Asynchronous transfer mode switching LSI chips with 10-Gb/s serialI/O ports

LSI chips were developed that fit on a switching fabric using chip-to-chip optical interconnections; they have 10-Gb/s serial input and output ports, which facilitates the layout of optically interfaced switching element modules. A test switching module composed of these chips was operated at 10.2 Gb/s without bit errors. Ultrahigh-speed switching LSI chips have been developed for a future asynchronous transfer mode (ATM) switching system with an over-Tb/s capacity. Their serial input and output ports facilitate chip-to-chip optical interconnection. Cell-dropper and crosspoint-router LSI chips, composing the core of the switching element, were fabricated by using GaAs LSI technology. A test switching module composed of these chips was operated at 10.2 Gb/s without bit errors     

光互连研究进展

光互连在高度并行、高速、大容量的数字系统和智能计算等领域显示了卓越的潜能。文章首先比较了在超大规模集成系统（ＶＬＳＩ）中光互连和电互连的优劣,总结了各种类的光互连及近年取得的新进展,并分析了光互连遇到的困难和未来前景。     

Compact packaging of optical and electronic components for on-board optical interconnects

An optical interconnection plate was developed in order to achieve a compact and cost-effective interconnection module for an optical data link between chips on printed circuit boards. On the silica substrate, transmission lines and solder bumps are formed on the top surface of the substrate, and polymer waveguide array with 45/spl deg/ mirror planes is formed on the back side. This optical interconnection plate technique makes the alignment procedure quite simple and economical, because all the alignment steps between the optical components can be achieved in wafer processes and a high accuracy flip-chip bonding technique. We confirmed the sufficiently high coupling efficiency and low optical crosstalk using the simplified experimental setup. Flip-chip bonding of the vertical-cavity surface-emitting laser and photodiode arrays on the top surface of the optical interconnection plate was performed using indium bumps in order to avoid thermal damage of the polymer waveguide. The fully packaged optical interconnection plate showed an optical data link at rates of 455 Mb/s. Improvement of the mirror surface roughness and the mirror angle accuracy could lead to an optical link at higher rates. In addition, the interconnection system can be easily constructed by inserting the optical interconnection plate between the processing chips or data lines requiring optical links.     

光互连新进展

本文首先分析了在超大规模集成电路中电互连所遇到的困难,讨论了光学互连的优点。然后,总结了各种光互连,包括导波光互连和自由空间光互连的最近进展,最后分析了光互连研究中所遇到的困难以及相应的解决办法。     

A full asynchronous serial transmission converter for network-on-chips

Large transmission power consumptions and excessive interconnection lines are two shortcomings which exist in conventional network-on-chips. To improve performance in these areas, this paper proposes a full asynchronous serial transmission converter for network-on-chips. By grouping the parallel data between routers into smaller data blocks, interconnection lines between routers can be greatly reduced, which finally brings about saving of power overheads in the transmission process. Null convention logic units are used to make the circuit quasi-delay insensitive and highly robust. The proposed serial transmission converter and serial channel are implemented based on SMIC 0.18 μm standard CMOS technology. Results demonstrate that this full asynchronous serial transmission converter can save up to three quarters of the interconnection line resources and also reduce up to two-thirds of the power consumption under 32 bit data widths. The proposed full asynchronous serial transmission converter can apply to the on chip network which is sensitive to area and power.     

一种基于标准CMOS工艺的单片光互连

探索了采用标准CMOS工艺实现单片光互连的可行性。采用特许(Chartered)半导体公司3.3V、0.35μm标准模拟CMOS工艺设计并制造了一种单片光互连系统,并用两种结构研究了衬底噪声耦合对互连性能的影响。测试结果表明:该光互连系统可工作于几×103Hz,验证了基于标准CMOS工艺的单片光互连系统是可行的。     

光互连与面发射激光二极管

为克服光通信、电子计算技术等的速度限制,采用光互连是一种有效途径。光互连也是光计算机的基本技术。文中对光互连技术进行了分析,并介绍了一种有利于光互连的最理想光源——面发射激光二极管。     

Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board

The demonstration of an optical platform based on an optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip optical interconnection. The optical platform was designed for 96 Gb/s total throughput which was 2 layers times 4 channels times 4 parallel links times 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D optical interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90deg-bent fiber connectors, and 2-D optical transmitter/receiver (Tx/Rx) modules. The total optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The optical interconnection using an optical platform was successfully achieved with 3-Gb/s/ch data transmission     

OE MCM的自由空间光互连结构及其设计

现代集成电路系统采用的互连技术中,电互连和光互连各有优缺点,ＯＥＭＣＭ可以根据实际情况将二者的特点结合起来。目前国际上流行的自由空间光互连技术已经应用于异步传输模式和并行处理计算机结构中。着重介绍采用自由空间光互连ＯＥ ＭＣＭ的结构和设计考虑。     

迈向21世纪的光互连和光计算机

为了适应２１世纪高度信息化社会的需要，解决目前电子系统中电互连和信息处理技术带来的局限，光互连与光计算已成为跨世纪引人注目的话题，文中介绍光互连的特点，功能．形式，以及在光计算机和光神经网络中的作用。     

Advanced optical interconnection technology in switching equipment

Demands for increased interconnection density and higher bandwidth, coupled with stringent cost constraints of advanced wide bandwidth telecommunication switching equipment, are exhausting conventional electrical interconnection capabilities. The requirement for greater interconnection capabilities, spawned in part by the advances in integrated circuit technologies and the need for enhanced digital services, dictate that technology advancement must occur in traditional electronic packaging and/or interconnection techniques. The resolution of these technological needs is paramount for the successful competitive introduction of these systems. Presently, a “bottle-neck” occurs at the board-to-board level of the interconnection hierarchy. Therefore, an opportunity exists for the development of new optical interconnection techniques which can be incorporated into system designs beginning at this interconnection level and beyond. The strategic insertion of optical interconnection technology into these electronic processing systems not only meets projected performance requirements, but potentially offers them at a competitive cost. This paper describes some of the new optical strategies switching equipment designers are incorporating into today's products. These strategies range from optical data links to an implementation of a flexible optical backplane called OptiFlex     

一种高效、高分辨的FPS光学互连网络

提出了一种ＦＰＳ光学互连的新装置。在这一装置中，由于使用普通透镜和光楔作为光学互连元件，故其结构简单，制备方便，价格便宜，并具有高的光能利用率和高的互连信道密度等优点，因而具有实际应用价值     

并行计算机系统的光WDM互连链路

光波分复用 (WDM)互连接是并行计算机系统克服“电子瓶颈”的可行方案 ,光纤传输的特性可使大容量、低时延、低误码率传输的并行计算机互连成为现实。探讨了并行计算机光WDM互连的一种结构 ,分析研究了其中的关键技术 ,并设计了一个实验系统。分析和实验表明采用光WDM互连可以实现超大容量的并行计算机系统     

无线光互连技术发展综述

人们对无线宽带通信技术的需求在近些年稳步增长.无线电波频谱的带宽限制和频带拥堵,通过微波无线网络的发展已经有了明显的改善.然而,无线光互连技术才能使得数据传输带宽达到理想的要求.作为许多无线通讯系统的最终方案,无线光互连也被选择为长期的解决策略.并且,无线光互连的大量优势还没有得到完全的发掘,许多基础性和应用性的研究还需要在实验层面和商业应用层面加以深入.国外,Gb/s的无线光传输已经在实验室中得到了验证,然而,可用的室内无线光互连系统也仅仅达到了155Mb/s的速度.下面将着重从收发系统、性能及安全性方面对无线光互连技术作一概况阐述.     

VCSEL技术与并行光互联

介绍了VCSEL结构和技术特点，它以很高的性能价值比成功地应用于单通道和并行光互联，并将在宽带以太网、高速数据通信网中得到广泛的应用，以VCSEL为基础器件的高速大容量、高并行处理功能的光互连、光交换系统有着极好的应用前景。     

可重构阵列处理器光电混合互连原型系统实现

高效视频编码(HEVC)标准在提升编码性能的同时,对系统带宽提出了更高的要求。传统电互连方式存在带宽小和时延大的问题,而光互连的高带宽和低功耗为片上资源数据通信提出了新的解决方案。然而由于工艺水平的限制,集成光器件无法在现场可编程门阵列(FPGA)芯片内部实现。采用片外光器件模拟片上光互连系统可以达到原型验证的目的。文章基于BEE4开发平台在单片上采用电互连方式进行数据通信,在Xilinx V6系列芯片间通过接入4通道小型可插拔+(QSFP+)光模块搭建光通信链路,构建光通信网络,实现了光电混合互连网络原型系统。以分辨率176×144的标准测试序列akiyoqcif176×144.yuv为例进行测试,实验结果表明,以光链路替代片间电通信能够正确实现,且板间传输时间仅为电互连的一半,综合频率为51.327 MHz。     

Optical fiber interconnection for the scalable parallel computingsystem

In this paper, we discuss the optical fiber interconnection technologies applied in the two types of parallel processing systems: 1) a backplane interconnection in a parallel processor array system and 2) a computing cluster network. We have set up a parallel processor array system using optical fiber to make point-to-point interconnection between processor elements and are developing a low-cost virtual parallel optical fiber interconnection link (VPOFLink) complying with peripheral component interconnect (PCI) local bus specifications for the computing cluster. VPOFLink is integrated with the popular PCI bus interface in order to make the link hold the same bandwidth as that of the PCI bus. It was fabricated as an available peripheral device that can been inserted into the bus slots of commercial computers directly and can operate under the control of PCI bus. Also in this paper, we demonstrate the optical fiber link for a ring network and the architecture of the ring network     

Integrated optical interconnections

The use of optical interconnections between processors, boards, chips, and gates in electronic digital systems to overcome the current performance limitations is described. The advantages of optical interconnections in relation to the interconnection distance, the data capacity, and the interconnection functions are presented. The devices which will support practical implementation of optical interconnections and the integration of optical interconnection devices are discussed. The development of future integrated optoelectronic materials, processing, and fabrication technologies to support integrated optical electronics is also discussed     

光互连的研究与新进展

讨论了集成电路向高集成度、高工作频率和更小特征尺寸发展时,常规金属互连存在的问题以及光互连对大系统如多芯片组件(MCM)、单芯片系统(SOC)等互连时的潜在优势。介绍了光互连发展中的几种新技术,太位自由空间转换加速器网络(FAST-Net)、选择性重复填充转移光刻组装(PL-pack with SORT)、自组织光波网络(SOLNET)、质子纵深成形(DLP)及光互连性能优化(带宽、功耗等)的研究,最后给出光互连所面临的一些问题并展望了其发展前景。     

Crossbar光交换网络

Crossbar网络是实现高速并行光学处理的一种最重要而有效的光交换网络结构。作为一种无阻塞网络,Crossbar网络具有简单性,易于实现控制,适合于构成光开关矩阵。总结和分析了近20多年来发展的Crossbar光交换网络,介绍了不同Crossbar光交换网络的原理、结构和性能,分析了Crossbar光交换网络的关键技术。目前光学互连网络的发展方向是实现集成大规模光互连。可以预见光学互连网络会朝着更加实用化的方向发展,并在其应用领域发挥越来越重要的作用。