1.5微米波段GaAs基异变InAs量子点分子束外延生长

1.55微米波段GaAs基近红外长波长材料在光纤通讯,高频电路和光电集成等领域有潜在的应用价值。本文用分子束外延方法研究了GaAs基异变InAs量子点材料的生长,力图实现在拓展量子点发光波长的同时保持或增加InAs量子点的密度。在实验中,首先优化了In0.15GaAs异变缓冲层的生长,研究了生长温度和退火对减少穿通位错的作用。在此基础上,优化了长波长InAs量子点的生长。最终在GaAs基上获得了温室发光波长在1491nm,半高宽为27.73meV,密度达到4×1010cm-2的InAs量子点。     

单光子源低密度长波长InAs／GaAs量子点的制备

通过优化分子束外延生长条件,得到室温发光在1300nm低密度的自组织InAs/GaAs量子点.使用极低的InAs生长速率(0.001单层/秒)可以把量子点的密度降低到4×106cm-2.这些结果使得InAs/GaAs量子点可以作为单光子源应用在未来的光纤基量子密码、量子通信中.     

有缺陷和无缺陷量子点内应变分布的比较与分析

阐述了量子点内能级结构与应变的关系,用ANSYS7．1计算了有缺陷和无缺陷两种情况下：InAs／GaAs量子点的应变分布,通过对计算结果的比较,讨论了两种情况下不同的应变分布对量子点电子结构影响的不同结果,指出有缺陷时量子点各能级的改变量都与无缺陷时不同,无缺陷时应变的作用只是使能级平行移动;有缺陷时,缺陷将使量子点内能级结构复杂化,有缺陷时发光波长和发光光谱都比无缺陷时复杂。     

自组织InAs/GaAs量子点的X射线双晶衍射研究

用X射线双晶衍射方法测定了自组织生长的InAs／GaAs量子点的摇摆曲线，根据Takagi-Taupin方程对曲线进行了拟合。在考虑量子点层晶格失配的情况下，理论曲线和实验曲线符合得很好，从而确定了量子点垂直样品表面的失配度，约为4～6％，这与宏观连续体弹性理论的预测相近。结合电镜、原子力显微镜的观察结果表明对子单层沉积方法获得的量子点层采用化合物构层进行拟合所得结果是合理的。     

更正

(1)应作者要求更正基金项目编号,2011年第1期第82页自组织InAs/GaAs与InGaAs/GaAs量子点生长及退火情况的比较和2010年第6期第70页不同V/III束流比对GaAs(001)面重构相的影响这两篇论文中的基金项目:国家自然科学基金资助项目(编号由60886001更正为60866001)。     

自组织InAs/GaAs与InGaAs/GaAs量子点生长及退火情况的比较

本文采用MBE进行InAs/GaAs与InGaAs/GaAs量子点的生长,利用RHEED进行实时监测,并利用RHEED强度振荡测量生长速率。对生长的InAs/GaAs和InGaAs/GaAs两种量子点生长过程与退火情况进行对比,观察到当RHEED衍射图像由条纹状变为网格斑点时,InAs所需要的时间远小于InGaAs;高温退火下RHEED衍射图像恢复到条纹状所需要的时间InAs比InGaAs要长。     

Ge基GaAs薄膜和InAs量子点MBE生长研究

采用分子束外延(MBE)法,在优化Ge衬底退火工艺的基础上,通过对比在(001)面偏<111>方向分别为0°、2°、4°和6°的Ge衬底上生长的GaAs薄膜,发现当Ge衬底的偏角为6°时有利于高质量GaAs薄膜的生长;通过改变迁移增强外延(MEE)的生长温度,发现在GaAs成核温度为375℃时,可在6°偏角的Ge衬底上获得质量最好的GaAs薄膜。通过摸索GaAs/Ge衬底上InAs量子点的生长工艺,实现了高效的InAs量子点光致发光,其性能接近GaAs衬底上直接生长的InAs量子点的水平。     

InAs沉积量对InAs/GaAs量子点表面形貌的影响

基于分子束外延(MBE)技术,以反射式高能电子衍射仪(RHEED)作为实时监测工具,在经过Ga液滴刻蚀而具有纳米洞的GaAs衬底上沉积不同厚度的InAs材料形成量子点,并利用扫描隧道显微镜(STM)研究了量子点的形成及分布与InAs沉积量之间的关系。结果表明,在GaAs衬底平坦区,InAs按照SK模式生长,在纳米洞位置,洞内及其周围的台阶会约束量子点的生长成核,而随着InAs沉积量的增加,这种约束会逐渐减小。特别是当InAs沉积量为2ML时,在纳米洞周围会形成尺寸均匀、分布有序且呈环状的量子点结构。     

量子点2D-3D完整生长过程的Monte Carlo模拟

利用蒙特卡罗模拟方法对GaAs衬底上MBE法自组织生长InAs量子点的过程进行了研究,完成了量子点二维到三维生长完整过程的模拟.充分考虑应力应变的影响因素,首次使用指数函数形式的应力应变模型,使模拟结果更加可靠.通过改变衬底温度, 生长停顿时间,得到了不同条件下量子点生长的计算机模拟图形并对结果进行了讨论.结果发现,适中的温度和较充分的迁移时间有助于生长出高质量的量子点.     

InAs/GaAs自组织量子点的可控分子束外延生长及其新型光电器件研究北大核心CSCD

半导体量子点因其具有类原子的分立能级结构,可在三维方向上对载流子运动进行束缚,因此被认为是光发射器件(激光器、量子光源等)极具前景的有源物质之一。其器件的性能强烈依赖于量子点材料的品质、光场与量子点偶极子场的有效相互作用等。本文将从半导体InAs/GaAs自组织量子点的可控分子束外延生长调控技术出发,进一步探讨应用于光通信、片上光互联领域的量子点激光器,以及应用于光量子信息领域的高品质量子光源器件。     

Issues related to the implementation of Pb-free electronic solders in consumer electronics

Consumer electronic applications are the primary target of the Pb-free initiative and package assembly and performance is affected by the move from eutectic Sn–Pb to Pb-free solder alloys. This paper outlines the key issues and mitigation possibilities for package assembly using Pb-free solders: High temperature reflow, Interfacial reactions, and Reliability. At the high temperatures required to reflow Pb-free alloys, moisture absorbed into the package can result in delamination and failure. The reaction of the Pb-free solder with Ni and Cu metallizations results in interfacial intermetallics that are not significantly thicker than with Sn–Pb but provide a path for fracture under mechanical loading due to the increased strength of the Pb-free alloys. The reliability issues discussed include thermomechanical fatigue, mechanical shock, electromigration and whiskering. The Pb-free alloys tend to improve thermomechanical fatigue and electromigration performance but are detrimental to mechanical shock and whiskering. Design trade-offs must be made to successfully implement Pb-free alloys into consumer applications.     

Intermetallic compounds in 3D integrated circuits technology: a brief review

Abstract

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.     

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use of lead (Pb) by the European Union. As a result, electronic manufacturers have sought a material comparable to the conventional 63Sn37Pb solder that has been traditionally used to assemble electronic hardware. Based on extensive review of various solder combination, the majority of electronic manufacturers appear to be adopting a tin–silver–copper (SAC) solder as a popular Pb-free solder replacement. Significant investments have been made by many researchers to characterize the material behavior and durability of this solder system. While the exact composition of the SAC solder is still in question, it now appears that the 96.5Sn3.0Ag0.5Cu (SAC305) solder is gaining wider acceptance as the favored Pb-free replacement, for surface mount assemblies that are going to be subjected predominantly to cyclic thermal environments. This paper presents a review of our current understanding of the life expectancy of Pb-free SAC solder interconnects for electronic hardware. To this end, the paper focuses on material characterization of SAC solder, as well as its temperature cycling and vibration fatigue reliability. From this review, SAC solder interconnects are shown to be suitable for providing adequate life expectancies for temperature cycling in electronic hardware. However, it is clear that there are differences between SAC and the conventional Sn37Pb solder, that need to be understood in order to design reliable electronic hardware.     

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

The global electronic assembly community is striving to accommodate the replacement of Pb-containing solders, primarily Sn–Pb alloys, with Pb-free solders due to environmental regulations and market pressures. Of the Pb-free choices, a family of solder alloys based on the Sn–Ag–Cu (SAC) ternary eutectic (T _eut. = 217°C) composition have emerged with the most potential for broad use across the industry, but the preferred (typically near-eutectic) composition is still in debate. This review will attempt to clarify the characteristic microstructures and mechanical properties of the current candidates and recommend alloy choices, a maximum operating temperature limit, and directions for future work. Also included in this review will be an exploration of several SAC + X candidates, i.e., 4th element modifications of SAC solder alloys, that are intended to control solder alloy undercooling and solidification product phases and to improve the resistance of SAC solder joints to high temperature thermal aging effects. Again, preliminary alloy recommendations will be offered, along with suggestions for future work.     

Reliability of Pb-free solders for harsh environment electronic assemblies

Abstract

Since 2006 and the implementation of environmental regulations, the electronic industry has moved to Pb-free solders. Harsh environment industries that were exempted from the regulations will soon have to follow suit. However, a suitable replacement solder for use in harsh environments still has to be validated and reliability models are yet to be established. In this review, research that led to the selection of currently used Pb-free alloys and the continuing search for high reliability alloys are described. Sn pest and Sn whiskers, potential major threats for electronics operating in harsh environments, are highlighted. This review also focuses on the microstructure, mechanical properties and deformation mechanisms of Pb-free alloys. Emphasis is placed on Sn–Ag–Cu alloys, now considered to be the alloys of choice for replacement of Sn–Pb solders. The reliability of Pb-free electronic assemblies is studied, focusing on thermal fatigue, believed to be the main source of failure through creep–fatigue mechanisms. The validity of models for Pb-free solder joints life time prediction is assessed and the lack of cohesiveness among the available reliability data is examined.     

Lead-free Solders in Microelectronics

Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable “Pb-free” solders an important issue for microelectronics assembly. Approximately 70 Pb-free solder alloy compositions have been proposed thus far. There is a general lack of engineering information, and there is also significant disparity in the information available on these alloys. The issues involved can be divided into two broad categories: manufacturing and reliability/performance. A major factor affecting alloy selection is the melting point of the alloy, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and intermetallic compound formation. The data available in the open literature have been reviewed and are summarized in this paper. Where data were not available, such as for corrosion and oxidation resistance, chemical thermodynamics was used to develop this information. While a formal alloy selection decision analysis methodology has not been developed, less formal approaches indicate that Sn-rich alloys will be the Pb-free solder alloys of choice, with three to four alloys being identified for each of the different applications. Research on this topic continues at the present time at a vigorous pace, in view of the imminence of the issue.     

Rare-earth additions to lead-free electronic solders

The research in lead(Pb)-free solder alloy has been a popular topic in recent years, and has led to commercially available Pb-free alloys. Further research in certain properties to improve aspects such as manufacturability and long term reliability in many Pb-free alloys are currently undertaken. It was found by researchers that popular Pb-free solders such as Sn–Ag, Sn–Cu, Sn–Zn and Sn–Ag–Cu had improved their properties by doping with trace amounts of rare earth (RE) elements. The improvements include better wettability, creep strength and tensile strength. In particular, the increase in creep rupture time in Sn–Ag–Cu–RE was 7 times, when the RE elements were primarily Ce and La. Apart from these studies, other studies have also shown that the addition of RE elements to existing Pb-free could make it solderable to substrates such as semiconductors and optical materials. This paper summarizes the effect of RE elements on the microstructure, mechanical properties and wetting behavior of certain Pb-free solder alloys. It also demonstrates that the addition of RE elements would improve the reliability of the interconnections in electronic packaging. For example, when Pb-free-RE alloys were used as solder balls in a ball grid array (BGA) package, the intermetallic compound layer thickness and the amount of interfacial reaction were reduced.     

Electrochemical composite deposition of Sn–Ag–Cu alloys

The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb–Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. One of the most promising replacements is eutectic or near-eutectic Sn–Ag–Cu alloys produced by electrodeposition. In this study, simple and “green” Sn–Cu-citrate solutions with suspended Ag particles have been developed and optimized for electrochemical composite deposition of eutectic and near-eutectic Sn–Ag–Cu solder films. Different plating conditions, including solution concentration, current density, agitation and additives, are investigated by evaluating their effects on plating rate, deposit composition and microstructure.     

Preparation of soft solder joints

The preparation of solder joints in electronic applications is not easy because the solder is soft and often surrounded by hard and brittle materials. Smearing, scratching, and structural changes caused by the preparation as well as destruction of the specimens during preparation due to their filigree geometries make the procedure demanding. A sequence has been developed that enables the preparation of soft solder under these difficult circumstances. The preparation and the development of the phases found in solder is explained step by step and illustrated with examples.     

Impact of the ROHS Directive on high-performance electronic systems

The European Union enacted legislation, the ROHS Directive, that bans the use of lead (Pb) and several other substances in electronic products commencing July 1, 2006. The legislation recognized that in some situations no viable alternative Pb-free substitute materials are known at this time, and so provided exemptions for those cases. It was also recognized that certain electronic products, specifically servers, storage and storage array systems, network infrastructure equipment and network management for telecommunication equipment referred to as high-performance electronic products, perform tasks so important to modern society that their operational integrity had to be maintained. The introduction of new and unproven materials posed a significant potential reliability risk. Accordingly, the European Commission (EC) granted an exemption permitting the continued use of Pb in solders, independent of concentration, for high-performance (H-P) equipment applications. This exemption was primarily aimed at assuring that the reliability of solder joints, particularly flip-chip solder joints is preserved. Flip-chip solder joints experience the most severe operating conditions in comparison to other applications that utilize Pb in electronic equipment. This paper briefly describes the solder-exempted H-P electronic products, their capabilities, and some typical tasks they perform. Also discussed are the major attributes that differentiate H-P electronic equipment from consumer electronics, particularly in relation to their operational and reliability requirements. Interestingly, other than the special solder exemption accorded to H-P electronic equipment, these products must meet all the other requirements for ROHS compliancy. The EC was aware that issues would surface after the legislation was enacted, so it created the Technical Advisory Committee (TAC) to review industry-generated requests for exemptions. The paper discusses three exemption requests granted by the EC that are particularly relevant to H-P electronic products. The exemptions allow the continued use of lead-bearing solder materials.