一种低温漂低电源电压调整率的基准电流源

利用NMOS管在亚阈值区、线性区和饱和区不同的导电特性,产生正温度系数电流;多晶硅高阻与N阱电阻组成串联电阻,代替线性区的NMOS管,产生与正温度系数电流互补的负温度系数电流。采用自偏置共源共栅电流镜结构,提出一种无运算放大器和三极管的求和型CMOS基准电流源。基于Nuvoton 0.35 μm CMOS工艺,完成设计与仿真。结果表明,在-40 ℃~100 ℃的温度范围内,电流变化为2.4 nA,温度系数为7.49×10-6/℃;在3.0~5.5 V的电压范围内,电源电压线性调整率为3.096 nA/V;在5 V工作电压下,输出基准电流为2.301 μA,电路功耗为0.08 mW,低频时电源电压抑制比为-57.47 dB。     

一种低温度系数曲率补偿带隙基准电路

设计了一种输出电压为0.72 V、带曲率补偿的带隙基准电路,该电路适用于收发器等数模混合电路。基于SMIC 0.18μm CMOS工艺,对电路进行了仿真和测试。结果表明,电路工作在1.5 V电源电压下时消耗100μA的电流,在1.3~1.8 V电压下以及-40℃~125℃温度范围内,可获得1.12×10-5V/℃的温度系数,电源抑制比为84 dB。     

一种高精度电流型CMOS带隙基准电压源设计

基于CSMC 0.5μm标准CMOS工艺,设计了一种高精度电流型CMOS带隙基准电压源。仿真结果表明,温度在-40℃~125℃范围内,基准输出电压的温度系数为1.3×10-5/℃;电源电压在3.3~5 V之间变化时,基准输出电压变化为0.076 mV,电源抑制比PSRR为-89 dB。同时,该电路包含修调电路,可在不同工艺角下进行校正,具有温度系数低、电源抑制比高、精度高等特点。     

一种低功耗低温度系数基准电压源的设计

基于0.35μm CMOS工艺,设计一种不带电阻的低功耗基准电压源,该基准源工作电压范围1.2 V~3.6 V.在3.6 V和室温时测量最大的电源电流为130 nA.在-20℃~100℃温度范围内,该基准电压温度系数为7.5×10-6/℃.在1.2 V~3.6 V电源电压范围内,线灵敏度为40×10-6/V,且在100 Hz时电源抑制比为-50 dB.该基准电压源适合在一些例如移动设备、植入式医疗设备和智能传感器网络等节能集成电路上应用.     

宽温范围高温度稳定性曲率互补电压基准设计

针对当前射频系统中电源管理芯片在宽温度范围下对带隙基准稳定性的较高要求,提出了一种新型互补带隙基准电路结构,通过将带隙基准与MOS弱反型区基准的温度系数曲率互补叠加,实现了极宽温度范围内带隙电压基准的高温度稳定性输出.采用0.35 μm CMOS工艺对所设计的电路进行了流片验证,测试结果表明,基准电压源工作电压为5V时,输出基准电压1.28 V,在-55 ～125℃温度范围内,温度系数可达4.5×10-6/℃,频率1 kHz时,电源抑制比(PSRR)可达-60 dB,100 kHz时,PSRR可达-55 dB,电压基准源芯片面积为0.22 mm×0.15 mm.     

一种新型的高噪声抑制比及高温度稳定性的基准电压产生器

基准电压源 (或基准电流源 )在CMOS模拟电路中被非常广泛地采用 ,因其在一定的温度范围内随温度的变化很小。本文介绍一种新型的CMOS基准电压产生器 ,采用CSMC6 0工艺和5 0V的工作电压 ,在 - 10℃到 +85℃的温度范围内 ,它能够产生约为 95 8± 3 5mV的基准电压 ,而且此基准电压在低频时的电源噪声抑制比PSRR达 15 5dB ,可以为各种中低功耗的CMOS集成电路提供稳定的工作电压     

一种新型高精度CMOS带隙基准源的设计

提出一种标准CMOS工艺结构的低压、低功耗电压基准源,工作电压为5~10 V。利用饱和态MOS管的等效电阻特性,对PTAT基准电流进行动态电流反馈补偿,设计了一种输出电压为1.3 V的带隙基准电路。使输出基准电压温度系数在-25~＋120℃范围的温度系数为7.427 ppm/℃,在27℃时电源电压抑制比达82 dB。该基准源的芯片版图面积为0.022 mm2,适用于低压差线性稳压器等领域。     

一种具有大电流驱动能力的低温漂带隙基准电压源

基于XFAB 0.6 μm CMOS工艺,设计了一种具有大电流驱动能力的低温度系数带隙基准电压源。通过设置不同温度系数的电阻的比值,实现带隙基准的2阶曲率补偿。采用新的电路结构,使基准源具有驱动10 mA以上负载电流的能力。经过Hspice仿真验证,常温基准输出电压为2.496 V,-55 ℃~125 ℃温度范围内的温度系数是3.1×10-6/℃;低频时,电源电压抑制比为-77.6 dB;供电电压在4~6 V范围内,基准输出电压的线性调整率为0.005%/V;负载电流在0~10 mA范围内,基准输出电压波动为219 μV,电流源负载调整率为0.022 mV/mA。     

宽温度范围高精度带隙基准电压源的设计

为了满足市场对宽温度范围、高精度带隙基准电压源的需求,本文设计制作了一种新型带隙基准电压电路。设计采用多点曲率补偿技术,在温度较低时采用指数频率补偿,高温时采用亚阈值指数曲率补偿。采用电压-电流转换器对分段补偿电流在输出端进行整合,进而在-55~150℃的温度范围内进行补偿,得到低温度系数的基准电压。设计的电路采用CSMC 0.5μm CMOS工艺验证,结果表明:5V电源电压下,输出1.25V的基准电压;在-55~150℃的温度范围内温度系数为2.5×10~(-6)/℃,在低频时,PSRR为-66dB。带隙基准电压源芯片面积为0.40mm×0.45mm。     

一种高精度二阶温度补偿带隙基准电路设计

基于通过负温度系数电压控制工作于亚阈值区MOS管栅压产生随温度变化的补偿电流原理,采用中芯国际0.18μm CMOS工艺,设计了一款高精度二阶温度补偿带隙基准电压源。测试结果表明,当电源电压大于1.6V时,电路能够产生稳定的1.21V输出电压;在电源电压为1.6~3.4V,-20~135℃温度范围内,最小温度系数为2×10-6/℃,最大温度系数为3.2×10-6/℃;当电源电压在1.6~3.4V之间变化时,输出电压偏差为0.6mV,电源调整率为0.34mV/V;在1.8V电源电压下,电源抑制比为69dB,因此能够适应于高精度基准源。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks