Zr对Cu-15Cr原位复合材料Cr纤维相及性能的影响

通过冷轧变形并结合中间退火制备了Cu-15Cr和Cu-15Cr-0.24Zr形变原位纤维复合薄板材料。采用扫描电子显微镜、拉伸试验机和电阻率测试仪研究了Zr及退火温度对Cr纤维形貌、合金强度及导电性能的影响。结果表明:Cr纤维随退火温度升高依次发生:边缘球化、晶界开裂和纤维断裂;Zr的加入使Cr纤维球化、断裂行为延迟约100℃;Zr提高了复合材料的抗拉强度,并使其抗软化温度提高100℃;450℃时,Cu-15Cr的抗拉强度/导电率达到良好的匹配,为656 MPa/81.7%IACS,550℃时,Cu-15Cr-0.24Zr的抗拉强度/导电率达到良好的匹配,为722 MPa/81.3%IACS。     

Ag对Cu-10Fe-0.15Zr原位复合材料微观结构及性能的影响

研究了Cu-10Fe-0.15Zr、Cu-10Fe-2Ag-0.15Zr合金微观组织及性能。测定了在不同条件下试验合金的强度和电导率;并利用扫描电镜对材料的微观组织结构进行了观察和分析。结果表明：Cu-10Fe-0.15Zr、Cu-10Fe-2Ag-0.15Zr原位复合材料经（450~500）℃×1 h的最终退火处理,可获得较好的导电性和强度。热稳定性测试表明进行固溶处理后的形变Cu-10Fe-0.15Zr、Cu-10Fe-2Ag-0.15Zr原位复合材料抗软化温度能提高到450~500℃左右。当退火温度低于500℃时,导电率随着温度的升高而升高,而当温度高于这个温度,导电率逐渐下降。Cu-10Fe-2Ag-0.15Zr形变原位复合材料中间退火温度在450℃左右时,可获得最佳的综合性能,抗拉强度1056 MPa、导电率75%IACS、抗软化温度高于450℃。Cu-10Fe-2Ag-0.15Zr合金中添加微量合金元素Ag可使材料的极限抗拉强度增大,并改善材料的热稳定性,但导电率略有提高。     

中间退火对Cu-15Fe-0.15Zr原位复合材料性能的影响

铜基形变原位复合材料是制备高强高导铜合金的新方法。由于Fe元素相对Nb、Ag等元素便宜,且板带铜材需求量巨大,使得Cu-Fe原位复合材料带材制备成为高性能铜合金研究的热点。文章通过冷轧和中间退火工艺制备了Cu-15Fe-0.15Zr形变原位复合材料,重点研究了中间退火对该材料抗拉强度、导电率和软化温度的影响。结果表明,中间退火可以在不损害材料强度的情况下大幅提高其电导率,而且材料的抗软化温度大于550℃。通过变形和中间退火的合理配合,可获得较理想的材料抗拉强度和电导率的匹配。     

冷轧Cu-15Cr原位复合材料组织和性能研究

经冷轧变形和中间退火制备了Cu-15Cr形变原位纤维增强复合薄板材料。用SEM、拉伸试验机和电阻率测试仪研究了变形量及退火温度对Cr纤维形貌、合金强度及导电性能的影响。结果表明:随合金变形量的增加,Cr纤维逐渐变薄、变宽,纤维间距逐渐减小,材料的抗拉强度和导电率都逐渐增大。退火温度升高,材料抗拉强度随之降低,导电率先升高后降低,退火温度为550℃时,导电率峰值为84.4%IACS;退火温度升高,Cr纤维依次发生球化,球化加剧、纤维断裂。最终变形量时,材料达到较好的综合性能匹配,退火前抗拉强度和导电率为694 MPa和78%IACS;500℃退火后抗拉强度和导电率为570 MPa和83%IACS。     

微合金化对Cu-15Cr原位复合材料组织和性能的影响

研究了合金元素Zr对Cu-15Cr原位复合材料微观组织、力学性能、导电性能及热稳定性的影响规律。用SEM和TEM分别观察了材料的微观组织演变和析出相形貌,测试了不同应变下材料的抗拉强度和导电率,测定了材料的抗软化温度。结果表明:Zr促进Cr的析出,保持了微合金化Cu-15Cr复合材料的导电性;添加少量Zr可使Cu-15Cr-0.1Zr的抗拉强度提高约15%;Zr的加入使复合材料的抗软化温度提高了50℃左右。     

Cu-15Cr-0.1Zr原位复合材料的组织与性能

采用冷变形+中间热处理方法制备Cu-15Cr-0.1Zr原位复合材料.这种Cr纤维原位强化复合材料的强度为1200 MPa,导电率为73%IACS.研究了不同应变量下材料的微观组织演变和力学性能.随应变量的增加,强度增加,Cr相形态由枝晶演变为细小丝带状.研究不同中间退火工艺对材料性能的影响,结果表明,通过冷变形及适当的中间热处理可获得强度和导电率的较好组合.     

冷轧Cu-15Cr原位复合材料性能及Cr纤维相高温稳定性

采用冷轧变形结合中间退火得到形变Cu-15Cr原位纤维增强复合材料。利用扫描电镜、电子拉力试验机及数字微欧计研究退火温度对材料的Cr纤维形貌、抗拉强度及导电性能的影响。结果表明:Cr纤维的高温不稳定性是边缘球化和晶界开裂的结果;随退火温度升高,Cr纤维的高温失稳过程为Cr纤维发生边缘球化、球化向Cr纤维中心扩展、Cr纤维晶界开裂(三叉晶界处)、Cr纤维断裂。随退火温度升高,Cu-15Cr原位复合材料抗拉强度逐渐降低,导电率先逐渐升高,在550℃达到峰值84.4%IACS后迅速下降;经450℃退火,能得到具有较好综合性能的冷轧Cu-15Cr原位复合材料,其抗拉强度达到656 MPa,导电率达到82%IACS。     

热型连铸制备Cu-0.3Sn合金线材的研究

通过"热型连铸法 冷拔 再结晶退火 冷拔"工艺制备的Cu-0.3Sn的合金线材,抗拉强度约为421MPa,导电率为73.2%IACS;通过软化性试验(300℃退火2h)后,抗拉强度下降不到6%.采用该工艺制备Cu-0.3Sn合金接触线材的抗拉强度、导电率和耐软化性能均达到TB/T2809-2005中Cu-Sn合金接触线的性能要求.     

Cu基原位复合材料在冷轧过程中的性能及组织演变分析

究了Cu-15Cr-0.24Zr合金在冷轧过程中的性能和显微组织的演变规律。结果表明,当材料的变形量达到91.2%时,Cr纤维会变为又长又细且连续的板条形状。同时材料的抗拉强度可高达800 MPa,导电率也高于70%IACS。     

Zr对Cu-15Cr合金铸态组织及热稳定性的影响

为了研究Zr对Cu-Cr形变原位复合材料组织和性能的影响,采用真空中频感应熔炼技术,制备了Cu-15Cr和Cu-15Cr-0.24Zr合金。利用扫描电子显微镜(SEM)、能谱仪(EDS)、透射电子显微镜(TEM)等表征手段,研究了Zr对Cu-15Cr合金铸态组织及不同温度退火1h后的组织的影响;对两种试验合金进行了冷轧变形,对最终变形量下的试验合金的热稳定性进行了研究。结果表明:Zr的加入,使合金的铸态组织中生成了薄片状的Cu Zr金属间化合物;抑制了共晶Cr相的生成,使共晶Cr含量远低于Cu-15Cr合金,同时,细化了枝晶Cr的尺寸;显著提高了合金的热稳定性,使其在550℃退火1 h后的抗拉强度提高了100 MPa。并通过对试验合金凝固过程的吉布斯自由能(ΔG_(mix))的计算,得出Zr的加入降低了Cu-15Cr合金的液相分离温度,减小了Cu-15Cr合金在凝固过程中动态平衡下的形核驱动力,因此抑制了共晶Cr的生成,这与试验观察到的铸态组织结果一致。     

Structures and properties of deformation-processed Cu-16Fe-2Cr in-situ composites

1　INTRODUCTIONTheCubasedinsitucomposites,whichconsistofCumatrixsreinforcedwithbccorfccmetalssuchasNb[13] ,Ta[4 ] ,Cr[56 ] ,Fe[8,9] andAg[10 ,11] havebeendevelopedtomeettheincreasingindustrialre quirementsformaterialswithhigherstrengthandhigherelectricalconductivity .Thesesocalledinsitucompositesare generallymanufacturedbyvacuumcastingorpowdermetallurgyfollowedbyheavycolddrawingorrolling ,andaresuperiortotheartificialcompositessuchascarbonfilamentreinforcedcoppercompositesduetotheirecon…     

Analysis of precipitation in a Cu-Cr-Zr alloy

Precipites in Cu-0.42%Cr-0.21%Zr alloy were analyzed by using scanning electron microscope （SEM）, energy dispersive X-ray spectroscopy （EDXS） and transmission electron microscope （TEM）. After the solid solution was performed at 980℃ for 2 h, water-quenched and aged at 450℃ for 20 h, the precipite had a bimodal distribution of precipitate size. The coarse precipitates are pure Cr and Cu5Zr, the dispersed fine precipitate is CrCu2（Zr, Mg） and pure Cr ranging from 1 to 50 nm. The coarse phases formed during solidification and were left undissolved during solid solution. The fine precipitates are the hardening precipitates that form due to decomposition of the supersaturated solid solution during aging.     

合金元素对Cu-Ag合金组织、力学性能和电学性能的影响

采用冷变形及中间热处理方法制备了具有双相纤维复合组织的Cu-Ag合金，研究了成分与组织，性能的关系，随着变形程度的增加，合金强度上升而电导率下降，合金中Ag含量由6％增加至24％时，铸态组织中第二相数量明显增多，变形后能够形成更多的Ag纤维复合相，因而合金强度明显上升，在Cu-6%Ag中添加1％Cr元素可以使合金基体得到进一步强化并在一定程度上细化了Ag纤维相，也可使合金度得到显著改善，在Cu－6%Ag-1%Cr合金中添加微量稀土元素可使Ag纤维分布更为弥散，因而使合金在不降低导电性的同时增加强度，尤其在高强度范围内这种作用更为显著。     

Electrical conductivity of Cu-Ag in situ filamentary composites

The electrical conductivity of Cu-10Ag in situ filamentary composite was studied during the deformation and annealing processes. The dependence of electrical resistivity of the deformed composites on the true strain presents a two-stage change with increase of the true strain. The intermediate heat treatment and the stabilized annealing treatment to the deformed composite promote the separation of Ag precipitate, and increase the electrical conductivity. The maximum conductivity of the composite experienced the stabilizing heat treatment can reach about 97% IACS with σb≥400 MPa at 550 ℃ annealing, and reach about 70% IACS with σb≥ 1 250 MPa at 300 ℃ annealing. The corresponded strength of the composite was reported. The microstructure reason for the changes of the conductivity was discussed.     

Microstructures and properties of cold drawn and annealed submicron crystalline Cu-5%Cr alloy

The microstructures and properties after cold drawing and subsequent annealing of submicron crystalline Cu-5%Cr (mass fraction) alloy were investigated. The results show that, the microstructure of submicron crystalline Cu-5%Cr can be further refined by cold drawing. After cold drawing, the grains of Cu-5%Cr alloy with grain size of 400-500 nm can be refined to be cellular structures and subgrains with size of 100-200 nm. Both strength and ductility of Cu-5%Cr alloy can be enhanced by cold drawing, and the optimal mechanical properties can be achieved with drawing deformation increasing. It is suggested that dislocation glide is still the main mechanism in plastic deformation of submicron crystalline Cu-5%Cr, but grain boundary slide and diffusion may play more and more important roles with drawing deformation increasing. When the cold drawn Cu-5%Cr wires are annealed at 550 ℃, fine recrystal grains with grain size of 200-300 nm can be obtained. Furthermore, there are lots of fine Cr particles precipitated during annealing, by which the recrystallization softening temperatures of the cold drawn Cu-5%Cr wires can be increased to 480-560 ℃. Due to the fact that Cr particles have the effect of restricting Cu grains growth, a favorable structural thermal stability of the submicron crystalline Cu-5%Cr can be achieved, and the submicron grained microstructure can be retained at high temperature annealing.     

Deformation-processed copper-chromium alloys: Optimizing strength and conductivity

A developmental research program has been carried out to produce deformation-processed copper-chromium wires with optimum combinations of ultimate strength and electrical conductivity. Properties are improved by use of deformation to assist in the precipitation of chromium from solid solution. Various combinations of deformation, solution heat treatment plus quenching, and aging have been studied and an optimum processing scheme determined. Using this processing scheme, it is shown that deformation-processed Cu-7 vol % Cr wires have strengths on the order of 50 % higher than commercial copper alloys available in the same conductivity range of 75 to 90% IACS.