压接连接工艺技术研究

介绍了压接连接技术的概念和特点,比较了压接连接与锡焊连接的特点及优势;对电子产品中常用的各种冷压端子进行了归类,介绍了闭合压线筒端子、开式压线筒端子的压接方法、工艺技术要求及检验标准;总结了压接工艺中导线的选用与处理方法、工具的使用及要求以及导线端头的处理等通用工艺。     

压接连接工艺技术

文章通过压接连接工艺技术与锡焊工艺技术进行性能比较,提出压接连接工艺技术的优越性。并规定了其工艺操作的技术要求、性能要求和质量保证要求。     

压接工艺及装配技巧

主要针对低频连接器压接特点,进行了压接工艺应用研究.在工艺试验的基础上,掌握了压接工艺的关键要素,明确了压接控制要求和控制方法,提出了压接工艺要求.重点讨论了处理屏蔽线时的压接装配技巧,为生产和设计提供参考.     

钢芯铝绞线塔上液压施工

随着电力技术的发展,四分裂、六分裂、双回路、四回路、多回路等架线施工越来越多,另有工期紧的抢修任务,还有地形不具备地面压接的情况。在以上情况下,塔上压接相比地面压接可以节约大量的时间,为赢得工期创造有利条件。文中论述了钢芯铝绞线塔上施工过程,包括压前准备、压接、压后控制三个阶段,提出了施工过程安全质量控制要点。     

动车组压接工艺全过程质量控制

通过对影响动车组端子压接工艺质量因素的分析,根据端子压接的基本工艺过程,提出了从电缆检验、端子质量检验、匹配关系以及压接工艺操作规范等方面综合进行压接工艺全过程质量控制的概念,为压接工艺的质量检验提供检查项点和参考依据,并提出了检验的基本技术方法。     

XKE连接器压接工艺实验研究

介绍了压接工艺技术的概念及特点;比较了压接技术与焊接技术相比的优点：无需外接电源、可靠性高、体积小和质量轻等;针对手动SYQ-001/002型压接工具与XKE连接器开展了相关工艺研究;利用拉脱力实验仪采集了三组共15个样本的拉脱力实验数据;通过对拉脱力实验数据的分析和对断层图片的判读,提出了影响压接质量的五个重要因素;总结了压接技术中常见的故障模式与故障原因。     

端子压接工艺分析及应用

本文通过端子压接与焊接的比较,以及端子压接的要求,阐述了以端子压接替代导线焊接的优势,并在PzK电控箱产品生产中得以应用,不仅避免了某些因焊接而带来的诸多问题,而且提高了生产效率。     

压接式F型连接器件的构造设计与连接方法

F型连接器件的构造设计和连接方法存在诸多问题,在工程施工和线路检修中表现为接触不良、电缆拉脱、射频泄漏、中心接触器件分离、漏水短路和打火拉弧等故障。针对以上问题,进行了一系列技术创新,研制了一种压接式F型连接器件,介绍压接式F型连接器件的构造设计与连接方法。     

连接器压接工艺技术

连接器广泛应用于航空航天、军工、电子产品等领域。作为系统最小和最基本的单元,在使用过程中,它很容易出现各种影响产品质量和可靠性的问题,因此,为了保证产品质量和提高产品的可靠性,有必要对其进行工艺应用研究。本文阐述了压接工艺的特点及工艺流程,并对实际应用中影响压接可靠性的因素进行了总结。     

压接连接工艺技术研究

概述了压接技术的概念、原理、设计要点和应用及其检测.通过实际应用,为了满足导线截面与插针孔孔径匹配,需分叉时用接头.总结出了导线与接头压接的典型压接工艺流程和控制点,并测试抗拉强度.     

嵌入元器件板推力研究

由于电子元器件组装及后续的设备安装运行过程中对于嵌入式器件与PCB的结合力（常用推出力表征）的严格要求,在制作含嵌入式器件PCB的过程中,需重点研究影响嵌入式器件推出力的因素及其控制方法。本项目设计正交试验,以PCB板厚、嵌入式器件锯齿数量、器件嵌入PCB开槽内的深度以及PCB开槽内镀铜厚度等四个因子各2两个水平进行试验研究,从而得出不同嵌入式器件推出力需求下的PCB板厚设计、嵌入式器件设计以及其它相关工艺参数等设计准则。     

Silicon carbide face-cooled 4% ceramic Nd:YAG laser

It has been demonstrated that silicon carbide (SiC) may be used as an efficient heatsinking material for intracavity face cooling of gain media in solid-state lasers. Comparative thermal modelling and temperature distribution measurements of a diode-pumped 4% Nd:YAG ceramic laser medium face cooled by undoped YAG (as a baseline), diamond and SiC lead to the belief that SiC is an effective replacement for much more expensive diamond in this application. Laser performance of a SiC face-cooled 4% Nd:YAG ceramic press-fit stack without AR coatings was demonstrated to have 24% slope efficiency     

Consumer applications of power semiconductors

Power semiconductors--transistors, thyristors, and rectifiers --all have found widespread application in the three major consumer markets --automotive, entertainment, appliance. These devices have been developed to provide low-cost solutions to existing needs. In the mid-1950's, the germanium power transistor, as used in hybrid auto radio sets, was the sole power semiconductor represented in a consumer application. It was soon joined by rectifiers designed for power supply use in line operated television sets. Near the turn of the decade, the development of press-fit alternator rectifiers created a completely new consumer use. Today these devices in only slightly modified form are used for the original application as well as a host of allied uses. Recently, power thyristors expressly designed for appliance controls have opened up entirely new concepts in this market area. Upwards of 200 million [1] power semiconductors are used in consumer applications each year. As technology progresses, indications are that this market will more than double in the next few years as TRIAC [2], [3] and QUADRAC open new appliance markets, as high-voltage power transistors phase into television, and as alternator regulators switch to large area integrated circuitry. Whether the market is automotive, appliance, or entertainment, and whether the application is audio, phase control, or switching, the penetration of power semiconductors into consumer use has followed a history of applying advanced device technology directly to a market opportunity. The successes have always been the result of providing lower costs, a better way, or in adding value to the consumer product. This paper will discuss the features of consumer power devices and their applications that make them different from their predecessors.     

Solder joint reliability in alternator power diode assemblies

Power diodes in an alternator convert alternating current, generated by the spinning magnetic field, to direct current to be used by the battery and all the automotive electrical/electronic components. The diodes are press-fit into aluminum heatsinks to quickly and efficiently dissipate the heat from the silicon dies in the diode body. The diodes are soldered to a rectifier circuit board through the diode leads by a wave soldering process using a Pb-free, eutectic Sn-3.5Ag solder. A set of positive diodes reside on a different substrate than the set of negative diodes, resulting in differences in the lengths of the diode leads. The distance from the diode body to the solder joint on the leads of the positive diodes is 7 mm less than those of the negative diodes. Solderability, cross-section micrographs, and thermal-cycling fatigue reliability studies were compared between the positive and negative diodes and between diode designs from different suppliers. Wetting balance testing showed significant differences in solderability between positive and negative diodes and between the two different diode designs. Combining the diode body and lead together had a more drastic effect on the solderability than the lead alone. It was discovered that, although the nature of the diode design is to dissipate the heat away from the diode quickly and efficiently, there is a large temperature gradient along the lead immediately above the solder bath which can be as much as 100°C just 2 mm from the bath. This large temperature gradient caused some leads to be too “cold” to form good solder fillets. The solder fillets obtained in the laboratory wetting tests matched those observed in the actual alternators. The inadequate solder fillets resulted in a 250% difference in the thermal cycling fatigue reliability between the two diode designs.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

电磁兼容检测实验室测试系统相符性比对研究

电磁兼容测试结果与检测实验室可靠性程度直接相关,检测实验室自身质量是保证电磁兼容测试结果准确性先决条件,检测实验室测试系统相符性则成为电磁兼容系统性能评估中需要考虑的关键内容和重要指标。因此,检测实验室测试系统相符性比对是实现电磁兼容系统评估研究的基础工作之一。本文首先针对电磁兼容检测实验室测试系统相符性比对的特点,结合自己几年来的测试实践论述了电磁兼容检测实验室测试系统相符性对比方案,然后提出了具体的案例同时进行了详细的分析,最后总结出了影响电磁兼容检测实验室测试系统相符性因素,整个案例和分析过程及结果可作为电磁兼容检测实验室测试系统相符性比对的手段和依据,具有重要的现实指导意义。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

圆球微腔对水蒸汽的敏感特性仿真实验研究

研究了圆球微腔在水蒸汽传感中应用的可行性。通过测试在有/无水蒸汽的气室环境下,圆球微腔透射光谱的变化来对气室水蒸汽浓度情况进行传感测试。仿真实验结果显示:在有无水蒸汽干扰的条件下系统输出光强有明显的变化,即研制基于圆球微腔的传感器是可行的。