X波段功率AlGaAs／InGaAs p－n－p异质结双极晶体管（HBT）

Ｘ波段功率ＡｌＧａＡｓ／ＩｎＧａＡｓｐ－ｎ－ｐ异质结双极晶体管（ＨＢＴ）＝Ｘ－ｂａｎｄｐｏｗｅｒＡｌＧａＡｓ／Ｉｎ－ＧａＡｓｐ－ｎ－ｐＨＢＴ’ｓ［刊，英］／Ｈｉｌｌ．Ｄ．Ｇ．…／／ＩＥＥＥＥｌｅｃｔｒｏｎＤｅｖｉｃｅＬｅｔｔｅｒｓ．１９９３．１４（４...     

InP衬底上的p－沟和n－沟异质结绝缘栅场效应晶体管

在ＩｎＰ衬底上用通常的晶格匹配（ｙ＝０．５３）和晶格失配（ｙ＞０．５３）Ｉｎ＿（０．５３）Ａｌ＿０．４８Ａｓ／Ｉｎ＿ｙＧａ＿（１－ｙ）Ａｓ层结构同时制作ｐ－沟和ｎ－沟曾强型异质结绝缘栅场效应晶体管（ＨＩＧＦＥＴ）。获得１μｍ栅长ｅ型ｐ－沟ＨＩＧＦＥＴ，其阈值电压约０．６６Ｖ，夹断尖锐，栅二极管开启电压０．９Ｖ，室温时非本征跨导＞２０ｍＳ／ｍｍ。相邻的（互补的）ｎ－小沟ＨＩＧＦＥＴ也显示ｅ型工作（阈值Ｖ＿ｔｈ＝０．１６Ｖ），低的漏电，０．９Ｖ栅开启电压和高跨导（ｇｍ＞３２０ｍＳ／ｍｍ）。这是首次报道在ＩｎＰ衬底上同时制作具有适合作互补电路特性的ｐ＿和ｎ－沟ＨＩＧＦＥＴ。     

通信卫星用GaAs微波场效应晶体管可靠性快速评价技术

叙述了一种快速评价ＧａＡｓ微波功率场效应晶体管可靠性的方法，利用该方法对ＧａＡｓ微波功率场效应晶体管ＣＸ５６２进行可靠性评估。     

科研成果介绍

科研成果介绍砷化镓功率场效应晶体管系列ＧａＡｓＰｏｗｅｒＭＥＳＦＥＴｓＳｅｒｉｅｓ南京电子器件研究所已研制成ＧａＡｓ功率场效应晶体管系列，具有以下特点：。用途广：卫星通讯，移动通讯，微波系统，微波数字通讯，相控阵雷达等设备中的振荡与功放。。高可靠：微...     

采用原位磷掺杂和大晶粒多晶硅发射极接触的64GHzf_T、3．6VBV_（CEO）硅双极晶体管

采用原位磷掺杂和大晶粒多晶硅发射极接触的６４ＧＨｚｆ＿Ｔ、３．６ＶＢＶ＿（ＣＥＯ）硅双极晶体管＝Ａ６４－ＧＨｚｆ＿Ｔａｎｄ３．６ＶＢＶ＿（ＣＥＯ）Ｓｉｈｉｐｏｌａｒｔｒａｎｓｉｓｔｏｒｕｓ－ｉｎｇｉｎｓｉｔｕｐｈｏｓｐｈｏｒｕｓ－ｄｏｐｅｄａｎｄｌａ...     

GaAsMESFET和DHEMT的中子辐射效应研究

本文介绍了ＧａＡｓＭＥＳＦＥＴ和ＨＥＭＴ的中子辐射效应。依据中子辐射损伤机理，分析了器件参数与中子辐射剂量Φ的依从关系，其中，器件参数包括物理参数Ｎ＿Ｄ、Ｎ＿ｓ、Ｖ＿ｓ，μ和电参数Ｉ＿ＤＳ、ｇ＿ｍ、Ｖ＿ｐ、Ｇ等。     

控制场效应晶体管（CFET）──一种新型的MMIC控制器件

控制场效应晶体管（ＣＦＥＴ）──一种新型的ＭＭＩＣ控制器件据《ＩＥＥＥ１９９５Ｍ．＆ＭＭ．Ｗ．Ｍｏｎｏｌ．Ｃｉｒｃ．Ｓｙｍｐ》报道，ＤａｖｉｄＪ．Ｓｅｙｍｏｕｒ等研制成一种微波单片控制电路用的新型ＧａＡｓ器件──控制场效应晶体管（ＣＦＥＴ）。为了降低...     

采用氧离子注入制作的重碳掺杂基极高f_（max）集电极AlGaAs异质结双极晶体管

采用氧离子注入制作的重碳掺杂基极高ｆ＿（ｍａｘ）集电极ＡｌＧａＡｓ／ＧａＡｓ异质结双极晶体管＝Ｈｉｇｈｆ＿（ｍａｘ）ｃｏｌｌｅｃｔｏｒ－ｕｐＡｌＧａＡｓ／ＧａＡｓｂｅｔｅｒｏｊｕｎｃｔｉｏｎｂｉｐｏ－ｌａｒｔｒａｎｓｉｓｔｏｒｓｗｉｔｈａｂｅａｖｉｌ...     

通信卫星用GaAs微波场效应晶体管可靠性快速评价技术

叙述了一种快速评价ＧａＡｓ微波功率场效应晶体管可靠性的方法, 利用该方法对ＧａＡｓ微波功率场效应晶体管ＣＸ５６２ 进行可靠性评估     

集电区阶梯缓变InGaAsP层的具有超高f＿（max）、f＿T的双异质结双极晶体管

本文用不同的发射极宽度和长度与集电极电流Ｉ＿ｃ和集电极－发射极问电压Ｖ＿ＣＥ的函数关系研究了集电区含ＩｎＧａＡｓＰ层、基区为Ｚｎ高掺杂的小尺寸ＩｎＰ／ＩｎＧａＡｓＤＨＢＴ的高性能。结果表明，减小发射极宽度比减其长度能更有效地提高，０．８μｍ发射极金属条宽的ＤＨＢＴ在Ｉ＿ｃ＝４ｍＡ的小电流时，具有超出超高的ｆ＿（ｍａｘ）和ｆ＿Ｔ，其数值分别为２６７ＧＨｚ和１４４ＧＨｚ，ｆ＿（ｍａｘ）的增加归结为基区电阻和降低了的Ｂｃ结电容乘积的降低。     

ANALYTICAL RESEARCH ON THE STATIC CHARACTERISTICS OF HETEROSTRUCTURE ISOLATED GATE FIELD-EFFECT TRANSISTORS

Based on improved charge control model and combining GSW velocity-field equa-tion, a series of analytical solutions for the static characteristics of HIGFETs such as I_D-V_D-V_G,I_(DS)-V_G, G_m and C_G are derived. The results of calculation are compared with experimentaldata reported in references, within the range of V_G<2V, I_D相似文献   

MMIC高温工作加速寿命试验失效机理分析

采用恒定功耗高温加速的试验方法,搭建了相关的试验系统,对高温工作寿命试验(HTOL)方法在功率GaAs MMIC领域的应用进行了一些探索。试验获得了对失效机理进行分析所需的失效数,所有样品的失效都是由同一原因引起的。通过监测数据和失效样品的分析,发现存在欧姆接触退化与栅金属下沉两种失效机理,但最终引起失效的机理单一,为栅金属下沉。     

CMOS工艺制备的高压PMOSFET温度特性研究

采用Cascade探针台与Agilent 4155B参数测试仪测试采用1.5μmP阱单层多晶单层金属CMOS工艺制作的宽长比为50∶4的高压PMOSFET在不同温度下(27°C～200°C)的器件特性,包括漏电流I_(DS)、阈值电压V_T、栅跨导gm的温度特性,并与常压PMOSFET温度特性比较,推导阈值电压值与温度的简单关系。     

Evaluation of the reliability of high concentrator GaAs solar cells by means of temperature accelerated aging tests

Evaluating the reliability, warranty period, and power degradation of high concentration solar cells is crucial to introducing this new technology to the market. The reliability of high concentration GaAs solar cells, as measured in temperature accelerated life tests, is described in this paper. GaAs cells were tested under high thermal accelerated conditions that emulated operation under 700 or 1050 suns over a period exceeding 10 000 h. Progressive power degradation was observed, although no catastrophic failures occurred. An Arrhenius activation energy of 1.02 eV was determined from these tests. The solar cell reliability [R(t)] under working conditions of 65°C was evaluated for different failure limits (1–10% power loss). From this reliability function, the mean time to failure and the warranty time were evaluated. Solar cell temperature appeared to be the primary determinant of reliability and warranty period, with concentration being the secondary determinant. A 30‐year warranty for these 1 mm²‐sized GaAs cells (manufactured according to a light emitting diode‐like approach) may be offered for both cell concentrations (700 and 1050 suns) if the solar cell is operated at a working temperature of 65°C. Copyright © 2012 John Wiley & Sons, Ltd.     

Integrated Hydrogen-Sensing Amplifier With GaAs Schottky-Type Diode and InGaP–GaAs Heterojunction Bipolar Transistor

New hydrogen-sensing amplifiers are fabricated by integrating a GaAs Schottky-type hydrogen sensor and an InGaP–GaAs heterojunction bipolar transistor. Sensing collector currents ( $I_{rm CN}$ and $I_{rm CH}$) reflecting to $hbox{N}_{2}$ and hydrogen-containing gases are employed as output signals in common-emitter characteristics. Gummel-plot sensing characteristics with testing gases as inputs show a high sensing-collector-current gain $(I_{rm CH}/I_{rm CN})$ of $≫hbox{3000}$. When operating in standby mode for in situ long-term detection, power consumption is smaller than 0.4 $muhbox{W}$. Furthermore, the room-temperature response time is 85 s for the integrated hydrogen-sensing amplifier fabricated with a bipolar-type structure.      

GaAs微波功率FET可靠性评价技术研究

为了使GaAs微波功率FET更可靠地应用于重要微波系统，选取高可靠器件生产线生产的CS0531型器件进行加速寿命试验，并研制了专用试验设备。观察到器件n因子随着试验时间有增大的趋势，初始低频噪声值与器件突然烧毁有一定的相关性。这一结果表明低频噪声有可能成为未来评价GaAs器件可靠性的一种方法。该器件失效机构激活能2．45eV，为道温度110℃时，10年平均失效率4Fit，平均寿命75137×1011h。     

应变Si/SiGe沟道功率UMOSFET的模拟分析

提出一种应变Si/SiGe UMOSFET结构,并与Si-UMOSFET器件的电流-电压特性进行比较;对SiGe区域在UMOSFET器件中的不同厚度值进行静态电学仿真。应变Si/SiGe异质结能够有效地提高沟道区载流子的迁移率,增大IDS,降低Vth及器件的Ron;且应变异质结与载流子有效传输沟道距离的大小,对器件的Vth、Isat、V(BR)DSS及电流-电压特性都有较大的影响。因此在满足击穿电压要求的基础上,应变Si/SiGe沟道异质结的UMOSFET相对Si-UMOSFET在I-V特性和Ron方面有较大的改进。     

粉末冶金材料激光深熔焊接光致等离子体行为及控制

采用LSM2 4 0型全自动CO2 激光焊接机焊接粉末材料 ,研究不同粉末材料产生等离子体所需的临界激光功率。粉末配方为 :Fe粉 +15 %羟基Fe粉 ,Co粉 ,Ni粉 +15 %羟基Ni粉三种试样。研究结果表明 ,Fe ,Co ,Ni三种试样在CO2 激光作用下产生金属蒸气时的临界激光功率密度IC 为ICFe >ICCo >ICNi;等离子体得以有效控制的下限临界气流量QS 为QFeS 相似文献   

大功率GaAs/GaAlAs单量子阱激光器

采用MOCVD技术在φ40mmGaAs衬底上研制成大功率GaAs/GaAlAs单量子阱激光器。该激光器激射波长为830～870nm,室温CW阈值电流密度小于350A/cm~2,最低值为310A/cm~2,输出光功率大于200mW/(单面,未镀膜)。     

Characteristics of I2L at low current levels

The validity of the injection model is assessed in the low power range. Experimental evidence is given that the three base current components (I_{nc}, I_{no}, and Ip) can be determined from a three-gate experiment. The results are explained from the underlying device physics. Experimental data are presented for the temperature dependence of the upward current gain.