1200 V常开型4H-SiC VJFET

用沟槽和离子注入方法在自主外延的4H导通型碳化硅晶圆上研制了垂直沟道结型场效应晶体管(VJFET).在栅电压V<,G>=-10 V时阻断电压达到1 200 V;在V<,G>=2.5 V,V<,D>=2V时的电流密度为395 A/cm<'2>,相应的比导通电阻为5.06 mΩ·cm<'2>.分析发现欧姆接触电阻是导通电阻...     

Determination of Base Spreading Resistance and Junction Temperature of Uniform-base Junction Transistors†

The propagation of waves in incompressible beam-plasma systems is investigated on the basis of linear fluid equations. The pressure is assumed scalar and the incompressibility condition is chosen to illustrate a class of non-barotropic plasmas. The dispersion law For these linear waves is derived, and is generally discussed. The case of oblique propagation differs appreciably from results obtained for barotropic plasmas, mainly because compressional longitudinal waves are absent. Alfvén. waves in beam-plasma systems are then denned as low-frequency waves, with wave and drift frequencies small compared to gyrofrequencies. The Alfvén approximation of the dispersion law shows that the wave frequency at fixed wave-number is lower than if no streaming were applied.     

1200V/100A高温大电流4H-SiC JBS器件的研制

基于SiC结势垒肖特基(JBS)二极管工作原理及其电流/电场均衡分布理论,采用高温大电流单芯片设计技术及大尺寸芯片加工技术,研制了1 200 V/100 A高温大电流4H-SiCJBS二极管.该器件采用优化的材料结构、有源区结构和终端结构,有效提高了器件的载流子输运能力.测试结果表明,当正向导通压降为1.60 V时,其正向电流密度达247 A/cm2(以芯片面积计算).在测试温度25和200℃时,当正向电流为100 A时,正向导通压降分别为1.64和2.50 V;当反向电压为1 200 V时,反向漏电流分别小于50和200μA.动态特性测试结果表明,器件的反向恢复特性良好.器件均通过100次温度循环、168 h的高温高湿高反偏(H3TRB)和高温反偏可靠性试验,显示出优良的鲁棒性.器件的成品率达70％以上.     

Transit Time of Junction Transistors at High Bias Currents†

A study is made of the behaviour of the small-signal base transit time of a transistor at high bias current levels, where increase of transit time occurs due to collector depletion layer contraction in combination with high level injection effects in the base. Computation of theoretical current dependence of transit time is carried out for devices of single-diffused base grading with alloyed emitter and collector junctions. A physical model of the devices, involving exponential base impurity density grading, is used as a basis of analysis. The physical parameters of this model are determined specifically for the transistor samples under study by interpretation of measured terminal properties under low-level injection conditions. Very close agreement between measured and computed dependence of base transit time on d. c. bias current is obtained, subject to appropriate allowance, in analysis, for variation of the operating temperature of the device with d. c. bias condition.     

Static Performance of 20 A, 1200 V 4H-SiC Power MOSFETs at Temperatures of −187°C to 300°C

Silicon carbide (4H-SiC) power metal–oxide–semiconductor field-effect transistors (MOSFETs) have been attracting tremendous attention for high-power applications at a wide range of operating temperatures, owing to their normally-off characteristics, high-speed switching operation, avalanche capability, and low on-resistance. To optimize performance of 4H-SiC MOSFETs for various applications at different temperatures, it is important to understand the mechanisms of temperature dependence of the key parameters, such as on-resistance, threshold voltage, and metal–oxide–semiconductor (MOS) channel mobility. We report on the temperature dependence of the on-resistance of 20 A, 1200 V 4H-SiC power MOSFETs for temperatures ranging from −187°C to 300°C. The MOSFET showed normally-off characteristics throughout the entire experimental temperature range. Different temperature dependences of the total on-resistance in different temperature regimes have been observed. Due to the poor MOS channel mobility and the low free carrier concentration in the inversion channel of the 4H-SiC MOSFET, the MOS channel resistance is the dominant part of the total on-resistance. This was also found to be true in a 4H-SiC long-channel lateral MOSFET.     

2700V4H-SiC结势垒肖特基二极管

在76.2 mm 4H-SiC晶圆上采用厚外延技术和器件制作工艺研制的结势垒肖特基二极管(JBS).在室温下,器件反向耐压达到2700 V.正向开启电压为0.8V,在VF=2V时正向电流密度122 A/cm2,比导通电阻Ron=8.8 mΩ·cm2.得到肖特基接触势垒qφв=1.24 eV,理想因子n=1.     

耐250℃高温的1200V-5A4H-SiC JBS二极管

采用碳化硅外延和器件工艺制造了碳化硅结势垒肖特基(JBS)二极管,耐压达到1 200 V,封装的器件电流室温达到5 A(正向压降2.1 V).通过在不同工作温度下对比测试显示了直流特性随工作温度的变化情况,并验证至少在250℃下依旧能正常工作.研制的1 200 V碳化硅JBS二极管和IXYS公司的600 V硅快恢复二极管(Fast recovery diode)进行了对比:室温动态开关测试中,碳化硅二极管的反向恢复能耗比硅二极管节省92%.这是国内首次报道的250℃高温下正常工作的碳化硅JBS二极管.     

耐250℃高温的1200 V-5 A 4H-SiC JBS二极管

碳化硅(4H-SiC)材料具有宽带隙、高饱和电子漂移速率和高热导率等优良特性,因此SiC电力电子器件在高功率、大电流、高频率、耐高温和抗辐射等方面相对于Si器件性能要优胜得多,被认为在更高功率、更苛刻环境下有取代Si的非常广泛的应用前景.     

3300V 4H-SiC MOSFET 设计与加工

成功设计并制造了击穿电压超过3300V 的4H-SiC MOSFET。通过数字仿真优化了漂移层和DMOSFET有源区参数。漂移层N型外延厚度为33微米并且掺杂浓度为2.5E15cm-3。器件采用浮空场限制环作为终端。当栅极电压为20V,漏极电压为2.5V时,漏极电流为5A。     

Advanced SPICE-Modeling of 4H-SiC MESFETs

A modified drain source current suitable for simulation program with integrated circuit emphasis （SPICE） simulations of SiC MESFETS is presented in this paper. Accurate modeling of SiC MESFET is achieved by introducing three parameters in Triquint＇s own model （TOM）. The model, which is single piece and continuously differentiable, is verified by measured direct current （DC） I-V curves and scattering parameters （up to 20 GHz）.     

Simulation and Analysis of Photo—charge Transfer Characteristics of Bipolar Junction Photogate Transistor for CMOS Imagers

The principle of the two carriers contributing to carry the pixel signal charges is firstly presented,and then the bipolar junction photogate transistor(BJPT)with high performance is proposed for the CMOS image sensor.The numerical analytical model of the photo-Chrge transfer for the bipolar junction photogate is established in detail.Some numerical simulations are obtained unider 0.6μm CMOS process,which show that its readout rate increases exponentially with the increase of the photo-Charge at applied voltage.     

3000V 10A 4H-SiC结型场效应晶体管的设计与制造

介绍了一种常开型高压4H-SiC JFET的仿真与制造工艺。通过仿真对器件结构和加工工艺进行优化,指导下一步的工艺改进。在N+型4H-SiC衬底上生长掺杂浓度(ND)为1.0×1015 cm-3,厚度为50μm的N-外延层,并采用本实验室开发的SiC JFET工艺进行了器件工艺加工。通过测试,当栅极偏压VG=-6V时,研制的SiC JFET可以阻断3 000V电压;当栅极偏压VG=7V、漏极电压VD=3V时,正向漏极电流大于10A,对应的电流密度为100A/cm2。     

1000V 4H-SiC VDMOS结构设计与特性研究

设计并优化了一种基于4H-SiC的1000V垂直双扩散金属氧化物半导体场效应晶体管(VDMOS),在留有50%的裕度后,通过Silvaco仿真软件详细研究了器件各项参数与耐压特性之间的关系。经优化,器件的阈值电压为2.3V,击穿电压达1525V,相较于相同耐压条件下的Si基VDMOS,4H-SiC VDMOS的击穿电压提升了12%。此外,击穿时4H-SiC VDMOS表面电场分布相对均匀,最大值为3.4×10⁶V/cm。终端有效长度为15μm,约为Si基VDMOS的6%,总体面积减小了近1/10。并且4H-SiC VDMOS结构简单,与相同耐压条件下的Si基VDMOS相比,未增加额外的工艺步骤,易于实现。     

1200V 40A碳化硅肖特基二极管设计

设计并实现了一种阻断电压为1 200V、正向电流40A的碳化硅(SiC)肖特基势垒二极管(SBD)。采用有限元仿真的方法对器件的有源区和终端保护参数进行了优化。器件采用10μm厚度掺杂浓度为6E15cm-3的外延材料,终端保护采用浮空场限制环。正向电压1.75V时,导通电流达到40A。     

850V／18A,1200V／8AIGBT研制

简单介绍了８５０Ｖ／１８Ａ，１２００Ｖ／８ＡＩＧＢＴ的研制与工艺，并给出了测试结果。     

1200 V/480 A全SiC功率模块

<正>面向工业电源、太阳能发电及不间断电源等领域的逆变器和转换器应用,扬州国扬电子有限公司采用自主知识产权的低电感封装结构,通过高对称性多电流通道设计方法,实现了多并联芯片的寄生参数一致性,突破了超声波金属焊接工艺技术、铜引线键合技术、大尺寸焊层厚度控制技术、端子应力缓冲结构设计等关键技术,研制出2款低电感高可靠的1 200V/480 A的全SiC功率模块"WCC480B120E53、     

500A,1200V光控双向晶闸管的研制

本文具体描述了中心锥形槽状光敏门极结构光控双向晶闸管的结构特点，介绍了该新型结构器件的关键生产工艺，并对器件的触发特性进行了较深入的理论研究。研制成功的直径为４０ｍｍ，电流宣传品量为５００Ａ，耐压为１２００Ｖ的光控双向晶闸管的最小光触发功率小于１５ｍＷ，动态峰值压降小于１．６Ｖ，换向ｄｖ／ｄｔ耐量大于１００Ｖ／μｓ，换向ｄｉ／ｄｔ耐量大于５０Ａ／μｓ。     

Study of Electron Mobility in 4H-SiC Buried-Channel MOSFETs

研究了几种因素对4H-SiC隐埋沟道MOSFET沟道迁移率的影响.提出了一个简单的模型用来定量分析串联电阻对迁移率的影响.串联电阻不仅会使迁移率降低,还会使峰值场效应迁移率所对应的栅压减小.峰值场效应迁移率和串联电阻的关系可用一个二次多项式来准确描述.详细分析了均匀分布和不均匀分布的界面态对场效应迁移率的影响.对于指数分布的界面态,低栅压下界面态的影响基本上可以忽略不计,随着栅压的增加,界面态的影响越来越显著.     

800V／10A和1200V／6A绝缘栅双极晶体管的研制

本文简单介绍了８００Ｖ／１０Ａ和１２００Ｖ／Ａ绝缘栅双极晶体管（ＩＧＢＴ）的研制．重点介绍工艺过程和测试结果．     

6.5kV,25 A 4H-SiC功率DMOSFET器件

<正>与硅IGBT相比,SiC高压功率DMOSFET器件的导通电阻和开关损耗更低,工作温度更高,在智能电网的应用中具有巨大的应用前景。南京电子器件研究所研制出一款6.5kV25ASiC功率DMOSFET器件。建立了高压SiC DMOSFET仿真模型并开展元胞结构设计,通过采用低界面态密度栅极氧化层制备以及JFET区选择掺杂等先进工艺技术,在60μm厚外延层上制备了6.5 kV SiC DMOSFET,芯片有源区尺寸37 mm~2。该器件击穿电压大于6.9 kV,导通电流大于25 A,峰值有效沟道迁移率为23 cm~2/(V·s),比导通电阻降低到44.3 mΩ·cm~2,缩小了与国际先进水平的差距。