ZrON/GeON 双钝化层改善Ge MOS器件的界面特性和电特性

本文研究了利用等离子体氮化形成ZrON/GeON双钝化层制备Ge MOS器件的界面特性和电特性。结果发现,相比于N2等离子处理,NH3等离子处理制备的双钝化层显著改善了器件的界面和电特性,获得了低的界面态密度 (Dit = 1.64×1011 cm-2 eV-1)和栅极漏电流(Jg = 9.32×10-5 A cm-2@Vfb +1 V),小的电容等效厚度 (CET = 1.11 nm)以及高的k值 (32). XPS分析表明,由NH3等离子体分解出的H原子和NH基团可以有效促进Ge表面不稳定低k GeOx的挥发,从而形成了高质量的GeON钝化层;且NH3等离子体氮化导致更多氮在ZrON/GeON中结合,能更有效阻止O、Ti、Ge等元素间的相互扩散,从而获得好的界面质量和电特性。     

基于MIS电容器的Al2O3与In0.74Al0.26As的界面特性

采用In_0.74Al_0.26As/In_0.74Ga_0.26As/In_xAl_1-xAs异质结构多层半导体作为半导体层,制备了金属-绝缘体-半导体（MIS）电容器。其中,SiN_x和SiN_x/Al₂O₃分别作为MIS电容器的绝缘层。高分辨率透射电子显微镜和X射线光电子能谱的测试结果表明,与通过电感耦合等离子体化学气相沉积生长的SiN_x相比,通过原子层沉积生长的Al2_O3可以有效地抑制Al₂O₃和In_0.74Al_0.26As界面的In₂O₃的含量。根据MIS电容器的电容-电压测量结果,计算得到SiN_x/Al₂O₃/In...     

共沉淀法制备Y2O2SO4:Eu3+荧光粉及其光致发光研究

采用商业Y(NO3)3·6H2O、Eu(NO3)3·6H2O、(NH4)2SO4和NaOH为实验原料,通过共沉淀法制备了Y2O2SO4:Eu3+荧光粉。利用热分析(DTA-TG-DTG)、傅里叶变换红外(FT-IR)光谱、X射线衍射(XRD)、扫描电子显微镜(SEM)和光致发光(PL)光谱等手段对合成的粉体进行了表征。结果表明,当(NH4)2SO4引入到反应体系中时,前驱体具有非晶态结构,且在空气气氛中800℃煅烧2h能转化为单相的Y2O2SO4粉体,该Y2O2SO4粉体呈准球形,粒径范围分布在0.5~1.0μm之间,团聚较严重。PL光谱分析表明,在270nm紫外光激发下,Y2O2SO4:Eu3+荧光粉呈红光发射,主发射峰位于620nm,归属于Eu3+的5D0→7F2跃迁。Eu3+的猝灭浓度是5 mol%,其对应的荧光寿命为1.22 ms。另外,当(NH4)2SO4未引入到反应体系中时,采用类似的方法合成了Y2O3:Eu3+荧光粉,并对Y2O2SO4:Eu3+和Y2O3:Eu3+荧光粉的PL性能进行了比较。     

钝化处理对Al2O3/InP MOS电容界面特性的影响

制备了Al/Al_2O_3/InP金属氧化物半导体(MOS)电容,分别采用氮等离子体钝化工艺和硫钝化工艺处理InP表面。研究了在150、200和300 K温度下样品的界面特性和漏电特性。实验结果表明,硫钝化工艺能够有效地降低快界面态,在150 K下测试得到最小界面态密度为1.6×10¹⁰ cm^-2·eV^-1。与硫钝化工艺对比,随测试温度升高,氮等离子体钝化工艺可以有效减少边界陷阱,边界陷阱密度从1.1×10¹² cm^-2·V^-1降低至5.9×10¹¹ cm^-2·V^-1,同时减少了陷阱辅助隧穿电流。氮等离子体钝化工艺和硫钝化工艺分别在降低边界陷阱和快界面态方面有一定优势,为改善器件界面的可靠性提供了依据。     

Al2(WO4)3的激光烧结合成及特性

采用激光烧结技术快速成功地将比例适当的Al2O3和WO3粉末合成了形貌良好且致密的Al2(WO4)3材料,并对该材料采用多种分析手段进行了分析。 拉曼光谱分析说明在合适工艺参数下激光烧结可避免原料挥发，使原料完全参与反应。X射线衍射(XRD)分析表明合成物主要是Al2(WO4)3，属空间群Pnca，具有正交结构，可能显示负热膨胀特性，另外还含有少量的AlxWO3(x≤1)和WO3-x(x<1)。扫描电镜(SEM)发现合成物晶粒呈球形、细小、排列致密、少有气孔、尺寸约在10 nm左右。能量散射光谱(EDS)分析显示合成物内部成分分布均匀。热分析则得出合成物中少许杂相为复杂非平衡相。     

Bi2O3对Al2O3-ZnO-Bi2O3-B2O3低熔玻璃结构和性能的影响

采用传统的熔淬技术制得了低熔Al2O3-ZnO-Bi2O3-B2O3玻璃,研究了玻璃结构、玻璃特征温度、线膨胀系数(αl)以及密度随Bi2O3含量的变化关系。结果表明:随着Bi2O3含量的增加,玻璃网络中[BO4]取代了部分[BO3],玻璃网络中出现Bi—O结构,玻璃中非桥氧的数量也逐渐增多;软化温度(ts)、玻璃化温度(tg)都是先上升后下降,而线膨胀系数先减小后逐渐增大,玻璃密度先是线性增加,然后增加趋势变大。     

磁控溅射工作压强对β-Ga2O3薄膜特性的影响

作为新兴的第三代半导体材料,β-Ga₂O₃高质量薄膜是制备高效Ga₂O₃基器件的基础,β-Ga₂O₃薄膜的制备、表征及光电特性的研究具有深刻的意义。通过分析研究磁控溅射工作压强变化对薄膜性能和形貌的影响,为制备更高质量的薄膜提供了一种新的方法。基于射频磁控溅射方法,在单晶c面蓝宝石(Al₂O₃)衬底上沉积生长Ga₂O₃薄膜,并进行900℃、90min的氮气退火处理,以得到β-Ga₂O₃薄膜。沉积过程不改变其他实验参数,仅改变工作压强,研究工作压强对β-Ga₂O₃薄膜特性的影响。X射线衍射仪(XRD)和原子力显微镜(AFM)表征结果显示,β-Ga₂O₃薄膜具有不同取向的衍射峰,沿着■晶向择优生长,薄膜呈多晶状态。适当增大工作压强可使β-Ga<...     

Al2O3厚度对SAW传感器声波模式及性能的影响

该文采用多物理场耦合的有限元模型,探究了保护层Al₂O₃厚度对以LGS为压电基底、Pt为电极的声表面波(SAW)高温传感器中声波特性及器件性能的影响。结果表明,随着Al₂O₃保护层厚度的增加,声表面波在L波方向的振动位移增加,在SH波和SV波方向的振动位移减弱,当保护层归一化厚度为6.25%时,其能量向衬底内部扩散;当保护层归一化厚度为18.75%时,Rayleigh波消失,此时为体波BAW模式;增加Al₂O₃保护层,波速v、机电耦合系数K²显著升高;一阶频率温度系数τ_f,1和转换温度随保护层厚度的增加而升高。利用Al₂O₃薄膜对SAW温度传感器进行结构优化,为了获得良好的综合性能,归一化厚度应该在0.94%附近。     

氧分压对脉冲激光沉积β-Ga2O3-δ薄膜光学性能的影响

在不同氧分压下,用脉冲激光沉积法在c-蓝宝石衬底上制备了高质量β-Ga₂O_3?δ薄膜。通过X-射线衍射、远红外反射光谱、X-射线光电子能谱和紫外-可见-近红外透射光谱系统地研究了β-Ga₂O_3?δ薄膜的晶格结构、化学计量比和光学性质。X-射线衍射分析表明,所有沉积的薄膜以(-201)晶向方向生长。透射光谱显示薄膜在255 nm以上的紫外-可见-近红外波段具有80%以上的高透明度,同时在255 nm附近有一个陡峭的吸收边。此外,利用Tauc-Lorentz(TL)色散函数模型和Tauc公式,我们提取了β-Ga₂O_3?δ薄膜的光学常数和光学直接带隙。更进一步,我们通过理论计算解释了氧气分压对β-Ga₂O_3?δ薄膜光学性质的影响。     

氧分压对磁控溅射β-Ga2O3薄膜结构及光学特性的影响

通过磁控溅射沉积以及高温热退火处理,在5.08 cm(2 inch)c-plane蓝宝石异质衬底上制备出单晶β-Ga2O3薄膜,研究了溅射气氛中氧分压对β-Ga2O3薄膜的晶体结构以及光学特性的影响.通过调控氧分压,获得了具有{-2 01}晶面族X射线衍射峰的β-Ga2O3薄膜,其最大晶粒尺寸达到138 nm,在300～800 nm波段透射率大于80％,最大光学带隙达5.12 eV.最优的薄膜表面粗糙度达0.401 nm,800 nm波长处折射率为1.94.实验结果表明,降低氧分压有利于溅射粒子动能增大、数量增多,从而提升β-Ga2O3薄膜结晶质量、增加薄膜透射率和光学带隙;适当提高氧分压则有利于改善薄膜表面平整度,并提高致密度.     

Effects of surface passivation during atomic layer deposition of Al2O3 on In0.53Ga0.47As substrates

In this work we investigate the effect of different III-V surface passivation strategies during atomic layer deposition of Al₂O₃. X-ray photoelectron spectroscopy indicates that bare As-decapped and sulfur passivated In_0.53Ga_0.47As present residual oxides on the surface just before the beginning of the Al₂O₃ deposition while the insertion of a Ge interface passivation layer results in an almost oxide free Ge/III-V interface. The study of the initial growth regimes, by means of in situ spectroscopic ellipsometry, shows that the growth of Al₂O₃ on Ge leads to an enhanced initial growth accompanied by the formation of Ge-O-Al species thus affecting the final electrical properties of the stack. Alternatively, deposition on decapped and S-passivated In_0.53Ga_0.47As results in a more controlled growth process. The sulfur passivation leads to a better electrical response of the capacitor that can be associated to a lower oxide/semiconductor interface trap density.     

用于GaAs射频集成电路的不同厚度氧化铝MIM 电容的研究

本文研究了不同厚度的氧化铝对MIM电容直流和射频特性的影响。在1MHz下,对于20nm氧化铝MIM电容,其拥有3850 pF/mm₂的高电容密度和可接受的681 ppm/V₂的VCC-α电压系数。1MHz时突出的74 ppm/V₂VCC-α电压系数,8.2GHz谐振频率以及2GHz时41的Q值可以从100nm氧化铝MIM电容获得。采用GaAs工艺以及原子层淀积制造的高性能ALD氧化铝MIM电容很有可能成为GaAs射频集成电路很有前景的候选器件。     

Al2O3 stacks on In0.53Ga0.47As substrates: In situ investigation of the interface

In this work we present an in situ investigation of the interface composition between an In_0.53Ga_0.47As substrate and an Al₂O₃ oxide grown by molecular beam deposition in ultra high vacuum conditions. In the effort to improve the chemical quality of the interface, reduction of semiconductor-oxygen bonding at the interface can be obtained by growing a few Å thick pure Al layer before starting exposure of the surface to the atomic oxygen flux. Conversely, when a Ge interface passivation layer is intercalated between the semiconductor and the oxide stack, the interface chemistry is governed by Ge reaction with other species (Al, O), leading only to a partial suppression of the interface oxides.     

Sn掺杂对(In0.95-xSnxFe0.05)2O3薄膜的结构、电学及磁特性的影响

我们利用脉冲激光沉积的方法制备了一系列(In0.95-xSnxFe0.05)2O3 (x=0~0.09)薄膜,并在其中发现了室温铁磁性。X射线衍射结果表明锡与铁离子已掺入氧化铟晶格。随着锡的掺入,样品内的载流子浓度得到了很大的提高,但相应的铁磁性却几乎没有变化。我们认为氧空位相关的束缚磁极化子模型能够跟好的解释我们的铁掺杂氧化铟薄膜中的铁磁耦合的机制,而载流子传导的RKKY相互作用则不适用于这一系统。     

Comparison of interfacial and electrical properties between Al2O3 and ZnO as interface passivation layer of GaAs MOS device with HfTiO gate dielectric

GaAs metal–oxide–semiconductor(MOS) capacitors with HfTiO as the gate dielectric and Al2O3 or ZnO as the interface passivation layer(IPL) are fabricated. X-ray photoelectron spectroscopy reveals that the Al2O3 IPL is more effective in suppressing the formation of native oxides and As diffusion than the ZnO IPL. Consequently, experimental results show that the device with Al2O3 IPL exhibits better interfacial and electrical properties than the device with ZnO IPL: lower interface-state density(7.21012 eV1cm2/, lower leakage current density(3.60107A/cm2 at Vg D1 V) and good C–V behavior.     

Improved interfacial properties of GaAs MOS capacitor with NH3-plasma-treated ZnON as interfacial passivation layer

The GaAs MOS capacitor was fabricated with HfTiON as high-k gate dielectric and NH₃-plasma-treated ZnON as interfacial passivation layer (IPL), and its interfacial and electrical properties are investigated compared to its counterparts with ZnON IPL but no NH₃-plasma treatment and without ZnON IPL and no plasma treatment. Experimental results show that low interface-state density near midgap (1.17×10¹² cm^-2eV^-1) and small gate leakage current density have been achieved for the GaAs MOS device with the stacked gate dielectric of HfTiON/ZnON plus NH₃-plasma treatment. These improvements could be ascribed to the fact that the ZnON IPL can effectively block in-diffusion of oxygen atoms and out-diffusion of Ga and As atoms, and the NH₃-plasma treatment can provide not only N atoms but also H atoms and NH radicals, which is greatly beneficial to removal of defective Ga/As oxides and As-As band, giving a high-quality ZnON/GaAs interface.     

The structural and electrical properties of the SrTa2O6/In0.53Ga0.47As/InP system

The structural and electrical properties of SrTa₂O₆(SrTaO)/n-In_0.53GaAs_0.47(InGaAs)/InP structures where the SrTaO was grown by atomic vapor deposition, were investigated. Transmission electron microscopy revealed a uniform, amorphous SrTaO film having an atomically flat interface with the InGaAs substrate with a SrTaO film thickness of 11.2 nm. The amorphous SrTaO films (11.2 nm) exhibit a dielectric constant of ∼20, and a breakdown field of >8 MV/cm. A capacitance equivalent thickness of ∼1 nm is obtained for a SrTaO thickness of 3.4 nm, demonstrating the scaling potential of the SrTaO/InGaAs MOS system. Thinner SrTaO films (3.4 nm) exhibited increased non-uniformity in thickness. From the capacitance-voltage response of the SrTaO (3.4 nm)/n-InGaAs/InP structure, prior to any post deposition annealing, a peak interface state density of ∼2.3 × 10¹³ cm⁻² eV⁻¹ is obtained located at ∼0.28 eV (±0.05 eV) above the valence band energy (E_v) and the integrated interface state density in range E_v + 0.2 to E_v + 0.7 eV is 6.8 × 10¹² cm⁻². The peak energy position (0.28 ± 0.05 eV) and the energy distribution of the interface states are similar to other high-k layers on InGaAs, such as Al₂O₃ and LaAlO₃, providing further evidence that the interface defects in the high-k/InGaAs system are intrinsic defects related to the InGaAs surface.     

氧化铟纳米管的制备及它的甲苯气敏特性研究

Abstract： The pristine In2O3 nanotubes were synthesized by electrospinning and subsequent calcination. Scanning electron microscope, X-ray powder diffraction and transmission electron micrograph were employed to analyze the morphology and crystal structure of the as-synthesized nanotubes. Gas-sensing properties of the as-synthesized In203 nanotubes were investigated by exposing the corresponding sensors to toluene, acetone, ethanol, formalde- hyde, ammonia and carbon monoxide at 340 ℃. The results show that the gas sensor possesses a good selectivity to toluene at 340 ℃. The response of the In2O3 nanotube gas sensor to 40 ppm is about 5.88. The response and recovery times are about 3 s and 17 s, respectively.