光纤耦合激光器驱动与控制技术研究

针对一种将多个半导体激光器(LD)芯片串联驱动,通过光纤耦合进行功率合成,构成光纤耦合高功率输出激光模块的特殊驱动要求,研发了小型化高效率激光电流源组件和小型化高效率半导体制冷(TEC)LD模块温度控制组件。组件工作温度范围为-45℃～55℃,实验证明达到了设计性能指标要求。建立了LD模块驱动电流源电路的数学模型,提出了LD模块电流源控制电路的数字化实现方法,并利用ADuC831单片机实现了数字化设计。给出了一种基于TEC的LD模块温度控制组件的结构,建立了简化、实用的温度控制系统数学模型,对TEC的性能系数ξ、控制端的热量Qc和TEC的工作电流I进行了寻优控制,减小了激光器输出波长随温度的漂移。     

Thermal analysis of laser diode module by an equivalent electrical network method

Heat generation and dissipationin LDpackages with-out TEC have been investigated both analytically andexperi mentally[1-4].However,the thermal analysis ofLDMincorporated with a TEC has not yet been suffi-cientlyinvestigated.Afinite element methodtoanalyse…     

Thermal management strategies for high power semiconductor pump lasers

Semiconductor pump lasers are an important component in erbium-doped fiber amplifiers and Raman amplifiers. Thermal management has become one of the major obstacles of pump laser development. Understanding of the thermal behavior of high-power laser packages is crucial to the thermal design and optimization of pump lasers. In this paper, we report on the thermal characteristics of a high-power pump laser and discuss the issues associated with heat dissipation. The thermal management of high-power pump laser modules mainly consists of three aspects. One is the thermal resistance reduction which reduces bulk temperature rise in the laser diode chip. The second is facet temperature control, and the third is the thermoelectric cooler (TEC) coefficient of performance improvement. In this paper, the approaches to reduce thermal resistance and facet temperature at the chip level and package level will be reviewed, and the thermal design and optimization of the package assembly to improve the TEC coefficient of performance will be discussed. The thermal resistance of a pump laser could be reduced up to 40% by the proper design of the laser chip and epi-down bonding. An unpumped window design in the pump laser diode is proven to be very effective in reducing the facet temperature and increasing the catastrophic optical mirror damage level. Assembly and package optimization can provide more uniform temperature distribution on TEC cold plate which is critical in improving the TEC coefficient of performance.     

7.5 mol-% Nb:KTP晶体折射率温度系数的表达式

基于不同温度下主折射率的测量结果,报道了7.5mol-% Nb:KTP晶体作为波长函数的折射率温度系数的表达式.利用该式可以计算539.75～1079.5nm波长范围内7.5mol-% Nb:KTP晶体的折射率温度系数.计算结果与测量结果具有较好的一致性.     

Out-of-plane thermal expansion coefficient of biphenyldianhydride-phenylenediamine polyimide film

The out-of-plane thermal expansion coefficient α_⊥ of biphenyldianhydride-phenylenediamine (BPDA-PDA) polyimide thin film between 20 and 400°C has been measured using a laser spot scanning interferometer. The α_⊥ varies from 100 ppm/°C at 20°C to 400 ppm/°C at 400°C. As the result of highly anisotropic microstructure, the α_⊥ is much larger than the in-plane thermal expansion coefficient α_∥ and increases dramatically when the temperature exceeds the glass transition temperature (≈320°C).     

Analytical equations for predicting the thermal properties of isotropic conductive adhesives

This paper investigates a set of theoretical equations for analyzing the thermal properties of isotropic conductive adhesives (ICAs) containing several types of Cu filler particles. The thermal conductivity of ICAs containing randomly dispersed filler particles can be simulated well by Bruggeman’s equation for spherical particles and by Kanari’s equation for flake particles. The effect on the thermal conductivity of any residual voids can be taken into account in the analysis by the additional application of Bruggeman’s or Kanari’s equations with the appropriate shape factor. The linear thermal expansion coefficient of the ICAs was analyzed using Schapery’s scheme. The thermal expansion coefficients of ICAs with 40–50 vol.% of filler particles range between Schapery’s upper and lower limits. As the particle size of the filler decreases, the thermal expansion coefficient starts to approach the lower limit at a lowr volume fraction of the filler particles. The transition behavior of the thermal expansion coefficient is related to the characteristics of the network structure formed by percolating the filler particles.     

Controlling the Thermoelectric Properties of Organometallic Coordination Polymers via Ligand Design

Organometallic coordination polymers (OMCPs) are a promising class of thermoelectric materials with high electrical conductivities and thermal resistivities. The design criteria for these materials, however, remain elusive and so far material modifications have been focused primarily on the nature of the metal cation to tune the thermoelectric properties. Herein, an alternative approach is described by synthesizing new organic ligands for OMCPs, allowing modulation of the thermoelectric properties of the novel OMCP materials over several orders of magnitude, as well as controlling the polarity of the Seebeck coefficient. Extensive material purification combined with spectroscopy experiments and calculations furthermore reveal the charge‐neutral character of the polymer backbones. In the absence of counter‐cations, the OMCP backbones are composed of air‐stable, ligand‐centered radicals. The findings open up new synthetic possibilities for OMCPs by removing structural constraints and putting significant emphasis on the molecular structure of the organic ligands in OMCP materials to tune their thermoelectric properties.     

高热负荷激光介质热应力场的分析与优化研究

研究了高热负荷板状激光介质在抽运面采用常规冷却技术时,换热面积较小的上下侧面的换热强度对激光介质最高温度及最大应力的影响情况,并对热应力场进行了优化研究。结果表明,任意抽运功率下,介质的最高温度及最大应力均随侧面换热系数的变化而变化,并存在最优换热系数。与侧面采用常规冷却手段时相比,采用最优换热系数时介质的最大应力降幅高达36%。另外,对介质上下侧面进行温度控制,也可达到与控制换热系数相同的效果。     

高膨胀系数玻璃-陶瓷复合材料的性能研究

选用具有良好介电性能和膨胀性能的硼硅酸盐(SiO2-BaO-B2O3-Al2O3)和石英,采用固相法合成了一系列具有高热膨胀系数的玻璃-陶瓷复合材料,并对这些复合材料进行了XRD、SEM分析,及其热、力、电性能的测试。结果表明:所制复合材料的热膨胀系数和弯曲强度随着石英含量的增加而增大,其相对介电常数则随之减小。石英质量分数为40%的复合材料在980℃烧结时,析出了大量的方石英相,复合材料的热膨胀系数增大。最终制备的复合材料具有高的热膨胀系数[(10.3～25.5)×10-6/℃]、较高的弯曲强度(146MPa)、较低的相对介电常数(5.6～6.4)及介电损耗(0.10%～0.30%)。     

Examination of natural convection plumes from partially heated PCB plates and estimation of the heat transfer coefficients

Accurate values of convection heat transfer coefficients are required for the simulation of the thermal characteristics of printed circuit boards. This paper presents the results of experiments carried out using a Schlieren apparatus to examine the natural convection plumes from a horizontally positioned partially heated printed circuit board plate. It has been demonstrated that for a board with a centrally positioned resistor, the convection coefficients may be approximated to two values, one over the heated resistor area and another over the rest of the plate. These observations were then used in an optimization process to estimate the convection coefficients from such surfaces. Values of 4 W/m²K and 13.5 W/m²K were obtained for the resistor and the adjoining unheated sections, respectively. It is concluded that it is not generally satisfactory to assume a uniform value for convection coefficients during thermal simulation of electronic structures. However, a simplifying assumption of two values for convection coefficient appears to be acceptable; the lower value applying in the region of convection plumes and the higher value elsewhere.     

实时测量聚合物薄膜的玻璃化转变温度

根据热膨胀原理,利用基于衰减全反射原理建立的CCD薄膜实时监控系统,提出了测量聚合物材料的玻璃化转变温度(Tg)的方法.用监测系统实时监测聚合物薄膜在升温过程中薄膜折射率及厚度的变化.实验结果发现薄膜的热膨胀系数β和温度相关的折射率dn/dT在升温过程中发生了突变,这个突变点所对应的温度就是聚合物薄膜的Tg.以掺杂型聚合物DR1/PMMA薄膜为例,给出了测量过程和实验结果,并检验了用该方法测量聚合物薄膜Tg的重复性和可靠性.     

基于条纹跟踪实现热膨胀系数的高精度自动测量

将改进的菲涅耳双镜干涉装置用于材料在273～373 K温度范围内的热膨胀系数的测量,分析了把常用的热膨胀系数测量方法用于更高精度的测量时存在的不足.新方法利用干涉条纹图像实时采集与处理系统,对由材料受热膨胀时引起的干涉条纹的移动量进行跟踪测量,并利用最小二乘法对导出的材料热膨胀量与干涉条纹移动所掠过的CCD像元个数间的线性关系进行曲线拟合,从而对材料的热膨胀系数进行计算.实验结果表明,新的测量方法是可行的,测量结果与文献推荐值吻合得很好,绝对热膨胀量可测到0.1μm,相对不确定度为1.1%.     

Thermoelectric Properties of Co<Subscript>4</Subscript>Sb<Subscript>12</Subscript> Skutterudite Materials with Partial In Filling and Excess In Additions

The properties of Co₄Sb₁₂ with various In additions were studied. X-ray diffraction revealed the presence of the pure δ-phase of In_0.16Co₄Sb₁₂, whereas impurity phases (γ-CoSb₂ and InSb) appeared for x = 0.25, 0.40, 0.80, and 1.20. The homogeneity and morphology of the samples were observed by Seebeck microprobe and scanning electron microscopy, respectively. All the quenched ingots from which the studied samples were cut were inhomogeneous in the axial direction. The temperature dependence of the Seebeck coefficient (S), electrical conductivity (σ), and thermal conductivity (κ) was measured from room temperature up to 673 K. The Seebeck coefficient of all In-added Co₄Sb₁₂ materials was negative. When the filler concentration increases, the Seebeck coefficient decreases. The samples with In additions above the filling limit (x = 0.22) show an even lower Seebeck coefficient due to the formation of secondary phases: InSb and CoSb₂. The temperature variation of the electrical conductivity is semiconductor-like. The thermal conductivity of all the samples decreases with temperature. The central region of the In_0.4Co₄Sb₁₂ ingot shows the lowest thermal conductivity, probably due to the combined effect of (a) rattling due to maximum filling and (b) the presence of a small amount of fine-dispersed secondary phases at the grain boundaries. Thus, regardless of the non-single-phase morphology, a promising ZT (S ² σT/κ) value of 0.96 at 673 K has been obtained with an In addition above the filling limit.     

绿宝石激光晶体的主折射率及其温度系数的精确测量

报道了用自准直法在 0 4 88μm ,0 5 3975 μm ,1 0 795 μm和 1 34 14μm激光波长上测量了含Cr3 + 离子浓度为 1 0 1at . %的Cr3 + ∶Be3 Al2 Si6O18晶体的主折射率及其温度系数 ,得到了该晶体的Sellmeier方程 ,用此结果反算了该晶体在上述 4种波长下不同温度的折射率 ,误差小于 1 0 9× 10 -4 ,最后对测量误差进行了讨论。     

Finite element analysis of miniature thermoelectric coolers with high cooling performance and short response time

The miniature thermoelectric cooler (TEC) is a promising device for microelectronics applications with high cooling performance and short response time. In this paper, a comprehensive numerical analysis focusing on the cooling performance and response time of the TEC is performed by finite element methods (FEMs). The effects of load current, geometric size, ratio of length to cross-sectional area and substrate's thermal resistance on the performance of the TEC are studied. The results show that the performance of TECs has been improved by reducing the TEC's size and ratio of length to cross-sectional area, resulting in a maximum cooling temperature difference of 88 °C, a cooling power density of 1000 W cm⁻² and a short response time on the order of milliseconds. Furthermore, the substrate, which hinders the circulation of heat between the TEC and the atmosphere, also has a significant influence on the performance of the TEC.     

卤化铊晶体折射率温度系数的理论研究

研究了卤化铊晶体的折射率温度效应,结果表明晶格常数变化引起的带宽变化对这类晶体折射率温度系数的影响不可忽视,且是负贡献。理论算得的折射率温度系数与实验结果一致。     

红外加热中物料内部温度场的数值分析

对红外加热技术中物料内部出现温度峰值的条件及响影因素作了探讨,采用了导热与辐射非稳态复合换热的一维模型,对红外加热均匀物性的干物料内温度场作了数值计算。结果表明,物料内部出现温度峰值的主要原因是辐射,并且只有在下列条件同时满足时物料内部才可能出现峰值;(1)表面存在投射辐射;(2)物料表面的透射率不等于零;(3)物料为半透明物料;(4)物料加热表面受到对流冷却,并讨论了物料的吸收系数,折射率,导热系数,换热系数,物料表面辐射特性对温度场的影响。     

光存储用偶氮镍螯合物染料的光学与热学性质研究

分别对三种以4-甲基噻唑、苯并噻唑和6-甲基苯并噻唑作为重氮组份,以3-二乙氨基苯酚作为偶合组份的偶氮染料的镍螯合物的光谱、热学性质和薄膜的光学常数(复折射率N=n ik)及光存储性能进行了研究.结果表明,以4-甲基噻唑作为重氮组份的偶氮镍螯合物在激光工作波长650 nm处具有较高的折射率指数(n=2.46)和较小的消光系数(k=0.18),在330℃左右分解,而且分解曲线陡峭.光盘静态测试仪的测试结果表明该染料薄膜在较低的写入功率和较窄的脉冲下,可以获得大的反射率对比度.该染料有望作为高密度可录光盘(DVD-R)的记录介质.     

A Promising Radiation Thermal Protection Coating Based on Lamellar Porous Ca-Cr co-Doped Y3NbO7 Ceramic

Dissipation of heat efficiently from a hot object via radiation while minimizing the inward heat conduction is the key requirement of radiation thermal protection. In this study, a Ca-Cr co-doped Y₃NbO₇ coating with lamellar porous structure is fabricated, which shows an ultra-low thermal conductivity (<0.7 W m⁻¹ K⁻¹) and near-unity emissivity (>0.9) across a broad wavelength range of ≈1–24 µm. This record high emissivity to thermal conductivity ratio (≈1.3) is experimentally and theoretically revealed from a multi-scale perspective. The diffusoin-mediated thermal conduction feature of niobates combined with lamellar porous structure of the coating reduces its thermal conductivity to an impressive 0.5 W m⁻¹ K⁻¹ at 25 °C, surpassing the theoretical amorphous limitation of 0.72 W m⁻¹ K⁻¹. Experiments and FDTD calculation results demonstrate that the intrinsic emissivity dips at shallow extinction wavelengths (1 and 8 µm) and strong phonon-polariton resonances wavelengths (>13 µm) can be effectively compensated by the multiple scattering/absorption and gradual modulation of conical shape/effective refractive index induced by surface micro-protrusion structures, respectively. Furthermore, the coating exhibits robust mechanical and thermal stability with a high bonding strength (18.3 MPa) and thermal expansion coefficient (≈11 × 10⁻⁶ K⁻¹ at 1200 °C) comparable to YSZ, showing great potential in the radiation thermal protection field.     

Thermal Conductivity of HfTe5: A Critical Revisit

Hafnium pentatelluride (HfTe₅) has attracted extensive interest due to its exotic electronic, optical, and thermal properties. As a highly anisotropic crystal (layered structure with in‐plane chains), it has highly anisotropic electrical‐transport properties, but the anisotropy of its thermal‐transport properties has not been established. Here, accurate experimental measurements and theoretical calculations are combined to resolve this issue. Time‐domain thermoreflectance measurements find a highly anisotropic thermal conductivity, 28:1:8, with values of 11.3 ± 2.2, 0.41 ± 0.04, and 3.2 ± 2.0 W m^-1 K^-1 along the in‐plane a‐axis, through‐plane b‐axis, and in‐plane c‐axis, respectively. This anisotropy is even larger than what was recently established for ZrTe₅ (12:1:6), but the individual values are somewhat higher, even though Zr has a smaller atomic mass than Hf. Density‐functional‐theory calculations predict thermal conductivities in good agreement with the experimental data, provide comprehensive insights into the results, and reveal the origin of the apparent anomaly of the relative thermal conductivities of the two pentatellurides. These results establish that HfTe₅ and ZrTe₅, and by implication their alloys, have highly anisotropic and ultralow through‐plane thermal conductivities, which can provide guidance for the design of materials for new directional‐heat‐management applications and potentially other thermal functionalities.