共查询到16条相似文献,搜索用时 234 毫秒
1.
含氢非晶硅薄膜经过快速热退火处理后,我们用拉曼散射和X-射线衍射技术对样品进行分析.我们的实验结果表明:在非晶硅薄膜中形成的纳米硅晶粒的大小随着热退火过程中升温快慢而变化.在升温过程中,当单位时间内温度变化量较大时(~100℃/s),则所形成纳米硅粒较小(~1.6~15nm);若单位时间内温度变化量较低(~1℃/s),则纳米硅粒较大(~23~46nm)。根据分形生长理论和计算机模拟,我们讨论了升温快慢与所形成的纳米硅颗粒大小的关系. 相似文献
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报道了一种从氢化非晶硅薄膜中生长纳米硅粒的方法.氢化非晶硅薄膜经过不同条件的热退火处理后,用拉曼散射和X射线衍射技术对样品进行了分析.实验结果表明:在快速升温条件下所形成的nc-Si在薄膜中的分布是随机均匀的,直径在1.6~15 nm范围内,硅粒大小随退火过程中升温快慢而变化. 相似文献
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报道了氢化非晶硅薄膜在600~620℃温度下快速退火10 s可以形成纳米晶硅,其拉曼散射表明,所形成的纳米晶硅在薄膜中的分布是随机的,其直径在1.6~15 nm内.根据晶体生长理论和计算机模拟,讨论了升温快慢与所形成纳米硅颗粒大小之间的关系,并且在强光照射下观察了纳米晶硅在薄膜中的结晶和生长情况.经退火形成的nc-Si可见光辐射较弱,不能检测到它们的光致发光,但用氢氟酸腐蚀钝化后则可检测到较强的红PL,并且钝化后的nc-Si在空气中暴露一定时间后,其辐射光波长产生了蓝移.就表面钝化和量子限制对可见光辐射的重要性作了讨论. 相似文献
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《电子科技文摘》2006,(10)
0626019阳极氧化中烧损行为及防止〔刊,中〕/王平//西华大学学报(自然科学版).—2006,25(4).—41-43(G)0626020利用热退火法从非晶硅薄膜中生长纳米硅粒〔刊,中〕/薛清//量子电子学报.—2006,23(4).—565-568(L)报道了一种从氢化非晶硅薄膜中生长纳米硅粒的方法。氢化非晶硅薄膜经过不同条件的热退火处理后,用拉曼散射和X射线衍射技术对样品进行了分析。实验结果表明:在快速升温条件下所形成的nc-Si在薄膜中的分布是随机均匀的,直径在1.6~15nm范围内,硅粒大小随退火过程中升温快慢而变化。参70626021脉冲电沉积Ni-W合金镀层的摩擦磨损性… 相似文献
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报道了氢化非晶硅薄膜在600~620℃温度下快速退火10s可以形成纳米晶硅,其喇曼散射表明,在所形成的纳米晶硅在薄膜中分布是随机的,其直径在1.6~15nm以内.并且在强光照射下观察了纳米晶硅在薄膜中的结晶和生长情况. 相似文献
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采用PECVD技术在P型硅衬底上制备了a-SiOx:H/a-SiOy:H多层薄膜,利用AES和TEM技术研究了这种薄膜微结构的退火行为.结果表明:a-SiOx:H/a-SiOy:H多层薄膜经退火处理形成nc-Si/SiO2多层量子点复合膜,膜层具有清晰完整的结构界面.纳米硅嵌埋颗粒呈多晶结构,颗粒大小随退火温度升高而增大.在一定的实验条件下,样品在650℃下退火可形成尺寸大小合适的纳米硅颗粒.初步分析了这种多层复合膜形成的机理. 相似文献
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采用 PECVD技术在 P型硅衬底上制备了 a- Si Ox∶ H/a- Si Oy∶ H多层薄膜 ,利用 AES和 TEM技术研究了这种薄膜微结构的退火行为 .结果表明 :a- Si Ox∶ H/a- Si Oy∶ H多层薄膜经退火处理形成 nc- Si/Si O2 多层量子点复合膜 ,膜层具有清晰完整的结构界面 .纳米硅嵌埋颗粒呈多晶结构 ,颗粒大小随退火温度升高而增大 .在一定的实验条件下 ,样品在 650℃下退火可形成尺寸大小合适的纳米硅颗粒 .初步分析了这种多层复合膜形成的机理 相似文献
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SiC/SiO_2镶嵌结构薄膜光致发光特性研究 总被引:2,自引:0,他引:2
采用 SiC/SiO_2复合靶,用射频磁控共溅射技术和高温退火的方法制备了 SiC/SiO_2纳米镶嵌结构复合薄膜,并应用傅里叶红外吸收(FTIR),X 射线衍射(XRD),扫描电镜(SEM)和光致发光(PL)实验分析了薄膜的结构、表面形貌以及光致发光性能。结果表明,样品经高温退火后在 SiO_2基质中有 SiC 纳米颗粒形成。以 280 nm 波长光激发样品薄膜表面,显示出较强的 365 nm 的紫外光发射以及 458 nm 和 490 nm 处的蓝光发射,其发光强度随退火温度从 800℃升高至 1 050℃而增强。其发光归结为薄膜中与 Si-O 相关的缺陷形成的发光中心。 相似文献
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Xue Qing 《半导体光子学与技术》2005,11(3)
A method to control the size of nanoscale silicon grown in thermally annealed hydrogenated amorphous silicon (a-Si : H) films is reported. Using the characterizing techniques of micro-Raman scattering,X-ray diffraction and computer simulation, it is found that the sizes of the formed silicon particles change with the temperature rising rate in thermally annealing the a-Si : H films. When the a-Si: H films have been annealed with high rising rate( ~ 100 C/s), the sizes of nanoscale silicon particles are in the range of 1.6~ 15nm. On the other hand, if the a-Si: H films have been annealed with low temperature rising rate(~1 C/s),the sizes of nanoscale silicon particles are in the range of 23~46 nm. Based on the theory of crystal nucleation and growth, the effect of temperature rising rate on the sizes of the formed silicon particles is discussed. Under high power laser irradiation, in situ nanocrystallization and subsequent nc-Si clusters are small enough for visible light emission, authors have not detected any visible photoluminescence(PL) from these nc-Si clusters before surface passivation. After electrochemical oxidization in hydrofluoric acid, however, intense red PL has been detected. Cyclic hydrofluoric oxidization and air exposure can cause subsequent blue shift in the red emission. The importance of surface passivation and quantum confinement in the visible emissions has been discussed. 相似文献
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XUE Qing 《半导体光子学与技术》2005,11(3):174-178
A method to control the si ze of nanoscale silicon grown in thermally annealed hydrogenated amorphous silico n (a-Si∶H) films is reported. Using the characterizing techniques of micro-Ra man scattering, X-ray diffraction and computer simulation, it is found that the sizes of the formed silicon particles change with the temperature rising rate i n thermally annealing the a-Si∶H films. When the a-Si∶H films have been anne aled with high rising rate( ~100 ℃/s), the sizes of nanoscale silicon particle s are in the range of 1.6~15 nm. On the other hand, if the a-Si∶H films have been annealed with low temperature rising rate(~1 ℃/s), the sizes of nanoscale silicon particles are in the range of 23~46 nm. Based on the theory of crystal nucleation and growth, the effect of temperature rising rate on the sizes of th e formed silicon particles is discussed. Under high power laser irradiation, in situ nanocrystallization and subsequent nc-Si clusters are small enough for vis ible light emission, authors have not detected any visible photoluminescence(PL) from these nc-Si clusters before surface passivation. After electrochemical ox idization in hydrofluoric acid, however, intense red PL has been detected. Cycli c hydrofluoric oxidization and air exposure can cause subsequent blue shift in t he red emission. The importance of surface passivation and quantum confinement i n the visible emissions has been discussed. 相似文献
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低温高速率沉积非晶硅薄膜及太阳电池 总被引:1,自引:0,他引:1
采用射频等离子体增强化学气相沉积(RF-PECVD)技术,保持沉积温度在125℃制备非晶硅薄膜材料及太阳电池。在85 Pa的低压下以及400~667 Pa的高压下,改变Si H4浓度和辉光功率等沉积参数,对本征a-Si材料的性能进行优化。结果表明,在高压下,合适的Si H4浓度和压力功率比可以使a-Si材料的光电特性得到优化,并且薄膜的沉积速率得到一定程度的提高。采用低压低速和高压高速的沉积条件,在125℃的低温条件下制备出效率为6.7%的单结a-Si电池,高压下本征层a-Si材料的沉积速率由0.06~0.08 nm/s提高到0.17~0.19 nm/s。 相似文献
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Low resistivity layers have been formed at low process temperatures, by high dose Co+ ion implantation in to hydrogenated amorphous silicon (a-Si:H) and amorphous silicon carbide (a-SiC:H). The lowest resistivities,
of the order of 10 ohms/Sq, have been observed for the carbon-free films (a-Si:H) and can be obtained at annealing temperatures
of <250°C. Schottky barrier contacts to the a-Si:H films exhibit near ideal behavior with low leakage currents, of the order
10−9 A·cm−2. The electrical properties of the amorphous films are assessed as a function of ion dose, dose rate and annealing conditions,
with a view to optimizing these parameters. 相似文献
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快速光热退火法制备多晶硅薄膜的研究 总被引:5,自引:1,他引:4
为了制备应用于太阳电池的优质多晶硅薄膜,研究了非晶硅薄膜的快速光热退火技术。先利用 PECVD 设备沉积非晶硅薄膜,然后放入快速光热退火炉中进行退火。退火前后的薄膜利用 X 射线衍射仪(XRD)和扫描电子显微镜(SEM)测试其晶体结构及表面形貌,用电导率设备测试其暗电导率。研究表明退火温度、退火时间对非晶硅薄膜的晶化都有很大的影响,光热退火前先用常规高温炉预热有助于增大多晶硅薄膜的晶粒尺寸和暗电导率。 相似文献