溅射功率对TaN薄膜电阻电性能的影响

本文利用直流反应磁控溅射技术,通过调节溅射功率于200℃、3％的氮分压条件在Al2O3基片上沉积了一系列TaN薄膜,并使用光刻工艺制备出相应的TaN薄膜电阻,研究了溅射功率对TaN薄膜电阻率、电阻温度系数（TCR）和功率容量的影响。实验结果表明：当溅射功率从200W增大到1000W,TaN薄膜电阻率逐渐减小,TCR绝对值从几百ppm／℃降为几十ppm／℃,功率容量呈现逐渐增大趋势。     

氮化钽薄膜稳定性的研究

氮化钽薄膜作为混合集成电路重要的电阻材料广泛受到人们的重视和应用。我们采用直流平面磁控反应溅射工艺制得氮化钽薄膜,实验研究了溅射过程中氮分压P_(N_2)与沉积所得的含氮钽薄膜的结晶相结构和薄膜电阻率ρ、电阻温度系数TCR之间的关系。发现     

溅射非晶态薄膜磁性的控制

微电子技术的迅速发展要求电子元件薄膜化,从而促进了磁性薄膜的发展.为了达到控制溅射非晶态薄膜磁性的目的,从溅射非晶态薄膜的组成成分、溅射工艺参数、基体材料及温度、膜层厚度和镀后热处理工艺等几方面论述了影响非晶态溅射薄膜磁性的因素,结果表明,薄膜组成、膜厚、基材、溅射工艺及镀后热处理对溅射非晶态薄膜的磁性有较大的影响,应根据不同磁性要求加以控制.     

Cr-Si-Ni-N电阻薄膜的晶化与氧化特性

在PN2／PAr2分压比分别为0％，2．5％，5％，10％的溅射气氧化中制备了不同氮含量的Cr-Si-Ni-N薄膜，并研究了薄膜在热处理过程中的晶化，氧化行为以及电性能变化。结果表明，非晶Cr-Si-Ni-N薄膜在加热过程中，将析出晶化相CrSi2，随薄膜中氮含量增加，晶化相的形核与长大减缓，然而，薄膜的抗氧化能力得到提高。与低氮含量Cr-Si-Ni-N薄膜相比，高氮含量Cr-Si-Ni-N薄膜的电阻值在热处理过程中变化较小，欲获得较小电阻温度系数（TCR）需要更高的退火温度。     

用于微测辐射热计的氧化钒薄膜制备

采用射频(RF)反应溅射法,在微结构衬底上制备氧化钒薄膜,研究了氧气压、衬底温度、退火条件及薄膜厚度对薄膜电阻及电阻温度系数(TCR)的影响.在氮气保护下,采用常规退火和快速升降温退火对薄膜进行热处理.结果表明:氧分压、退火条件和薄膜厚度对电阻温度系数影响较大,需综合考虑;衬底温度对薄膜电阻的影响较大,但对电阻温度系数的影响较小;与常规退火方法相比,采用快速升降温退火有利于薄膜电阻温度系数的提高;通过优化工艺参数,制得的薄膜电阻温度系数可达(-4%/℃)左右,满足微测辐射热计的要求.     

反应磁控溅射制备氮化钽扩散阻挡层的研究

采用反应磁控溅射在硅衬底上制备了TaN薄膜,研究了氮分压、溅射功率及衬底温度对薄膜晶体结构、表面形貌和电学性能的影响。结果表明,晶体结构随工艺参数的改变发生变化,GIXRD图谱衍射峰强度随溅射功率和衬底温度的增加而增强,氮气分压的增加使择优取向向(111)晶面偏移;TaN薄膜的表面形貌与溅射功率和氮气分压密切相关,与衬底温度的关系不大,其粗糙度随溅射功率的增加而增大,随氮气分压的增加而减小;TaN薄膜的方块电阻随溅射功率的增加逐渐减小,随氮气分压的增加逐渐增大,温度对方块电阻的影响不大;对Cu/TaN/Si互联体系热处理后发现TaN薄膜具有优异的阻挡性能,在600℃时依然可有效阻止Cu向Si的扩散。     

磁控溅射与硫化热处理制备β-In_2S_3薄膜及光电性能

采用磁控溅射预制In薄膜和硫化热处理工艺制备了性能优良的β-In2S3薄膜。应用XRD、拉曼光谱仪及UV-Vis测试仪对薄膜的品质进行了分析,并测试了薄膜的光学与电学性能。结果表明,溅射功率和硫化热处理温度是影响薄膜品质的主要因素,比较合适的溅射功率为100~140 W,硫化热处理温度为450℃,过高的热处理温度容易在薄膜中形成缺陷,在薄膜生长过程中容易产生In5S4杂相,相比之下,溅射气体压强对薄膜品质的影响较小,溅射气体压强可选择在0.4~0.6Pa。光学与电学性能测试结果指出,得到的β-In2S3薄膜具有良好的光谱透过率,属n型半导体,可用于太阳能电池缓冲层。     

VO2镀膜工艺与薄膜导电特性的研究

利用射频磁控溅射方法制备了VO2薄膜,通过正交试验设计研究镀膜工艺因素对薄膜导电特性的影响规律.试验结果表明,影响薄膜导电性能的主要因素是热处理温度,其次是衬底的温度,溅射功率和工作压强对薄膜导电性能的影响很小.X射线衍射结果表明,制备的VO2薄膜为非晶体结构,480℃真空热处理后,VO2薄膜结晶良好.由此得到制备VO2薄膜的最优化工艺为:衬底的温度400℃、热处理温度480℃、溅射频率120W和工作气压1.5Pa.     

用于在片测试系统整体校准的电阻标准件

为解决在片测试系统中1～1000Ω电阻无法进行整体校准问题,通过采用GaAs材料作为衬底,利用半导体工艺中薄膜溅射法,使用轰击离子Ar~+与靶材作用形成反应层,激发出的溅射原子NiCr打至GaAs表面,制作薄膜电阻。采用方块电阻为50Ω/块,通过调节长与宽的比值,研制出1～1 000Ω电阻标准件。为消除电阻测量过程中芯片内部回路引线的影响,研制出相对应的短路器。通过组建具有温度控制系统的定标装置,在-40～100℃温度下对标准件进行定标,定标结果表明电阻标准件的阻值与温度具有良好的线性关系,短期重复性RSD优于0.05%,年稳定性RSD优于0.1%,可以有效解决现有在片测试系统低值电阻参数的整体校准问题。     

用于微测辐射热探测器的纳米VO2薄膜

用离子束溅射和后退火工艺制备了一种适用于微测辐射热探测器热敏材料的新型纳米结构二氧化钒(VO2)薄膜材料,薄膜具有平均粒度8 nm,在半导体相区具有电阻温度系数(TCR)为-7%/K,性能高于传统的VO2材料(平均粒度为1-2μm,在半导体相区具有TCR约为-2%/K).基于纳米结构的VO2薄膜材料的器件比基于传统的VO2薄膜材料具有更高的性能,而两者的噪声基本相当.     

新型AgInSbTe相变薄膜的结晶活化能研究

利用磁控溅射法制备了新型AgInSbTe相变薄膜, 热处理前后的X射线衍射(XRD)表明了薄膜在热作用下从非晶态转变到晶态. 通过非晶态薄膜粉末的示差扫描量热(DSC)实验测定了不同升 温速率条件下的结晶峰温度, 计算了粉末的摩尔结晶活化能、原子激活能和频率因子. 从结晶活化能E可以判断出新型AgInSbTe相变薄膜具有较高的结晶速度, 可以用于高速可擦重 写相变光盘.     

Electrical characterisation of AlCuMo thin films prepared by DC magnetron sputtering

Thin film resistors have been manufactured to evaluate the electrical performance characteristics of AlCuMo thin films. The films were prepared on Al2O3 substrates at room temperature as a function of Mo concentration by DC magnetron sputtering and were then annealed at various temperatures in air and N2 atmospheres. The effect of annealing temperature on the electrical properties of the films was systematically investigated. Increase in Mo content produced a decrease in temperature coefficient of resistance (TCR), an increase in resistivity (r) and an improvement in long term stability (DV/V) of the films. TCR varied from negative to positive and further improvements in resistance stability of the films were also achieved through increasing annealing temperature in both air and N2 atmospheres. A temperature region is proposed where `near zero? TCR (ppm/8C) and long term stability of better than 0.2% can be realised.     

高温ITO薄膜应变计制备及压阻性能EI北大核心CSCD

高温薄膜应变计被广泛应用于极端条件热端构件的应变测量。ITO薄膜应变计通常能够应用于1000℃以上的应变测量,为了研究ITO薄膜的显微结构、XPS光谱、阻温特性及压阻响应,采用磁控溅射在陶瓷基底上制备了ITO薄膜应变计,并在高温纯N2中热处理ITO薄膜。结果表明,其电阻温度系数稳定在-750×10-6℃-1,在1200℃下测试其应变特性,测得电阻漂移率为0.0018 h-1,应变因子为16。ITO薄膜在高温下具有稳定的电阻温度系数和低漂移率,为高温端部件应变的测量提供了可能。     

聚丙烯腈与二醋酸纤维素共混膜的研制

采用扫描电子显微镜、红外光谱仪、示差扫描量热仪、超滤装置等方法研究了成膜工艺条件与膜结构性能的关系．结果表明，膜的结构与性能是共混体系组成、总固浓度、成膜温度、预蒸发时间及温度、凝固浴组成及温度和热处理温度等诸因素的函数，从而为根据实际需要来制备一定结构性能的膜提供了理论依据．     

Influence of the nitrogen partial pressure on the properties of d.c.-sputtered titanium and titanium nitride films

The properties of titanium and titanium nitride films deposited onto biased substrates in a d.c. sputtering system were studied as a function of the partial nitrogen pressure. The deposition rate was deduced from film thickness measurements. The film composition was determined by Rutherford backscattering analysis and the structure was studied using X-ray diffraction. The resistivity was measured by the four-probe method and the temperature coefficient of resistivity (TCR) was determined in the temperature range from ?196 to 25 °C.Around a critical nitrogen pressure p_c of 4 × 10^-2 Pa the deposition rate decreases rapidly, the film structure changes from h.c.p. titanium to nearly stoichiometric f.c.c. TiN. At the same pressure, the film resistivity and the TCR present minimum values.A general sputtering model which takes into account the gettering action of the deposited material is proposed. This model allows the calculation of the surface coverage of the target by the reactive gas or the metallic compound and the determination of the deposition rate as a function of the reactive partial pressure. A good agreement is found with the deposition rates measured experimentally.     

Kinetic studies on hot-stretching of polyacrylonitrile-based carbon fibers by using internal resistance heating Part 1 Changes in resistivity and strain

The effects of the stretching stress applied during high temperature heat-treatment of polyacrylonitrile(PAN)-based carbon fibers on the structural development and the properties of the fibers were investigated kinetically using internal resistance heating. The temperature-time superposition could be applied to the changes in structural parameters, resistivity and tensile strength during heat-treatment using the same shift factors. The application of the stretching stress effectively reduced the fractions of slower rate processes and the activation energy of the structural development in the temperature region below about 1800°C, and also influenced on the structural features. The longitudinal strain induced during heat-treatment increased in proportion to the logarithmic treatment time, showing different kinetics from that of the structural development.     

ZrOxNy薄膜的制备与低温电输运特性研究

针对于测温应用中对低温温度计的性能需求,为了获得灵敏度高和测温区间宽的氮氧化锆(ZrOxNy)电阻温度传感薄膜,系统研究了溅射气氛中O2流量对ZrOxNy薄膜结构和低温电输运行为的影响.采用射频反应磁控溅射工艺,通过精细调整溅射沉积过程中的O2流量在Al2O3基片上生长了系列ZrOxNy薄膜,测定了薄膜的晶体结构、形貌...     

Investigation on powder metallurgy Cr–Si–Ta–Al alloy target for high-resistance thin film resistors with low temperature coefficient of resistance

The sputtering target for high-resistance thin film resistors plays a decisive role in temperature coefficient of resistance (TCR). Silicon-rich chromium (Cr)–silicon (Si) target was designed and smelted for high-resistance thin film resistors with low TCR. Valve metal tantalum (Ta) and aluminum (Al) were introduced to the Cr–Si target to improve the performance of the target prepared. The measures for grain refining in smelting Cr–Si–Ta–Al target were taken to improve the performance of the prepared target. The mechanism and role of grain refinement were discussed in the paper. The phase structure of the prepared target was detected by X-ray diffraction (XRD). Rate of temperature drop was studied to reduce the internal stress of alloy target and conquer the easy cracking disadvantage of silicon-rich target. The electrical properties of sputtered thin film resistors were tested to evaluate the performance of the prepared target indirectly.     

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Highest precision in short cycle time – highly sensitive thin fiim strain gauges produced in an industrial high‐rate‐sputtering system Commonly, sputtered strain gauges are already used for highly precise pressure sensors. By using special highly sensitive piezoresistive nanocomposites consisting of metal nanoparticles embedded in an insulating matrix made from diamond‐like carbon (DLC) the sensitivity to strain can be significantly increased. Essential parameters for the characterization of the thin films used as sensor layer are the strain sensitivity (described by the gauge factor) and the temperature coefficient of resistance (TCR). Conventionally used NiCr alloys have a gauge factor of approximately 2. By using metal‐DLC nanocomposite films a factor 5 to 10 higher strain sensitivity in combination with a TCR close to zero was reached on laboratory scale. At first, the highly sensitive films were produced by static deposition using a box coater which led to quite long process times. By using a dynamic deposition process in the same machine the throughput of samples was slightly increased. But for using these highly sensitive films on industrial scale much higher cost and process efficiency is necessary. Hence, the process was transferred to a highrate sputtering system. A 20 times higher throughput of samples was reached in combination with a higher strain sensitivity compared to the dynamic process in the box coater. The used high‐rate sputtering system is also commercially available with enlarged process chambers which enables for a further up‐scaling for efficiently industrial production.