由RTD/MOSFET构成的新型振荡电路

基于一种新型的振荡机制,利用共振隧穿二极管(RTD)固有的负阻和双稳特性,与MOSFET器件相结合,首次实现了工作频率约为25MHz的RTD/MOSFET高频振荡电路.文章首先从理论上深入分析了该电路的振荡机理,然后通过高级设计系统(ADS)软件仿真和实验验证了此振荡电路的正确性.该电路的实现有望解决传统的基于RTD的振荡电路的功率限制问题,如果进一步用高电子迁移率晶体管(HEMT)等高频、高速器件取代MOSFET,可以在很大程度上提高这一电路的工作频率,并可实现RTD/HEMT的单片集成.因此该振荡电路在微波和射频领域具有广阔的应用前景.     

由RTD/MOSFET构成的压控振荡器的设计与实现

提出了一种基于负阻器件共振隧穿二极管(RTD)与MOSFET结合的新型压控振荡器(VCO),并利用了高级设计系统(ADS)软件对该振荡器的可行性进行了电路仿真,利用分立RTD、MOSFET器件实现了此种VCO,实际调频范围在20～26 MHz之间。RTD与三端器件的连接方式不同可呈现不同的调制I-V特性,这种调制特性对基于RTD的振荡电路的频率也会产生影响。通过深入研究这种调制对振荡电路频率产生的影响,得到多种不同于常规方法的电压控制频率方式,其中一些具有很好的线性度。因此该电路的研究对于RTD在高频、高速振荡电路中的进一步应用具有重要意义。     

RTD/HEMT多值逻辑(MVL)电路的PSPICE模拟

由共振隧穿二极管(RTD)与高电子迁移率晶体管(HEMT)相并联组成的结构是构成当前RTD高速数字电路常用的基本单元。由于RTD的负阻、双稳和自锁特性,由RTD/HEMT组成的逻辑电路可以大大减少器件的数目,用最少的器件完成一定的逻辑功能。本文对多值逻辑(MVL)中的文字逻辑门用PSPICE模拟软件进行了电路模拟,模拟结果与预期结果一致,并有助于指导该电路的设计。     

基于RTD和HEMT的单稳多稳转换逻辑(MML)模拟

用 PSpice对一种由串连的 RTD和 HEMT组成的单稳多稳转换逻辑 (MML)电路进行了模拟。基于自行研制的 RTD的特性曲线提取了合适的器件模型和参数 ,分析了由输入信号调节器件的峰值电流来控制器件翻转次序从而在 MML电路中实现门函数逻辑的原理并由模拟得以证实。     

平面型RTD与BJT构成的串联单元特性分析

采用了n+-GaAs衬底和硼离子注入的新型工艺实现了共振隧穿二极管(RTD)的平面化,解决了台面型RTD工艺的不足,得到常温电流峰谷比为2.51∶的平面型RTD(PRTD);利用高级设计系统ADS电路模拟和实验测量对PRTD与BJT串联单元的不同串联方式的电压-电流特性进行了深入分析。这一特性的研究对RTD与异质结双极晶体管(HBT)、MOSFET、高电子迁移率晶体管(HEMT)等三端器件的结合具有普遍意义。     

一种基于RTD和HEMT的单片集成逻辑电路

介绍了一种基于共振隧穿二极管(RTD)和高电子迁移率晶体管(HEMT)的单片集成电路.采用分子束外延技术在GaAs底层上重叠生长了RTD和HEMT结构.RTD室温下的峰谷电流比为5.2∶1,峰值电流密度为22.5kA/cm2.HEMT采用1μm栅长,阈值电压为-1V.设计电路称为单稳态-双稳态转换逻辑单元(MOBILE).实验结果显示了该电路逻辑运行成功,运行频率可达2GHz以上.     

一种基于RTD和HEMT的单片集成逻辑电路

介绍了一种基于共振隧穿二极管(RTD)和高电子迁移率晶体管(HEMT)的单片集成电路.采用分子束外延技术在GaAs底层上重叠生长了RTD和HEMT结构.RTD室温下的峰谷电流比为5.2∶1,峰值电流密度为22.5kA/cm2.HEMT采用1μm栅长,阈值电压为-1V.设计电路称为单稳态-双稳态转换逻辑单元(MOBILE).实验结果显示了该电路逻辑运行成功,运行频率可达2GHz以上.     

一种新型的常通型GaN HEMT器件

对新型常通型GaN HEMT器件的特性和参数进行了研究。阐述了其静态特性、动态特性及电流崩塌问题。针对其动态特性,与相近规格的Si MOSFET器件（TK2Q60D）在开通、关断时间与栅源电压的关系方面进行了对比,探讨了常通型GaN HEMT器件在不同输入电压和不同开关频率下的电流崩塌现象,并采用Boost电路,对常通型GaN HEMT器件和Si MOSFET器件的最高工作频率能力进行了对比。实验结果表明,常通型GaN HEMT器件具有更高的工作频率,且工作频率的升高不影响电流崩塌现象。     

InP基RTD/HEMT集成的几个关键工艺研究

用MBE设备在半绝缘的InP衬底上依次生长高电子迁移率晶体管(HEMT)外延材料和共振遂穿二极管(RTD)外延材料,在此材料结构基础上研究和分析了RTD与HEMT器件单片集成工艺中的隔离工艺、欧姆接触工艺、HEMT栅挖槽工艺和空气桥工艺等几步关键工艺,给出了这些工艺的相关参数。利用上述工艺成功地制作了RTD和HEMT器件,并在室温下分别测试了RTD器件和HEMT器件的电学特性。测试表明:在室温下,RTD器件的峰电流密度与谷电流密度之比(PVCR)为3.66;HEMT器件的最大跨导约为370 mS/mm,在Vds=1.5 V时的饱和电流约为391 mA/mm。这将为RTD与HEMT的单片集成研究奠定工艺基础。     

RTD/HEMT串联型RTT的设计与研制

依据RTD/HEMT串联型RTT的概念,设计了RTD/HEMT单片集成材料结构,该结构采用分子束外延技术生长.采用湿法化学腐蚀、金属剥离、台面隔离和空气桥互连技术,研制了RTD/HEMT串联型RTT,并对RTT及RTT中RTD和HEMT的直流特性进行了测试.测试结果表明:在室温下,器件具有明显的栅控负阻特性,正接型RTT的最大峰谷电流之比在2.2左右,反接型RTT的最大峰谷电流之比在4.6左右.实验为RTD/HEMT串联型RTT性能的优化和RTD/HEMT单片集成电路的研制奠定了基础.     

A simple and analytical parameter-extraction method of a microwaveMOSFET

A simple and accurate parameter-extraction method of a high-frequency small-signal MOSFET model including the substrate-related parameters and nonreciprocal capacitors is proposed. Direct extraction of each parameter using a linear regression approach is performed by Y-parameter analysis on the proposed equivalent circuit of the MOSFET for high-frequency operation. The extracted results are physically meaningful and good agreement has been obtained between the simulation results of the equivalent circuit and measured data without any optimization. Also, the extracted parameters, such as g_m and g_ds, match very well with those obtained by DC measurement     

Study and implementation of a low conduction loss zero-current resonant switch

Zero-current (ZC) resonant switches allow one to reduce the switching losses in high-frequency DC/DC switched mode power supplies. ZC resonant switches can be either unidirectional (half-wave) or bidirectional (full-wave). If a conventional power MOSFET is chosen to implement the ZC resonant switch, the turn-on of the slow intrinsic diode has to be avoided. This is usually done with a fast blocking diode, which is connected in series with the MOSFET. Furthermore, an antiparallel fast diode is added when a FW ZC resonant switch is required. The conduction losses are relevant in this implementation, owing to the threshold voltage and to the series resistances of the two diodes. In this paper, a low-conduction-loss FW ZC resonant switch has been proposed. Its implementation is based on a power MOSFET and a single antiparallel Schottky diode. The possibility of an implementation with a power MOSFET alone is also discussed. A control circuit suitable for the proposed ZC resonant switch has been described. The experimental results obtained from a ZCS-QR buck converter are discussed.<>     

Coreless printed circuit board (PCB) transformers for powerMOSFET/IGBT gate drive circuits

Gate drive circuits for modern power electronic switches, such as MOSFET and insulated gate bipolar transistor (IGBT), often require electrical isolation. This paper describes the modeling and experimental results of some coreless printed circuit board (PCB)-based transformers that can be used for MOSFET and IGBT devices at high-frequency (500 kHz to 2 MHz) operation. PCB-based transformers do not require the manual winding procedure and thus simplify the manufacturing process of transformer-isolated gate drive circuits. With no core loss, coreless transformers are found to have favorable characteristics at high-frequency operations. This project demonstrates an important point that the size of the magnetic core can approach zero and become zero when the frequency is sufficiently high     

具有自动稳幅功能的软激励C类大功率射频振荡器

介绍了一种具有自动稳幅功能的软激励C类大功率射频振荡器。大功率射频振荡器已经广泛应用于电力电子、射频电源、低温等离子体、高频感应加热等领域。该大功率射频振荡器能够输出较高的输出电压和输出功率,并且通过对输出电压采样控制MOS管的静态工作点,稳定输出电压;另外,该设计电路起振时工作在AB类状态,稳定工作时在自动稳幅电路的作用下进入C类工作状态,实现了C类射频振荡器的软激励。最后通过仿真和实物电路测试了电路性能,并给出了振荡器输出电压、输出功率与MOS管工作状态关系的经验公式。     

Extraction of high-frequency equivalent circuit parameters ofsubmicron gate-length MOSFET's

As the effective gate-length of a MOSFET reduces, its high-frequency characteristics improve. However, they become more difficult to model. Current SPICE models are based on DC measurement data and simplistic capacitance models which can only approximate the high-frequency device characteristics up to a fraction of the device unity current gain frequency (f_τ). Thus, it is important to investigate the high-frequency characteristics and then incorporate the small-signal equivalent circuit parameters in SPICE. In this, work we report a simple nonquasi static model, which offers good accuracy needed for circuit simulation, and a new curve fitting method for the extraction of the network model elements. The current work is part of a study aimed at improving the existing scalable model for MOSFET's, and it focuses on extracting the elements of an equivalent circuit which describes the state-of-the-art device     

A High-Frequency Resonant Inverter Using Current-Vector Control Scheme and Its Performance Evaluations

The authors introduce a new configuration of resonant-type high-frequency inverter having inherent fast control response of the output power and variable-voltage variable-frequency (VVVF) capability. The circuit is composed of a parallel combination of two series-resonant inverters with common input and output terminals. Both inverter units are operated at synchronous frequency and with an adjustable phase difference from 0° to 180°, allowing control of the output power from full to null power, respectively. Operation of this inverter is explained and computer-simulated operating waveforms and characteristic curves are shown in terms of normalized control variables and circuit parameters. A prototype inverter using Power MOSFET modules has been originally tested with a high-frequency induction heating and melting load to demonstrate experimentally the proposed control principle and the steady-state inverter performances under parallel tuned load conditions.     

A BiCMOS Current Conveyor Based Four-Quadrant Analog Multiplier

A novel circuit for an analog multiplier in BiCMOS technology is described. It is based on a two-current conveyor cell associated with a four MOSFET transconductor. This differential multiplier achieves a bandwidth of 10 MHz because of the use of high-frequency current-conveyor.     

双栅双应变沟道全耗尽SOI CMOS的瞬态特性分析

在提出双栅双应变沟道全耗尽SOl MOSFET新结构的基础上,模拟了沟道长度为25nm时基于新结构的CMOS瞬态特性.结果表明,单栅工作模式下,传统应变SiGe(或应变Si)器件的CMOS电路只能实现上升(或下降)时间的改善,而基于新结构的CMOS电路能同时实现上升和下降时间的缩短;双栅模式下,CMOS电路的上升和下降时间较单栅模式有了更进一步的改善,电路性能得以显著提高.     

1.2 kV碳化硅MOSFET瞬态可靠性研究

随着碳化硅MOSFET器件在功率变换领域的广泛应用,碳化硅MOSFET器件的瞬态可靠性问题成为研究热点。文章主要研究了1 200 V SiC MOSFET瞬态可靠性的测试与表征。通过搭建短路和UIS测试通用的测试平台进行实验,对短路和UIS失效机理进行分析。通过对商用器件进行重复性测试,研究器件在两种瞬态可靠性测试下性能退化情况,对器件内部退化机理进行合理的分析。