Thermal conductivity of ceramic/metal composites from preforms produced by freeze casting

Porous alumina and zirconia preforms, processed by ice templating, have been used to manufacture ceramic/metal composites by aluminium alloy infiltration. The aim of the present work is to study the influence of the ceramic material nature and of the initial porous structure on the thermal conductivity anisotropy of the composite in order to assess potential applications in the field of thermal management. The materials are characterised in terms of pore volume fraction and pore size before and after metal infiltration. The freeze casted preforms exhibit anisotropic lamellar structures with ellipsoidal pores ranging from 35 µm to 40 µm and porosity fractions from 64 to 67%. After metal infiltration, composite parts present the same anisotropic morphology, which correspond to alternating ceramic and metal layers. Thermal conductivities have been determined, with an average of 80 W m⁻¹ K⁻¹ and 13 W m⁻¹ K⁻¹ parallel and perpendicular to the freezing direction respectively, for zirconia/metal composites. Theoretical values of thermal conductivity can be calculated using the Maxwell-Eucken relation, to handle the residual porosity, in combination with series and parallel resistance models to describe the overall anisotropic character. These give good agreement to experiment.     

Porous Ca3Co4O9 with enhanced thermoelectric properties derived from Sol–Gel synthesis

Highly porous Ca₃Co₄O₉ thermoelectric oxide ceramics for high-temperature application were fabricated by sol–gel synthesis and subsequent conventional sintering. Growth mechanism of misfit-layered Ca₃Co₄O₉ phase, from sol–gel synthesis educts and upcoming intermediates, was characterized by in-situ X-ray diffraction, scanning electron microscopy and transmission electron microscopy investigations. The Ca₃Co₄O₉ ceramic exhibits a relative density of 67.7%. Thermoelectric properties were measured from 373 K to 1073 K. At 1073 K a power factor of 2.46 μW cm⁻¹ K⁻², a very low heat conductivity of 0.63 W m⁻¹ K⁻¹ and entropy conductivity of 0.61 mW m⁻¹ K⁻² were achieved. The maintained figure of merit ZT of 0.4 from sol–gel synthesized Ca₃Co₄O₉ is the highest obtained from conventional, non-doped Ca₃Co₄O₉. The high porosity and consequently reduced thermal conductivity leads to a high ZT value.     

The phase stability and thermophysical properties of InFeO3(ZnO)m (m = 2, 3, 4, 5)

The phase stability and thermophysical properties of InFeO₃(ZnO)_m (m = 2, 3, 4, 5) compounds were investigated, which are a general family of homologous layered compounds with general formula InFeO₃(ZnO)_m (m = 1–19). InFeO₃(ZnO)_m (m = 2, 3, 4, 5) ceramics were synthesized using cold pressing followed by solid-state sintering. They revealed an excellent thermal stability after annealing at 1450 °C for 48 h. No phase transformation occurred during heating to 1400 °C. InFeO₃(ZnO)₃ exhibited a thermal conductivity of 1.38 W m⁻¹ K⁻¹ at 1000 °C, which is about 30% lower than that of 8 wt.% yttria stabilized zirconia (8YSZ) thermal barrier coatings. The thermal expansion coefficients (TECs) of InFeO₃(ZnO)m bulk ceramics were in a range of (10.97 ± 0.33) × 10⁻⁶ K⁻¹ to (11.46 ± 0.35) × 10⁻⁶ K⁻¹ at 900 °C, which are comparable to those of 8YSZ ceramics.     

Crystal structure,mechanical and thermal properties of Yb4Al2O9: A combination of experimental and theoretical investigations

The key requirements for a successful thermal and environmental barrier coating (T/EBC) material include stability in high temperature water vapor, low Young's modulus, close thermal expansion coefficient (TEC) with mullite, low thermal conductivity and weak mechanical anisotropy. The current prime candidates for top coat are ytterbium silicates (Yb₂SiO₅ and Yb₂Si₂O₇). A major weakness of these two silicates is the severe anisotropy in mechanical properties and thermal expansion that would lead to cracking of the coating. Thus, searching for new materials with weak mechanical and thermal anisotropy is of signification. In this work, the crystal structure, mechanical and thermal properties of a promising T/EBC candidate, Yb₄Al₂O₉, are investigated theoretically and experimentally. Good ductility, low shear deformation resistance, low Young's modulus (151 GPa) and low thermal conductivity (0.78 W m⁻¹ K⁻¹) is underpinned by heterogeneous bonding characteristic and distortion of the structure. Close TEC (6.27 × 10⁻⁶ K⁻¹) with mullite and weak mechanical anisotropy highlight the suitability of Yb₄Al₂O₉ as a prospective T/EBC.     

Theoretical investigation of mechanical and thermal properties of MPO4 (M = Al,Ga)

Minimum lattice thermal conductivities and mechanical properties of polymorphous MPO₄ (M = Al, Ga) are investigated by first principles calculations. The theoretical minimum thermal conductivities are found to be 1.02 W (m K)^?1 for α-AlPO₄, 1.20 W (m K)^?1 for β-AlPO₄, 0.87 W (m K)^?1 for α-GaPO₄ and 0.88 W (m K)^?1 for β-GaPO₄. The lower thermal conductivities in comparison to YSZ can be attributed to the lattice phonon scattering due to the framework of heterogeneous bonds. In addition, the low shear-to-bulk modulus ratio for both β-AlPO₄ (0.38) and β-GaPO₄ (0.30) is observed. Our results suggest their applications as light-weight thermal insulator and damage-tolerant/machinable ceramics.     

A strategy for fabricating textured silicon nitride with enhanced thermal conductivity

C-axis textured Si₃N₄ with a high thermal conductivity of 176 W m⁻¹ K⁻¹ along the grain alignment direction was fabricated by slip casting raw α-Si₃N₄ powder seeded with near-equiaxed β-Si₃N₄ particles and Y₂O₃–MgSiN₂ as sintering additives in a rotating strong magnetic field of 12 T, followed by gas pressure sintering at 1900 °C for 12 h at a nitrogen pressure of 1 MPa. The green material reached a relative density of 57%, with slip casting and the sintered material exhibited a relative density of 99% and a Lotgering orientation factor of 0.98. The morphology of the β-Si₃N₄ seeds had little effect on the texture development and thermal anisotropy of textured Si₃N₄. The technique developed provides highly conductive Si₃N₄ with conductivity to the thickness direction, which is a major advantage in practical use. The technique is also simple, inexpensive and effective for producing textured Si₃N₄ with high thermal conductivity of over 170 W m⁻¹ K⁻¹.     

A new estimation method for the intrinsic thermal conductivity of nonmetallic compounds: A case study for MgSiN2, AlN and β-Si3N4 ceramics

A new method for estimating the maximum achievable thermal conductivity of non-electrically conducting materials is presented. The method is based on temperature dependent thermal diffusivity data using a linear extrapolation method enabling discrimination between phonon-phonon and phonon-defect scattering. The thermal conductivities estimated in this way for MgSiN₂, AlN and β-Si₃N₄ ceramics at 300 K equal 28, 200 and 105 W m⁻¹ K⁻¹, respectively in favourable agreement with the highest experimental values of 23, 266 and 106–122 W m⁻¹ K⁻¹. This suggests the general applicability of the proposed estimation method for non-metallic compounds. It is expected that when optic phonons contribute to the heat conduction (as is the case for AlN) the intrinsic thermal conductivity at lower temperatures (e.g. 300 K) is underestimated. However, the reliability and accuracy of the presented ‘easy to use’ estimation method seems to be much better than several other estimation methods. Furthermore the needed input for this method can provide information about which processing parameters should be optimised to obtain the highest thermal conductivity.     

Fabrication and thermal conductivity of highly porous alumina body from platelets with yeast fungi as a pore forming agent

A highly porous alumina body was fabricated by heating a green clinker body consisting of platelets and yeast fungi as a pore forming agent. Four kinds of alumina platelets were used. When green clinker bodies of platelet aggregates (A11) with 10 and 30 mass% of yeast fungi were heated at 1500 °C for 2 h, their porosities reached 72% and 78%, respectively. In contrast, when the green clinker bodies composed of platelets with an average size of 10 µm and an aspect ratio of 25–30 (SERATH①), and 20 mass% of yeast fungi were heated at 1400 °C for 2 h, the porosity of the resultant porous alumina body was also approximately 72%. However, the room temperature thermal conductivities of the porous alumina bodies with 72% porosity derived from A11 and SERATH① were 0.86 and 0.50 W m⁻¹ K⁻¹, respectively. The decrease in the thermal conductivity of the porous alumina body produced from SERATH① is caused by the long path route for heat transfer.     

Thermal,mechanical and electrical properties of hard B4C,BCN, ZrBC and ZrBCN ceramics

We study the thermal, mechanical and electrical properties of B₄C, BCN, ZrBC and ZrBCN ceramics prepared in the form of thin films by magnetron sputtering. We focus on the effect of Zr_x(B₄C)_1−x sputter target composition, the N₂+Ar discharge gas mixture composition, the deposition temperature and the annealing temperature after the deposition. The thermal properties of interest include thermal conductivity (observed in the range 1.3–7.3 W m⁻¹ K⁻¹), heat capacity (0.37–1.6×10³ J kg⁻¹ K⁻¹ or 1.9–4.1×10⁶ Jm⁻³ K⁻¹), thermal effusivity (1.6–4.5×10³ J m⁻² s^−1/2 K⁻¹) and thermal diffusivity (0.38–2.6×10⁻⁶ m² s⁻¹). We discuss the relationships between materials composition, preparation conditions, structure, thermal properties, temperature dependence of the thermal properties and other (mechanical and electrical) properties. We find that the materials structure (amorphous×crystalline hexagonal ZrB₂-like×nanocrystalline cubic ZrN-like), more than the composition, is the crucial factor determining the thermal conductivity and other properties. The results are particularly important for the design of future ceramic materials combining tailored thermal properties, mechanical properties, electrical conductivity and oxidation resistance.     

Porosity analysis and oxidation behavior of plasma sprayed YSZ and YSZ/LaPO4 abradable thermal barrier coatings

In this research, the high temperature oxidation behavior, porosity, and microstructure of four abradable thermal barrier coatings (ATBCs) consisting of micro- and nanostructured YSZ, YSZ-10%LaPO₄, and YSZ-20%LaPO₄ coatings produced by atmospheric (APS) method were evaluated. Results show that the volume percentage of porosity in the coatings containing LaPO₄ was higher than the monolithic YSZ sample. It was probably due to less thermal conductivity of LaPO₄ phases. Furthermore, the results showed that the amount of the remaining porosity in the composite coatings was higher than the monolithic YSZ at 1000 °C for 120 h. After 120 h isothermal oxidation, the thickness of thermally growth oxide (TGO) layer in composite coatings was higher than that of YSZ coating due to higher porosity and sintering resistance of composite coatings. Finally, the isothermal oxidation resistance of conventional YSZ and nanostructured YSZ coating was investigated.     

Thermal analysis of submicron nanocrystalline diamond films

The thermal properties of sub-μm nanocrystalline diamond films in the range of 0.37–1.1 μm grown by hot filament CVD, initiated by bias enhanced nucleation on a nm-thin Si-nucleation layer on various substrates, have been characterized by scanning thermal microscopy. After coalescence, the films have been outgrown with a columnar grain structure. The results indicate that even in the sub-μm range, the average thermal conductivity of these NCD films approaches 400 W m^− 1 K^− 1. By patterning the films into membranes and step-like mesas, the lateral component and the vertical component of the thermal conductivity, k_lateral and k_vertical, have been isolated showing an anisotropy between vertical conduction along the columns, with k_vertical ≈ 1000 W m^− 1 K^− 1, and a weaker lateral conduction across the columns, with k_lateral ≈ 300 W m^− 1 K^− 1.     

Effect of seeding on the thermal conductivity of self-reinforced silicon nitride

Thermal conductivity of Si₃N₄ containing large β-Si₃N₄ particles as seeds for grain growth was investigated. Seeds addition promotes growth of β-Si₃N₄ grains during sintering to develop the duplex microstructure. The thermal conductivity of the material sintered at 1900 °C improved up to 106 W m⁻¹ K⁻¹, although that of unseeded material was 77 Wm⁻¹ K⁻¹. Seeds addition leads to reduction of the sintering temperature with developing the duplex microstructure and with improving the thermal conductivity, which benefits in terms of production cost of Si₃N₄ ceramics with thermal conductivity. ©     

Structural,thermal and mechanical properties of aluminum nitride ceramics with CeO2 as a sintering aid

AlN ceramics have been prepared with CeO₂ as a sintering aid at a sintering temperature of 1900 °C. The effect of CeO₂ contents on the microstructure, density, thermal conductivity and hardness was investigated. Addition of CeO₂ exerted a significant effect on the densification of AlN ceramics and hence on the microstructure. Thermal conductivity of AlN ceramics increased with CeO₂ content and was greater than that of Y₂O₃-doped AlN ceramics at a similar sintering temperature. The resulting AlN ceramics with 1.50 wt% of CeO₂ had the highest relative density of 99.94%, thermal conductivity of 156 W m⁻¹ K⁻¹ and hardness of 72.46 kg/mm².     

Parametric study of intrinsic thermal transport in vertically aligned multi-walled carbon nanotubes using a laser flash technique

The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films synthesized by thermal chemical vapor deposition was measured by a laser flash technique, and shown to be ～30 mm² s^?1 along the tube-alignment direction. The calculated thermal conductivities of the VACNT films and the individual CNTs were ～27 and ～540 W m^?1 K^?1, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube–tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube–tube interaction in dense VACNT films decreased the effective thermal conductivity of the individual CNTs in the films. The tip-to-tip contact resistance was shown to be ～1 × 10^?7 m² K W^?1. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging.     

Highly thermal conductive composites with polyamide-6 covalently-grafted graphene by an in situ polymerization and thermal reduction process

The thermal conductive polyamide-6/graphene (PG) composite is synthesized by in situ ring-opening polymerization reaction using ε-caprolactam as the monomer, 6-aminocaproic acid as the initiator and reduced graphene oxide (RGO) as the thermal conductive filler. The generated polyamide-6 (PA6) chains are covalently grafted onto graphene oxide (GO) sheets through the “grafting to” strategy with the simultaneous thermal reduction reaction from GO to RGO. The homogeneous dispersion of RGO sheets in PG composite favors the formation of the consecutive thermal conductive paths or networks at a relatively low GO sheets loading, which improves the thermal conductivity (λ) from 0.196 W m⁻¹ K⁻¹ of neat PA6 to 0.416 W m⁻¹ K⁻¹ of PG composite with only 10 wt% GO sheets loading.     

Fabrication of highly insulating foam glass made from CRT panel glass

We prepared low-density foam glasses from cathode-ray-tube panel glass using carbon and MnO₂ as the foaming agents. We investigated the influence of the carbon and MnO₂ concentrations, the glass-powder preparation and the foaming conditions on the density and homogeneity of the pore structure and the dependence of the thermal conductivity on the foam density. The results show that the moderate foaming effect of the carbon is greatly improved by the addition of MnO₂. A density as low as 131 kg m⁻³ can be achieved with fine glass powder. The foam density has a slight dependence on the carbon and MnO₂ concentrations, but it is mainly affected by the foaming temperature and the time. The thermal conductivity of the foam-glass samples is lower than that of commercial foam glasses with the same density. The lowest value was determined to be 42 mW m⁻¹ K⁻¹ for a foam glass with a density of 131 kg m⁻³. A further improvement in the closed porosity could potentially decrease the thermal conductivity even further, and thus our approach has great potential in terms of a thermal insulation material.     

High temperature thermal conductivity of free-standing diamond films prepared by DC arc plasma jet CVD

Free-standing diamond films with 1.68 mm in polished thickness have been prepared by DC arc plasma jet CVD. By means of simply changing the placing orientation of diamond films along the laser transmission direction while testing, the through-thickness thermal conductivity (κ_⊥) together with the in-plane (κ_//) thermal conductivity of free-standing diamond films were measured by laser flash technique over a wide temperature range. Results show that the thermal conductivity κ_⊥ and κ_// of free-standing diamond films are up to 1916 and 1739 Wm^− 1 K^− 1 at room temperature, respectively, showing small anisotropy (9%), and following the relationship κ ~ T^− n as temperature rises. The conductivity exhibits similar value compared to that of high-quality single crystal diamond above 500 K for both through-thickness and in-plane directions of CVD diamond films. The effects of impurities and grain boundaries on thermal conductivity of diamond films with increasing temperature were discussed.     

Graphite foam from pitch and expandable graphite

Graphite foams were prepared from a coal tar pitch that was partially converted into mesophase. Expandable graphite was used instead of an inert gas to “foam” the pitch. The resulting foam was subjected to a series of heat treatments with the objective of first crosslinking the pitch, and thereafter carbonizing and graphitizing the resulting foam. XRD confirmed that the graphitization at 2600 °C resulted in a highly graphitic material. The porosity of this foam derives from the loose packing of the vermicular exfoliated graphite particles together with their internal porosity. During the foaming process the pitch tends to coat the outside surface of the expanding graphite flakes. It also bonds them together. The graphite foam prepared with 5 wt.% expandable graphite had a bulk density of 0.249 g cm⁻³, a compressive strength of 0.46 MPa and a thermal conductivity of 21 W m⁻¹ K⁻¹. The specific thermal conductivity (thermal conductivity divided by the bulk density) of this low-density carbon foam was 0.084 W m² kg⁻¹ K⁻¹ which is considerably higher than that of copper metal (0.045 W m² kg⁻¹ K⁻¹) traditionally used in thermal management applications.     

Fabrication and evaluation of NiO/Y2O3-stabilized-ZrO2 hollow fibers for anode-supported micro-tubular solid oxide fuel cells

In this work NiO/3 mol% Y₂O₃–ZrO₂ (3YSZ) and NiO/8 mol% Y₂O₃–ZrO₂ (8YSZ) hollow fibers were prepared by phase-inversion. The effect of different kinds of YSZ (3YSZ and 8YSZ) on the porosity, electrical conductivity, shrinkage and flexural strength of the hollow fibers were systematically evaluated. When compared with Ni–8YSZ the porosity and shrinkage of Ni–3YSZ hollow fibers increases while the electrical conductivity decreases, while at the same time also exhibiting enhanced flexural strength. Single cells with Ni–3YSZ and Ni–8YSZ hollow fibers as the supported anode were successfully fabricated showing maximum power densities of 0.53 and 0.67 W cm⁻² at 800 °C, respectively. Furthermore, in order to improve the cell performance, a Ni–8YSZ anode functional layer was added between the electrolyte and Ni–YSZ hollow fiber. Here enhanced peak power densities of 0.79 and 0.73 W cm⁻² were achieved at 800 °C for single cells with Ni–3YSZ and Ni–8YSZ hollow fibers, respectively.     

Microstructure and thermal properties of nanostructured gadolinia doped yttria-stabilized zirconia thermal barrier coatings produced by air plasma spraying

In this article, the nanostructured 2 mol% Gd₂O₃-4.5 mol% Y₂O₃-ZrO₂(2GdYSZ) coating was developed by the atmospheric plasma spraying technique. And the microstructure and thermal properties of plasma-sprayed 2GdYSZ coating were investigated. The result from the investigation indicates that the as-sprayed coating is characterized by typical microstructure consisting of melted zones, nano-zones, splats, nano-pores, high-volume spheroidal pores and micro-cracks. The 2GdYSZ coating shows a lower resistance to destabilization of the metastable tetragonal (t′) phase compared to the yttria stabilized zirconia(YSZ). The thermal diffusivity and thermal conductivity of the nano-2GdYSZ coating at room temperature are 0.431 mm² s⁻¹ and 1.042 W/m K, respectively. Addition of gadolinia to the nano-YSZ can significantly reduce the thermal conductivity compared to the nano-YSZ and the conventional YSZ. The reduction is mainly attributed to the synergetic effect of gadolinia doping along with nanostructure.