, we parallelize the dicing process by splitting the laser focus into two foci, where the laser intensity at different depths are automatically adjusted to achieve optimal dicing condition. By combining the height sensor and ETLs, each laser focus, i.e., laser scan lines, can be rapidly controlled axially to compensate the wafer curvature and misalignment errors in real time, leading to substantially improved precision (kerf width < 2 μm) and speed, demonstrated by our experimental results. The new dual-beam laser dicing system presents an effective solution for high-speed wafer dicing as well as other important engineering applications, e.g., fabrication of micro-devices and optical components.     

Chatter and dynamic cutting force prediction in high-speed ball end milling

Machine tool chatter is a serious problem which deteriorates surface quality of machined parts and increases tool wear, noise, and even causes tool failure. In the present paper, machine tool chatter has been studied and a stability lobe diagram (SLD) has been developed for a two degrees of freedom system to identify stable and unstable zones using zeroth order approximation method. A dynamic cutting force model has been modeled in tangential and radial directions using regenerative uncut chip thickness. Uncut chip thickness has been modeled using trochoidal path traced by the cutting edge of the tool. Dynamic cutting force coefficients have been determined based on the average force method. Several experiments have been performed at different feed rates and axial depths of cut to determine the dynamic cutting force coefficients and have been used for predicting SLD. Several other experiments have been performed to validate the feasibility and effectiveness of the developed SLD. It is found that the proposed method is quite efficient in predicting the SLD. The cutting forces in stable and unstable cutting zone are in well agreement with the experimental cutting forces.     

Modeling and Analytical Solution of Chatter Stability for T-slot Milling

T-slot milling is one of the most common milling processes in industry. Despite recent advances in machining technology, productivity of T-slot milling is usually limited due to the process limitations such as high cutting forces and stability. If cutting conditions are not selected properly the process may result in the poor surface finish of the workpiece and the potential damage to the machine tool. Currently, the predication of chatter stability and determination of optimal cutting conditions based on the modeling of T-slot milling process is an effective way to improve the material removal rate(MRR) of a T-slot milling operation. Based on the geometrical model of the T-slot cutter, the dynamic cutting force model was presented in which the average directional cutting force coefficients were obtained by means of numerical approach, and leads to an analytical determination of stability lobes diagram(SLD) on the axial depth of cut. A new kind of SLD on the radial depth of cut was also created to satisfy the special requirement of T-slot milling. Thereafter, a dynamic simulation model of T-slot milling was implemented using Matlab software. In order to verify the effectiveness of the approach, the transfer functions of a typical cutting system in a vertical CNC machining center were measured in both feed and normal directions by an instrumented hammer and accelerators. Dynamic simulations were conducted to obtain the predicated SLD under specified cutting conditions with both the proposed model and CutPro?. Meanwhile, a set of cutting trials were conducted to reveal whether the cutting process under specified cutting conditions is stable or not. Both the simulation comparison and experimental verification demonstrated that the satisfactory coincidence between the simulated, the predicted and the experimental results. The chatter-free T-slot milling with higher MRR can be achieved under the cutting conditions determined according to the SLD simulation.