ZrON/GeON 双钝化层改善Ge MOS器件的界面特性和电特性

本文研究了利用等离子体氮化形成ZrON/GeON双钝化层制备Ge MOS器件的界面特性和电特性。结果发现,相比于N2等离子处理,NH3等离子处理制备的双钝化层显著改善了器件的界面和电特性,获得了低的界面态密度 (Dit = 1.64×1011 cm-2 eV-1)和栅极漏电流(Jg = 9.32×10-5 A cm-2@Vfb +1 V),小的电容等效厚度 (CET = 1.11 nm)以及高的k值 (32). XPS分析表明,由NH3等离子体分解出的H原子和NH基团可以有效促进Ge表面不稳定低k GeOx的挥发,从而形成了高质量的GeON钝化层;且NH3等离子体氮化导致更多氮在ZrON/GeON中结合,能更有效阻止O、Ti、Ge等元素间的相互扩散,从而获得好的界面质量和电特性。     

基于MIS电容器的Al2O3与In0.74Al0.26As的界面特性

采用In_0.74Al_0.26As/In_0.74Ga_0.26As/In_xAl_1-xAs异质结构多层半导体作为半导体层,制备了金属-绝缘体-半导体（MIS）电容器。其中,SiN_x和SiN_x/Al₂O₃分别作为MIS电容器的绝缘层。高分辨率透射电子显微镜和X射线光电子能谱的测试结果表明,与通过电感耦合等离子体化学气相沉积生长的SiN_x相比,通过原子层沉积生长的Al2_O3可以有效地抑制Al₂O₃和In_0.74Al_0.26As界面的In₂O₃的含量。根据MIS电容器的电容-电压测量结果,计算得到SiN_x/Al₂O₃/In...     

共沉淀法制备Y2O2SO4:Eu3+荧光粉及其光致发光研究

采用商业Y(NO3)3·6H2O、Eu(NO3)3·6H2O、(NH4)2SO4和NaOH为实验原料,通过共沉淀法制备了Y2O2SO4:Eu3+荧光粉。利用热分析(DTA-TG-DTG)、傅里叶变换红外(FT-IR)光谱、X射线衍射(XRD)、扫描电子显微镜(SEM)和光致发光(PL)光谱等手段对合成的粉体进行了表征。结果表明,当(NH4)2SO4引入到反应体系中时,前驱体具有非晶态结构,且在空气气氛中800℃煅烧2h能转化为单相的Y2O2SO4粉体,该Y2O2SO4粉体呈准球形,粒径范围分布在0.5~1.0μm之间,团聚较严重。PL光谱分析表明,在270nm紫外光激发下,Y2O2SO4:Eu3+荧光粉呈红光发射,主发射峰位于620nm,归属于Eu3+的5D0→7F2跃迁。Eu3+的猝灭浓度是5 mol%,其对应的荧光寿命为1.22 ms。另外,当(NH4)2SO4未引入到反应体系中时,采用类似的方法合成了Y2O3:Eu3+荧光粉,并对Y2O2SO4:Eu3+和Y2O3:Eu3+荧光粉的PL性能进行了比较。     

钝化处理对Al2O3/InP MOS电容界面特性的影响

制备了Al/Al_2O_3/InP金属氧化物半导体(MOS)电容,分别采用氮等离子体钝化工艺和硫钝化工艺处理InP表面。研究了在150、200和300 K温度下样品的界面特性和漏电特性。实验结果表明,硫钝化工艺能够有效地降低快界面态,在150 K下测试得到最小界面态密度为1.6×10¹⁰ cm^-2·eV^-1。与硫钝化工艺对比,随测试温度升高,氮等离子体钝化工艺可以有效减少边界陷阱,边界陷阱密度从1.1×10¹² cm^-2·V^-1降低至5.9×10¹¹ cm^-2·V^-1,同时减少了陷阱辅助隧穿电流。氮等离子体钝化工艺和硫钝化工艺分别在降低边界陷阱和快界面态方面有一定优势,为改善器件界面的可靠性提供了依据。     

Al2(WO4)3的激光烧结合成及特性

采用激光烧结技术快速成功地将比例适当的Al2O3和WO3粉末合成了形貌良好且致密的Al2(WO4)3材料,并对该材料采用多种分析手段进行了分析。 拉曼光谱分析说明在合适工艺参数下激光烧结可避免原料挥发,使原料完全参与反应。X射线衍射(XRD)分析表明合成物主要是Al2(WO4)3,属空间群Pnca,具有正交结构,可能显示负热膨胀特性,另外还含有少量的AlxWO3(x≤1)和WO3-x(x<1)。扫描电镜(SEM)发现合成物晶粒呈球形、细小、排列致密、少有气孔、尺寸约在10 nm左右。能量散射光谱(EDS)分析显示合成物内部成分分布均匀。热分析则得出合成物中少许杂相为复杂非平衡相。     

Bi2O3对Al2O3-ZnO-Bi2O3-B2O3低熔玻璃结构和性能的影响

采用传统的熔淬技术制得了低熔Al2O3-ZnO-Bi2O3-B2O3玻璃,研究了玻璃结构、玻璃特征温度、线膨胀系数(αl)以及密度随Bi2O3含量的变化关系。结果表明:随着Bi2O3含量的增加,玻璃网络中[BO4]取代了部分[BO3],玻璃网络中出现Bi—O结构,玻璃中非桥氧的数量也逐渐增多;软化温度(ts)、玻璃化温度(tg)都是先上升后下降,而线膨胀系数先减小后逐渐增大,玻璃密度先是线性增加,然后增加趋势变大。     

磁控溅射工作压强对β-Ga2O3薄膜特性的影响

作为新兴的第三代半导体材料,β-Ga₂O₃高质量薄膜是制备高效Ga₂O₃基器件的基础,β-Ga₂O₃薄膜的制备、表征及光电特性的研究具有深刻的意义。通过分析研究磁控溅射工作压强变化对薄膜性能和形貌的影响,为制备更高质量的薄膜提供了一种新的方法。基于射频磁控溅射方法,在单晶c面蓝宝石(Al₂O₃)衬底上沉积生长Ga₂O₃薄膜,并进行900℃、90min的氮气退火处理,以得到β-Ga₂O₃薄膜。沉积过程不改变其他实验参数,仅改变工作压强,研究工作压强对β-Ga₂O₃薄膜特性的影响。X射线衍射仪(XRD)和原子力显微镜(AFM)表征结果显示,β-Ga₂O₃薄膜具有不同取向的衍射峰,沿着■晶向择优生长,薄膜呈多晶状态。适当增大工作压强可使β-Ga<...     

Al2O3厚度对SAW传感器声波模式及性能的影响

该文采用多物理场耦合的有限元模型,探究了保护层Al₂O₃厚度对以LGS为压电基底、Pt为电极的声表面波(SAW)高温传感器中声波特性及器件性能的影响。结果表明,随着Al₂O₃保护层厚度的增加,声表面波在L波方向的振动位移增加,在SH波和SV波方向的振动位移减弱,当保护层归一化厚度为6.25%时,其能量向衬底内部扩散;当保护层归一化厚度为18.75%时,Rayleigh波消失,此时为体波BAW模式;增加Al₂O₃保护层,波速v、机电耦合系数K²显著升高;一阶频率温度系数τ_f,1和转换温度随保护层厚度的增加而升高。利用Al₂O₃薄膜对SAW温度传感器进行结构优化,为了获得良好的综合性能,归一化厚度应该在0.94%附近。     

La2O3-B2O3玻璃添加对Zn0.5Ti0.5NbO4微波介质陶瓷结构及性能影响

利用X射线衍射、扫描电子显微镜等手段研究了添加La₂O₃-B₂O₃玻璃作为烧结助剂的Zn_0.5Ti_0.5NbO₄微波介质陶瓷在低温烧结过程中的结构及微波介电性能变化。实验结果表明,适当的La₂O₃-B₂O₃玻璃添加不会影响Zn_0.5Ti_0.5NbO₄陶瓷的相组成。添加质量分数2%的La₂O₃-B₂O₃烧结助剂有助于在烧结过程中形成液相,液相能有效加速Zn_0.5Ti_0.5NbO₄陶瓷的低温烧结过程,实现Zn_0.5Ti_0.5NbO₄陶瓷的致密化。在875℃烧结时,添加质量分数2%La₂O₃-B₂O₃玻璃的Zn_0.5Ti_0.5NbO₄陶瓷具有优异的微波介电性能:ε_r =33.91,Q×f=16579 GHz（f=6.1 GHz）,τ_f=-68.54×10^-6/℃。     

氧分压对脉冲激光沉积β-Ga2O3-δ薄膜光学性能的影响

在不同氧分压下,用脉冲激光沉积法在c-蓝宝石衬底上制备了高质量β-Ga₂O_3?δ薄膜。通过X-射线衍射、远红外反射光谱、X-射线光电子能谱和紫外-可见-近红外透射光谱系统地研究了β-Ga₂O_3?δ薄膜的晶格结构、化学计量比和光学性质。X-射线衍射分析表明,所有沉积的薄膜以(-201)晶向方向生长。透射光谱显示薄膜在255 nm以上的紫外-可见-近红外波段具有80%以上的高透明度,同时在255 nm附近有一个陡峭的吸收边。此外,利用Tauc-Lorentz(TL)色散函数模型和Tauc公式,我们提取了β-Ga₂O_3?δ薄膜的光学常数和光学直接带隙。更进一步,我们通过理论计算解释了氧气分压对β-Ga₂O_3?δ薄膜光学性质的影响。     

Effects of surface treatments on the electrical and the microstructural changes of Pd contact on p-type GaN

We investigated the effects of surface treatments by aqua regia and (NH₄)₂S_x on the electrical and the microstructural changes of Pd contact on p-type GaN during annealing. The formation of a surface oxide was suppressed by the (NH₄)₂S_x treatment, and S-Ga and S-N bonds with binding energy of 162.1 eV and 163.6eV were formed, degrading the structural ordering of Pd. After 300°C annealing, the contact resistivity in the aqua regia-treated sample increased significantly. This could be attributed to the outdiffusion of N atoms leaving N vacancies below the contact, as confirmed by the increase of the Pd (111) plane spacing probably due to the dissolution of N atoms in Pd interstitial sites. Meanwhile, the contact resistivity in the (NH₄)₂S_x-treated sample was not degraded and no change was observed in the Pd (111) plane spacing. These results suggest that S-Ga and S-N bonds formed on (NH₄)₂S_x-treated GaN could act as a diffusion barrier for the outdiffusion of N atoms. The contact resistivity for the aqua regia-treated sample decreased again, probably due to the outdiffusion of Ga as well as N atoms at 500°C.     

(NH4)2Sx-treated InP(100) surfaces studied by soft x-ray photoelectron spectroscopy

The sulfur chemical bonding state on (NH₄)₂S_x-treated InP(100) surfaces has been studied by S 1s core-level photoelectron measurements using synchrotron radiation soft x-rays. The change in the sulfur chemical bonding states caused by rinsing with water and annealing in vacuum after the (NH₄)₂S_x-treatment was observed clearly in the S 1s spectra. Four kinds of sulfur bonding states were resolved in the S 1s spectrum of the as-treated surface. Only one sulfur bonding state was detected on the surfaces with and without the water rinse after annealing, indicating that the InP surfaces were terminated by the S-In bond. The effect of rinsing the (NH_j4)₂S_x-treated InP surface is discussed by comparison with the (NH₄)₂S_x-treated GaAs surface.     

Reduction of deep levels in MOCVD-regrown AlxGa1−x as interfaces by (NH4)2S passivation and in-situ HCl etching

The effects of surface preparation usinginsitu HCl etching and (NH₄)₂S passivation of Al_xGa_1-xAs episurfaces prior to regrowth by MOCVD are analyzed by deep level transient spectroscopy (DLTS), electrochemical profiling (C-V) and room-temperature photoluminescence (PL). Four electron traps were found from the DLTS measurements; a DX-center and three traps previously reported for oxygen-contaminated MOCVD systems. Electrical and optical measurements on quantum well lasers containing a regrown interface in the optical confinement region are also presented. It is demonstrated that both (NH₄)₂S passivation and HClin-situ etching improve the electrical and optical quality of the regrown Al_xGa_1-xAs interfaces, with the best results being obtained when the two methods are used in tandem.     

Carrier transport and related phenomena in MOS devices

Silicon-based devices are currently the most attractive group because they are functioning at room temperature and can be easily integrated into conventional silicon microelectronics. There are many models and simulation programs available to compute CV curves with quantum correction [Choi C-H, Wu Y, Goo JS, Yu Z, Dutton RW. IEEE Trans on Electron Devi 2000; 47(10): 1843; Croci S, Plossu C, Burignat S. J Mater Sci Mater Electron 2003; 14: 311; Soliman L, Duval E, Benzohra M, Lheurette E, Ketata K, Ketata M. Mater Sci Semicond Process 2001; 4: 163]. This work deals with the simulation of electron transfer through SiO₂ barrier of metal–oxide–semiconductor structure (MOS). The carrier density is given by a self consistent resolution of Schrödinger and Poisson equations and then the MOS capacitance is deduced and compared with results available in literature. As it is well known, the MOS capacitance–voltage profiling provides a simple determination of structure parameters. The extracted tunnel oxide thickness and substrate doping are compared with those used in the simulation. For the purpose to investigate the electron tunnelling through the barrier, we have used the transfer matrix approach. Using I–V simulations, we have shown that the traps in SiO₂ matrix have a drastic influence on electron tunnelling through the barrier. The trap-assisted contribution to the tunnelling current is included in many models [Maserjian J, Zamani N. J Appl Phys 1982; 53(1): 559; Houssa M, Stesmans A, Heyns MM. Semicond Sci Technol 2001; 16: 427; Aziz A, Kassmi K, Kassmi Ka, Olivie F. Semicond Sci Technol 2004; 19: 877; Wu You-Lin, Lin Shi-Tin. IEEE Trans Dev Mater Reliab 2006; 6(1): 75; Larcher L. IEEE Trans Electron Dev 2003; 50(5): 1246]; this is the basis for the interpretation of stress induced leakage current (SILC) and breakdown events. Memory effect becomes typical for this structure. We have studied the I–V dependence with trap parameters.     

Impurity-induced disordering of AlxGa1−xAs-GaAs quantum well heterostructures with (Si2)x(GaAs)1−x barriers

Recent work indicates that the alloy (Si₂)_x(GaAs)_1−x can be formed within the GaAs quantum well of an Al_xGa_1−xAs-GaAs quantum well heterostructure (QWH) and results in a shift of laser operation to higher energy. In this paper we show, by SIMS and EDS measurements, that the Si concentration in the (Si₂)_x(GaAs)_1−x layer far exceeds typical “doping” levels. The stability of these QWHs has been investigated with respect to thermal annealing and Zn impurity-induced layer disordering (Zn-IILD). Data are presented showing that the (Si₂)_x(GaAs)_1−x alloy is stable against thermal annealing unless a rich source of Ga vacancies is provided, and that relatively low temperature Zn diffusion greatly enhances the disordering process of the alloy layer.     

溅射压力对制备a-GaAs1-xNx 薄膜光学常数的影响

采用反应磁控溅射法在室温条件下制备了a-GaAs_1-xN_x 薄膜。实验测定了薄膜厚度、氮含量、载流子浓度和光学透过率及并研究了其随溅射压的变化。系统研究了溅射压对所制备薄膜的光学带隙、折射率和色散参数的影响。所制备的薄膜为直接带隙材料,利用Cauchy和Wemple模型能够很好地拟合所制备薄膜的折射率色散曲线。     

Sn掺杂对(In0.95-xSnxFe0.05)2O3薄膜的结构、电学及磁特性的影响

我们利用脉冲激光沉积的方法制备了一系列(In0.95-xSnxFe0.05)2O3 (x=0~0.09)薄膜,并在其中发现了室温铁磁性。X射线衍射结果表明锡与铁离子已掺入氧化铟晶格。随着锡的掺入,样品内的载流子浓度得到了很大的提高,但相应的铁磁性却几乎没有变化。我们认为氧空位相关的束缚磁极化子模型能够跟好的解释我们的铁掺杂氧化铟薄膜中的铁磁耦合的机制,而载流子传导的RKKY相互作用则不适用于这一系统。