A 4<Emphasis Type="Italic">H</Emphasis>-SiC<Emphasis Type="Italic">p-i-n</Emphasis> diode fabricated by a combination of sublimation epitaxy and CVD

The possibility of fabricating heavily doped (N _a ?N _d ≥ 1 × 10¹⁹ cm_?3) p⁺-4H-SiC layers on CVD-grown lightly doped n-4H-SiC layers by sublimation epitaxy has been demonstrated. It is shown that a Au/Pd/Ti/Pd contact, which combines a low specific contact resistance (～2 × 10^?5 Ω cm²) with high thermal stability (up to 700°C), is the optimal contact to p-4H-SiC. The p-n structures obtained are used to fabricate packaged diodes with a breakdown voltage of up to 1400 V.     

The effects of interface states on the capacitance and electroluminescence efficiency of InGaN/GaN light-emitting diodes

The capacitance-voltage characteristics and external quantum efficiency of electroluminescence in blue GaN light-emitting diodes (LEDs) with an InGaN quantum well have been investigated in the temperature range 77–300 K. The results obtained are interpreted taking into account the effect of the InGaN/GaN interface states of structural defects and impurities on the capacitance of the GaN LEDs. The nonlinearity of the C^?2(U) characteristics observed at low forward bias is attributed to an increase in the interface charge resulting from tunneling of free electrons and their trapping at the interface states. According to estimates, states with a density of about 3 × 10¹² cm^?2 are present at the interface. A recombination current in the interface region suppresses the injection of charge carriers into the quantum well and decreases the electroluminescence efficiency at high forward bias. Degradation of the optical power of the LEDs, accompanied by an increase in the measured capacitance, is attributed to an increase in the density of charged interface states and changes in their distribution in the band gap.     

Low-frequency noise in gallium nitride epitaxial layers with different degrees of order of mosaic structure

The correlation between the noise level 1/f and the degree of mosaic-structure order in gallium nitride epitaxial layers was studied for the first time. Samples with a doping level of N _d ?N _a ≈8×10¹⁶ cm^?3 and a relatively high degree of order were characterized by the Hooge parameter α≈1.5×10^?3. This value is unprecedently low for thin GaN epitaxial films. The Hooge parameter was significantly higher for samples with N _d ?N _a ≈1.1×10¹⁸ cm^?3 and a low degree of order despite the fact that α generally decreases with increasing doping level at the same degree of order. Thus, the degree of mosaic-structure order affects not only the optical and electrical characteristics but also the fluctuation parameters of GaN epitaxial layers.     

High-voltage (900 V) 4 <Emphasis Type="Italic">H</Emphasis>-SiC Schottky diodes with a boron-implanted guard <Emphasis Type="Italic">p-n</Emphasis> junction

High-voltage (900 V) 4H-SiC Schottky diodes terminated with a guard p-n junction were fabricated and studied. The guard p-n junction was formed by room-temperature boron implantation with subsequent high-temperature annealing. Due to transient enhanced boron diffusion during annealing, the depth of the guard p-n junction was equal to about 1.7 μm, which is larger by approximately 1 μm than the projected range of 11 B ions in 4H-SiC. The maximum reverse voltage of fabricated 4H-SiC Schottky diodes is found to be limited by avalanche breakdown of the planar p-n junction; the value of the breakdown voltage (910 V) is close to theoretical estimate in the case of the impurity concentration N = 2.5 × 10¹⁵ cm^?3 in the n-type layer, thickness of the n-type layer d = 12.5 μm, and depth of the p-n junction r _j = 1.7 μm. The on-state diode resistance (3.7 mΩ cm²) is controlled by the resistance of the epitaxial n-type layer. The recovery charge of about 1.3 nC is equal to the charge of majority charge carriers that are swept out of an epitaxial n-type layer under the effect of a reverse voltage.     

Determination of the charge transport mechanism in <Emphasis Type="Italic">p-n</Emphasis> junctions by analyzing temperature dependences of forward current-voltage characteristics

A method is suggested for determining the charge transport mechanism in p-n junctions by analyzing the temperature dependence of forward current-voltage characteristics at a low injection level. The method has been experimentally tested with Si:Au diodes, green GaP LEDs, and blue AlGaN/InGaN/GaN LEDS with a quantum well.     

Effect of Dislocation-related Deep Levels in Heteroepitaxial InGaAs/GaAs and GaAsSb/GaAs <Emphasis Type="Italic">p</Emphasis>–<Emphasis Type="Italic">i</Emphasis>–<Emphasis Type="Italic">n</Emphasis> Structures on the Relaxation time of Nonequilibrium Carriers

The results of an experimental study of the capacitance–voltage (C–V) characteristics and deep-level transient spectroscopy (DLTS) spectra of p⁺–p⁰–i–n⁰ homostructures based on undoped dislocationfree GaAs layers and InGaAs/GaAs and GaAsSb/GaAs heterostructures with homogeneous networks of misfit dislocations, all grown by liquid-phase epitaxy (LPE), are presented. Deep-level acceptor defects identified as HL2 and HL5 are found in the epitaxial p⁰ and n⁰ layers of the GaAs-based structure. The electron and hole dislocation-related deep levels, designated as, respectively, ED1 and HD3, are detected in InGaAs/GaAs and GaAsSb/GaAs heterostructures. The following hole trap parameters: thermal activation energies (E _t ), capture cross sections (σ _p ), and concentrations (N _t ) are calculated from the Arrhenius dependences to be E _t = 845 meV, σ _p = 1.33 × 10^–12 cm², N _t = 3.80 × 10¹⁴ cm^–3 for InGaAs/GaAs and E _t = 848 meV, σ _p = 2.73 × 10^–12 cm², N _t = 2.40 × 10¹⁴ cm^–3 for GaAsSb/GaAs heterostructures. The concentration relaxation times of nonequilibrium carriers are estimated for the case in which dislocation-related deep acceptor traps are involved in this process. These are 2 × 10^–10 s and 1.5 × 10^–10 s for, respectively, the InGaAs/GaAs and GaAsSb/GaAs heterostructures and 1.6 × 10^–6 s for the GaAs homostructures.     

The effect of damaging radiation (<Emphasis Type="Italic">p,e, γ</Emphasis>) on photovoltaic and tunneling GaAs and GaSb <Emphasis Type="Italic">p-n</Emphasis> junctions

The properties of multiple-junction solar cells depend on the properties of the constituent photovoltaic and tunneling p-n junctions. In this study, the properties of the space-charge region for photovoltaic and tunneling p-n junctions were examined using the dark current-voltage characteristics for two semiconductors: GaSb (a narrow-gap semiconductor) and GaAs (a wide-gap semiconductor). The effects of irradiation with protons (the energy of 6.78 MeV and the maximum fluence of 3 × 10¹² cm^?2), electrons (the energy of 1 MeV and the maximum fluence of 3 × 10¹⁶ cm^?2), and γ-ray photons (the energy of 1.17–1.33 MeV and the maximum dose of 17 Mrad) on the lifetime of charge carriers in the space-charge region of photovoltaic p-n junctions and on the peak current of connecting tunneling p-n junctions were studied. The coefficients of the damage for the inverse lifetime are determined for photovoltaic p-n junctions. The coefficients of equivalence between the used types of radiation are determined; these coefficients are found to be almost independent, on the order of magnitude, of the type and material of the p-n-junction (and nearly equal for photovoltaic GaAs p-n junctions and tunneling GaAs and GaSb p-n junctions).     

Electroreflectance spectra from multiple InGaN/GaN quantum wells in the nonuniform electric field of a <Emphasis Type="Italic">p–n</Emphasis> junction

A line at E = 2.77 eV (with a width of Γ = 88 meV) related to interband transitions in the region of multiple quantum wells in the active region is detected in the electroreflectance spectra of the GaN/InGaN/AlGaN heterostructure. As the modulation bias is reduced from 2.9 to 0.4 V, the above line is split into two lines with energies of E ₁ = 2.55 eV and E ₂ = 2.75 eV and widths of Γ₁ = 66 meV and Γ₂ = 74 meV, respectively. The smaller widths of separate lines indicate that these lines are caused by interband transitions in particular quantum wells within the active region. The difference between the interband transition energies E ₁ and E ₂ in identical quantum wells in the active region is related to the fact that the quantum wells are in an inhomogeneous electric field of the p–n junction. The magnitudes of the electric-field strengths in particular quantum wells in the active region of the heterostructure are estimated to be 1.6 and 2.2 MV/cm.     

Mechanism of dislocation-governed charge transport in schottky diodes based on gallium nitride

A mechanism of charge transport in Au-TiB _x -n-GaN Schottky diodes with a space charge region considerably exceeding the de Broglie wavelength in GaN is studied. Analysis of temperature dependences of current-voltage (I–V) characteristics of forward-biased Schottky barriers showed that, in the temperature range 80–380 K, the charge transport is performed by tunneling along dislocations intersecting the space charge region. Estimation of dislocation density ρ by the I–V characteristics, in accordance with a model of tunneling along the dislocation line, gives the value ρ ≈ 1.7 × 10⁷ cm^?2, which is close in magnitude to the dislocation density measured by X-ray diffractometry.     

Emission sensitization and mechanisms of electron-excitation migration in structures based on III-nitrides doped with rare-earth elements (Eu,Er, Sm)

The effect of doping with Eu, Er, and Sm rare-earth ions on the shape of the luminescence spectrum for heterostructures with GaN/In _x Ga_{1 ? x} N (0.1 < x < 0.4) quantum wells and from p-GaN〈Mg〉/n-GaN and p-AlGaN/n-GaN junctions is investigated. The results of measurements of the electroluminescence of these structures correlate with the previous data on photoluminescence and Mössbauer spectroscopy. It is shown that it is the GaN “yellow” (5000–6000 Å) band that plays the important role in the excitation of intracenter states in the structures with several GaN/InGaN quantum wells doped with Eu and Sm. In this case, Eu is most likely the sensitizer for Sm. Additional introduction of 3d metal (Fe⁵⁷) in p-GaN〈Mg〉/n-GaN:Eu results in the realization of intracenter transitions in Eu³⁺: ⁵ D ₀ → ⁷ F ₁ (6006 Å), ⁵ D ₀ → ⁷ F ₂ (6195 Å), ⁵ D ₀ → ⁷ F ₃ (6627 Å), and ⁵ D ₁ → ⁷ F ₄ (6327 Å) due to the occurrence of new, efficient channels of excitation transfer to intracenter states and in the effect of Fe on the local environment of rare-earth ions including due to the f–d hybridization enhancement.     

Dependence of the mechanism of current flow in the in-<Emphasis Type="Italic">n</Emphasis>-GaN alloyed ohmic contact on the majority carrier concentration

Based on the study of the temperature dependence of resistance of the In-n-GaN alloyed ohmic contacts, it is found that the mechanism of current flow in them substantially depends on the concentration N of uncompensated donors in GaN. At N = 5 × 10¹⁶ ? 1 × 10¹⁸ cm^?3, current mainly flows along the metallic shunts, and at N ? 8 × 10¹⁸ cm^?3 it flows by tunneling.     

Tunneling Current in Oppositely Connected Schottky Diodes Formed by Contacts between Degenerate <Emphasis Type="Italic">n</Emphasis>-GaN and a Metal

The nonlinear behavior of the I–V characteristics of symmetric contacts between a metal and degenerate n-GaN, which form oppositely connected Schottky diodes, is investigated at free-carrier densities from 1.5 × 10¹⁹ to 2.0 × 10²⁰ cm^–3 in GaN. It is demonstrated that, at an electron density of 2.0 × 10²⁰ cm^–3, the conductivity between metal (chromium) and GaN is implemented via electron tunneling and the resistivity of the Cr–GaN contact is 0.05 Ω mm. A method for determining the parameters of potential barriers from the I–V characteristics of symmetric opposite contacts is developed. The effect of pronounced nonuniformity of the current density and voltage distributions over the contact area at low contact resistivity is taken into account. The potential-barrier height for Cr–n⁺-GaN contacts is found to be 0.47 ± 0.04 eV.     

Kinetics and inhomogeneous carrier injection in InGaN nanolayers

The electrical and optical properties of light-emitting devices with an active region containing several layers of InGaN/GaN quantum dots (QDs) separated by GaN spacers are studied. It is shown that the overgrowth of the QD layer with an InGaN layer that has a reduced In content at higher temperatures raises the confinement energy of carriers in QDs. Furthermore, inhomogeneous carrier injection, predominantly into regions with higher confinement energy, is observed. The electrical and optical properties of p-n junctions and the effect of the inhomogeneities on these properties are studied in detail. It is shown that the shifts of photoluminescence and electroluminescence lines, which are observed when changing the experimental conditions, are related to these properties of the inhomogeneities in the p-n junction.     

Photoluminescence of electron-hole plasma in semi-insulating undoped GaAs

The dependence of the photoluminescence spectrum of electron-hole plasma in semi-insulating undoped GaAs on the concentration of the background carbon impurity N_C(3×10¹⁵ cm^?3≤N_C≤4×10¹⁶ cm^?3) is studied at 77 K. It is established that the density of the electron-hole plasma, which is equal to n _e?h ≈1.1×10¹⁶ cm^?3 in crystals with the lowest impurity concentration at an excitation intensity of 6×10²² photons/(cm² s), decreases considerably as the value of N_C increases in the range mentioned above. A decrease in the density of the electron-hole plasma with increasing N_C is attributed to the effect of fluctuations in the carbon concentration N_C, which give rise to a nonuniform distribution of interacting charge carriers and to localization of holes in the tails of the density of states of the valence band.     

Electron mobility in the inversion layers of fully depleted SOI films

The dependences of the electron mobility μ_eff in the inversion layers of fully depleted double–gate silicon-on-insulator (SOI) metal–oxide–semiconductor (MOS) transistors on the density N _e of induced charge carriers and temperature T are investigated at different states of the SOI film (inversion–accumulation) from the side of one of the gates. It is shown that at a high density of induced charge carriers of N _e > 6 × 10¹² cm^–2 the μeff(T) dependences allow the components of mobility μ_eff that are related to scattering at surface phonons and from the film/insulator surface roughness to be distinguished. The μ_eff(N _e ) dependences can be approximated by the power functions μ_eff(N _e) ∝ N _e ^?n . The exponents n in the dependences and the dominant mechanisms of scattering of electrons induced near the interface between the SOI film and buried oxide are determined for different N _e ranges and film states from the surface side.     

Effective electron mass in a Mn<Subscript>x</Subscript>Hg<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Te system

The reflection spectra of n-Mn_xHg_1?xTe single crystals and epitaxial layers were measured at 300 K. The effective electron mass was determined for the samples with x=0.06–0.10 and an electron concentration N>6×10¹⁶ cm^?3. The calculated values of effective electron mass are close to experimental values.     

Electrical properties of Si:H/<Emphasis Type="Italic">p</Emphasis>-Si structures fabricated by hydrogen implantation

Hydrogenated silicon (Si:H) layers and Si:H/p-Si heterostructures were produced by multiple-energy (3–24 keV) high-dose (5×10¹⁶–3×10¹⁷ cm^?2) hydrogen implantation into p-Si wafers. After implantation, current transport across the structures is controlled by the Poole-Frenkel mechanism, with the energy of the dominating emission center equal to E _c ?0.89 eV. The maximum photosensitivity is observed for structures implanted with 3.2×10¹⁷ cm^?2 of hydrogen and annealed in the temperature range of 250–300°C. The band gap of the Si:H layer E _g ≈2.4 eV, and the dielectric constant ?≈3.2. The density of states near the Fermi level is (1–2)×10¹⁷ cm^?3 eV^?1.     

Iodine Doping of CdTe and CdMgTe for Photovoltaic Applications

Iodine-doped CdTe and Cd_1?x Mg _x Te layers were grown by molecular beam epitaxy. Secondary ion mass spectrometry characterization was used to measure dopant concentration, while Hall measurement was used for determining carrier concentration. Photoluminescence intensity and time-resolved photoluminescence techniques were used for optical characterization. Maximum n-type carrier concentrations of 7.4 × 10¹⁸ cm^?3 for CdTe and 3 × 10¹⁷ cm^?3 for Cd_0.65Mg_0.35Te were achieved. Studies suggest that electrically active doping with iodine is limited with dopant concentration much above these values. Dopant activation of about 80% was observed in most of the CdTe samples. The estimated activation energy is about 6 meV for CdTe and the value for Cd_0.65Mg_0.35Te is about 58 meV. Iodine-doped samples exhibit long lifetimes with no evidence of photoluminescence degradation with doping as high as 2 × 10¹⁸ cm^?3, while indium shows substantial non-radiative recombination at carrier concentrations above 5 × 10¹⁶ cm^?3. Iodine was shown to be thermally stable in CdTe at temperatures up to 600°C. Results suggest iodine may be a preferred n-type dopant compared to indium in achieving heavily doped n-type CdTe.     

Raman and infrared spectroscopy of GaN nanocrystals grown by chloride-hydride vapor-phase epitaxy on oxidized silicon

Raman and infrared spectroscopy were applied to study nanocrystalline GaN films grown by chloride-hydride vapor-phase epitaxy on SiO₂/Si(111) substrates at T=520°C. It was ascertained that GaN nanocrystals are formed on the oxidized silicon surface at a rate of 10^?2 nm/s. It was shown that the peaks in the Raman spectra E₂(high)=566 cm^?1 and A₁(LO)=730 cm^?1 correspond to the elastically strained GaN wurtzite structure. It was detected that a peak related to E₁(TO)=558 cm^?1 arises in the infrared spectra, which shows that elastic stresses in the nanocrystals are insignificant.     

Structural and Electrical Properties of Ag/<Emphasis Type="Italic">n</Emphasis>-TiO<Subscript>2</Subscript>/<Emphasis Type="Italic">p</Emphasis>-Si/Al Heterostructure Fabricated by Pulsed Laser Deposition Technique

We have investigated the structural and electrical characteristics of the Ag/n-TiO₂/p-Si/Al heterostructure. Thin films of pure TiO₂ were deposited on p-type silicon (100) by optimized pulsed laser ablation with a KrF-excimer laser in an oxygen-controlled environment. X-ray diffraction analysis showed the formation of crystalline TiO₂ film having a tetragonal texture with a strong (210) plane as the preferred direction. High purity aluminium and silver metals were deposited to obtain ohmic contacts on p-Si and n-TiO₂, respectively. The current–voltage (I–V) characteristics of the fabricated heterostructure were studied by using thermionic emission diffusion mechanism over the temperature range of 80–300 K. Parameters such as barrier height and ideality factor were derived from the measured I–V data of the heterostructure. The detailed analysis of I–V measurements revealed good rectifying behavior in the inhomogeneous Ag/n-TiO₂/p-Si(100)/Al heterostructure. The variations of barrier height and ideality factor with temperature and the non-linearity of the activation energy plot confirmed that barrier heights at the interface follow Gaussian distributions. The value of Richardson’s constant was found to be 6.73 × 10⁵ Am^?2 K^?2, which is of the order of the theoretical value 3.2 × 10⁵ Am^?2 K^?2. The capacitance–voltage (C–V) measurements of the heterostructure were investigated as a function of temperature. The frequency dependence (Mott–Schottky plot) of the C–V characteristics was also studied. These measurements indicate the occurrence of a built-in barrier and impurity concentration in TiO₂ film. The optical studies were also performed using a UV–Vis spectrophotometer. The optical band gap energy of TiO₂ films was found to be 3.60 eV.