1.3-μm n-type modulation-doped AlGaInAs/AlGaInAsstrain-compensated multiple-quantum-well laser diodes

In this paper, we report the fabrication and characterization of 1.3-μm AlGaInAs/AlGaInAs laser diodes (LDs) with an n-type modulation-doped strain-compensated multiple-quantum-well (MD-SC-MQW) active region and a linearly graded index separate confinement heterostructure. The barrier in the MD-SC-MQW active region contains the 28 Å Si-doped modulation-doped region and two 29 Å surrounding undoped regions that serve to prevent the overflow of Si doping atoms into the wells. We investigate the threshold current density, infinite current density, differential quantum efficiency, internal quantum efficiency, internal optical loss, threshold gain (for the cavity length of 300 μm), and transparency current density as a function of doping concentration in the n-type AlGaInAs barrier for the 1.3-μm MD-SC-MQW LDs. The theoretical and experimental results show that the optimum doping concentration of doped barriers is 5×10 ¹⁸ cm^-3. With this optimum condition, the 3.5-μm ridge-striped LDs without facet coating will exhibit a lower threshold current and a higher differential quantum efficiency of 18 mA and 52.3% under the CW operation as compared to those of 22 mA and 43% for the undoped active region, respectively. In addition, a high characteristic temperature of 70 K, a low slope efficiency drop of -1.3 dB between 20 and 70°C, and a wavelength swing of 0.4 nm/°C for the LDs operated at 60 mA and 8 mW can be obtained in the LDs with doped barriers     

Process and device characterization of high voltage gallium arsenide P-i-N layers grown by an improved liquid phase epitaxy method

GaAs P-i-N layers with an i-region net doping of less than 10¹² cm⁻³ were grown on P⁺ and N⁺ substrates by a modified liquid phase epitaxy (LPE) method. Doping profiles and structural data obtained by varius characterization techniques are presented and discussed. A P⁺-P-i-N-N⁺ diode with a 25 μm-wide i-region exhibits a breakdown voltage of 1000 V, a t_rr of 50 ns, and reverse current densities (at V_R = 800 V) of − 3 × 10⁻⁶ A/cm² at 25°C and 10⁻² A/cm² at 260° C.     

Electrical characteristics of GaAsP Schottky barrier diodes

Schottky barrier diodes of chromium on n-type epitaxial gallium arsenide phosphide (GaAsP) were studied from 25°C to 440°C. The diodes showed significant rectification properties up to a temperature of 440°C. At high temperature the reverse leakage current was 1.15 mA at 25 V with a diode area of 1.14×10⁻³ cm² as compared with 0.25-μA current at room temperature. The n factor derived from the slope of the ln I vs. V curves was 1.1. The barrier height for chromium was found to be 1.25 eV from the capacitance measurements and 1.12 eV from the saturation current vs. temperature measurements. The slope of the C-V curves yielded a carrier concentration of 6.0×10¹⁵ carriers per cm³.     

Growth of InxGa(1−x)N compound semiconductors and high-power InGaN/AlGaN double heterostructure violet-light-emitting diodes

In_xGa(_1−x)N films were grown on GaN films with an indium mole fraction x up to X = 0.33 at temperatures between 720°C and 850°C. The growth rate of InGaN films had to be decreased sharply to obtain high-quality InGan films when the growth temperature was decreased. Band-gap energies between 2.67 eV and 3.40 eV obtained by room-temperature photoluminescence measurements fit quite well to parabolic forms previously obtained by Osamura et al. on the indium mole fraction x assuming that the band-gap energies for GaN and InN are 3.40 and 1.95 eV, respectively. High-power InGaN/AlGaN double-heterostructure violet-light-emitting diodes were fabricated. The typical output power was 1000 μW and the external quantum efficiency was as high as 1.5% at a forward current of 20 mA at room temperature. The peak wavelength and the full width at half-maximum of the electroluminescence were 380 nm and 17 nm, respectively.     

An investigation of LixNi1−x,O as a mixed-valence thermoelectric material

The mixed valence material, Li_xNi_1−xO, has been investigated as a potential thermoelectric material. Measurements of the Seebeck coefficient, (μ V/°C), electrical resistivity, ρ(Ω-cm), and thermal conductivity, k(W/cm°C) have been made as a function of temperature and lithium concentration. The thermoelectric figure of merit, Z(²/ρk), reaches a value of approximately 1·4×10⁻⁴ at 1100°C for the composition Li_0.04Ni_0.96O.     

On the behaviour of buried oxygen implanted layers in highly doped GaAs

Highly doped GaAs substrate material (doping level 10¹⁸ cm⁻³) has been implanted with 350 keV O⁺ ions with doses of 10¹⁴ – 10¹⁶ cm⁻² to produce high resistivity layers which are stable at high temperatures. LPE growth of flat GaAs epilayers onto the implanted wafers was achieved up to doses of about 1 × 10¹⁵ O⁺/cm² and 5 × 10¹⁵O⁺/cm² for RT and 200°C implants, respectively. N-o-n and p-o-n structures (o: oxygen implanted) were fabricated in which breakdown voltages of up to 15 V were obtained. Examples for application of this isolation technique are shown.     

Characterization of phosphorus implanted low pressure chemical vapor deposited polycrystalline silicon

Thin (3000–5000Å) low pressure chemically vapor deposited (LPCVD) films of polycrystalline silicon suitable for microelectronics applications have been deposited from silane at 600°C and at a pressure of 0.25 Torr. The films were phosphorus implanted at 150 KeV and electrically characterized with the annealing conditions and film thickness as parameters, over a resistivity range of four orders of magnitude (10³–10⁷Ω/□). Annealing during silox deposition was found to result in a lower film resistivity than annealing done in nitrogen atmosphere. Resistivity measurements as a function of temperature indicate that the electrical activation energy is a linear function of 1/N(N is the doping concentration), changing from 0.056 eV for a doping concentration of 8.9 × 10¹⁸ cm⁻³ to 0.310 eV for doping concentration of 3.3 × 10¹⁸ cm⁻³. The grain boundary trap density was found to have a logarithmically decreasing dependence on the polysilicon thickness, decreasing from 1.3 × 10¹³ cm⁻² for 2850Å polysilicon film to 8.3 × 10¹² cm⁻² for 4500Å polysilicon film.     

Electrical, structural, and optical characterization of free-standing GaN template grown by hydride vapor phase epitaxy

Electrical, structural, and optical properties of a free-standing 200 μm thick n-type GaN template grown by hydride vapor phase epitaxy have been investigated. Hall mobilities of 1100 and 6800 cm²/V s have been obtained at room temperature and 50 K, respectively. Quantitative analysis of acceptor concentration, donor concentration and donor activation energy has been conducted through simultaneous fitting of the temperature dependent Hall mobility and carrier concentration data which led to a donor concentration of 2.10×10¹⁶ cm⁻³ and an acceptor concentration of 4.9×10¹⁵ cm⁻³. The resultant donor activation energy is 18 meV. The analysis indicates that the dominant scattering mechanism at low temperatures is by ionized impurities. The extended defect concentrations on Ga- and N-faces were about 5×10⁵ cm⁻² for the former and about 1×10⁷ cm⁻² for the latter, as revealed by a chemical etch. The full width at half maximum of the symmetric (0 0 0 2) X-ray diffraction peak was 69″ and 160″ for the Ga- and N-faces, respectively. That for the asymmetric (10–14) peak was 103″ and 140″ for Ga- and N-faces, respectively. The donor bound exciton linewidth as measured on the Ga- and N-face (after a chemical etch to remove the damage) is about 1 meV each at 10 K. Instead of the commonly observed yellow band, this sample displayed a green band, which is centered at about 2.45 eV.     

Uniformity and high temperature performance of X-band nitride power HEMTs fabricated from 2-inch epitaxy

X-band performance, high temperature D.C. operation and uniformity have been evaluated for 1 μm gate AlGaN/GaN HEMTs grown by RF atomic nitrogen plasma MBE. Deposition and fabrication were performed on 2-inch (0001) sapphire substrates to determine process uniformity. HEMTs with 300 μm total gate width and dual gate finger geometry have been fabricated with 650–700 cm² V⁻¹×s mobility. Maximum frequency cut-offs on the order of 8–10 GHz were achieved. D.C. performance at room temperature was >500 mA mm⁻¹, and external transconductance was >70 mS mm⁻¹. The transistors operated at test temperatures of 425°C in air.     

AlGaInAs/InP应变补偿多量子阱激光器

为了优化在长距离光纤通讯系统中采用的1.31μm波长的量子阱激光器,对AlGaInAs/InP材料的有源区应变补偿的量子阱激光器进行了设计研究。采用应变补偿的方法,根据克龙尼克-潘纳模型理论计算出量子阱的能带结构,设计出有源区由1.12%的压应变AlGaInAs阱层和0.4%的张应变AlGaInAs垒层构成。使用ALDS软件对所设计出的器件进行了建模仿真,对其进行了阈值分析和稳态分析。结果表明,在室温25℃下,该激光器具有9mA的低阈值电流和0.4W/A较高的单面斜率效率;在势垒层采用与势阱层应变相反的适当应变,可以降低生长过程中的平均应变量,保证有源区良好的生长,改善量子阱结构的能带结构,提高对载流子的限制能力,降低阈值电流,提高饱和功率,改善器件的性能。     

Carrier recombination in single crystal PbSe

The photoconductivity decay curves after illumination of single crystal n- and p-type PbSe were analysed assuming recombination through different localized impurity levels in conjunction with direct recombination. The lifetimes deduced for direct (Auger and radiative) recombination below 250 K were in agreement with the calculated values for carrier concentrations 2·10¹⁷ cm⁻³. Furthermore, the existence of up to three impurity levels was concluded from the longer lifetime-components present in the decay curves. Appropriate approximations of the general recombination theory yielded energies separated between 20 and 50 meV from the nearer band edge and minority carrier cross sections 10⁻¹⁷−4·10⁻¹⁹ cm² in the temperature range 250-100 K, and majority carrier cross sections 10⁻¹⁹−10⁻²⁰ cm² at T < 100 K for these levels.     

Simulation and experimental results on the forward J–V characteristic of Al implanted 4H–SiC p–i–n diodes

In this work the forward J–V characteristics of 4H–SiC p–i–n diodes are analysed by means of a physics based device simulator tuned by comparison to experimental results. The circular devices have a diameter of 350 μm. The implanted anode region showed a plateau aluminium concentration of 6×10¹⁹ cm⁻³ located at the surface with a profile edge located at 0.2 μm and a profile tail crossing the n-type epilayer doping at 1.35 μm. Al atom ionization efficiency was carefully taken into account during the simulations. The final devices showed good rectifying properties and at room temperature a diode current density close to 370 A/cm² could be measured at 5 V. The simulation results were in good agreement with the experimental data taken at temperatures up to about 523 K in the whole explored current range extending over nine orders of magnitude. Simulations also allowed to estimate the effect of a different p⁺ doping electrically effective profile on the device current handling capabilities.     

Schottky barrier height of a new ohmic contact NiSi2 to n-type 6H-SiC

We present a new ohmic contact material NiSi₂ to n-type 6H-SiC with a low specific contact resistance. NiSi₂ films are prepared by annealing the Ni and Si films separately deposited on (0 0 0 1)-oriented 6H-SiC substrates with carrier concentrations (n) ranging from 5.8×10¹⁶ to 2.5×10¹⁹ cm⁻³. The deposited films are annealed at 900 °C for 10 min in a flow of Ar gas containing 5 vol.% H₂ gas. The specific contact resistance of NiSi₂ contact exponentially decreases with increasing carrier concentrations of substrates. NiSi₂ contacts formed on the substrates with n=2.5×10¹⁹ cm⁻³ show a relatively low specific contact resistance with 3.6×10⁻⁶ Ω cm². Schottky barrier height of NiSi₂ to n-type 6H-SiC is estimated to be 0.40±0.02 eV using a theoretical relationship for the carrier concentration dependence of the specific contact resistance.     

High-temperature, low threshold current, and uniform operation1×12 monolithic AlGaInAs/InP strain-compensated multiple quantumwell laser array in 1.5 μm

In this paper, we describe the fabrication of a monolithically integrated 1×12 array of 1.5-μm AlGaInAs/InP strain-compensated multiple-quantum-well (MQW) lasers, which has high reliability and highly uniform characteristics in low threshold current, slope efficiency, and lasing wavelength. Besides, each diode on the array exhibits a high characteristic temperature of 88 K and a low slope-efficiency drop of less than 1 dB between 20-80°C and a lasing wavelength of 1510 nm at 20°C and 20 mA. Also, the diode on the array has a maximum resonance frequency of above 8 GHz or 3-dB modulation bandwidth of 12 GHz     

High temperature ohmic contacts to 3C–silicon carbide films

Currently, large-area 3C–SiC films are available from a number of sources and it is imperative that stable high temperature contacts be developed for high power devices on these films. By comparing the existing data in the literature, we demonstrate that the contact behavior on each of the different polytypes of SiC will vary significantly. In particular, we demonstrate this for 6H–SiC and 3C–SiC. The interface slope parameter, S, which is a measure of the Fermi-level pinning in each system varies between 0.4–0.5 on 6H–SiC, while it is 0.6 on 3C–SiC. This implies that the barrier heights of contacts to 3C–SiC will vary more significantly with the choice of metal than for 6H–SiC. Aluminum, nickel and tungsten were deposited on 3C–SiC films and their specific contact resistance measured using the circular TLM method. High temperature measurements (up to 400°C) were performed to determine the behavior of these contacts at operational temperatures. Aluminum was used primarily as a baseline for comparison since it melts at 660°C and cannot be used for very high temperature contacts. The specific contact resistance (ρ_c) for nickel at room temperature was 5×10⁻⁴ Ω cm², but increased with temperature to a value of 1.5×10⁻³ Ω cm² at 400°C. Tungsten had a higher room temperature ρ_c of 2×10⁻³ Ω cm², which remained relatively constant with increasing temperature up to 400°C. This is related to the fact that there is hardly any reaction between tungsten and silicon carbide even up to 900°C, whereas nickel almost completely reacts with SiC by that temperature. Contact resistance measurements were also performed on samples that were annealed at 500°C.     

MBE growth and device applications of lattice-matched and strained heterostructures on (n11)-oriented and patterned substrates

The epitaxy of lattice-matched and strained semi-conducting films on patterned and misoriented substrates has led to new growth phenomena, material properties and device applications. Our work on InP- and GaAs-based heterostructures on (111)- and (311)-oriented substrates and strained heterostructures on planar and patterned (small area) substrates is described in this paper. The possibility of reliable and reproducible p-type doping of (311)A GaAs by Si during molecular-beam epitaxial growth and the application of such doping in the realization of high-performance electronic devices have been investigated. It is seen that p-type doping up to a free hole concentration of 4 × 10¹⁹ cm⁻³ is obtained at low ( 500°C) growth temperature and high As₄ flux. The incorporation of Si atoms into electrically active As sites is at least 95%. n-p-n heterojunction bipolar transistors grown by all-Si doping exhibit excellent current voltage characteristics and a common emitter current gain β = 240. Doped channel p-type heterojunction field-effect transistors have transconductance g_m = 25 mS/mm. We have experimentally and theoretically studied piezo-electric field effects in InP-based In_xGa_{1 − x}As/In_0.52Al_0.48As pseudomorphic quantum wells grown by molecular-beam epitaxy on (111)B InP substrates. The electro-optic coefficients of this material were measured and found to be much larger than that of GaAs. We have also investigated the consequences of altered growth modes on the epitaxy of highly strained InGaAs on patterned small area (001) GaAs substrates. Al_0.15Ga_0.85As/In_0.25Ga_0.75As pseudomorphic modulation-doped field-effect transistors and strained In_xGa_{1 − x}As/GaAs p-i-n photodiodes have been fabricated on patterned (100)-GaAs substrates and characterized. Compared with devices made on planar substrates, small area growth improves the dc transconductance by 40% and current gain cutoff frequency by 50% in the transistors. Photodiodes grown in small recesses (30 μm) exhibit 2–4 times higher quantum efficiency than those on planar substrates.     

Temperature effects on tungsten etching

The influence of the substrate temperature (from T_s = +20°C to T_s = −45°C) on the etching characteristics (etch rate and anisotropy) of tungsten material has been investigated using a surface-wave sustained magnetoplasma reactor operated with SF₆. By correlating the F-atom concentration and the ion current density to the etching characteristics, we found that ion-assisted etching becomes more important than spontaneous chemical etching as the substrate temperature and SF₆ gas pressure decrease, ensuring, in absence of external biasing, high etching anisotropy together with high microscopic uniformity for submicrometer features (0.2 to 1 μm). Our results reveal the competitive influence between substrate temperature (which inhibits spontaneous chemical reaction as it is lowered) and gas pressure (which favours spontaneous chemical reaction as it is increased). Obtaining high anisotropy requires, in the present case, a substrate temperature of T_s = −20°C for P = 0.5 mTorr and a temperature as low as T_s = −35°C for P = 1.5 mTorr.     

Thermal noise of a silicon double-injection plasma diode

Measurements of the thermal noise of a silicon p⁺−π−n⁺ diode operating in the Lampert-insulating regime agree within 6 per cent with the prediction S_i = 4kT Re(Y). The noise measurements were performed in the cube-law regime with d.c.-currents from 100 μA to 4mA at room temperature.     

CoSi2 ohmic contacts to n-type 6H---SiC

Cobalt disilicide (CoSi₂) ohmic contacts possessing low specific contact resistivity (_c < 3.0 ± 0.4 × 10⁻⁵ ωcm²) to n-type 6H---SiC are reported. The contacts were fabricated via sequential electron-beam evaporation of Co and Si layers followed by a two-step vacuum anealing process at 500 and 900°C. Stochiometry of the contact so formed was confirmed by Rutherford backscattering spectrometry and X-ray diffraction. Specific contact resistivities were obtained via current-voltage (I-V) analysis at temperatures ranging from 25 to 500°C. _c is compared as a function of carrier concentration, current density, temperature and time at elevated temperature.     

Strained 1.3 μm MQW AlGaInAs lasers grown by digital alloy MBE

AlGaInAs strained MQW lasers, emitting at 1.3 μm, have been prepared for the first time using a digital alloy approach. 2 μm stripe geometry lasers have characteristics comparable to those of lasers prepared using bulk alloy layers. The infinite length threshold current densities are as low as 140 kA/cm²/quantum well and T ₀ values (20-40°C) range from 75-90 K for chip lengths of 375-2375 μm