一种带有延伸电极的碲镉汞多元红外探测器

碲镉汞红外探测器的电极制作一直是探测器研制过程中的一项关键技术。通常人们是采用金丝球焊、超声键压等方法引出电极的,但这些技术有一个共同点,即它们都是在较大的超声压力或静压力下使金丝、硅铝丝与光敏元边上的电极区的金属键合的,因此其键压点承受的压强较     

碲镉汞红外探测器高低温循环特性研究

由于卫星长寿命的要求与机械制冷机有限寿命的矛盾，制冷机必须采用间歇式工作模式，因此星载碲镉汞红外探测器在太空中工作会经受从常温（20℃）到低温（-173℃以下）的成千上万次的温度循环，这给红外探测器带来了新的可靠性问题。本文介绍了自主研发的高低温循环试验系统，液氮致冷，温度循环范围为295K到100K。利用试验系统对两种型号的红外探测器组件进行了温度循环试验可靠性研究，测试和统计了循环试验前后的电阻、信号和噪声变化，针对具体试验结果做了分析和解释，为器件的工艺研发和改进提供了参考。     

低损伤碲镉汞长波红外焦平面探测器电极接触孔刻蚀技术研究

长波碲镉汞材料受结构、组分等因素影响。在制备器件过程中,刻蚀电极接触孔易发生材料损伤,影响芯片的成像性能。利用现有电感耦合等离子体(Inductively Coupled Plasma, ICP)设备刻蚀长波碲镉汞芯片电极接触孔,采用分步刻蚀以避免损伤。该方法虽可提高芯片的成像质量,但效率低,难以应用于大规模生产。为了提高刻蚀效率和实现器件大规模制备,通过对ICP刻蚀机上下电极射频功率的协同优化,开发出长波碲镉汞芯片电极接触孔一次成型工艺。经中测验证,探测器(长波320×256,像元中心间距为30 μm)的盲元率仅为0.26%。该工艺能够实现低损伤电极孔刻蚀,可推广到大批量长波红外芯片制备。     

碲镉汞红外探测器高低温循环特性研究

由于卫星长寿命的要求与机械制冷机有限寿命的矛盾，制冷机必须采用间歇式工作模式，因此星载碲镉汞红外探测器在太空中工作会经受从常温(20℃)到低温(-173℃以下)的成千上万次的温度循环，这给红外探测器带来了新的可靠性问题。本文介绍了自主研发的高低温循环试验系统，液氮致冷，温度循环范围为295K到100K。利用试验系统对两种型号的红外探测器组件进行了温度循环试验可靠性研究，测试和统计了循环试验前后的电阻、信号和噪声变化，针对具体试验结果做了分析和解释，为器件的工艺研发和改进提供了参考。     

金属/碲镉汞接触研究的发展

介绍了金属/碲镉汞(Hg_1-xCd_xTe,MCT)接触研究的发展状况,包括基本概念、生长结构、化学活性以及电学性能。金属/MCT接触有两类:一类是电子（欧姆）接触,另一类是整流（Shottky）接触。欧姆接触是MCT红外探测器的一个重要组成部分,它决定了器件的性能和可靠性。欧姆接触的电阻小,与MCT黏附性好,并且在热循环条件下可保持性能稳定。由于需要具有较大功函数的接触金属,p型MCT很难实现,而n型MCT则可以用很多金属实现。     

长波红外碲镉汞探测器

1 引言 红外辐射最早是1800年英国的天文学家赫谢耳(W.Herschel)在研究太阳光谱的热效应时,用水银温度计测量各种颜色光的加热效果而发现的。1830年,L.Nobili利用塞贝克发现的温差电效应制成了“温差电型辐射探测器”;     

长波光伏碲镉汞材料上的欧姆接触

碲镉汞器件性能与材料及诸多工艺因素相关,而材料与电极间的接触性能是必须要解决的基础问题之一.利用金属In/Au在光伏长波碲镉汞材料上做了接触性能研究,通过实验获得了较理想的欧姆接触,测试后计算出In与n型和p型HgCdTe材料间的接触电阻率分别为3.25×10-4Ω cm2、8.95×10-4Ω·cm2.     

碲镉汞红外探测器量子效率计算研究

首先分析了量子效率计算的相关方法,然后分析红外碲镉汞探测器测试过程。对器件进行电学性能测试及光谱响应测试基础上,利用测试方法和测试数据计算出探测器产生的电子数。再将实际电子数与理论分析的光子数相比,计算出探测器对不同红外波段量子效率,最高可达66 %,达到了国外同类型器件响应的量子效率指标。本文的研究为评价碲镉汞探测器的光电转换性能提供了一种有效的方法。     

中短波HgCdTe金属接触的退火研究

为制备良好的碲镉汞金属接触,研究了热退火处理对中短波Hg空位掺杂碲镉汞金属接触的影响。对中短波HgCdTe-Sn/Au接触及中波HgCdTe-Cr/Au接触经不同条件退火后的接触进行了测量。对于短波碲镉汞,p型HgCdTe-Sn/Au接触经95 ℃,30 min退火可降低比接触电阻2个量级,而经125 ℃,30 min退火可降低3个量级;离子注入的n型HgCdTe-Sn/Au接触则容易形成欧姆接触。对于中波碲镉汞,退火前p型HgCdTe-Sn/Au接触平均比接触电阻为10-1 Ωcm2量级,经适当条件退火可以降低3个量级;此外,Sn/Au比Cr/Au更适合作为中波HgCdTe的接触金属。因而HgCdTe金属接触可通过一定退火处理得到改善。     

中短波HgCdTe金属接触的退火研究

为制备良好的碲镉汞金属接触,研究了热退火处理对中短波Hg空位掺杂碲镉汞金属接触的影响。对中短波HgCdTe-Sn/Au接触及中波HgCdTe-Cr/Au接触经不同条件退火后的接触进行了测量。对于短波碲镉汞,p型HgCdTe-Sn/Au接触经95℃,30 min退火可降低比接触电阻2个量级,而经125℃,30 min退火可降低3个量级;离子注入的n型HgCdTe-Sn/Au接触则容易形成欧姆接触。对于中波碲镉汞,退火前p型HgCdTe-Sn/Au接触平均比接触电阻为10-1Ωcm2量级,经适当条件退火可以降低3个量级;此外,Sn/Au比Cr/Au更适合作为中波HgCdTe的接触金属。因而HgCdTe金属接触可通过一定退火处理得到改善。     

碲镉汞p型接触孔湿法腐蚀工艺研究

针对碲镉汞芯片p型接触孔湿法腐蚀工艺进行研究,采用不同条件的湿法腐蚀工艺完成碲镉汞p型接触孔制备,通过扫描电子显微镜和激光扫描显微镜分析腐蚀后的接触孔表面形貌,电学接触性能通过伏安特性曲线表征。实验结果表明,传统湿法腐蚀工艺在碲镉汞芯片接触孔制备过程中存在钻蚀严重和均匀性不好等问题,针对以上问题提出了一种超声辅助湿法腐蚀工艺,制备出形貌及均匀性较好的p型接触孔。     

Independently accessed back-to-back HgCdTe photodiodes: A new dual-band infrared detector

We report the first data for a new two-color HgCdTe infrared detector for use in large dual-band infrared focal plane arrays (IRFPAs). Referred to as the independently accessed back-to-back photodiode structure, this novel dual-band HgCdTe detector provides independent electrical access to each of two spatially collocated back-to-back HgCdTe photodiodes so that true simultaneous and independent detection of medium wavelength (MW, 3–5 μm) and long wavelength (LW, 8–12 μm) infrared radiation can be accomplished. This new dual-band detector is directly compatible with standard backside-illuminated bump-interconnected hybrid HgCdTe IRFPA technology. It is capable of high fill factor, and allows high quantum efficiency and BLIP sensitivity to be realized in both the MW and LW photodiodes. We report data that demonstrate experimentally the key features of this new dual-band detector. These arrays have a unit cell size of 100 x 100 μm², and were fabricated from a four-layer p-n-N-P HgCdTe film grown in situ by metalorganic chemical vapor deposition on a CdZnTe substrate. At 80K, the MW detector cutoff wavelength is 4.5 μm and the LW detector cutoff wavelength is 8.0 μm. Spectral crosstalk is less than 3%. Data confirm that the MW and LW photodiodes are electrically and radiometrically independent.     

High performance SWIR HgCdTe detector arrays

Short wave infrared (SWIR) devices have been fabricated using Rockwell’s double layer planar heterostructure (DLPH) architecture with arsenic-ion implanted junctions. Molecular beam epitaxially grown HgCdTe/CdZnTe multilayer structures allowed the thin, tailored device geometries (typical active layer thickness was ∼3.5 μm and cap layer thickness was ∼0.4 μm) to be grown. A planar-mesa geometry that preserved the passivation advantages of the DLPH structure with enhanced optical collection improved the performance. Test detectors showed Band 7 detectors performing near the radiative limit (∼3-5X below theory). Band 5 detector performance was ∼4-50X lower than radiative limited performance, apparently due to Shockley-Hall-Read recombination. We have fabricated SWIR HgCdTe 256 × 12 × 2 arrays of 45 um × 45 μm detector on 45 μm × 60 μm centers and with cutoff wavelength which allows coverage of the Landsat Band 5 (1.5−1.75 μm) and Landsat Band 7 (2.08−2.35 μm) spectral regions. The hybridizable arrays have four subarrays, each having a different detector architecture. One of the Band 7 hybrids has demonstrated performance approaching the radiative theoretical limit for temperatures from 250 to 295K, consistent with test results. D* performance at 250K of the best subarray was high, with an operability of ∼99% at 10¹² cm Hz^1/2/W at a few mV bias. We have observed 1/f noise below 8E-17 AHz ^1/2 at 1 Hz. Also for Band 7 test structures, Ge thin film diffractive microlenses fabricated directly on the back side of the CdZnTe substrate showed the ability to increase the effective collection area of small (nominally <20 μm μm) planar-mesa diodes to the microlens size of 48 urn. Using microlenses allows array performance to exceed 1-D theory up to a factor of 5.     

Bake stability of long-wavelength infrared HgCdTe photodiodes

The bake stability was examined for HgCdTe wafers and photodiodes with CdTe surface passivation deposited by thermal evaporation. Electrical and electrooptical measurements were performed on various long-wavelength infrared HgCdTe photodiodes prior to and after a ten-day vacuum bakeout at 80°C, similar to conditions used for preparation of tactical dewar assemblies. It was found that the bakeout process generated additional defects at the CdTe/ HgCdTe interface and degraded photodiode parameters such as zero bias impedance, dark current, and photocurrent. Annealing at 220°C under a Hg vapor pressure following the CdTe deposition suppressed the interface defect generation process during bakeout and stabilized HgCdTe photodiode performance.     

长波碲镉汞探测器的原位集成微透镜技术研究

采取原位集成的方式在红外焦平面探测器芯片的入光侧制备微透镜阵列以达到增强信号以及减小串音的作用,通过光学分析获得了匹配不同中心距器件的微透镜结构设计,在长波碲镉汞320×256,50 μm和30 μm中心距的探测器上验证了原位集成的微透镜阵列能够有效地通过汇聚光线,使信号增强分别达到28 %和61 %。对于超高灵敏度红外探测以及SWaP和超大规模红外探测器研究具有重大意义。     

MOCVD of bandgap-engineered HgCdTe p-n-N-P dual-band infrared detector arrays

We report the implementation of recent advances in metalorganic chemical vapor deposition (MOCVD) for in situ growth of four-layer HgCdTe mid wave/ long wave (MW/LW) simultaneous dual-band 64 × 64 infrared detector arrays. This independently accessed, simultaneous, double-heterojunction p-n-N-P dualband detector has two back-to-back stacked photodiodes grown on CdZnTe (100) substrates. The LW photodiode is a p-on-n heterojunction grown on top of an MW N-on-P heterojunction photodiode. Secondary ion mass spectrometry depth profiles of these 28 μ m thick p-n-N-P dual-band films show four well-defined regions of alloy composition and doping, and agree well with the device design. 64 × 64 arrays of dual-band detectors were fabricated from these films using electron cyclotron resonance dry etching and CdTe passivation, and hybridized to a dual-band readout chip. Two bump inter-connects in each unit cell provide independent electrical access to the back-to-back MW and LW photodiodes, and allow the MW and LW photocurrents to be separate and independent. The dualband infrared focal plane arrays (IRFPAs) spectral response data at 78K are well-behaved and are fully consistent with that observed in individual singleband LW p-on-n and MW N-on-P heterojunction devices of the same design. The hybridized 64 × 64 duai-band FPAs have MW and LW average in-band quantum efficiencies of 79 and 67%, and median D* values of 4.8 × 10¹¹ and 7.1 × 10¹⁰ cm-√Hz/W, in the respective spectral bands at 78K. The data demonstrate that MOCVD has progressed significantly toward being a practical and viable vapor phase in situ growth technology for advanced bandgap-engineered HgCdTe detector arrays.     

离子束刻蚀碲镉汞的沟槽深宽比改进

高深宽比离子束刻蚀技术是实现碲镉汞红外焦平面探测器的关键工艺技术.国内应用最广泛的双栅考夫曼刻蚀机束散角较大,沟槽深宽比较低.针对Ar离子束刻蚀机,尝试了三种提高深宽比的方法:选择不同的光刻胶做掩模、改变刻蚀角度和使用三栅离子源,并通过扫描电子显微镜(SEM)观察了碲镉汞刻蚀图形的剖面轮廓并计算了深宽比.分析了这些工艺方法对刻蚀图形轮廓的影响,获得了一些有助于获得高深宽比的离子束刻蚀沟槽的实验结果.