Mixed-mode fracture load prediction in lead-free solder joints

Double cantilever beam (DCB) fracture specimens were made by joining copper bars with both continuous and discrete SAC305 solder layers of different lengths under standard surface mount (SMT) processing conditions. The specimens were then fractured under mode-I and various mixed-mode loading conditions. The loads corresponding to crack initiation in the continuous joints were used to calculate the critical strain energy release rate, J_ci, at the various mode ratios using elastic–plastic finite element analysis (FEA). It was found that the J_ci from the continuous joint DCBs provided a lower bound strength prediction for discrete 2 mm and 5 mm long joints at the various mode ratios. Additionally, these J_ci values calculated from FEA using the measured fracture loads agreed reasonably with J_ci estimated from measured crack opening displacements at crack initiation in both the continuous and discrete joints. Therefore, the critical strain energy release rate as a function of the mode ratio of loading is a promising fracture criterion that can be used to predict the strength of solder joints of arbitrary geometry subject to combined tensile and shear loads.     

Effect of geometry on the fracture behavior of lead-free solder joints

Copper bars were soldered along their length with a thin layer of lead-free Sn3.0Ag05.Cu alloy under standard surface mount processing conditions to prepare double cantilever beam (DCB) specimens. The geometry of the DCBs was varied by changing the thickness of the solder layer and the copper bars. These specimens were then fractured under mode-I and two mixed-mode loading conditions. The initiation strain energy release rate, G_ci, increased with the relative fraction of mode-II, but was unaffected by the changes in either the substrate stiffness or the solder layer thickness. However, the steady-state strain energy release rate, realized after several millimeters of crack growth, was found to increase with the solder layer thickness at the various mode ratios. The crack path was found to be influenced by mode ratio of loading and followed a path that maximizes the von Mises strain rather than maximum principal stress. Finally, some preliminary results indicated that the loading rate significantly affects the G_ci.     

Electromigration issues in lead-free solder joints

As the microelectronic industry advances to Pb-free solders due to environmental concerns, electromigration (EM) has become a critical issue for fine-pitch packaging as the diameter of the solder bump continues decreasing and the current that each bump carries keeps rising owing to higher performance requirement of electronic devices. As stated in 2003 International Technology Roadmap for Semiconductors (ITRS), the EM is expected to be the limiting factor for high-density packages. This paper reviews general background of EM, current understanding of EM in solder joints, and technical hurdles to be addressed as well as possible solutions. It is found that the EM lifetimes of Pb-free solder bumps are between the high-Pb and the eutectic composition under the same testing condition. However, our simulation results show that the electrical and thermal characteristics remain essentially almost the same during accelerated EM tests when the Pb-containing solders are replaced by Pb-free solders, suggesting that the melting points of the solders are likely the dominant factor in determining EM lifetimes. The EM behavior in Pb-free solder is a complicated phenomenon as multiple driving forces coexist in the joints and each joint contains more than four elements with distinct susceptibility to each driving force. Therefore, atomic transport due to electrical and thermal driving forces during EM is also investigated. In addition, several approaches are presented to reduce undesirable current crowding and Joule heating effects to improve EM resistance.     

Fracture load prediction of lead-free solder joints

Continuous and discrete SAC305 solder joints of different lengths were made between copper bars under standard surface mount (SMT) processing conditions, and then fractured under mode-I loading. The load-displacement behavior corresponding to crack initiation and the subsequent toughening before ultimate failure were recorded and used to calculate the critical strain energy release rates. The fracture of the discrete solder joints was then simulated using finite elements with two different failure criteria: one in terms of the critical strain energy release rate at initiation, G_ci, and another based on a cohesive zone model at the crack tip (CZM). Both criteria predicted the fracture loads reasonably well. In addition, the CZM was able to predict accurately the overall load-displacement behavior of the discrete joint specimen. It could also predict the load sharing that occurred between neighboring solder joints as a function of joint pitch and adherend stiffness. This has application in the modeling of the strength of solder joint arrays such as those found in ball grid array packages.     

Micromechanical characterization of thermomechanically fatigued lead-free solder joints

Nanoindentation testing (NIT) was used to investigate micromechanical properties of (i) as-fabricated, (ii) thermomechanically fatigued (TMF), and (iii) TMF and crept lead-free solder joints. NIT also served to generate information for a database on lead-free solder joints. Sn–Ag-based solder materials used in this study included a binary eutectic alloy, one ternary alloy, and two quaternary alloys. TMF solder joints were thermally cycled for 0, 250, 500, 1000 cycles between –15 and 150 °C. Using NIT, mechanical properties such as hardness, elastic modulus, strength trends, creep behavior, and stress exponent for power-law creep were obtained on small (nominally, 100 m thick) solder joints. Because the volume of material probed by the indenter during NIT is small and highly localized, the properties observed depended strongly on the particular joint microstructure of the indent location. Scanning electron microscopy (SEM) was used to image the nanoindents and monitor deformation and fracture events that resulted from the indenting.     

Reliability behavior of lead-free solder joints in electronic components

With more consumer products moving towards environmentally friendly packaging, making solder Pb-free has become an urgent task for electronics assemblies. Solder joints are responsible for both electrical and mechanical connections. Solder joint does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Materials behavior of solder joints involves a creep–fatigue interaction, making it a poor material for mechanical connections. The reliability of solder joints of electronics components has been found playing a more important role in service for microelectronics components and micro-electro-mechanical systems. So many researchers in the world investigated reliability of solder joints based on finite element simulation and experiments about the electronics devices, such as CR, QFP, QFN, PLCC, BGA, CSP, FCBGA and CCGA, which were reviewed systematically and extensively. Synchronously the investigation on reliability of solder joints was improved further with the high-speed development of lead-free electronic packaging, especially the constitutive equations and the fatigue life prediction equations. In this paper, the application and research status of constitutive equations and fatigue life prediction equations were reviewed, which provide theoretic guide for the reliability of lead-free solder joints.     

The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

Solder joints in electronic packaging systems are becoming smaller and smaller to meet the miniaturization requirements of electronic products and high density interconnect technology. Furthermore, many properties of the real solder joints at the microscale level are obviously different from that of bulk solder materials. Creep, as one of the key mechanical properties at elevated temperatures, can impair the reliability of miniature solder joints in electronic devices. However, there is a lack of knowledge about the comparative creep properties of microscale solder joints of different sizes. Most previous studies have focused on the creep properties of bulk solder materials or solder joints of the same size. In this research, to determine whether a size effect exists for creep properties of solder joints or not, we characterized the creep behaviors of Sn–3.0Ag–0.5Cu lead-free solder joints under tensile loading modes using microscale butt-joint specimens with a copper-wire/solder/copper-wire sandwich structure with two different sizes. Also, the creep failure mechanisms were investigated. Experimental results show that the creep activation energy and creep stress exponent are very similar for both sizes of solder joint. However, under the same testing conditions, the joints with a larger size exhibit a much higher steady-state creep rate and a shorter creep lifetime than the smaller joints.     

球栅阵列无铅焊点随机振动失效研究

通过非接触式激光全息激振方法对试件(电路板组件)进行试验模态分析,了解其动态特性;以其第一阶固有频率作为中心频率,分别进行了三种不同加速度功率谱密度幅值的窄带随机振动疲劳试验,并对失效焊点进行金相剖面分析,探究球栅阵列(BGA)无铅焊点在随机振动载荷下的失效机理。结果表明,三种加速度功率谱密度幅值的随机振动试验中BGA无铅焊点的失效机理不尽相同,随着功率谱密度幅值增加,焊点失效位置由靠近电路板(PCB)一侧向靠近封装一侧转变,分别是靠近PCB一侧的焊球体,焊点颈部以及靠近封装一侧的Ni/金属间化合物(IMC)界面处,相应的失效模式由疲劳断裂转为脆性断裂     

Experimental and numerical studies on size and constraining effects in lead-free solder joints

The durability and reliability of lead‐free solder joints depends on a large number of factors, like geometry, processing parameters, microstructure and thermomechanical loads. In this work, the nature and influence of the plastic constraints in the solder due to joining partners have been studied by parametric finite element simulation of solder joints with different dimensions. The apparent hardening due to plastic constraints has been shown to strongly depend on the solder gap to thickness ratio with an inversely proportional evolution. Due to interaction of several parameters, the macroscopic stress–strain constitutive law of lead‐free solder materials should be determined in the most realistic conditions. In order to identify the elasto‐plastic constitutive law of Sn–Ag–Cu solders, a sub‐micron resolution Digital Image Correlation technique has been developed to measure the evolution of strain in solder joints during a tensile test. Experimental results of the stress–strain response of Sn–Ag–Cu solder joints have been determined for several solder gaps. The measured load–displacement curves have been used in an inverse numerical identification procedure to determine the constitutive elasto‐plastic behaviour of the solder material. The effects of geometrical constraints in a real solder joint with heterogeneous stress and strain fields are then studied by comparing the apparent (constrained) and constitutive (non‐constrained) stress–strain relationships. Once the size dependant constraining effects have been removed from the stress–strain relationship, the scale effects can be studied separately by comparing the constitutive elasto‐plastic parameters of joints with a variable thickness. Experimental stress–strain curves (constrained and unconstrained) for Sn–4.0Ag–0.5Cu solder in joints of 0.25–2.4 mm gap are presented and the constraining and the size effects are discussed.     

Reliability of lead-free solder joints in CSP device under thermal cycling

Finite element method and Garofalo–Arrheninus creep model were combined and used to evaluate the reliability of different lead-free solder joints (SnAgCu, SnAg, SnSb and SnZn) and SnPb solder joints in chip scale package (CSP) 14 × 14 device under thermal cyclic loading. The results show that von Mises stress and equivalent creep strain in each of the four lead-free solder joints and SnPb solder joints were strongly different, increasing in the order SnPb < SnAg < SnSb < SnZn < SnAgCu. It is found that maximum stress–strain concentrates on the top-surface of corner solder joints in the CSP device for all solder joints, and SnAgCu solder joints shows the highest fatigue life among those five kinds of solder joints.     

Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints

In the present study, the effect of adding trace amount of rare earth (RE) on the shear strength of Sn3.8Ag0.7Cu lead-free solder joints has been investigated. The shear strength of the solder joints as-reflowed and after aging at 150 °C for 168 and 336 h was measured at a constant loading rate of 0.3 mm/min and room temperature. The investigation indicates that the shear strength of Sn3.8Ag0.7Cu0.1RE solder joints is lower than that of Sn3.8Ag0.7Cu solder joints. The shear strength of both Sn3.8Ag0.7Cu solder joints and Sn3.8Ag0.7CuRE solder joints was reduced after aging at elevated temperature. However, the shear strength reduction rate of the Sn3.8Ag0.7Cu solder joints was much faster than that of Sn3.8Ag0.7CuRE solder joints. Moreover, the fracture surfaces were examined by scanning electron microscopy (SEM) and the thickness of intermetallic compounds layer (IML) in the solder joints that join Cu substrate was measured. The results indicated that the addition of rare earth elements suppresses the growth of the thickness of intermetallic compounds layer.     

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

Most lead-free solders comprise tin (Sn) as the majority component, and nominally pure β-Sn is the majority phase in the microstructure of these solders. It is well established that nucleation of β-Sn from Sn-base liquid alloys is generally difficult. Delays in the onset of β-Sn formation have a profound effect upon the microstructural development of solidified Sn-base alloys. Utilizing stable and metastable phase diagrams, along with solidification principles, the effects of inhibited β-Sn nucleation on microstructural development are discussed, employing the widely studied Sn–Ag–Cu (SAC) alloy as a model system. This analysis shows that the main effect of suppressed β-Sn nucleation on near-eutectic SAC solders is to increase the number and/or volume fraction of primary or primary-like microconstituents, while simultaneously decreasing the volume fraction of eutectic microconstituent. General strategies are outlined for avoiding unwanted microconstituent development in these materials, including the use of metastable phase diagrams for selecting alloy compositions, employment of inoculants to promote β-Sn nucleation, and utilization of high cooling rates to limit solid phase growth. Finally, areas for future research on the development of inoculated Sn-base solder alloys are outlined.     

Failure mode analysis of lead-free solder joints under high speed impact testing

Using an Instron micro-impact system, this study investigates the failure characteristics of 96.5Sn–3Ag–0.5Cu lead-free solder joints aged at either room temperature or 125 °C, respectively, and then impacted at shear rates of up to 1 m/s. Four types of failure mode are identified, namely M1: interfacial fracture with no residual solder left on the pad; M2: interfacial fracture with residual solder left on the pad; M3: solder ball fracture; and M4: substrate fracture. The experimental results reveal that the solder specimens fail in different failure modes at the same impact speed. The transition from ductile to brittle failure occurs at an impact speed of around 0.5 m/s. At an impact speed of 0.7 (±0.05) m/s or more, over 70% of the specimens fail in the M1 or M2 modes under all of the testing conditions. The isothermal aging process is found to reduce the interfacial strength, and hence the percentage of M3 and M4 mode failures reduces significantly. Overall, the experimental results suggest that the failure mode distribution obtained in high speed impact tests performed at 0.5 m/s provides a feasible component-level quality assurance index.     

耐高温瞬时液相连接无铅钎焊接头的时效稳定性

通过瞬时液相(TLP)连接的互连工艺,采用Sn4.7Ag1.7Cu+Ag复合钎料,制备Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头.采用SEM观察恒温时效过程中接头的组织,结合EDS对比不同工艺下试样接头组织,并对接头性能进行对比分析.结果表明:随着Ag颗粒含量的增加,Sn4.7Ag1.7Cu+Ag/Cu接头耐高温(300℃)服役性能随之提高;Ag含量为25％(质量分数)时接头在高于基体钎料熔点(217℃)83℃下服役15天未断裂,且抗拉强度为25.74 MPa,达到了低温焊接、高温服役的目的;与Sn4.7Ag1.7Cu/Cu接头相比,随着时效的进行,Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头焊缝组织中残余的Ag颗粒不断溶解,并在接头界面附近产生大量Ag3 Sn化合物,而大量的块状Ag3 Sn化合物可以有效抑制焊缝中Sn元素向Cu基板扩散,达到抑制Cu3 Sn层生长的目的;在200℃服役温度条件下,随着时效的进行,Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头力学性能先下降后上升,然后再下降并趋于稳定,且力学性能稳定性比Sn4.7Ag1.7Cu/Cu接头要好.     

Standardization of a shear test method for lead-free solder paste chip joints

The electronics industry is moving to replace Pb-based solder with Pb-free solder because of the growing environmental regulations governing the use of lead. Solder joints made from Pb-free solder paste do not yet have an evaluation method to classify its mechanical properties such as shear strength. In this study, we reflowed solder joints from Sn–3.0Ag–0.5Cu solder paste. To standardize the shear test method, we measured the shear strength of the solder joint of a 2012 ceramic chip at a shear rate of 3–60 mm/min and a shear height of 10–380 μm using different shaped shear jigs. We statistically analyzed the optimum number of shear tests by calculating the accumulative average value, standard deviation, and width of the confidence interval. The fracture surface was examined by scanning electron microscope and discussed in terms of the shear conditions.     

无铅焊料研究现状与发展展望

随着电子工业飞速发展以及人们环保意识的提高，以“绿色焊接”为主题的电子装配技术对无铅焊料的需求也尤为迫切。本文从焊料可焊性和焊接蛄构的可靠性等方面介绍了近年来国内外无铅焊料研究方面的最新成果；着重概括了为提高焊接性能而在配料组分、金属间化合物析出与组织控制等工作，重点阐明了稀土元素在焊料组织控制中的关键作用；针对我国稀土资源蕴藏丰富的特点，指出了元铅焊料进一步发展的方向。     

Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

In this paper, in situ tensile tests under various amounts of deformation were performed on Sn3.0Ag0.5Cu lead-free solder joints subjected to multi-reflow and isothermal aging processes by using a scanning electron microscope. Microstructure evolution and deformation behavior of the solder joints were observed. Effects of the intermetallic compound (IMC) Cu₆Sn₅ on fracture behaviors of the solder joints were investigated. Results showed that the Sn3.0Ag0.5Cu lead-free solder joints contained only a few Sn grains, and the sequence and degree of plastic deformation varied for the different grains in the same solder joint due to the strong anisotropic properties of Sn grains. Further experiments revealed that plastic deformation occured primarily in the form of slip bands in the solder joints during the in situ tensile test. Various fracture modes including intergranular and phase boundary fractures were observed. The fracture behaviors of solder joints were significantly affected by morphologies and distributions of the Cu₆Sn₅ IMCs. It was found that Cu₆Sn₅ particles located at the grain boundaries are apt to become crack sources, and that the long rod shaped Cu₆Sn₅ were easily broken. However, spherical Cu₆Sn₅ hardly deformed during the tensile test, resulting in dynamic recrystallization. In this case, fracture occured at the sub-grain boundaries.     

Fatigue fracture of SnAgCu solder joints by microstructural modeling

The ongoing miniaturization trend in the microelectronic industry enforces component sizes to approach the micron, or even the nano scale. At these scales, the underlying microstructural sizes and the geometrical dimensions are comparable. The increasing influence of microscopic entities on the overall mechanical properties makes conventional continuum material models more and more questionable. In this study, the thermomechanical reliability of lead-free BGA solder balls is investigated by microstructural modeling. Microstructural input is provided by orientation imaging microscopy (OIM), converted into a finite element framework. Blowholes in BGA solder balls are examined by optical microscopy and a statistical analysis on their size, position and frequency is conducted. Combining the microstructural data with the appropriate material models, three dimensional local models are created. The fatigue life of the package is determined through a critical solder ball. The thermomechanical reliability of the local models are predicted using cohesive zone based fatigue damage models. The simulation results are validated by statistical analyses provided by the industry.