Electron-assisted deposition of cubic boron nitride by r.f. magnetron sputtering

Cubic boron nitride (cBN) has been deposited on silicon (100) substrates by means of radio frequency (r.f.) magnetron sputtering in nitrogen using a hexagonal boron nitride target with the assistance of a simultaneous electron bombardment of the growing surface. Unlike most thin-film deposition processes for cBN, intentional bombardment of the growing surface by ion beams within specific ranges in energy and flux is not required for this process to achieve high-purity cBN films. Fourier transform infra-red (FTIR) spectra of cBN films show a strong absorption band around 1070 cm⁻¹. With electrons bombarding the growing surface at a current density of 140 mA cm⁻² or higher, pure (according to FTIR spectra) cBN films are deposited on silicon substrates at temperatures above 750°C. The effects of electron current density and nitrogen gas pressure on the synthesis of cBN films will be discussed.     

Growth of diamond films with high surface smoothness

Diamond films with highly smooth backside surface have been deposited by positively biasing the substrate during diamond growth in a hot-filament chemical vapor deposition (HFCVD) system. By bonding the diamond film on the glass and wet etching to remove silicon, the highly smooth diamond surface can be exposed and used directly for the fabrication of diamond devices.Silicon substrate was first treated by diamond powder of 625 nm in an ultrasonic bath. By positively biasing the substrate, electron bombardment during diamond growth increases the nucleation density from 10⁸ ∼ 10⁹ cm^− 2 to 4 × 10¹¹ cm^− 2. The surface smoothness on the backside of diamond film has thus been improved significantly, inducing root-mean-square roughness of 5 nm. Owing to the extremely high surface smoothness and the high crystalline quality on the backside of diamond film and the high diamond growth rate, the backside surface of the diamond film grown under electron bombardment is particularly suitable for device fabrication.     

Mechanistic study of ion-induced diamond nucleation

The effect of low-energy ion bombardment of silicon on diamond nucleation was investigated. By bombarding 100 eV ions of methane and hydrogen on a silicon substrate prior to diamond growth by chemical vapor deposition, diamond nucleation can be immensely enhanced. The ion beam treatment deposited a layer of nano-crystalline graphitic carbon embedded with amorphous SiC. Diamond then nucleated on the graphite overlayer; the nucleation density increased with increasing ion dose. At 1×10¹⁹ ions cm⁻², a nuclei density of 4×10⁸ cm⁻² was obtained. These results show that ion bombardment of the substrate enhances diamond nucleation.     

The effect of annealing on electrical properties of fluorinated amorphous carbon films

Fluorinated amorphous carbon (a–C:F) films have been deposited by electron cyclotron resonance chemical vapor deposition (ECR–CVD) at room temperature using C₄F₈ and CH₄ as precursor gases. The chemical compositions and electrical properties of a–C:F films have been studied by X-ray photoelectron spectroscopy (XPS), capacitance–voltage (C–V) and current-voltage (I–V) measurements. The results show that C–CF_x and C–C species of a–C:F films increase and fluorine content decreases after annealing. The dielectric constant of the annealed a–C:F films increases as a result of enhancement of film density and reduction of electronic polarization. The densities of fixed charges and interface states decrease from 1.6 × 10¹⁰ cm^− 2 and (5–9) × 10¹¹ eV^− 1 cm^− 2 to 3.2 × 10⁹ cm^− 2 and (4–6) × 10¹¹ eV^− 1 cm^− 2 respectively when a–C:F films are annealed at 300 °C. The magnitude of C–V hysteresis decreases due to reduced dangling bonds at the a–C:F/Si interfaces after heat treatment. The conduction of a–C:F films shows ohmic behavior at lower electric fields and is explained by Poole–Frankel (PF) mechanism at higher electric fields. The PF current increases indicative of reduced trap energy when a–C:F films are subjected to higher annealing temperatures.     

Fabrication of highly efficient TiO2/Ag/TiO2 multilayer transparent conducting electrode with N ion implantation for optoelectronic applications

Fabrication of highly conductive and transparent TiO₂/Ag/TiO₂ (referred hereafter as TAT) multilayer films with nitrogen implantation is reported. In the present work, TAT films were fabricated with a total thickness of 100 nm by sputtering on glass substrates at room temperature. The as-deposited films were implanted with 40 keV N ions for different fluences (1×10¹⁴, 5×10¹⁴, 1×10¹⁵, 5×10¹⁵ and 1×10¹⁶ ions/cm²). The objective of this study was to investigate the effect of N⁺ implantation on the optical and electrical properties of TAT multilayer films. X-ray diffraction of TAT films shows an amorphous TiO₂ film with a crystalline peak assigned to Ag (111) diffraction plane. The surface morphology studied by atomic force microscopy (AFM) and field emission scanning electron microscope (FESEM) revealed smooth and uniform top layer of the sandwich structure. The surface roughness of pristine film was 1.7 nm which increases to 2.34 nm on implantation for 1×10¹⁴ ions/cm² fluence. Beyond this fluence, the roughness decreases. The oxide/metal/oxide structure exhibits an average transmittance ~80% for pristine and ~70% for the implanted film at fluence of 1×10¹⁶ ions/cm² in the visible region. The electrical resistivity of the pristine sample was obtained as 2.04×10⁻⁴ Ω cm which is minimized to 9.62×10⁻⁵ Ω cm at highest fluence. Sheet resistance of TAT films decreased from 20.4 to 9.62 Ω/□ with an increase in fluence. Electrical and optical parameters such as carrier concentration, carrier mobility, absorption coefficient, band gap, refractive index and extinction coefficient have been calculated for the pristine and implanted films to assess the performance of films. The TAT multilayer film with fluence of 1×10¹⁶ ions/cm² showed maximum Haacke figure of merit (FOM) of 5.7×10⁻³ Ω⁻¹. X-ray photoelectron spectroscopy (XPS) analysis of N 1s and Ti 2p spectra revealed that substitutional implantation of nitrogen into the TiO₂ lattice added new electronic states just above the valence band which is responsible for the narrowing of band gap resulting in the enhancement in electrical conductivity. This study reports that fabrication of multilayer transparent conducting electrode with nitrogen implantation that exhibits superior electrical and optical properties and hence can be an alternative to indium tin oxide (ITO) for futuristic TCE applications in optoelectronic devices.     

Preparation and characterization of transparent indium- doped TiO2 films deposited by MOCVD

Titanium dioxide (TiO₂) films doped with different indium (In) concentrations have been prepared on SrTiO₃ (STO) substrates by high vacuum metalorganic chemical vapor deposition (MOCVD). X-ray diffraction (XRD) analyses revealed the TiO₂ films doped with low In concentrations to be [001] oriented anatase phase and the films with high In concentrations to present polycrystalline structures. The 1.8% In-doped TiO₂ film exhibited the best electrical conductivity properties with the lowest resistivity of 8.68×10⁻² Ω cm, a Hall mobility of 10.9 cm² V⁻¹ s⁻¹ and a carrier concentration of 6.5×10¹⁸ cm⁻³. The films showed excellent transparency with average transmittances of over 85% in the visible range.     

Neutron transmutation of 10B doped diamond

Free standing ¹⁰B isotope doped diamond films deposited by chemical vapor deposition in a microwave chamber were irradiated to thermal neutron fluence values of 0.32 × 10¹⁹, 0.65 × 10¹⁹, 1.3 × 10¹⁹, and 2.6 × 10¹⁹ n/cm². Cooling of the diamond films was maintained during irradiation. In a separate experiment, neutron irradiation to a total fluence of 2.4 × 10²⁰ n/cm² with equal fast and thermal neutrons was also performed on a diamond epilayer without cooling during irradiation. The formation of defects in the diamond films was characterized using Raman, FTIR, photoluminescence, electron paramagnetic resonance spectroscopy, and X-ray diffraction. It was found that defect configurations in diamond responsible for an increase in continuum background in the one-phonon region of Raman spectrum were absent in the films that have been cooled. The FTIR peak at 1530 cm^− 1 annealed in the sample irradiated to a fluence of 2.6 × 10¹⁹ n/cm² indicating that the sample reached a temperature of 300 °C during irradiation. Absence of characteristic infrared absorption peaks that were observed only upon annealing neutron irradiated diamond is used to conclude that the temperature of the sample during neutron irradiation to a fluence of 2.6 × 10¹⁹ n/cm² was well below 650 °C needed for mobility of defects and accumulation of stable unrecoverable damage. On the other hand, results from diamond epilayer subjected to equal thermal and fast neutron fluence of 2.4 × 10²⁰ n/cm² and without cooling showed that defects formed from displaced carbon atoms became mobile and formed complex configurations of irrecoverable damage. Electrical conductance of the unirradiated and irradiated diamond samples was measured as a function of temperature to determine the compensation of the p-type by the n-type charge carriers.     

Influence of irradiation by 24 GeV protons on the properties of 4H–SiC radiation detectors

We had investigated the effects of the irradiation by 24 GeV protons with the doses from 10¹³ cm^− 2 up to 10¹⁶ cm^− 2 on the properties of radiation detectors fabricated as Schottky diodes on 4H–SiC. Numbers and activities of radionuclides and isotopes produced after the irradiation were analysed. Activities of ⁷Be and ²²Na were found to be proportional to the irradiation dose and ranged from 1.3 up to 890 Bq and from 1.9 up to 950 Bq, respectively. The total amount of formed stable isotopes was from 1.2 × 10¹¹ cm^− 2 up to 5.9 × 10¹³ cm^− 2. 390 days after the irradiation the number of radiated electrons with different energies ranged from 1.0 up to 600 per second, respectively. The contact properties were investigated by means of the current–voltage analysis. At lower irradiation doses a slight decrease of the effective potential barrier height from about 0.74 eV down to < 0.7 eV took place. The reverse current of the diodes grew by up to one order of magnitude. At the doses above 3 × 10¹⁵ cm^− 2 opposite changes were observed. Irradiation by up to 1 × 10¹⁶ protons/cm^− 2, resulted in the increase of the potential barrier height up to ∼ 0.85 eV, followed by the drop of the reverse current by up to two orders of magnitude. The observed effects were explained by the appearance of the disordered material structure because of the high-energy particle bombardment.     

The influence of ion beam assisted deposition parameters on the properties of boron nitride thin films

We studied ion beam assisted deposition of cubic boron nitride thin films on silicon (100) and high speed steel. The boron nitride films were grown by the electron beam evaporation of pure boron (99.4%) and the simultaneous ion bombardment of a mixture of nitrogen and argon ions from a Kaufman ion source. At a constant boron evaporation rate, the ion energy, ion current density, substrate temperature and process gas mixture was varied. The thickness of the films was kept between 200 and 300 nm. Boron nitride films with >80% of the cubic phase (determined by Fourier transform infrared spectroscopy) were obtained with nitrogen/argon mixtures of 50/50 at ion energies of 450 eV and substrate temperatures of 400°C. The current density amounted to 0.45 mA cm⁻² at a nominal boron rate of 200 pm s⁻¹. Cubic boron nitride films were deposited on high speed steel by introducing a titanium interlayer for adhesion improvement.     

Bio-inspired cross-linking with borate for enhancing gas-barrier properties of poly(vinyl alcohol)/graphene oxide composite films

The demand for flexible and transparent barrier films in industries has been increasing. Learning from nature, borate ions were used to cross-link poly(vinyl alcohol) (PVA) and graphene oxide (GO) to produce flexible, transparent high-barrier composite films with a bio-inspired structure. PVA/GO films with only 0.1 wt% GO and 1 wt% cross-linker exhibited an O₂ transmission rate <0.005 cc m⁻² day⁻¹, an O₂ permeability <5.0 × 10⁻²⁰ cm³ cm cm⁻² Pa⁻¹ s⁻¹, and a transmittance at 550 nm >85%; thus, they can be used for flexible electronics. Fourier transform infrared spectrometry and X-ray photoelectron spectroscopy indicated that the outstanding barrier properties are attributed to the formation of chemical cross-linking involving borate ions, GO sheets, and PVA, similar to the borate cross-links in high-order plants. Comparing our experimental data with the Cussler model, we found that the effective aspect ratio was significantly increased after cross-linking, suggesting that cross-linking networks connected GO with each other to form ultra-large impermeable regions. A feasible green technique, with potential for commercial production of barrier films for flexible electronics was presented.     

The control of BN and BC bonds in BCN films synthesized using pulsed laser deposition

A novel chemical bond transformation from BN to BC was observed in BCN films synthesized using pulsed laser deposition (PLD). BCN film prepared by using green laser (λ=532 nm) induced two IR absorption at 1370 and 800 cm⁻¹. This film was dominated by amorphous carbon phase and sp² hybridized BN bonds. BCN film deposited using an ultraviolet (UV) laser (λ=266 nm ) induced an addition infrared (IR) absorption at 1250 cm⁻¹. As we deposit BCN film by deep-UV laser (λ=213 nm), the absorption at 1370 and 800 cm⁻¹ disappeared while the absorption at 1250 cm⁻¹ remained. According to X-ray photoelectron spectroscopy (XPS), BC bonds with a carbon rich composition were formed. The formation of BC bonds in BCN films was also sensitive to deposition gas pressure and substrate temperature. Reactive carbon and boron species were needed to enable BC bonds that hybridized the carbon and the BN phases. A low substrate temperature was required to avoid competition with sp² hybridized pure BN and pure carbon bonds.     

Silicon carbide films from polycarbosilane and their usage as buffer layers for diamond deposition

Thin films of polycarbosilane (PCS) were coated on a Si (100) wafer and converted to silicon carbide (SiC) by pyrolyzing them between 800 and 1150 °C. Granular SiC films were derived between 900 and 1100 °C whereas smooth SiC films were developed at 800 and 1150 °C. Enhancement of diamond nucleation was exhibited on the Si (100) wafer with the smooth SiC layer generated at 1150 °C, and a nucleation density of 2 × 10¹¹ cm^− 2 was obtained. Nucleation density reduced to 3 × 10¹⁰ cm^− 2 when a bias voltage of − 100 V was applied on the SiC-coated Si substrate. A uniform diamond film with random orientations was deposited to the PCS-derived SiC layer. Selective growth of diamond film on top of the SiC buffer layer was demonstrated.     

Characterization of spray pyrolytically deposited high mobility praseodymium doped CdO thin films

Praseodymium (Pr) doped CdO thin films with high transparency and high mobility were deposited, using a homemade spray pyrolysis setup, on micro-slide glass substrates preheated at 300 °C. Polycrystalline nature and Cd-O bond vibration of deposited films were confirmed by X-ray diffraction, micro-Raman and Fourier transform infrared spectroscopy analyses. The oxidation state of Cd²⁺, O²⁻, and Pr³⁺ was confirmed by X-ray photoelectron spectroscopy analysis. The highest average particle size (92 nm-FESEM) and high RMS (13.48 nm-AFM) values are obtained for 0.50 wt% Pr doped CdO thin film. The optical band gap is varied between 2.38 eV and 2.52 eV, depending on the Pr doping concentration. Photoluminescence spectra revealed that Pr doped CdO thin film exhibits strong green emission at 582 nm. High mobility (82 cm²/V s), high charge carrier concentration (2.19×10²⁰ cm⁻³) and high transmittance (83%) were observed for 0.50 wt% Pr doped CdO film. A high figure of merit (9.79×10⁻³ Ω⁻¹) was obtained for 0.50 wt% Pr doped CdO thin films. The mechanism behind the above results is discussed in detail in this paper.     

Graphene synthesis by C implantation into Cu foils

Cu foils of 2 × 2 cm² have been implanted with 70 keV C⁻ ions to nominal fluences of (2–10) × 10¹⁵ cm⁻² at room temperature (RT) and subsequently annealed at 900–1100 °C for 15 min, before being cooled to RT to form graphene layers on the Cu surfaces. Analyses with Raman spectroscopy and atomic force microscopy demonstrate that a continuous film of bi-layer graphene (BG) is produced for implant fluences as low as 2 × 10¹⁵ cm⁻², much less than the carbon content of the BG films. This suggests that the implanted carbon facilitates the nucleation and growth of graphene, with additional carbon supplied by the Cu substrate (0.515 ppm carbon content). No graphene was observed on unimplanted Cu foils subjected to the same thermal treatment. This implantation method provides a novel technique for the selective growth of graphene on Cu surfaces.     

Effects of yttrium additions on the microstructure and charge transport properties of indium tin oxide semiconductors

The effects of yttrium (Y) additions (x=0, 0.05, 0.1, and 0.2) on the microstructure, chemical structure, and electrical properties of Y_xInSnO_y (YITO) thin films, prepared using a sol-gel process were examined. The transmission electron microscopy (TEM) observations showed that the undoped InSnO (ITO) film consisted of an amorphous structure with local crystalline domains on the film surface, whereas the Y additions (x=0.05, 0.1, and 0.2) to ITO suppressed the formation of the crystalline phase. X-ray photoelectron spectroscopy (XPS) analysis showed that the Y content decreased the concentration of oxygen vacancies owing to the strong incorporation of Y with oxygen. As a result of the Y incorporation, the carrier concentration of ITO films decreased. The saturation mobility (μ_sat), the on-off ratios (I_on/off), and the sub-threshold swing (S.S) of YITO films were 1.1 cm² V⁻¹ s⁻¹, ~10⁶, and ~0.5 V decade⁻¹, respectively, which are comparable with 1.7 cm² V⁻¹ s⁻¹, ~10⁵, and ~1.17 V decade⁻¹ of ITO film. Additionally, the initial threshold voltage (V_TH) was positive shift with increased of Y addition and V_TH shift (ΔV_TH) under the positive bias stress (PBS) results decreased by Y addition.     

Microstructure,optical and electrical properties of sputtered HfTiO high-k gate dielectric thin films

The microstructure, optical and electrical properties of HfTiO high-k gate dielectric thin films deposited on Si substrate and quartz substrate by RF magnetron sputtering have been investigated. Based on analysis from x-ray diffraction (XRD) measurements, it has been found that the as-deposited HfTiO films remain amorphous regardless of the working gas pressure. Meanwhile, combined with characterization of ultraviolet-visible spectroscopy (UV–vis) and spectroscopy ellipsometry (SE), the deposition rate, band gap and optical properties of sputtered HfTiO gate dielectrics were determined. Besides, by means of the characteristic curves of high frequency capacitance–voltage (C–V) and leakage current density–voltage (J–V), the electrical parameters, such as permittivity, total positive charge density, border trap charge density, and leakage current density, have been obtained. The leakage current mechanisms are also discussed. The energy band gap of 3.70 eV, leakage current density of 1.39×10⁻⁵ A/cm² at bias voltage of 2 V, and total positive charge density and border trap charge density of 9.16×10¹¹ cm⁻² and 1.3×10¹¹ cm⁻², respectively render HfTiO thin films deposited at 0.6 Pa, potential high-k gate dielectrics in future CMOS devices.     

Growth of cubic and hexagonal BN particles by using BBr3, NH4Br and metallic Na as reactants

Hexagonal BN (h-BN) particles were prepared by using BBr₃, NH₄Br and metallic Na as reactants in stainless steel autoclaves at 450 ºC for 24 h; When the target temperature was set in the range of 500–600 ºC, cubic BN (c-BN) particles that co-existed with h-BN were obtained. It is found that 600 ºC and a molar ratio of BBr₃ to NH₄Br of 1:3 are the optimal reaction parameters for the highest yield production of c-BN particles. c-BN powder with controllable content has been synthesized through a one-step method in the absence of solvents. The as-obtained samples that contain pure h-BN and the mixture of c-BN and h-BN have high thermal stabilities in ambient atmosphere below 920 and 1100 ºC, respectively.     

Comparison of the electrical behavior of Schottky diodes built on the nucleation and growth surfaces of polycrystalline diamond

In this work free-standing polycrystalline diamond was used to build Schottky diodes both on nucleation and growth surface of different films, in surface contact geometry, using gold and aluminum electrodes. The surface films were characterized by micro-Raman spectroscopy and Atomic Force Microscopy. The current–voltage characteristics of the devices were measured in a temperature range from 50 K to room temperature. The diodes showed a barrier height, attributed to the interface grain–metal, ranging from 1.26 to 1.74 V and an ideality factor from 1.4 to 1.8. All the diodes revealed the presence of deep states of energy, and its density close to the Fermi level ranges from 2 × 10¹² to 8 × 10¹⁶ eV^− 1 cm^− 3. These different characteristics were then related with both the films quality and the surface. The hypothesis of using the nucleation surface for building electronic devices is discussed.     

Room-temperature UV-ozone assisted solution process for zirconium oxide films with high dielectric properties

A facile, low-cost, and room-temperature UV-ozone (UVO) assisted solution process was employed to prepare zirconium oxide (ZrO_x) films with high dielectric properties. ZrO_x films were deposited by a simple spin-coating of zirconium acetylacetonate (ZrAcAc) precursor in the environment-friendly solvent of ethanol. The smooth and amorphous ZrO_x films by UVO exhibit average visible transmittances over 90% and energy bandgap of 5.7 eV. Low leakage current of 6.0 × 10⁻⁸ A/cm² at 3 MV/cm and high dielectric constant of 13 (100 Hz) were achieved for ZrO_x dielectrics at the nearly room temperature. Moreover, a fully room-temperature solution-processed oxide thin films transistor (TFT) with UVO assisted ZrO_x dielectric films achieved acceptable performances, such as a low operating voltage of 3 V, high carrier mobility of 1.65 cm² V⁻¹ s⁻¹, and on/off current ratio about 10⁴–10⁵. Our work indicates that simple room-temperature UVO is highly potential for low-temperature, solution-processed and high-performance oxide films and devices.     

Thermal,mechanical and electrical properties of hard B4C,BCN, ZrBC and ZrBCN ceramics

We study the thermal, mechanical and electrical properties of B₄C, BCN, ZrBC and ZrBCN ceramics prepared in the form of thin films by magnetron sputtering. We focus on the effect of Zr_x(B₄C)_1−x sputter target composition, the N₂+Ar discharge gas mixture composition, the deposition temperature and the annealing temperature after the deposition. The thermal properties of interest include thermal conductivity (observed in the range 1.3–7.3 W m⁻¹ K⁻¹), heat capacity (0.37–1.6×10³ J kg⁻¹ K⁻¹ or 1.9–4.1×10⁶ Jm⁻³ K⁻¹), thermal effusivity (1.6–4.5×10³ J m⁻² s^−1/2 K⁻¹) and thermal diffusivity (0.38–2.6×10⁻⁶ m² s⁻¹). We discuss the relationships between materials composition, preparation conditions, structure, thermal properties, temperature dependence of the thermal properties and other (mechanical and electrical) properties. We find that the materials structure (amorphous×crystalline hexagonal ZrB₂-like×nanocrystalline cubic ZrN-like), more than the composition, is the crucial factor determining the thermal conductivity and other properties. The results are particularly important for the design of future ceramic materials combining tailored thermal properties, mechanical properties, electrical conductivity and oxidation resistance.