一种BiCMOS欠压保护电路的设计

基于0.6μm BiCMOS工艺,设计实现了一种欠压保护电路.该电路结构简单,避免使用电压基准和比较器等辅助模块,工艺实现容易,可用于功率集成电路或单片集成电源.仿真结果表明,该电路能在欠压时输出逻辑信号,且有迟滞功能.     

一种非对称欠压锁定电路设计

传统带隙基准结构的欠压锁定(UVLO)电路存在结构复杂、温漂特性差、功耗高等缺陷。为精准实现低温漂,提出了一种欠压锁定电路结构,该结构基于差分放大器的非对称性产生滞回电压,进而降低了阈值电压的温度敏感性,提高了阈值电压的精度。该欠压保护电路通过反馈控制法产生了上、下门限阈值电压,克服了单个阈值抗干扰能力差的缺点。电路基于0.18μm BCD工艺设计,仿真结果表明：当电源电压高于上门限阈值电压(V_IH)2.2 V时,芯片系统正常工作;当电源电压低于下门限阈值电压2.01 V时,芯片系统被关断;在-55～+125℃温度范围内,该电路的滞回电压为0.19 V,V_IH温漂为0.01 V,滞回电压温漂为0.07 V,且该欠压锁定电路的功耗在3 V电源下为9.54μW。     

一种高精度快速响应欠压锁定电路设计

针对传统欠压锁定(UVLO)电路结构复杂和响应速度慢的问题,设计了一种高精度的快速响应欠压锁定电路.该电路整体均由CMOS管组成,结构简单且易于实现.采用电流模控制技术,随电源电压呈二次方曲线变化的自偏置电流控制阈值电压的产生,有效提高了电路的响应速度.该欠压锁定电路基于0.18μm BCD工艺设计,并利用HSPICE进行仿真验证,当电源电压在0～5V区间变化时,输出电压翻转的上阈值门限为3.91 V,相应下阈值门限为3.82V,迟滞量为90 mV,温度在-40～125℃范围变化时,阈值门限电压容差仅为0.9μV,可实现输出电压的高精度转换,电路面积仅为15 μm×48μm.     

一种用于PWM的基准电压源设计

基于传统带隙基准的原理,设计了一种用于脉宽调制器(PWM)的带隙基准电压源。该电路采用4μm双极型工艺设计,并且整个基准电压源受控制器内部欠压锁定信号控制,经Cadence Spectre仿真表明该电压源具有良好的温度特性,电源抑制比高,带负载能力强,可满足PWM控制器的应用需要。     

应用于BUCK-BOOST的低功耗高精度欠压锁定设计研究

传统的欠压锁定电路离不开外部电路提供的基准电压和偏置电流,同时当进入欠压锁定状态时,基准电路无法关断,不利于芯片的低功耗设计.针对传统电路的缺点,设计了一种不需要外部基准电压和偏置电流,并且电路结构简单、响应速度快、温度漂移低、阈值随PVT变化较小、功耗较低的欠压锁定电路.基于0.18 μm BCD工艺对提出的电路进行...     

一种改进的BiCMOS工艺欠压锁存电路的设计

针对DC-DC电源管理芯片中所必需的欠压锁存功能,利用带隙基准电压源的原理,提出一种新的改进的UV-LO(欠压锁存)电路的设计,实现了欠压锁存的阈值点和迟滞量,成功地实现了欠压锁存电路的预定功能。基于0.6μm BiC-MOS工艺,HSpice软件仿真的结果表明所设计的UVLO电路具有结构简单、温度漂移小、功耗低等特点,性能有很大改善,满足了芯片的需要。     

一种新型欠压锁定电路的设计

针对电源控制芯片中常需用到的欠压锁定功能,提出一种新的欠压锁定电路的设计,采用高稳定基准电压源作为比较基准,成功综合了单门限比较器和迟滞比较器的优点,并改善了逻辑电路的设计,成功实现了电路的预定功能.SPECTRES模拟仿真的结果表明所设计的UVLO电路具有启动电流小、响应速度快,温度漂移小等特点.     

基于0．5μmBCD工艺的欠压锁存电路设计

针对DC-DC电源管理系统中所必须的欠压锁存(UVLO)功能,提出一种改进的欠压锁存电路.所设计的电路在不使用额外的带隙基准电压源作为比较基准的情况下,实现了阈值点电位、比较器的滞回区间等参量的稳定.整个电路采用CSMC 0.5 μm BCD工艺设计,使用HSpice软件仿真,结果表明所设计的UVLO电路具有结构简单,反应灵敏、温度漂移小、功耗低等特点.     

一种CMOS欠压保护电路的设计

本文设计了一种CMOS工艺下的欠压保护电路,首先分析了电路的工作原理,而后给出了各MOS管的参数计算,并给出pspice仿真的结果.此电路结构简单,工艺实现容易,可用于高压和功率集成电路中的电源保护.     

一种结构简单的新型CMOS欠压保护电路

分析了两种传统欠压保护电路的工作原理及优缺点,在此基础上提出一种新颖的欠压保护电路。电路采用电流比较的方式,不依赖比较器、基准电源等辅助结构,结构简单,具有良好的独立性和稳定性;此外,有源器件中仅使用了MOS管,工艺实现容易,更便于集成。仿真结果表明,当电源电压在2.5V到3V之间变化时,电路欠压保护功能正常,并具有90mV的迟滞,可有效防止电源电压波动引起的误触发。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.