压电喷墨3D打印射频多层电路工艺

针对传统射频电路板加工周期长、工艺流程复杂等问题,创新性地采用压电喷墨3D打印技术打印射频天线多层电路板,开展了打印材料、打印参数及打印工艺对成型效果的研究.经测试,打印的样件在外形尺寸、打印线路精度,以及驻波损耗等电性能方面均能达到设计指标要求.论证了压电喷墨3D打印技术可有效用于射频多层电路的快速制造和快速验证,为...     

新产品与新技术（11）

喷墨打印技术帮助实现可印刷电子可印刷电子产品正在成为新一轮电子革命热潮,喷墨打印技术帮助实现电路印刷。日本Konicaminolta公司开发了喷墨打印技术,适用于LCD膜、印制板、IC封装板和太阳能电池等图形加工,可采用水溶性油墨、溶剂型油墨、导电性油墨等多种,达到360dpi(71μm节距)的解像率。已有喷印银纳米粒子的导电油墨制作高密度印制板。     

喷墨打印在液晶用彩色滤光片制造中的应用

彩色滤光片是液晶显示器件的重要组件,为了降低生产成本并提高显示性能,新型彩色滤光片制造技术的研发成为热点。喷墨打印具有快速、精准、材料利用率高等一系列优点,成为替代传统颜料分散法的新一代彩色滤光片制备技术。文章介绍了喷墨打印的基本原理,比较了喷墨打印成膜与传统涂布成膜的优缺点,分析了喷墨法制备彩色滤光片的技术关键,并根据目前的产业现状提出了努力方向。     

喷墨打印银电极用于有机晶体管器件与电路

使用喷墨打印技术制得了高质量的导电银电极,并制备了高性能的有机晶体管器件与简单电路。经优化的喷墨银电极表面形貌光滑、一致性好、电导率高。通过限制墨滴在打印基底上的浸润能力,可以有效减小电极间的沟道长度。基于这种高质量打印银线的短沟道有机晶体管和简单“非”门电路均展示出了很好的电学性能。     

基于喷墨打印技术的聚合物电致发光显示

喷墨打印聚合物电致发光显示(PLED)技术具有操作简单、成本低廉、易于产业化的特点.文章介绍和分析了喷墨打印聚合物PLED技术的现状、产业化所面临的问题及其可能的解决途径,探讨了喷墨打印PLED的未来发展趋势.     

瓷砖装饰用压电喷墨打印头关键技术研究

压电喷墨技术是一种广泛应用于工业数字印刷领域的喷墨打印技术。根据压电陶瓷变形模式不同,压电喷墨可分为挤压式、弯曲式、推动式和剪切式4种驱动原理。该文介绍了4种压电喷墨原理及相关研究方法。有限元分析和流体动力学计算可模拟墨滴生成与飞行的过程,便于研究喷头电学参数和几何尺寸对喷墨性能的影响。并讨论了喷墨打印头的压电元件、喷嘴板等材料优化,以及压电喷墨头研究进展及未来展望。     

数字喷墨打印技术在PCB抗蚀层制作中的初步研究

随着数字喷墨打印设备和纳米油墨的不断发展,喷墨打印技术在PCB制作中得到了越来越广泛的应用。目前市场上主要包括三个方面的应用：抗蚀层、字符、阻焊。文章通过市场调研,成本评估和工艺能力评估重点研究了喷墨打印技术在线路抗蚀层制作中的应用。结果发现喷墨打印技术相对于传统的线路制作工艺具有一定的成本优势和线路制作能力。     

商用喷打好选择爱普生ME Office 80W

降低打印成本是办公室节省办公经费的妙招之一，尤其是对于小型办公群体来说这么做显得尤为明显。随着技术的不断发展，尤其是喷墨打印技术的有效提高，喷墨打印成本相较于激光打印在整体成本上有着越来越明显的优势，而且在打印速度上也有了很大的提高，完全可以满足小型办公的使用需要。     

气溶胶喷墨打印在有机器件制备中的应用

气溶胶喷墨打印是近年来新出现的一种打印技术。通过将形成的墨水气溶胶喷射至基底表面而成膜,使得气溶胶喷墨打印对墨水的黏度要求低、打印分辨率好、适用墨水的范围广。文章对气溶胶喷墨打印技术的基本原理、在有机器件制备方面的应用以及将来的改进等方面进行了简介和评价。     

数字化文字喷印及其在PCB生产中应用

目前,数字喷墨打印技术正成为一种多样化替代传统化学蚀刻工艺直接成图的手段。配备有最新压电式喷头和UV曝光装置的前沿工业级喷墨打印机允许终端用户直接打印和固化UV墨水形成所需图形。在PCB工业中,省却传统丝印技术中的图形生成、图形转移、曝光和显影等工艺步骤已经可以实现,而且随之带来的设备、材料及工时的下降意味着更低的生产成本。文章将简介汉印科技公司对这种工业级商用打印机开发和可能应用。     

蓝牙打印机接口卡的设计

蓝牙,作为一种短距离无线通信技术,近年来越来越受到人们的青睐。蓝牙打印机接口卡用于取代计算机与打印机之间的电缆,实现打印机的无线打印,通过该接口卡可以使多台计算机共享一台打印机,为人们的工作、生活带来了诸多方便。设计主要采用单片计算机、蓝牙等电路,对蓝牙打印机接口卡的软硬件设计方法进行了阐述。测试表明,该打印机接口卡可用于所有具有并行接口的通用打印机（LPT打印机）。     

基于组件模型的虚拟打印系统的研究与实现

为了在第三方系统中可以方便地使用虚拟打印,在研究虚拟打印技术的基础上,按照组件模型标准提供了丰富的二次开发接口,包括安装、卸载虚拟打印机等。为快速将文档转换成图形文件,该系统采用重写Print Processor方式实现虚拟打印。目前该系统已经在多个第三方系统中得到初步的应用。     

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

The effect of thermomechanical properties of underfill and compliant interposer materials, such as coefficient of thermal expansion (CTE) and stiffness (Young's modulus) on reliability of flip chip on board (FCOB) and chip scale packages (CSPs) under thermal cycling stresses is investigated in this study. Quasi-three-dimensional viscoplastic stress analysis using finite element modeling (FEM) is combined with an energy partitioning (EP) model for creep-fatigue damage accumulation to predict the fatigue durability for a given thermal cycle. Parametric FEM simulations are performed for five different CTEs and five different stiffnesses of the underfill and compliant interposer materials. The creep work dissipation due to thermal cycling is estimated with quasi 3-D model, while 3-D model is used to estimate the hydrostatic stresses. To minimize the computational effort, the 3-D analysis is conducted only for the extreme values of the two parameters (CTE and stiffness) and the results are interpolated for intermediate values. The results show that the stiffness of the underfill material as well as the CTE play important role in influencing the fatigue life of FCOB assemblies. The fatigue durability increases as underfill stiffness and CTE increase. In the case of compliant interposers, the reverse is true and durability increases as interposer stiffness decreases. Furthermore, the interposer CTE affects the fatigue durability more significantly than underfill CTE, with durability increasing as CTE decreases. The eventual goal is to define the optimum design parameters of the FCOB underfill and CSP interposer, in order to maximize the fatigue endurance of the solder joints under cyclic thermal loading environments.     

Effects of radiofrequency energy on human chondromalacic cartilage: an assessment of insulation material properties

The objective of this study was to establish guidelines for the selection of an insulation material used to surround the electrode of radiofrequency energy (RFE) probes used for thermal chondroplasty. These guidelines were established by identifying which insulation materials resulted in the least amount of chondrocyte death while smoothing the surface of chondromalacic cartilage. RFE causes electrolyte oscillation and molecular friction in the tissue to heat it and subsequently smooth the surface. Material properties investigated included the coefficient of thermal expansion (CTE), thermal conductivity (TC), and volume resistivity (VR). Fresh human chondromalacic cartilage samples of Outerbridge grades II and III were obtained from patients undergoing total knee arthroplasty. Stiffness measurements were taken pretreatment and posttreatment. RFE was applied to a 1-cm2 area for 15 s in a paintbrush treatment pattern. The insulation materials evaluated included Macor (decrease CTE, decrease TC, increase VR; in relation to CTE = 10 x 10(-6)/degrees C at 20 degrees C, TC = 3 W/mK, VR=1 x 10(14) ohm x cm), zirconia toughened alumina (ZTA) and 99.5% alumina (decrease CTE, increase TC, increase VR), aluminum nitride (decrease CTE, increase TC, decrease VR), Teflon (PTFE) (increase CTE, decrease TC, increase VR), partially stabilized zirconia (YTZP) (decrease CTE, decrease TC, decrease VR), and Ultem (increase CTE, decrease TC, decrease VR). There were no significant differences between pretreatment and posttreatment stiffness of the cartilage for any material investigated. Subjectively scored scanning electron microscopy (SEM) images revealed that the surfaces of all samples treated with RFE were relatively smooth with melted fronds. Prototype probes made with Macor, 99.5% alumina, and ZTA had TC < or = 30 W/mol x K and resulted in a mean of 35% less cell death (176+/-56 microm, 130+/-48 microm, and 114+/-33 microm, respectively) than aluminum nitride, PTFE, and YTZP (246+/-68 microm, 231+/-108 microm, and 195+/-89 microm, respectively). Macor, 99.5% alumina, and ZTA prototype probes all had VR > or = 1 x 10(14) ohm x cm and resulted in a mean 37% less cell death than aluminum nitride or YTZP. There was no apparent relationship between CTE and the depth of chondrocyte death.     

基于FPGA与VHDL的微型打印机的驱动设计

为了取代传统利用单片机驱动微型打印机,使用Altera公司的FPGA芯片EP3C25Q240C8N设计驱动打印机的硬件控制电路,并正确控制微型打印机的工作时序。软件使用硬件描述语言VHDL实现对微型打印机的时序控制,并通过QuartusⅡ软件平台下载到FPGA调试通过,证明该方法行之有效,完全可以取代传统利用单片机来驱动微型打印机,且抗干扰性好,可靠性高,具有较强的可移植性。     

Effect of Nanotube Functionalization on the Coefficient of Thermal Expansion of Nanocomposites

Single‐walled carbon nanotubes (SWNTs) are functionalized through both covalent and noncovalent bonding approaches to enhance dispersion and interfacial bonding. The coefficient of thermal expansion (CTE) of the functionalized‐SWNT‐reinforced epoxy composites are measured with a thermal mechanical analyzer (TMA). Experimental results indicate that changes of the glass‐transition temperature (T_g) in functionalized SWNT–polymer composites are dependent upon the functionalization methods. The CTE below the glass‐transition temperature of nanocomposites with a 1 wt % loading of nanotubes is substantially diminished compared to a neat polymer. A reduction in the CTE of up to 52 % is observed for nanocomposites using functionalized nanotubes. However, the CTE above the T_g significantly increases because of the contribution from phonon mode and Brownian motions of a large number of SWNTs in resin‐crosslinked networks, but the increments are compromised by possible interfacial confinement. A tunable CTE induced through nanotube functionalization has application potentials for high‐performance composites, intelligent materials, and circuit protections.     

一种集成蓝牙功能的卷式发票打印机

随着信息化技术和集成电路技术的飞速发展,集成无线打印功能的打印机的需求愈加迫切。为此,本文介绍了一种集成蓝牙功能的卷式发票打印机,该打印机既可以直接插到PC机的USB口上,又可以通过移动终端的蓝牙功能进行发票打印,操作简单,安全可靠。     

谈喷印机喷印工艺与油墨性能的关系

喷印机的喷印过程中,喷印质量直接受油墨性能和喷印工艺参数的影响。本文从喷印机的实用性出发,主要分析探讨了在保证喷印质量的情况下喷印工艺参数的设定与油墨性能的相互关系,并对喷印工艺参数的设定和油墨的使用提出了一些量化指标,为使用者在选择油墨及对油墨性能进行调整和改善提供一定的参考依据,对喷印机的实际应用也有着一定的指导意义。     

Halftoning via direct binary search using analytical and stochastic printer models

We incorporate models for printer dot interactions within the iterative direct binary search (DBS) halftoning algorithm. Monochrome electro-photographic printers are considered. Both analytical and stochastic models are studied. In the analytical model it is assumed that the printer can generate a circular spot with constant absorptance at each printer addressable location, whereas the stochastic model is based on microscopic absorptance and variance measurements. We also present an efficient strategy for evaluating the change in computational cost as the search progresses. With our scheme, updating the change in error only involves a few fetches from two look-up-tables and some scalar multiplications and additions. Experimental results are provided that show that DBS with an appropriate model for printer dot interactions yields enhanced detail rendition, and improved tonal gradation in shadow areas.     

电路板设计中的膨胀系数匹配问题

电子产品设计是一个系统性的问题,设计人员的注意力只集中到了原理的设计,注重产品的电性能指标.对于元器件、原材料的膨胀系数匹配问题容易忽视.本文从元器件、基板、焊料等材料膨胀系数的匹配问题入手,对此问题进行了分析.解决了在产品使用中由于膨胀系敷不匹配可能会造成的质量问题.